KR100389861B1 - Adhesion method of actuator for inkjet printer - Google Patents
Adhesion method of actuator for inkjet printer Download PDFInfo
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- KR100389861B1 KR100389861B1 KR10-2000-0039470A KR20000039470A KR100389861B1 KR 100389861 B1 KR100389861 B1 KR 100389861B1 KR 20000039470 A KR20000039470 A KR 20000039470A KR 100389861 B1 KR100389861 B1 KR 100389861B1
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- bonding material
- diaphragm
- actuator
- bonding
- mask
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- 238000000034 method Methods 0.000 title abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 55
- 238000003825 pressing Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
본 발명은 잉크젯 프린터에서 액츄에이터에 관한 것으로서, 보다 상세하게는 잉크젯 프린터에서 사용되는 압전체와 진동판을 결합시켜 액츄에이터를 제작할 때 접착을 보다 정밀하게 할 수 있도록 구성된 잉크젯 프린터용 액츄에이터의 압전체 접착 방법에 관한 것이다.The present invention relates to an actuator in an inkjet printer, and more particularly, to a piezoelectric bonding method of an actuator for an inkjet printer configured to bond more precisely when manufacturing an actuator by combining a piezoelectric body and a diaphragm used in an inkjet printer. .
본 발명의 목적은 본딩재의 점도에 관계없이 진동판 전체에 본딩재를 도포하지 않으면서 압전체의 접합 시 본딩재가 전체에 균일하게 접합되도록 하는 잉크젯 프린터용 액츄에이터의 압전체 접착 방법을 제공함에 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a piezoelectric bonding method of an actuator for an inkjet printer, in which the bonding material is uniformly bonded to the whole when the piezoelectric material is bonded without applying the bonding material to the whole diaphragm regardless of the viscosity of the bonding material.
상기한 목적을 실현하기 위하여 본 발명에 따른 접착 방법은, 진동판(50)에 다수의 통과공(S1)이 형성된 마스크(S)를 위치시키는 단계와, 상기한 마스크(S)의 상면에 본딩재(2)를 도포하여 상기 통과공(S1)을 통해 진동판(50)에 본딩재(2)가 부분적으로 도포되도록 하는 단계와, 상기한 마스크(S)를 제거한 후 본딩재(2)의 상면에 압전체(52)를 소정 압력으로 가압시켜 본딩재(2)가 균일하게 퍼지도록 하는 단계로 구성함을 특징으로 한다.In order to achieve the above object, the bonding method according to the present invention includes positioning a mask S having a plurality of through holes S1 formed in the diaphragm 50, and bonding the upper surface of the mask S to a bonding material. (2) applying the bonding material 2 to the diaphragm 50 through the passage hole S1 partially, and removing the mask S on the upper surface of the bonding material 2. The piezoelectric body 52 is characterized in that it comprises a step to uniformly spread the bonding material 2 by pressing the predetermined pressure.
Description
본 발명은 잉크젯 프린터에서 액추에이터에 관한 것으로서, 보다 상세하게는 잉크젯 프린터에서 사용되는 압전체와 진동판을 결합시켜 액츄에이터를 제작할 때 접착을 보다 정밀하게 할 수 있도록 구성된 잉크젯 프린터용 액츄에이터의 압전체 접착 방법에 관한 것이다.The present invention relates to an actuator in an ink jet printer, and more particularly, to a piezoelectric bonding method of an actuator for an ink jet printer, which is configured to bond more precisely when manufacturing an actuator by combining a piezoelectric body and a diaphragm used in an ink jet printer. .
일반적으로, 잉크젯 프린터는 피코리터급의 잉크 방울을 열전사등의 방법을 통해 종이에 분사함으로써, 텍스트 및 화상을 출력하는 장치인 바, 상기한 잉크 방울을 분사하기 위해 매우 미세하게 작동하는 헤드가 필요하게 된다.In general, an inkjet printer is a device that outputs text and images by spraying picoliter-grade ink droplets onto paper through a thermal transfer method, such that a head which operates very finely to spray the ink droplets is It is necessary.
상기한 헤드는 카트리지와 연결된 잉크 공급 케이스에서 잉크를 공급받는 바, 잉크 공급공이 형성된 헤드와, 상기한 잉크 공급공에 대응되도록 대응공이 형성된 잉크 공급 케이스와, 상기한 헤드의 상면에 안착되어 잉크를 분출시키는 신호 인가용의 FPC(Flexible Printed Cable)로 구성되어 있다.The head is supplied with ink from an ink supply case connected to the cartridge, the head having the ink supply hole formed therein, an ink supply case having a corresponding hole formed corresponding to the ink supply hole, and seated on an upper surface of the head to receive ink. It is composed of FPC (Flexible Printed Cable) for signal application.
즉, 상기한 잉크 공급 케이스로부터 잉크가 공급되면 헤드 내부에 잉크가 충진됨과 아울러 상기한 FPC에 의한 제어 신호에 의해 액츄에이터가 잉크를 분출하게 되는 것이다.That is, when ink is supplied from the ink supply case, ink is filled in the head and the actuator ejects ink by the control signal by the FPC.
여기서, 상기한 액츄에이터는 압전체와 진동판이 결합되어 구성되는 바, 이는 도 4에 도시된 바와 같이 진동판(50)과, 상기한 진동판(50)에 본딩재(51)를 개재한 상태로 접합된 압전체(52)로 구성되어 있다.Here, the actuator is composed of a piezoelectric body and a diaphragm coupled to each other, which is a piezoelectric body bonded to the diaphragm 50 and the diaphragm 50 through the bonding material 51 as shown in FIG. It consists of 52.
상기한 압전체(52)와 진동판(50)의 접합 시 압전체(52)에 의한 진동판(51)의진동을 균일하게 하기 위해서는, 상기한 본딩재(51)의 두께를 최대한 얇게 유지하면서 일정하게 해야 하는 바, 상기한 본딩재(51)의 점도에 따라 도포 두께등을 적절하게 조절하게 된다.In order to make the vibration of the diaphragm 51 by the piezoelectric body 52 uniform when the piezoelectric body 52 and the diaphragm 50 are bonded together, the thickness of the bonding material 51 should be kept constant as thin as possible. The coating thickness and the like are appropriately adjusted according to the viscosity of the bonding material 51 described above.
즉, 소정의 도포 장치등을 사용하여 진동판(50)의 상면에 본딩재(51)를 도포하고, 그 상면에 압전체(52)를 부착시키게 되는 것이다.That is, the bonding material 51 is apply | coated to the upper surface of the diaphragm 50 using a predetermined | prescribed coating apparatus, etc., and the piezoelectric body 52 is affixed on the upper surface.
그러나, 상기한 바와 같이 압전체와 진동판을 접합시킬 때 본딩재로 결합시키게 되면, 상기한 본딩재의 도포 시 본딩재의 점도가 높게 되면 도포 두께를 얇게 유지하기가 어렵게 되고, 본딩재의 점도가 낮게 되면 도포 균일성을 유지하기가 어렵게 되는 문제점이 있다.However, when the piezoelectric body and the diaphragm are bonded together as described above, when the bonding material is bonded to the bonding material, when the viscosity of the bonding material is high, it is difficult to keep the coating thickness thin, and when the viscosity of the bonding material is low, the coating uniformity is achieved. There is a problem that makes it difficult to maintain sex.
즉, 본딩재의 도포를 전체적으로 하게 되면, 상기한 본딩재의 점도에 따라 정확한 두께 및 도포 균일성을 유지하기가 어렵게 되는 것이다.That is, when the application of the bonding material as a whole, it is difficult to maintain the correct thickness and coating uniformity according to the viscosity of the bonding material.
따라서, 본 발명의 목적은 상기한 문제점을 해결하기 위한 것으로서, 본딩재의 점도에 관계없이 진동판 전체에 본딩재를 도포하지 않으면서 압전체의 접합 시 본딩재가 전체에 균일하게 접합되도록 하는 잉크젯 프린터용 액츄에이터의 압전체 접착 방법을 제공함에 있다.Accordingly, an object of the present invention is to solve the above-described problems, the ink jet printer actuator of the bonding material to be uniformly bonded to the whole when the piezoelectric bonding without applying the bonding material to the whole diaphragm regardless of the viscosity of the bonding material A piezoelectric bonding method is provided.
상기한 목적을 실현하기 위하여 본 발명에 따른 접착 방법은, 진동판에 다수의 통과공이 형성된 마스크를 위치시키는 단계와,In order to achieve the above object, the bonding method according to the present invention comprises the steps of: positioning a mask having a plurality of through holes formed in the diaphragm;
상기한 마스크의 상면에 본딩재를 도포하여 상기 통과공을 통해 진동판에 본딩재가 부분적으로 도포되도록 하는 단계와,Applying a bonding material to the upper surface of the mask to partially apply the bonding material to the diaphragm through the through hole;
상기한 마스크를 제거한 후 본딩재의 상면에 압전체를 소정 압력으로 가압시켜 본딩재가 균일하게 퍼지도록 하는 단계로 구성함을 특징으로 한다.After removing the mask is characterized in that the step of pressing the piezoelectric material to a predetermined pressure on the upper surface of the bonding material to uniformly spread the bonding material.
도 1a는 본 발명에 따른 잉크젯 프린터용 액츄에이터의 압전체 접착 방법을 설명하기 위한 개략 단면도,1A is a schematic cross-sectional view for explaining a piezoelectric bonding method of an actuator for an inkjet printer according to the present invention;
도 1b는 도 1a에서 압전체가 부착된 상태를 도시한 개략 단면도,1B is a schematic cross-sectional view showing a state in which a piezoelectric body is attached in FIG. 1A;
도 2는 도 1에서 접착제 프린트를 위해 사용되는 마스크의 일예를 도시한 평면도,FIG. 2 is a plan view showing one example of a mask used for printing an adhesive in FIG. 1;
도 3은 본 발명에 따른 잉크젯 프린터용 액츄에이터의 압전체 접착 방법의 다른 실시예를 설명하기 위한 개략 단면도,3 is a schematic cross-sectional view for explaining another embodiment of a piezoelectric bonding method of an actuator for an inkjet printer according to the present invention;
도 4는 일반적인 잉크젯 프린터용 액츄에이터의 압전체 부착 구조를 도시한 개략 단면도.4 is a schematic cross-sectional view showing a piezoelectric attachment structure of a typical ink jet printer actuator.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
1 : 간격 2 : 본딩재1: interval 2: bonding material
50 : 진동판 52 : 압전체50: diaphragm 52: piezoelectric body
S : 마스크 S1 : 통과공S: Mask S1: Through Hole
도 1a와 도 1b와 도 2는 본 발명에 따른 잉크젯 프린터용 액츄에이터의 압전체 접착 방법을 설명하기 위한 개략 단면도와 마스크 일예의 정면도로서, 진동판(50)의 상면에 다수의 통과공(S1)이 형성된 마스크(S)에 의해 일정 간격(1)을 갖도록 본딩재(2)를 도포하고, 상기한 본딩재(2)의 도포 후 상기한 압전체(52)를 가압하여 본딩재(2)가 전면에 골고루 퍼지면서 접합되도록 구성되어 있다.1A, 1B, and 2 are schematic cross-sectional views and a front view of an example of a mask for explaining a piezoelectric bonding method of an actuator for an inkjet printer according to the present invention, in which a plurality of through holes S1 are formed on an upper surface of a diaphragm 50. The bonding material 2 is coated to have a predetermined interval 1 by the mask S, and after the application of the bonding material 2, the piezoelectric body 52 is pressed to bond the bonding material 2 evenly to the entire surface. It is configured to be joined while spreading.
즉, 상기한 진동판(50)에 본딩재(2)를 도포시킬 때 전체적으로 도포하지 않고, 부분적으로만 도포함과 아울러 상기한 본딩재(2)가 압전체(52)에 의해 가압될 때, 진동판(50) 전체에 균일하게 도포되도록 하는 것이다.That is, when the bonding material 2 is applied to the diaphragm 50, the diaphragm 50 is not entirely applied, but only partially covered and when the bonding material 2 is pressed by the piezoelectric body 52, the diaphragm ( 50) It is to be uniformly applied to the whole.
여기서, 상기한 본딩재(2)의 도포에는, 상기한 도 2에 도시된 바와 같은 마스크(S)를 사용함으로써, 본딩재(2)의 도포를 정확하게 수행할 수 있게 된다.Here, the application of the bonding material 2 can be performed accurately by applying the mask S as shown in FIG. 2 to the application of the bonding material 2.
즉, 상기한 마스크(S)의 통과공(S1)을 통해 본딩재(2)의 도포 위치 및 본딩재(2)가 가압될 때 얇은 두께를 유지할 수 있도록, 통과공(S1)의 크기 및 위치를 구성하게 되는 것이다.That is, the application position of the bonding material 2 through the through hole S1 of the mask S and the size and position of the through hole S1 to maintain a thin thickness when the bonding material 2 is pressed. Will be configured.
여기서, 상기한 마스크(S)를 상기한 바와 같은 포지티브 형태가 아닌 네가티브 형태로 제작하게 되면, 도 3에 도시된 바와 같이 본딩재(2)의 부분 부분에 홈(3)이 형성되도록 도포하면, 상기한 압전체(52)의 가압 시 홈(3)이 본딩재(2)의 과다량을 담을 수 있는 공간이 됨으로써, 동일한 효과가 나타나게 된다.Here, when the mask S is manufactured in a negative form instead of the positive form as described above, as shown in FIG. 3, when the groove 3 is coated to be formed in a portion of the bonding material 2, When the piezoelectric body 52 is pressurized, the groove 3 becomes a space that can contain an excessive amount of the bonding material 2, thereby exhibiting the same effect.
상기한 바와 같은 본 발명의 작용 효과를 설명하면 작업자가 프린터 헤드의 액츄에이터를 제작하기 위하여, 상기한 진동판(50)을 소정 작업 위치에 이동시키게 된다.Referring to the operation and effect of the present invention as described above, the operator moves the diaphragm 50 to a predetermined working position in order to manufacture the actuator of the print head.
진동판(50)이 소정 위치에 이동되면, 상기한 진동판(50)의 상면에 소정 형태의 마스크(S)를 안착시킴과 아울러 상기한 마스크(S) 상면을 통해 본딩재(2)를 도포하게 된다.When the diaphragm 50 is moved to a predetermined position, the mask S is mounted on the upper surface of the diaphragm 50 and the bonding material 2 is applied through the upper surface of the mask S. .
이때, 상기한 마스크(S)의 통과공(S1)을 통해 본딩재(2)가 진동판(50)에 소정 형태로 도포되는 바, 상기한 마스크(S)를 분리한 후, 진동판(50) 상면에 압전체(52)를 안착시키게 된다.At this time, the bonding material 2 is applied to the diaphragm 50 in a predetermined form through the through-hole S1 of the mask S. After the mask S is separated, the upper surface of the diaphragm 50 is removed. The piezoelectric body 52 is seated on the substrate.
압전체(52)를 안착시킨 후, 상기한 압전체(52)를 소정 압력으로 가압하여 상기한 본딩재(2)가 균일하게 퍼지도록 한다.After the piezoelectric body 52 is seated, the piezoelectric body 52 is pressurized to a predetermined pressure to uniformly spread the bonding material 2.
본딩재(2)가 균일하게 퍼지게 되면, 상기한 압전체(52)의 접착이 완료되는 것이다.When the bonding material 2 is uniformly spread, the bonding of the piezoelectric body 52 is completed.
이때, 상기한 본딩재(2)의 두께는 본딩재(2)의 투입량 및 가압력에 의해 결정되는 바, 상기한 본딩재(2)의 점도에 관계없이 비교적 얇게 조정 가능하게 되는 것이다.At this time, the thickness of the bonding material 2 is determined by the amount of the bonding material 2 and the pressing force, it is possible to adjust relatively thin regardless of the viscosity of the bonding material (2).
또한, 상기한 압전체(52)의 가압력이 균일하게 본딩재(2)에 적용되기 때문에, 상기한 본딩재(2)의 두께도 비교적 균일하게 유지할 수 있게 되는 것이다.In addition, since the pressing force of the piezoelectric body 52 is applied to the bonding material 2 uniformly, the thickness of the bonding material 2 can be maintained relatively uniformly.
본딩재의 두께가 비교적 얇게 되고 균일하게 유지되면 상기한 압전체(52)에서의 진동이 진동판(50)을 통해 전달될 때 보다 정확하게 이루어질 수 있는 것이다.If the thickness of the bonding material is relatively thin and uniformly maintained, the vibration in the piezoelectric body 52 may be more accurately performed when transmitted through the diaphragm 50.
이상과 같이 본 발명은 본딩재를 진동판의 전체에 도포하지 않고 부분 부분에 도포한 후, 상기한 압전체로 이를 가압하면서 접합하여 본딩재의 점도에 관계없이 도포 두께 및 균일성을 확보할 수 있는 잇점이 있는 것이다.As described above, in the present invention, the bonding material is applied to a part of the diaphragm without applying it to the whole of the diaphragm, and then bonded while pressing the piezoelectric material with the piezoelectric material as described above. It is.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0039470A KR100389861B1 (en) | 2000-07-11 | 2000-07-11 | Adhesion method of actuator for inkjet printer |
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