JPH05220966A - Manufacture of ink jet head - Google Patents

Abstract

PURPOSE:To efficiently manufacture an ink jet head having nozzles packed high in density and integration without reducing its original ink discharge performance. CONSTITUTION:A process wherein a bonding agent is spread out in a recess 23 of an intaglio 20 by a bonding agent application means and a process wherein a piezoelectric module 100 is placed in the recess by pressing its edge 106 of ink passage thereto are provided: thereby after a little amount of a bonding agent is uniformly applied, a nozzle substrate 101 and a piezoelectric module 100 are bonded together.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention is directed to ejecting ink droplets,
The present invention relates to an inkjet-type recording apparatus such as a printer that forms an ink image on a recording medium such as recording paper, and more particularly to a method for manufacturing an inkjet head.

[0002]

2. Description of the Related Art As a conventional inkjet head,
JP-B-63-252750, or JP-B-63
The device disclosed in Japanese Patent No. 247051 is a precursor thereof.

As shown in FIG. 7, each of these ink jet heads has a plurality of parallel flow paths 204 which are spaced from each other in the nozzle arrangement direction 111.
Reference numeral 04 denotes a side wall 205 extending in the longitudinal direction 112 of the flow path 204.
It is divided by. One end 203 of these flow paths 204
Is connected to a nozzle substrate 101 having a plurality of nozzles 102, and the other end is connected to an ink supply path 209 for replenishing each flow path with ink. The side wall 205 is partially or wholly formed of a piezoelectric material, and causes an electric actuating means (not shown) to cause a deformation such as a shearing mode parallel to the nozzle arrangement direction 111, so that the flow path 204 is formed in the pressure generating chamber. As the ink pressure is changed, the nozzle 10
The ink droplet was ejected from No. 2.

As shown in FIG. 8, the manufacturing method thereof includes an upper substrate (first channel member) 201 and a lower substrate (second substrate) made of piezoelectric ceramics polarized in the thickness direction.
And a step of forming a plurality of parallel flow paths 204 on the flow path member 202), and as shown in FIG. 9, an electrode layer 207 is formed for each flow path 204 on a side wall 205 that partitions adjacent flow paths 204. Steps, and as shown in FIG. 7, the upper substrate 201 and the lower substrate 202, which have been subjected to the above-mentioned steps, are connected to the channel 2 of both substrates.
04 are opposed to each other and overlap each other, and the side wall electrode layer 207a of the upper substrate 201 and the side wall electrode 207b of the lower substrate 202 are
It is composed of a step of forming a flow path forming member 206 by joining the surface parts 208 of both substrates so as to be electrically connected, and a step of adhering the nozzle substrate 101 and one end of the flow path forming member 206. there were.

[0005]

In the above-described conventional manufacturing method, the flowing adhesive may flow into the flow path 204 and the nozzle 102 in the bonding step to deteriorate ink droplet ejection characteristics. It has been confirmed. In a remarkable case, the nozzle 102 and the flow path 204 were blocked with the adhesive. Furthermore, as the number of nozzles becomes higher and higher and the distance between the adjacent nozzle openings becomes narrower, even if the amount of the inflowing adhesive is small, the influence on the ejection characteristics of the ink droplet cannot be ignored.

Therefore, the present invention has been made to solve such a problem, and it is possible to produce a head having high density and highly integrated nozzles with good quality without impairing the ink ejection performance originally possessed by the ink jet head. It is an object.

[0007]

In order to achieve the above object, a method of manufacturing an ink jet head according to the present invention comprises a nozzle substrate having a plurality of nozzles formed therein and a plurality of nozzles spaced from each other in the direction in which the nozzles are arranged. One or a plurality of flow path members forming a parallel flow path are bonded to a flow path forming member, and the pressure in the flow path is changed to one end of the flow path. A method of manufacturing an inkjet head that ejects ink droplets from a positioned nozzle, wherein at least a bonding step for bonding the nozzle substrate and the flow path forming member, and a bonding step for bonding the flow path members together One bonding step includes (1) a step of pushing the adhesive to the concave portion of the intaglio and a step of pressing at least one of the bonded surfaces to the concave portion of the intaglio to bond the adhesive. Or (2) a step of pushing the adhesive to the concave portion of the intaglio plate, a step of pressing the elastic body against the intaglio plate to transfer the adhesive to the elastic body side, and Or a step of applying an adhesive by pressing an elastic body to at least one of the adherend surfaces, or (3) a step of previously adhering the adherend surfaces to each other, and a step of superposing Or a step of permeating an adhesive having a viscosity of at least 1500 [m · Pa · s] or less into the gap between the adhered surfaces, or (4) at least one of the adherends has a viscosity of 200 [m ・ P
or a step of spraying an adhesive having an a.s or less] or (5) an adhesive having a viscosity of at least 1500 [m · Pa · s] or less inside an elastic body having an open-cell structure. And a step of pressing at least one of the adherend surfaces against the elastic body having an open-cell structure to apply the adhesive to the adherend surfaces.

[0008]

The method for manufacturing an ink jet head of the present invention will be described below. FIG. 1 is a partially omitted perspective view showing an example of an inkjet head manufactured by the method of the present invention. In the method of manufacturing such an inkjet head, the piezoelectric substrate (flow path member) 103 and 1
04, a bonding step between the flow path upper surface 114 and the upper lid substrate (flow path member) 105, and a bonding step between the flow path end surface 106 and the nozzle substrate 101. The present method is applicable to any bonding step. However, here, for convenience, the flow path end face 10 is used.
A bonding process between the nozzle 6 and the nozzle substrate 101 will be described as a typical example.

(First Embodiment) First, piezoelectric substrates 103, 1
04, and the upper substrate 105 and the piezoelectric substrate 100 and the nozzle substrate 10 which are the flow path forming members integrated with each other.
1 and prepare. Already at this point the piezoelectric module 100
The channel 106 is formed by a rotary grindstone blade or the like, and the sidewall 108 of the channel 106 has a sidewall electrode 109a.
Are formed.

Next, as shown in FIG. 2A, a film-shaped stencil 22 is set on the flat plate 21, and the intaglio plate 20 is constituted by these two members. A silicon nitride plate was used for the flat plate 21.

As shown in FIG. 2B, an adhesive 24 is placed on the intaglio 20, and a doctor blade 25 is used to move it in a moving direction 26. Therefore, the adhesive 24 is pushed into the recess 23. As the film-shaped stencil 22, a metal film was used in consideration of the thickness accuracy when the doctor blade 25 was moved and its durability. Also, the adhesive 2
For No. 4, an epoxy adhesive having a good balance of heat resistance, chemical resistance, bonding strength and the like was used.

As shown in FIG. 2C, the flow path end surface 106 of the piezoelectric module 100 is pressed against the concave portion 23 which is thus pressed with the adhesive 24 to the thickness of the film-shaped stencil 22.

Next, as shown in FIG. 2D, the recess 2
3 and the piezoelectric module 100 are separated, the flow path end face 1
The adhesive 24a is transferred to 06. Adhesive 2 at this time
Since the transfer ratio of No. 4 is about 50% by thickness, the film-shaped stencil 22 is selected in advance to have a desired thickness in consideration of it. However, in the inkjet head of this embodiment, when the formation density of the flow path 107 (see FIG. 1) is increased (for example, 150 dpi; dot / inch), when the adhesive 24 is applied,
The adhesive will flow into the flow path when it is bonded to the nozzle substrate. Therefore, the thickness of the film-like stencil 22 is preferably 0.02 [mm] or less, more preferably 0.012.
It is less than [mm]. Most preferably, it is 0.008 [mm] or less.

Since the flat plate 21 and the film-shaped stencil 22 can be separated from each other in the intaglio 20, the film-shaped stencil 22 is replaced when the film-shaped stencil 22 is consumed or when the depth or shape of the recess 23 is changed. There is a feature that can be easily changed.

Next, as shown in FIG. 2E, the nozzle substrate 101 and the flow path end surface 106 are aligned.

Finally, as shown in FIG. 2 (f), the adhesive 24a is pressure-hardened under desired curing conditions.

3 to 6 show another embodiment of the bonding process.

(Second Embodiment) In the embodiment shown in FIGS. 3A to 3H, the flow path end face 106 of the piezoelectric module 100 from the intaglio plate 20 through the elastic body 31 is used as the adhesive application means. The adhesive 30 is transferred and applied onto the adhesive (see (c) to (g)). In particular, in this embodiment, the elastic force of the elastic body 31 does not depend on the flatness of the concave portion 23 and the surface to be adhered (here, at least one of the nozzle substrate 101 and the flow path end surface 106), and a small amount. The adhesive 30a can have a uniform thickness.

(Third Embodiment) In the embodiment shown in FIGS. 4A to 4C, the adhered surfaces 101a and 106 are adhered to the gap c between the superposed nozzle substrate 101 and the piezoelectric module 100. The agent 40 is permeated. Particularly in this embodiment, the nozzle substrate 101 and the piezoelectric module 1 are
00 is set in advance (FIG. 4 (a)), the adhesive 4
The complexity of alignment between the nozzle substrate 101 and the piezoelectric module 100 after 0 coating is eliminated. The adhesive 40
The viscosity of the adhesive 40 is at least 1500 [m · Pa · s] so that the adhesive 40 penetrates in the penetrating direction 41 by utilizing the capillary force of the adhesive.
Below.

(Fourth Embodiment) In the embodiment shown in FIG. 5, the adhesive 50 is atomized (the atomized adhesive 50a) as a means for applying the adhesive, and the flow path end face of the piezoelectric module 100 is obtained. It was applied to 106.

The viscosity of the adhesive 50 is determined in order to atomize the adhesive 50 (the atomized adhesive 50a) (FIG. 5 (a)).
At least 200 [m · Pa · s] or less, preferably 100
[m ・ Pa ・ s] or less. It is more preferably 50 [m · Pa · s] or less. The lower the viscosity, the better. Particularly, in this embodiment, as the adhesive 50, an epoxy adhesive diluted with a solvent 52 such as acetone is used in order to obtain an adhesive having an extremely low viscosity. Therefore, it is necessary to apply solvent 50 to the flow path end surface 106 and then perform desolvation treatment such as depressurization treatment to prevent residual bubbles after joining (FIG. 5B).

The adhesive applying means of this embodiment can apply a small amount of adhesive with a uniform thickness without depending on the flatness of the flow path end face 106, as in the second embodiment.

(Fifth Embodiment) In the embodiment shown in FIG. 6, the adhesive application means is made to penetrate an adhesive 60 into a sponge (elastic body having an open cell structure) 61 to form an adhesive. 60b is applied to the flow path end surface 106 of the piezoelectric module 100. Since the adhesive 60 penetrates into the sponge 61 by the capillary force, the viscosity of the adhesive 60 is at least 1500 [m · Pa · s] or less, preferably 500.
[m ・ Pa ・ s] or less. More preferably 200 [m · Pa · s]
Below. The lower the viscosity, the better. Particularly, in this embodiment, as in the fourth embodiment, an epoxy adhesive diluted with a solvent 65 such as acetone is used as the adhesive.

First, the sponge 61 is dipped in the adhesive 60, and the adhesive 60 is permeated into the inside of the sponge 61 (permeating adhesive 60a) (FIG. 6 (a)).

The piezoelectric module 10 is attached to the sponge 61.
The channel end surface 106 of 0 is pressed (FIG. 6B).

On the surface of the sponge 61 against which the piezoelectric module 100 is pressed, the adhesive 60b seeps out and is applied to the flow path end surface 106 (FIG. 6C).

Next, the adhesive 60c applied to the flow path end face 106 is subjected to desolvation 65 treatment such as depressurization treatment to prevent residual bubbles after joining. (FIG. 6D) Next, the nozzle substrate 101 and the piezoelectric module 100 are aligned, and finally, the adhesive 60c is pressure-hardened according to the desired curing conditions (FIG. 6E).

The adhesive applying means of this embodiment is the adhesive 6
Sponge 61 for directly applying 0 to the flow path end face 106
Serves as a cushioning material, and the application surface (flow path end surface 106)
It is possible to apply a small amount of the adhesive 60c with a uniform thickness without depending on the flatness of the adhesive.

[0029]

According to the method of manufacturing an inkjet head of the present invention, it is possible to efficiently manufacture a head having high density and highly integrated nozzles without impairing the ink ejection performance originally possessed by the inkjet head.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of an inkjet head according to a manufacturing method of the present invention.

2A to 2F are manufacturing process diagrams showing a first embodiment of a method for manufacturing an inkjet head according to the present invention.

3A to 3H are manufacturing process diagrams showing a second embodiment of the method of manufacturing an inkjet head according to the present invention.

4A to 4C are manufacturing process diagrams showing a third embodiment of the method for manufacturing an inkjet head according to the present invention.

5A to 5D are manufacturing process diagrams showing a fourth embodiment of the method of manufacturing an inkjet head according to the present invention.

6A to 6E are manufacturing process diagrams showing a fifth embodiment of the method for manufacturing an inkjet head according to the present invention.

FIG. 7 is a manufacturing process diagram illustrating a conventional inkjet head and a manufacturing method thereof.

FIG. 8 is a manufacturing process drawing of the same.

FIG. 9 is a manufacturing process drawing of the same.

[Explanation of symbols]

 20 intaglio 21 flat plate 22 film-like stencil 23 intaglio recess 24 adhesive 24a adhesive applied to the flow path end face 24b adhesive left on the intaglio 25 doctor blade 26 doctor blade movement direction 30 adhesive 30a elastic Transferred adhesive agent 30b Adhesive agent left on intaglio 30c Adhesive agent applied to flow path end face 30d Adhesive agent left on elastic body 31 Elastic body 32 Printing pressure direction 33 Printing pressure direction 40 Adhesive 41 Adhesive Penetration direction 50 Adhesive and its moving direction 50a Atomized adhesive 50b Adhesive applied on the end face of flow path 51 Spray nozzle 52 Solvent 60 Adhesive 60a Adhesive penetrating into sponge and its penetrating direction 60b Surface of sponge Adhesive 60c Adhesive applied to the flow path end face 61 sponge 62 container 63 module Moving direction 64 Moving direction of module 65 Solvent 100 Piezoelectric module 101 Nozzle substrate 102 Nozzle opening 103 Piezoelectric substrate 104 Piezoelectric substrate 105 Upper lid substrate 106 Flow path end face 107 Flow path 108 Side wall 109a Side wall electrode 109b Side wall electrode 109c Surface electrode 110 Pressure generating chamber 111 Ink supply means 112 Nozzle arrangement direction 113 Longitudinal direction 114 Flow path upper surface 200 Piezoelectric module 201 Upper substrate 202 Lower substrate 203 Flow path end face 204 Flow path 205 Side wall 206 Pressure generating chamber 207 Electrode 207a Side wall electrode 207b Side wall electrode 207c Surface electrode 208 Up and down Electrical connection surface of substrate 209 Ink supply means

Claims (7)

[Claims] 1. A flow formed by adhering a nozzle substrate having a plurality of nozzles formed thereon and one or a plurality of flow path members forming a plurality of parallel flow paths having intervals in the nozzle array direction. A method for manufacturing an ink jet head, which is configured by adhering a channel forming member, changes the pressure in the flow path, and ejects ink droplets from a nozzle located at one end of the flow path, wherein the nozzle substrate At least one of an adhering step for adhering the flow path forming member and an adhering step for adhering the flow path members to each other includes at least a step of pressing the adhesive to the concave portion of the intaglio plate, and a surface to be adhered. And at least one of the surfaces to be adhered is pressed against the concave portion of the intaglio plate to apply an adhesive to the surface to be adhered. 2. The at least one bonding step according to claim 1, wherein the step of pressing the adhesive against the concave portion of the intaglio plate, the step of pressing the elastic body against the intaglio plate, and transferring the adhesive agent to the elastic body side, A step of pressing an elastic body against at least one of the adherend surfaces to apply an adhesive, and a method for manufacturing an inkjet head. 3. A method for manufacturing an inkjet head, wherein the intaglio plate according to claim 1 or 2 is composed of a flat plate and a film-shaped stencil that is separably installed on the flat plate. 4. The method of manufacturing an inkjet head according to claim 1, wherein the depth of the recess of the intaglio is 0.003 [mm] or more and 0.02 [mm] or less. 5. The at least one bonding step according to claim 1, wherein the surfaces to be adhered are made to face each other and the surfaces are preliminarily superposed, and a viscosity between the superposed adhesion surfaces is at least 1500 [m. Pa · s] or less, and a step of permeating an adhesive agent. 6. The step of applying at least one bonding step according to claim 1, wherein an adhesive having a viscosity of 200 [m · Pa · s] or less is atomized and applied to at least one of the surfaces to be bonded. A method of manufacturing an inkjet head, comprising: 7. The step of adhering at least one of the steps of claim 1, wherein an adhesive having a viscosity of at least 1500 [m · Pa · s] is permeated into an elastic body having an open cell structure. A step of pressing at least one of the adherend surfaces against an elastic body having an open-cell structure to apply an adhesive to the adherend surfaces.