JP2001347657A - Ink jet head and ink jet recording apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ink jet head and an ink jet recording apparatus which can realize a high-density arrangement of nozzles, improve a reliability of a connection method for electrodes and a printed board and reduce costs. SOLUTION: Electrodes 41 and 42 of a wiring pattern set on the printed board are electrically connected to a discrete electrode 19 and a common electrode 20 with the use of an anisotropic conductive material containing conductive particles 44 of a constant size.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an ink jet head and an ink jet recording apparatus, and more particularly to an ink jet recording apparatus using an ink jet head having electrodes formed on a silicon substrate.

[0002]

2. Description of the Related Art The non-impact recording method has attracted attention for office use and the like because noise generation during recording is small enough to be ignored. Among them, the so-called inkjet recording method, which is capable of high-speed recording and capable of recording on so-called plain paper without requiring a special fixing process, is an extremely powerful method.
Conventionally, various methods have been proposed or already commercialized and put to practical use. Such an ink jet recording method,
Flying small droplets of recording liquid called so-called ink,
Recording is performed by attaching the recording liquid to a recording medium. The recording liquid is roughly classified into several methods according to a method of generating droplets of the recording liquid and a control method for controlling the flight direction of the droplets. Among them, in recent years, as a method capable of achieving high density and high integration using a silicon substrate, there is a technique described in JP-A-4-52214 and a technique described in JP-A-3-293141 as a method of manufacturing the same. This is a recording method in which a voltage is applied between the substrate and the electrode of the diaphragm, and the diaphragm is displaced by electrostatic force to eject ink. As a head forming method, a liquid chamber and a diaphragm are formed by etching a silicon substrate. Is what you do. Also, as a configuration of this inkjet head,
As described in JP-A-6-50601,
By providing a diaphragm in a part of the ink liquid chamber and providing the counter electrode in a direction different from that of the ink liquid chamber, the head is made denser and thinner, and stable driving of the diaphragm is realized. That is, a common electrode is formed on a diaphragm, an individual electrode facing the common electrode is formed on an electrode substrate, and both electrodes are precisely arranged with a minute gap. In addition, by using a substrate such as silicon which is easy to be etched as an electrode substrate, a groove for forming a minute gap,
An individual electrode located at the bottom can be easily formed. As a method of attaching the ink jet head to a printed board, there is disclosed a method of joining a head electrode and a printed board with an anisotropic conductive film as described in JP-A-7-246706. . As another connection method, a method using solder is generally known. Both the anisotropic conductive film and the solder are connected via a printed circuit board and an electrode, and a thermocompression bonding method is generally used.

In an electrostatic ink jet head, an individual electrode formed on an electrode substrate and a common electrode formed on a diaphragm substrate are capacitively coupled. It is necessary to apply a voltage from the outside of the inkjet head using a printed circuit board. then,
It is preferable to join the individual electrodes and the common electrode at once from the viewpoint of reducing the processing cost. For this purpose, a structure is employed in which the common electrode formed on the diaphragm substrate is drawn to the same position as the individual electrode rows.

[0004]

However, when the diaphragm substrate is bonded to the electrode substrate, a step is formed between the diaphragm substrate and the electrode substrate because the diaphragm substrate has a thickness. Therefore, there is a technical problem in terms of reliability in simultaneously connecting the common electrode formed on the diaphragm substrate and the individual electrodes formed on the electrode substrate to the printed circuit board.

The present invention has been made to solve these problems, and realizes a high-density nozzle arrangement, improves the reliability of a method of connecting electrodes to a printed circuit board, and reduces costs. It is an object to provide an ink jet head and an ink jet recording apparatus which can be used.

[0006]

SUMMARY OF THE INVENTION In order to solve the above problems, a nozzle substrate having a nozzle for discharging ink, a liquid chamber communicating with the nozzle, and a pressure applied to the ink in the liquid chamber. It has a diaphragm substrate on which a diaphragm to be applied is formed, an electrode substrate on which individual electrodes are arranged opposite to the diaphragm with a small gap therebetween, and a printed circuit board for applying a voltage to the individual electrodes. According to the inkjet head of the present invention, the common electrode electrically connected to the diaphragm is formed with a step on the electrode substrate, and the printed board is electrically connected to the individual electrode and the common electrode. It is characterized in that an electrode of a wiring pattern provided on a printed circuit board is electrically connected to an individual electrode and a common electrode using an anisotropic conductive material containing conductive particles. And it is preferable that the particle diameter of the particles is larger than the step. Therefore, even if there is a step between the common electrode and the electrode substrate having the individual electrodes, the connection can be made to the printed board at the same time, and the reliability of the connection method between the electrode and the printed board can be improved.

According to another aspect of the present invention, there is provided a nozzle substrate on which a nozzle for discharging ink is formed, a liquid chamber communicating with the nozzle, and a vibration plate for applying pressure to the ink in the liquid chamber. A diaphragm substrate, an electrode substrate in which individual electrodes facing the diaphragm are formed in recesses, and a printed circuit board for applying a voltage to the individual electrodes, wherein the printed circuit board and the individual electrodes are electrically connected. According to the ink jet head, the electrodes of the wiring pattern provided on the printed circuit board and the individual electrodes are electrically connected using an anisotropic conductive material containing conductive particles of a certain size. There is a feature. The particle size of the particles is preferably larger than the depth from the surface of the electrode substrate to the surface of the individual electrode.
Therefore, even if there is a depth between the individual electrode and the surface of the electrode substrate, the individual electrode can be connected to the printed board at the same time, and the reliability of the connection method between the electrode and the printed board can be improved.

Further, as another invention, a nozzle substrate having a nozzle for discharging ink, a liquid chamber communicating with the nozzle, and a vibration plate for applying pressure to the ink in the liquid chamber are formed. A common electrode electrically connected to the diaphragm, comprising: a vibrating plate substrate; an electrode substrate in which individual electrodes facing the vibrating plate are formed in the recesses; and a printed circuit board for applying a voltage to the individual electrodes. Is formed on the electrode substrate with steps, and according to the inkjet head in which the printed circuit board and the individual electrodes and the common electrode are electrically connected, an anisotropic conductive material containing conductive particles of a certain size is used. Thus, it is characterized in that the electrodes of the wiring pattern provided on the printed board are electrically connected to the individual electrodes and the common electrode. The particle size of the particles is preferably larger than the larger of the depth and the step from the surface of the electrode substrate to the surface of the individual electrode. Therefore, it is possible to provide an ink jet head that can realize a high-density nozzle arrangement, improve the reliability of the method of connecting the electrodes to the printed circuit board, and reduce the cost.

[0009] The ink jet recording apparatus according to the present invention comprises:
It is characterized by having the above-mentioned inkjet head.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION An ink jet head according to the present invention uses an anisotropic conductive material containing conductive particles having a particle diameter larger than a step to form a wiring pattern provided on a printed circuit board. The feature is that the electrodes are electrically connected to the individual electrodes and the common electrode.

[0011]

FIG. 1 is a schematic sectional view showing the structure of an ink jet recording apparatus according to the present invention. As shown in FIG. 1, the ink jet recording apparatus 100 includes four ink cartridges 102 each containing ink of each color of cyan C, magenta M, yellow Y, and black BK, and a plurality of nozzles. Ink supply 4
Inkjet heads 103, a carriage 104 on which the ink cartridges 102 and the inkjet heads 103 are mounted, and a paper feed tray 105 for storing recording paper.
a transport roller 108 for transporting the recording paper from the a, 105b or the manual feed table 106 to the printing unit 107; and a discharge roller 110 for discharging the printed recording paper to a discharge tray 109. When printing the image data sent from the host device on the recording paper, the carriage 104 scans the carriage roller 111 while scanning the carriage roller 1.
In 08, ink is ejected from the nozzles of the inkjet head 103 onto the recording paper sent to the printing unit 107 in accordance with image data to record characters and images.

Next, the ink jet recording apparatus 10 shown in FIG.
The ink jet head 1 used for the ink jet head 0 is an external view of the ink jet head according to the first embodiment of another invention, FIG. 2, FIG.
As shown in FIG. 4 which is a cross-sectional view taken along the line B ′, the liquid chamber substrate 11,
A diaphragm board 12, an electrode board 13, a flexible printed wiring board (hereinafter abbreviated as FPC) 14, which is a printed board,
Two rows of staggered nozzles 15, F arranged in a row
The base 16 of the PC 14, the electrode lead 17 of the FPC 14,
The printed pattern 18 of the FPC 14, the individual electrode 19, the vibration plate 20 also serving as a common electrode, the liquid chamber 21, and the electrode lead 17 of the FPC 14 and the individual electrode 19 of the electrode substrate 13 are electrically connected, for example, solder, anisotropic conductive It comprises a conductive adhesive 22 such as a film or an anisotropic conductive paste. Further, the common liquid chamber 23 communicates with each liquid chamber 21,
A liquid chamber for supplying ink. The gap 24 is a gap between the individual electrode 19 and the diaphragm 20. Fluid resistance 2
5 is between the liquid chamber 21 and the common liquid chamber 23 and the liquid chamber substrate 11
And the diaphragm substrate 12 are formed close to each other. The electrode substrate 13 is made of a conductor or a semiconductor, and includes a conductive substrate 26 and an insulating layer 27 formed thereon. Also, the ink supply port 28
Is a supply port for supplying ink from an ink tank (not shown) to the communicating common liquid chamber 23. Further, the liquid chamber 2
1. Since the nozzle pitch is doubled by arranging the nozzles 15 in two rows in a staggered arrangement, the nozzles 15 can be formed as a common ink supply port 28 for supplying ink to both nozzles, so that the head area can be used effectively. Note that, for the sake of simplicity, ink supply means to the ink supply port and the like are omitted.

The liquid chamber substrate 11 is formed with a groove by a well-known method such as machining such as dicing or electroforming such as etching, and is joined to the diaphragm substrate 12 so as to be common to the nozzle 15 and the liquid chamber 21. A liquid chamber 23 can be formed. As a material of the liquid chamber substrate 11,
Metals such as stainless steel, semiconductors such as Si, and insulating materials such as glass are used. In addition, as a joining method, a dry film may be used. A nozzle substrate (not shown) is bonded on the liquid chamber substrate 11 with an adhesive. The ejection surface of the nozzle surface is subjected to a water-repellent treatment by a known method (eg, plating or coating with a water-repellent agent) in order to ensure water repellency with the ink.

Further, the diaphragm substrate 12 is formed by etching a metal such as stainless steel or a semiconductor such as Si.
This is preferable because a fine pattern can be formed with a desired thickness with high accuracy and the diaphragm substrate itself can be used as a common electrode. When an insulating material such as glass is used, a common electrode can be formed by depositing a metal such as Al, Cu, Cr, Ni, or Au on the surface by vapor deposition or sputtering. The diaphragm substrate 12 has a concave portion in which the diaphragm 20 is formed on the bottom surface by a known method such as mechanical processing such as partial polishing or electroforming such as etching. Further, a part of the diaphragm substrate 12 is
The common electrode pad extends to the individual electrode 19 side and is connected to a printed circuit board.

The electrode substrate 13 is formed by etching a metal such as stainless steel or a semiconductor such as Si.
Forming a gap 24 of a desired height, further to the gap 24, an insulating material such as resin or SiO ₂ insulating layer 2
7 is formed. On top of that, Ni, A
1, electrode material such as Ti / Pt, Cu, etc.
An individual electrode can be formed only in the gap by forming a film to a desired thickness by a film forming technique such as VD or vapor deposition, and then forming and etching a photoresist. Therefore, the structure of the electrode substrate 13 is made of a conductor or a semiconductor and has a conductive substrate 26.
Then, a concave portion corresponding to the gap 24 with the diaphragm 20 is formed on the insulating layer 27 formed thereon, and the individual electrode 19 formed of a conductive material is formed on the bottom surface thereof. ing. In addition, on the surface of the electrode substrate 13, by extracting and fixing a part of the above-described common electrode in a region other than the common electrode formation portion, the individual electrode and the common electrode can be formed in substantially the same plane. This facilitates connection with a printed circuit board (printed circuit board for driving the head) described later. The diaphragm substrate 12 and the electrode substrate 13 are joined by a direct joining method such as an adhesive or anodic joining. Further, on the individual electrode 19, an insulating layer made of SiO ₂ or a resist material may be formed except for a connection portion with a printed board for the purpose of further preventing the electrode from being damaged by short circuit or discharge. .

FIG. 5 is a view showing an electrode portion of the electrode substrate. FIG. 5 (a) is a plan view, and FIG. 5 (b) is a cross section taken along line CC 'of FIG. FIG. As shown in FIG. 3B, a step h occurs between the vibration plate 20 also serving as a common electrode and each upper surface of the electrode substrate 13. The value of the step h is generally formed to be substantially the same as the thickness of the diaphragm 20,
It is preferable because it can be formed at the same time as the shape of the diaphragm 20, and its value is 1 to 20 μm.

On the other hand, as the FPC 14 which is a printed board connected to the individual electrodes 19, a plate-shaped printed board made of glass epoxy resin or phenol resin, or a film-shaped FPC made of polyimide resin, PET resin or the like is used. Can be Further, on the FPC 14, as shown in FIG. 6, a pattern 41 for connecting to the individual electrode 19 of FIG. 4, and a pattern 42 for connecting to the diaphragm 20 also serving as a common electrode.
Are formed. Examples of a method of electrically connecting the electrode lead 17 on the FPC 14 to the individual electrode 19 and the electrode pad of the common electrode include a method of thermocompression bonding of solder, a method of thermocompression bonding with an anisotropic conductive adhesive, and a method of bonding between electrodes. And a wire bonding method. The wire bonding method is a highly reliable connection method because the electrodes are directly connected to each other with a metal wire, so that the connection resistance is low. The method of thermocompression bonding of solder, the method of thermocompression bonding with an anisotropic conductive adhesive, and the method of press-contacting between electrodes are easy to process because connections between multiple electrodes can be made at once.
This is an excellent method in that it is low in cost. further,
Among these, the method of thermocompression bonding of the FPC 14 and the electrode substrate with solder or an anisotropic conductive film is such that the substrates are bonded to each other after the compression, so that the electrical connection and the fixing of the FPC are simultaneously performed, and the processing, assembly, This is an excellent connection method in that a new bonding step for bonding is not required to improve reliability so that a connection portion cannot be removed in a printing operation or the like.

The anisotropic conductive film, which is one of the conductive adhesives 22, is a schematic diagram when the diaphragm 20 also serving as a common electrode and the individual electrodes 19 are connected to the FPC 14 by an anisotropic conductive film. As shown in FIG. 7, a thermoplastic or thermosetting resin 43 is obtained by dispersing conductive particles 44 called a filler. The anisotropic conductive film is crushed, and the particles 44 called fillers are brought into contact with both electrodes to establish conduction between the electrodes. The particle size R of the particles 44 called the filler is determined by the vibration plate 20 serving also as the common electrode and the electrode substrate 13.
Is used. Vibration plate 2 also serving as printed patterns 41 and 42 of FPC 14 and common electrode
0, the conductive particles 44 are in contact with each other in the portion where the individual electrodes 19 are opposed to each other, so that the conductive particles are in contact with each other.

FIG. 8 is an enlarged view of the individual electrode section.
As shown in the figure, the individual electrode 19 is formed by forming a recess in the electrode substrate 13 by etching or the like, and is formed on the bottom surface of the above-described material. Since the diaphragm substrate is bonded onto the electrode substrate 13, a gap is formed between the upper surface of the electrode of the pattern 41 and the diaphragm substrate, and t in FIG. Since there is no diaphragm 20 at the portion connected to the printed board, the individual electrode 13 is in a state lowered by t from the upper surface of the electrode board 20. Therefore, the conductive particles 4 of the anisotropic conductive film
No. 4 connects the electrode with the step t lowered. At this time, by making the particle diameter R of the particles 44 larger than t,
Since the particles 44 come out from the upper surface of the electrode substrate 13, the particles 44 surely come into contact with the electrode pattern of the printed circuit board, and good conduction can be obtained. On the other hand, when it is smaller than t, the particles 44 enter the recesses of the electrode substrate, and it is difficult to reliably connect the electrode pattern of the printed circuit board to the individual electrodes. This point is clear from the experimental results shown in FIG. 9 described later.

FIG. 10 is a view showing an example of a connection process of the FPC 14 using an anisotropic conductive film for the conductive adhesive 22. As shown in FIG. 10A, first, the anisotropic conductive film is positioned on the electrode portion of the FPC 14 which is a printed circuit board so that the anisotropic conductive film is positioned on the end face of the FPC, and then temporarily press-bonded to be different from the FPC 14. Anisotropic conductive film is adhered. At this time, the anisotropic conductive film used is
A pattern connected to the diaphragm 20 also serving as a common electrode and a pattern connected to the individual electrodes 19 are formed by one sheet of anisotropic conductive film without separation. Thereafter, the protective film of the anisotropic conductive film is removed, and as shown in FIG. 10B, the electrode pad portion of the electrode substrate 13 and the FPC 14
The electrode lead 17 is aligned. And FIG.
As shown in (c) of FIG. 0, the heated pressure bonding head 51 is pressed against the electrode area to perform thermocompression bonding. As described above, the diaphragm 20 serving also as a common electrode having a step and the individual electrode 19 are connected to one another.
By connecting to the FPC 14 with a sheet of anisotropic conductive film, the connection process can be performed only once.

Next, the operation of the ink jet head of this embodiment will be described. First, the ink supplied from the ink supply pipe to the ink supply port 28 passes through the common liquid chamber 23 and fills the entire ink supply channel. When the individual electrodes 19 are individually energized according to the image information, an electrostatic force is generated between the individual electrodes 19 and the diaphragm 20, and the diaphragm 20 is displaced toward the individual electrodes 19. Next, when the power is turned off, the diaphragm 20 attempts to return to the original state. Due to the rapid volume change at this time, the ink is
5 and fly as droplets.

Here, the ink jet head of this embodiment under the following constitutional conditions was used under the condition that the driving voltage was 3
0 V, pulse width 10 μsec, continuous drive frequency 16
When the head unit was driven at kHz, as can be seen from the experimental results shown in FIG. 9, when h <R, good ink ejection was observed from all nozzles, and a high-quality printed image was obtained. This indicates that good connection is formed even with an electrode having a step.

The ink jet head obtained from the experimental results shown in FIG. 9 has 192 nozzles, an array density of nozzles (array density of individual electrodes) of 300 dpi, and a diaphragm size of 14 dots.
0 μm, length 2 mm, thickness 2 μm, a step h between the diaphragm serving as a common electrode and the electrode substrate having a height h of 2 μm, 4 μm, and 10 μm is used, and the width of the common electrode is 0.5 mm and the width of the individual electrode is 130 μm , And the gap is 0.5 μm. Also,
The anisotropic conductive film used had a thickness of 25 μm and a particle diameter R of 5 μm.

The ink jet head of the above embodiment is a so-called side shooter type head, but need not be limited to this, and it is needless to say that the present invention can be applied to a so-called edge shooter type head. That is, the present invention is not limited to the above embodiment, and needless to say, various modifications and substitutions can be made within the scope of the claims.

[0025]

As described above, the nozzle substrate on which the nozzles for discharging the ink are formed, the liquid chamber communicating with the nozzle, and the vibration plate for applying pressure to the ink in the liquid chamber are formed. A diaphragm substrate, an electrode substrate on which individual electrodes are arranged facing each other with a small gap therebetween, and a printed circuit board for applying a voltage to the individual electrodes. According to the inkjet head according to the present invention, a common electrode that is electrically connected to the electrode substrate is formed with a step on the electrode substrate, and the printed circuit board is electrically connected to the individual electrode and the common electrode. It is characterized in that the electrodes of the wiring pattern provided on the printed circuit board are electrically connected to the individual electrodes and the common electrode using the contained anisotropic conductive material. And it is preferable that the particle diameter of the particles is larger than the step. Therefore, even if there is a step between the common electrode and the electrode substrate having the individual electrodes, the connection can be made to the printed board at the same time, and the reliability of the connection method between the electrode and the printed board can be improved.

According to another aspect of the present invention, there is provided a nozzle substrate having a nozzle for discharging ink, a liquid chamber communicating with the nozzle, and a diaphragm for applying pressure to the ink in the liquid chamber. A diaphragm substrate, an electrode substrate in which individual electrodes facing the diaphragm are formed in recesses, and a printed circuit board for applying a voltage to the individual electrodes, wherein the printed circuit board and the individual electrodes are electrically connected. According to the ink jet head, the electrodes of the wiring pattern provided on the printed circuit board and the individual electrodes are electrically connected using an anisotropic conductive material containing conductive particles of a certain size. There is a feature. The particle size of the particles is preferably larger than the depth from the surface of the electrode substrate to the surface of the individual electrode.
Therefore, even if there is a depth between the individual electrode and the surface of the electrode substrate, the individual electrode can be connected to the printed board at the same time, and the reliability of the connection method between the electrode and the printed board can be improved.

Further, as another invention, a nozzle substrate formed with nozzles for ejecting ink, a liquid chamber communicating with the nozzle, and a vibration plate for applying pressure to the ink in the liquid chamber are formed. A common electrode electrically connected to the diaphragm, comprising: a vibrating plate substrate; an electrode substrate in which individual electrodes facing the vibrating plate are formed in the recesses; and a printed circuit board for applying a voltage to the individual electrodes. Is formed on the electrode substrate with steps, and according to the inkjet head in which the printed circuit board and the individual electrodes and the common electrode are electrically connected, an anisotropic conductive material containing conductive particles of a certain size is used. Thus, it is characterized in that the electrodes of the wiring pattern provided on the printed board are electrically connected to the individual electrodes and the common electrode. The particle size of the particles is preferably larger than the larger of the depth and the step from the surface of the electrode substrate to the surface of the individual electrode. Therefore, it is possible to provide an ink jet head that can realize a high-density nozzle arrangement, improve the reliability of the method of connecting the electrodes to the printed circuit board, and reduce the cost.

The ink jet recording apparatus according to the present invention comprises:
It is characterized by having the above-mentioned inkjet head.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a configuration of an ink jet recording apparatus of the present invention.

FIG. 2 is an external view of an inkjet head according to another embodiment of the present invention.

FIG. 3 is a view taken in the direction of arrow A in FIG. 2;

FIG. 4 is a sectional view taken along line B-B 'of FIG.

FIG. 5 is a view showing an electrode portion of the electrode substrate.

FIG. 6 is a plan view showing a pattern on a printed circuit board.

FIG. 7 is a schematic diagram when a diaphragm serving also as a common electrode and individual electrodes are connected to an FPC with an anisotropic conductive film.

FIG. 8 is an enlarged view of an individual electrode unit.

FIG. 9 is a view showing an experimental result.

FIG. 10 is a process chart when a printed circuit board is connected to individual electrodes.

[Explanation of symbols]

11: liquid chamber substrate, 12: diaphragm substrate, 13: electrode substrate,
14, 28: printed circuit board, 15: nozzle, 16: base, 17: electrode lead, 18: printed pattern, 1
9: individual electrode, 20: diaphragm, 21: liquid chamber, 22: conductive adhesive, 23: common liquid chamber, 24: gap, 25: fluid resistance, 26: substrate, 27: insulating layer, 28:
Ink supply ports, 41 and 42: pattern, 43: resin, 4
4: Particles, 51: Crimping head.

Claims (7)

[Claims] A nozzle substrate on which a nozzle for discharging ink is formed, a liquid chamber communicating with the nozzle, and a diaphragm substrate on which a diaphragm for applying pressure to the ink in the liquid chamber is formed. An electrode substrate on which an individual electrode is formed facing the diaphragm with a small gap therebetween, and a printed circuit board for applying a voltage to the individual electrode, and electrically connected to the diaphragm. A common electrode is formed on the electrode substrate with a step, and in an ink jet head electrically connecting the printed board to the individual electrode and the common electrode, an anisotropic liquid containing conductive particles of a certain size is included. An ink-jet head, wherein an electrode of a wiring pattern provided on the printed board is electrically connected to the individual electrode and the common electrode using a conductive material. 2. The ink jet head according to claim 1, wherein the particle diameter of the particles is larger than the step. 3. A nozzle substrate on which a nozzle for discharging ink is formed, a liquid chamber communicating with the nozzle, and a diaphragm substrate on which a diaphragm for applying pressure to the ink in the liquid chamber is formed. An electrode substrate formed in a concave portion with an individual electrode opposed to the diaphragm, and a printed substrate for applying a voltage to the individual electrode, wherein the printed substrate and the individual electrode were electrically connected. In the inkjet head, using an anisotropic conductive material containing conductive particles of a certain size, electrically connecting the electrodes of the wiring pattern provided on the printed board and the individual electrodes. Characteristic inkjet head. 4. The ink jet head according to claim 1, wherein a particle diameter of the particles is larger than a depth from a surface of the electrode substrate to a surface of the individual electrode. 5. A nozzle substrate on which a nozzle for discharging ink is formed, a liquid chamber communicating with the nozzle, and a diaphragm substrate on which a diaphragm for applying pressure to the ink in the liquid chamber is formed. An electrode substrate in which a discrete electrode disposed opposite to the diaphragm is formed in a concave portion, and a printed circuit board for applying a voltage to the individual electrode, and a common electrode electrically connected to the diaphragm, An ink jet head formed on the electrode substrate with a step and electrically connecting the printed circuit board to the individual electrodes and the common electrode, wherein an anisotropic conductive material containing conductive particles of a certain size is used. An inkjet head, wherein an electrode of a wiring pattern provided on the printed board is electrically connected to the individual electrode and the common electrode. 6. The ink jet head according to claim 1, wherein a particle diameter of the particles is larger than a larger one of a depth from a surface of the electrode substrate to a surface of the individual electrode and the step. 7. An ink jet recording apparatus comprising the ink jet head according to claim 1.