KR100390130B1 - A probe connector for examination to semiconductor - Google Patents

Abstract

end. The technical field to which the invention described in the claims belongs.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe connector for inspecting electrical characteristics of a semiconductor chip on a wafer in a process for testing a semiconductor device. In particular, the invention relates to a probe connector of a probe card that can be simply connected and used repeatedly.

I. The technical problem to be solved by the invention.

Conventionally, when the electrical characteristics of the semiconductor chip are to be examined by using a probe card, heat of the iron is transferred directly to the probe by soldering a wire connection between related probes, so that the copper plate of the probe card is easily lifted and peeled off. Depending on the type of semiconductor chip, the probe must be frequently connected and replaced, resulting in scratches and abrasion of the metal, leading to an increase in contact resistance. There was a problem that the probe card is easily broken.

All. Summary of the Solution of the Invention.

A plurality of connection brackets are formed at both ends of the lead wire made of ultra-precision coaxial cable to be extrapolated to the probe so as to be crimped to prevent damage to the probe card and to allow repeated use of the lead wire.

la. Important uses of the invention

For semiconductor inspection

Description

A probe connector for examination to semiconductor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe connector for inspecting electrical characteristics of a semiconductor chip on a wafer in a process for testing a semiconductor device. Particularly, the present invention relates to a probe connector that is extrapolated to a probe by both ends of a lead wire made of a high precision coaxial cable. The connection brackets are formed to shorten the process according to the lead wire connection and to easily correct the circuit.

The probe card is a device that checks the electrical characteristics of each semiconductor chip circuit formed on the wafer during the semiconductor manufacturing process as designed at the time of design. In general, in order to inspect a highly integrated semiconductor chip, a probe that is fixed with epoxy on a printed circuit board (PCB) is contacted with a pad of a chip to be inspected, and then a tool that transmits an electrical signal of a test equipment on a chip.

Conventionally, in order to inspect each chip formed of a semiconductor wafer using a probe card, related probes are connected by connecting a combination of lead wires composed of ultra-precision coaxial cables between the probes, and then confirming the degree of transmission of electrical signals transmitted from inspection equipment such as oscilloscopes. As a method for connecting lead wires composed of ultra-precision coaxial cables between associated probes, general soldering has been performed.

However, the soldering performed to connect the coaxial cable to the probe transfers the heat of the iron to melt the lead directly to the probe so that the copper plate of the probe card is easily lifted or peeled off. As a result, scratches and wear on the surface of the probe made of metal result in an increase in contact resistance. As a result, the mismatch between the semiconductor chips is incorrectly judged, which causes the yield to be lowered, and the probe card is easily broken. There was a losing problem.

In addition, coaxial cables for connecting associated probes, despite being relatively expensive, were repeatedly consumed and resulted in higher costs.

In particular, the inspection of semiconductor chips integrated with high density requires many probes to be connected, so that the probes and the probes are narrow, so that a lot of space is not secured and there are many difficulties in soldering. This may be easily damaged, but there is a problem that the identification of the semiconductor chip is difficult and the inspection of the semiconductor chip cannot be performed efficiently.

Therefore, the present invention has been made to solve the above-mentioned conventional problems,

A plurality of connection brackets are formed at both ends of the lead wire made of the ultra-precision coaxial cable to be extrapolated to the probe and pressed to prevent damage to the probe card and to allow repeated use of the lead wire.

1 is an exploded perspective view of a semiconductor probe probe connector according to the present invention;

2 is a perspective view of a probe connector for semiconductor inspection according to the present invention.

3 is a state diagram used in the present invention.

Explanation of symbols on the main parts of the drawing

10: lead wire 20: connection bracket

21: insertion hole 22: bend

30: insulator 31: locking pin

40: insulation cover 41: hook hole

42: through hole 100: probe

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the case where the structural functions described in the specification and the drawings are the same, reference numerals and descriptions are omitted.

The probe connector for semiconductor inspection of the present invention includes a plurality of connection brackets 20 having a lead wire 10 covered with an ultra-precision coaxial cable on an outer sheath made of an insulator, and an insertion hole 21 formed at an end of the lead wire 10. ) And the one end of the lead wire 10 and one end of the connection bracket 20 are molded to cover the insulator 30 and the exposed connection bracket 20 so as to remain connected without being shaken. It is composed of an insulating cover 40 surrounding the tip.

The lead wire 10 is a high-precision coaxial cable 12 is coated with a coating 11 such as a synthetic resin to ensure insulation and to minimize the resistance value of the lead wire 10 to prevent the error of the inspection data.

The connection bracket 20 is hollow, and an insertion hole 21 is formed to be extrapolated to the probe 100 at one end thereof, and an inner surface thereof is pressed against the outer surface of the probe 100.

At this time, the connection bracket 20 is formed in one or more in parallel to selectively insert and connect to the probe 100, and a plurality of along the longitudinal direction so that the inner surface can be closely pressed to the outer surface of the probe 100 By forming an incision line and bending it inwardly, it is possible to form a reduced bent portion 22 of the cross-sectional area.

In addition, by forming a gold plated layer 23 on the surface of the connection bracket 20 to increase the electrical conductivity it is possible to solve the defects of the electrical conduction so that accurate inspection can be made.

A predetermined portion of the upper surface of the connected lead wire 10 and the connection bracket 20 is molded by an insulator 30.

The insulator 30 is formed of synthetic resin and the like so as to cover a part of the end of the lead wire 10 and the end of the connection bracket 20 so that the lead wire 10 is not shorted or disconnected even by repeated connection to the probe 100. It is to avoid.

On the other hand, the exposed insertion hole 21 of the connection bracket 20 is to be covered with a removable insulating cover 40 to prevent the short between the adjacent semiconductor test probe connectors or damage to the connection bracket 20 will be.

One surface of the insulator 30 is formed with a locking pin 31 which is protruded along the inclined cut inclined surface and corresponding to the insulation cover 40 which is extrapolated to surround the insulator 30 and the connection bracket 20. As the locking hole 41 is drilled on the surface, the extra insulation cover 40 is not detached.

In this case, the through hole 42 corresponding to the insertion hole 21 of the connection bracket 20 is formed at the end of the insulating cover 40, so that the insulating cover 40 can be inserted into the probe 100 while the insulating cover 40 is covered. It is forever.

Referring to the method for inspecting the electrical characteristics of the semiconductor using the probe connector for semiconductor inspection of the present invention having the above configuration as follows.

In general, in order to test a semiconductor device, it is more efficient to perform a batch test in a wafer state than to inspect a semiconductor packaged.

The semiconductor on the wafer may be connected to the probe connector of the present invention by a plurality of probes formed by contacting the probe card while being mounted on the probe card.

In addition, the probe connector for semiconductor inspection of the present invention is not only a wafer test of the semiconductor described above, but also a wafer board test, a probe card test, a semiconductor device test, a semiconductor circuit test, and a signal test ( Signal tests, printed circuit board tests, burn-in circuit tests, and semiconductor package tests can be performed in the same manner.

As described above, the present invention can prevent damage to the probe card due to soldering when connecting the lead to the probe of the probe card to check the electrical characteristics of the semiconductor, and reduce the consumption of the lead wire composed of a relatively expensive high precision coaxial cable. In other words, the circuit configuration can be easily changed.

Claims (2)

In order to inspect the electrical characteristics of the semiconductor chip using a probe card or the like, a plurality of probes 100 formed on one surface of the probe card may be connected to a connection connector for interconnecting the associated probe 100 in accordance with an intended design. The lead wire 10 having a high precision coaxial cable covered with an outer sheath made of an insulator, and a plurality of connection brackets 20 and lead wires 10 connected to ends of the lead wires 10 and having insertion holes 21 formed at ends thereof. The insulating cover 40 which covers the distal end of the exposed connection bracket 20 and the insulator 30 to maintain the connected state without being shaken by being molded by covering the one end portion of the connection portion and the one end portion of the connection bracket 20. Probe connector for semiconductor inspection, characterized in that consisting of). The method of claim 1, wherein one side of the insulator 30 is formed with a locking pin 31 which is driven into a curved incision portion and a locking hole 41 is formed on the corresponding surface of the insulating cover 40 Probe connector for semiconductor inspection, characterized in that configured to prevent any detachment of the insulating cover (40).