JP2018158466A - Method for manufacturing actuator device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid an increase in a size of an actuator device, and surely perform electrical connection between individual wires and individual contact points.SOLUTION: In an overlapping region overlapping a flow channel substrate 11 in a COF 18, a region which does not include a plurality of individual wires 18f and includes at least a part of each common wire 18g is represented by a first region R1, and a region including all of the plurality of individual wires 18f is represented by a second region R2. An adhesive A is interposed between the flow channel substrate 11 and the COF 18, the COF 18 and the flow channel substrate 11 are heated at a uncured temperature that is lower than a curing temperature of the adhesive A and prevents the adhesive A to be cured, and the COF 18 is temporarily bonded to the flow channel substrate 11. Then, the first region R1 is heated and pressurized at the curing temperature at which the adhesive A is cured, and then the second region R2 is heated and pressurized at a curing temperature at which the adhesive A is cured. A shortest distance (distance S) from the outer edge of each of the first regions R1 to the plurality of individual wires 18f is the minimum interval (interval D) of the plurality of individual wires 18f, or more.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a method for manufacturing an actuator device including an adhesion step of adhering a wiring board to an actuator substrate using a thermosetting adhesive.

  In a method for manufacturing an actuator device, a technique for bonding a wiring board to an actuator board using a thermosetting adhesive is known. For example, in Patent Document 1 (Claim 1, paragraphs 0021-0024, FIGS. 3 and 4), an anisotropic conductive sheet is interposed between a head chip (actuator substrate) and a flexible substrate (wiring substrate). An example of a manufacturing method including a temporary pressure-bonding process in which the vicinity of both ends of the wiring board is thermocompression bonded and a main pressure-bonding process in which a central region of the wiring board is thermocompression bonded after the temporary pressure bonding process is shown. In the above example, terminals are not provided near both ends of the wiring board. Patent Document 1 (FIG. 8) shows an example in which common wiring is provided in the vicinity of both ends of a wiring board.

Japanese Patent Laid-Open No. 2006-30402

  In Patent Document 1 (FIGS. 3 and 4), no terminals are provided near both ends of the wiring board. Therefore, an extra area for the temporary crimping process is required on the flow path substrate and the wiring substrate, leading to an increase in the size of the actuator device.

  In Patent Document 1 (FIG. 8), although terminals are provided in the vicinity of both ends of the wiring board, the shortest distance from the outer edge of the pressurization region (near both ends) to the individual wiring in the temporary press-bonding process is plural. It is smaller than the minimum interval between wirings. The inventor of the present application has found that the following problems may occur in such a case.

  When a certain area of the wiring board is heated and pressurized, the reaction of the adhesive proceeds by heating not only in the area but also in the surrounding area. In other words, in the surrounding area, the adhesive is semi-cured before receiving an appropriate pressure. Therefore, when the individual wiring is arranged outside the pressurization area, if the shortest distance from the outer edge of the pressurization area to the individual wiring is small, the part where the individual wiring is provided is semi-cured, and the individual wiring and the individual wiring There may be a problem that the electrical connection with the contact is not properly made.

  An object of the present invention is to provide a method of manufacturing an actuator device that can avoid an increase in size of the actuator device and can reliably perform electrical connection between individual wirings and individual contacts.

  In a first aspect, a method of manufacturing an actuator device according to the present invention includes a thermosetting adhesive between an actuator substrate having a plurality of individual contacts and a common contact and a wiring substrate having a plurality of individual wires and a common wire. And bonding the plurality of individual contacts and the plurality of individual wires, respectively, and electrically connecting the common contacts and the common wires, and the actuator substrate in the wiring substrate. In an overlapping region overlapping with the first region, the region that does not include the plurality of individual wires and includes at least a part of the common wires, and the second region is a region that includes all of the plurality of individual wires, The bonding step includes a first bonding step in which the first region is heated and pressed at a curing temperature at which the adhesive is cured, and after the first bonding step, the second region is moved to the hard region. And a second bonding step of applying heat and pressure at a temperature, characterized in that the shortest distance from the outer edge of the first region to the plurality of individual wires to more minimum spacing between said plurality of individual wires.

  In a second aspect, a method for manufacturing an actuator device according to the present invention includes an actuator substrate having a plurality of individual contacts and a common contact and a wiring substrate having a plurality of individual wires and a common wire via a thermosetting adhesive. And bonding the plurality of individual contacts and the plurality of individual wires, respectively, and electrically connecting the common contacts and the common wires, and the actuator substrate in the wiring substrate. In an overlapping region overlapping with the first region, the region that does not include the plurality of individual wires and includes at least a part of the common wires, and the second region is a region that includes all of the plurality of individual wires, In the bonding step, the second region is heated and pressed at a curing temperature at which the adhesive is cured, and after the third bonding step, the first region is moved to the hard region. Characterized in that it comprises a fourth bonding step of applying heat and pressure at a temperature.

  In a third aspect, a method for manufacturing an actuator device according to the present invention includes an actuator substrate having a plurality of individual contacts and a common contact and a wiring substrate having a plurality of individual wires and a common wire via a thermosetting adhesive. And bonding the plurality of individual contacts and the plurality of individual wires, respectively, and electrically connecting the common contacts and the common wires, and the actuator substrate in the wiring substrate. In the overlapping region overlapping with the plurality of individual wirings and a region not including at least a part of the common wiring as a third region and the entire overlapping region as a fourth region, the bonding step Is a fifth bonding step in which the third region is heated and pressurized at a curing temperature at which the adhesive is cured, and after the fifth bonding step, the fourth region is at the curing temperature. Characterized in that it comprises a sixth bonding step of applying heat pressure.

1 is a schematic plan view of a printer 100 including a head 1 according to a first embodiment of the present invention. 2 is a plan view of the head 1. FIG. It is sectional drawing along the III-III line of FIG. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 2 (illustration of the diaphragm 12a, the common electrode 12b, and the interlayer insulating film 12i is omitted). 3 is a flowchart showing a method for manufacturing the head 1. FIG. FIG. 5 is a cross-sectional view corresponding to FIG. 4 illustrating a manufacturing process of the head 1. FIGS. 6A and 6B are cross-sectional views corresponding to FIGS. 6B and 6C showing the manufacturing process of the head 201 according to the second embodiment of the present invention. FIGS. It is sectional drawing corresponding to FIG.6 (b), (c) which shows the manufacture process of the head 301 which concerns on 3rd Embodiment of this invention. It is sectional drawing corresponding to FIG.6 (b), (c) which shows the manufacture process of the head 401 which concerns on 4th Embodiment of this invention. It is sectional drawing corresponding to FIG.6 (b), (c) which shows the manufacture process of the head 501 which concerns on 5th Embodiment of this invention. It is sectional drawing corresponding to FIG.6 (b), (c) which shows the manufacture process of the head 601 which concerns on 6th Embodiment of this invention. It is sectional drawing corresponding to FIG.6 (b), (c) which shows the manufacture process of the head 701 which concerns on 7th Embodiment of this invention.

<First Embodiment>
First, an overall configuration of a printer 100 including a head unit 1x including the head 1 according to the first embodiment of the present invention will be described with reference to FIG. The head 1 corresponds to the actuator device of the present invention. The printer 100 includes a platen 3, a transport mechanism 4, and a control device 5 in addition to the head unit 1x.

  The head unit 1x is a line type (that is, a system that ejects ink to the paper 9 in a state where the position is fixed), and is long in a direction orthogonal to the transport direction. The head unit 1x includes four heads 1 arranged in a staggered manner along a direction orthogonal to the transport direction. The four heads 1 have the same structure. Each head 1 ejects ink from a plurality of nozzles 11n (see FIGS. 2 and 3).

  The platen 3 is disposed below the head unit 1x. Ink is ejected from each head 1 onto the paper 9 supported by the platen 3.

  The transport mechanism 4 includes two roller pairs 4a and 4b arranged with the platen 3 sandwiched in the transport direction. By driving the transport motor 4m, the two rollers constituting each of the roller pairs 4a and 4b rotate in opposite directions while sandwiching the paper 9, whereby the paper 9 is transported in the transport direction.

  The control device 5 controls the four heads 1, the transport motor 4m, and the like so that an image is recorded on the paper 9 based on a recording command input from an external device such as a PC.

  Next, the configuration of the head 1 will be described with reference to FIGS. The head 1 includes a flow path substrate 11, an actuator 12, and a COF 18. The flow path substrate 11 corresponds to the actuator substrate of the present invention, and the COF 18 corresponds to the wiring substrate of the present invention.

  As shown in FIG. 3, the flow path substrate 11 includes a reservoir member 11a, a pressure chamber plate 11b, and a nozzle plate 11c, which are bonded to each other. 2 and 3, a reservoir 11s, a plurality of pressure chambers 11m, a plurality of dummy pressure chambers 11md, a plurality of nozzles 11n, and a plurality of dummy nozzles 11nd are formed on the flow path substrate 11.

  The pressure chamber plate 11b is made of a silicon single crystal substrate, and has a plurality of pressure chambers 11m and a plurality of dummy pressure chambers 11md formed therethrough. The plurality of pressure chambers 11m and the plurality of dummy pressure chambers 11md have the same shape and size.

  As shown in FIG. 2, the plurality of pressure chambers 11m are arranged to form two pressure chamber rows 11mR. The plurality of pressure chambers 11m constituting each pressure chamber row 11mR are arranged at equal intervals in the arrangement direction (direction orthogonal to the transport direction). The two pressure chamber rows 11mR are arranged in a direction orthogonal to the arrangement direction (a direction parallel to the transport direction). The plurality of pressure chambers 11m are arranged in a staggered manner so that the positions in the arrangement direction are different from each other.

  The plurality of dummy pressure chambers 11md are arranged one by one at both ends of each pressure chamber row 11mR. The plurality of pressure chambers 11m and the plurality of dummy pressure chambers 11md are arranged at equal intervals in the arrangement direction of the plurality of pressure chambers 11m so that one dummy pressure chamber 11md is positioned at both ends in the arrangement direction. ing.

  A plurality of nozzles 11n and a plurality of dummy nozzles 11nd are formed through the nozzle plate 11c. The plurality of nozzles 11n communicate with each of the plurality of pressure chambers 11m, and the plurality of dummy nozzles 11nd communicate with each of the plurality of dummy pressure chambers 11md. The plurality of nozzles 11n and the plurality of dummy nozzles 11nd have the same shape and size. The nozzle plate 11c is bonded to the lower surface of the pressure chamber plate 11b.

  As shown in FIG. 2, the plurality of nozzles 11n are arranged in two rows, like the plurality of pressure chambers 11m, and are arranged in a staggered manner so that the positions in the arrangement direction are different from each other.

  The plurality of dummy nozzles 11nd are arranged one by one at both ends of each nozzle row, like the plurality of dummy pressure chambers 11md.

  The plurality of nozzles 11n eject ink as the volume of the corresponding pressure chamber 11m changes by driving the active portion 12x of the actuator 12. On the other hand, the plurality of dummy nozzles 11nd are provided with the active portion 12x at a position facing the dummy pressure chamber 11md, but the active portion 12x is not driven, and thus does not eject ink.

  As shown in FIG. 3, the actuator 12 is arranged on the upper surface of the pressure chamber plate 11b. The actuator 12 includes a diaphragm 12a, a common electrode 12b, a pair of piezoelectric bodies 12c, and a plurality of individual electrodes 12d in order from the bottom.

  The vibration plate 12a is a silicon dioxide film formed by oxidizing the surface of a silicon single crystal substrate constituting the pressure chamber plate 11b, and is formed on substantially the entire upper surface of the pressure chamber plate 11b.

  The common electrode 12b is an electrode common to the plurality of pressure chambers 11m, and is formed on substantially the entire top surface of the diaphragm 12a.

  The pair of piezoelectric bodies 12c is made of a piezoelectric material such as lead zirconate titanate (PZT) and extends in the arrangement direction on the upper surface of the common electrode 12b, and a plurality of pressure chambers constituting each pressure chamber row 11mR. 11m and a plurality of dummy pressure chambers 11md are covered.

  The plurality of individual electrodes 12d are individual electrodes for the plurality of pressure chambers 11m, and are disposed on the upper surface of each piezoelectric body 12c at positions facing each of the plurality of pressure chambers 11m. The plurality of individual electrodes 12d are also arranged at positions facing the respective dummy pressure chambers 11md on the upper surface of each piezoelectric body 12c.

  A portion sandwiched between the individual electrode 12d and the common electrode 12b in the piezoelectric body 12c functions as an active portion 12x that can be deformed in response to application of a voltage to the individual electrode 12d. That is, the actuator 12 has a plurality of active portions 12x facing the pressure chamber 11m or the dummy pressure chamber 11md. By driving the active part 12x facing the pressure chamber 11m (that is, by deforming the active part 12x in response to application of a voltage to the individual electrode 12d (for example, to be convex toward the pressure chamber 11m)), The volume of the pressure chamber 11m changes, pressure is applied to the ink in the pressure chamber 11m, and ink is ejected from the nozzle 11n. On the other hand, since the active portion 12x facing the dummy pressure chamber 11md is not driven, the volume of the dummy pressure chamber 11md does not change, and ink is not ejected from the dummy nozzle 11nd communicating with the dummy pressure chamber 11md.

  The actuator 12 is further provided with a piezoelectric protective film 12h, an interlayer insulating film 12i, a plurality of wirings 12e, and a wiring protective film 12j.

The piezoelectric protective film 12h has a function of preventing moisture in the air from entering the piezoelectric body 12c, and covers the pair of piezoelectric bodies 12c. The piezoelectric protective film 12h is made of, for example, aluminum oxide (alumina: Al ₂ O ₃ ). Note that the piezoelectric protective film 12h covers only the peripheral edge of each individual electrode 12d so that the driving of the active part 12x is not hindered, and the central part of each individual electrode 12d is exposed from the piezoelectric protective film 12h.

The interlayer insulating film 12i has a function of enhancing the insulation between the wiring 12e and the common electrode 12b, and is provided between the piezoelectric protective film 12h and the wiring 12e. The interlayer insulating film 12i is made of, for example, silicon dioxide (SiO ₂ ).

  The plurality of wirings 12e are formed on the upper surface of the interlayer insulating film 12i, and are connected to each of the plurality of individual electrodes 12d. Each wiring 12e is electrically connected to each individual electrode 12d by entering the through hole B that penetrates the piezoelectric protective film 12h and the interlayer insulating film 12i.

  As shown in FIG. 2, each of the plurality of wirings 12e is drawn to the downstream side in the transport direction and extends to a portion of the pressure chamber plate 11b that is not covered with the reservoir member 11a. An individual contact 12f is formed at the tip of the wiring connected to the individual electrode 12d facing the pressure chamber 11m among the plurality of wirings 12e. A dummy contact 12f 'is formed at the tip of the wiring connected to the individual electrode 12d facing the dummy pressure chamber 11md among the plurality of wirings 12e.

  The individual contacts 12f and the dummy contacts 12f ′ have the same shape and size as each other, and the dummy contacts 12f ′ are arranged at two ends at both ends in the arrangement direction at equal intervals (interval D) in the arrangement direction. Are arranged.

  A pair of common contacts 12g are further provided on the upper surface of the interlayer insulating film 12i so as to sandwich the plurality of individual contacts 12f and the plurality of dummy contacts 12f 'in the arrangement direction. The pair of common contacts 12g are electrically connected to the common electrode 12b by entering a through hole (not shown) that penetrates the interlayer insulating film 12i and the piezoelectric protective film 12h. The width (length in the arrangement direction) of each common contact 12g is larger than the width of each individual contact 12f and each dummy contact 12f '.

  A relatively large gap is formed between each common contact 12g and the individual contact 12f and the dummy contact 12f '. A pair of alignment marks M is provided in a portion corresponding to the gap on the upper surface of the interlayer insulating film 12i. The pair of alignment marks M are for aligning the COF 18 with the flow path substrate 11 and are made of the same material as that of the individual contact 12f and the dummy contact 12f '.

  The wiring protective film 12j has a function of improving the insulation between the plurality of wirings 12e, and is provided on the upper surface of the interlayer insulating film 12i so as to cover the plurality of wirings 12e. The wiring protective film 12j is made of, for example, silicon nitride (SiNx). The contacts 12f, 12f ', and 12g are not covered with the wiring protective film 12j.

  As shown in FIG. 3, the reservoir member 11a includes a reservoir 11s, a plurality of communication channels 11t that allow the reservoir 11s to communicate with each of the plurality of pressure chambers 11m, and a pair of recesses 11ax that respectively extend in the arrangement direction. Is formed. The reservoir member 11a is bonded to the upper surface of the pressure chamber plate 11b via the actuator 12 so that the pair of piezoelectric bodies 12c are accommodated in the pair of recesses 11ax, respectively. A plurality of through holes 12y are formed in portions of the actuator 12 that face the plurality of communication channels 11t.

  The reservoir 11s communicates with a tank for storing ink via a tube or the like. The ink in the tank is supplied to the reservoir 11s by driving a pump (not shown), and passes through the plurality of communication channels 11t and the plurality of through holes 12y, and the plurality of pressure chambers 11m and the pressure chambers 11mR. It is supplied to a plurality of dummy pressure chambers 11md. The ink supplied to each pressure chamber 11m is ejected from the nozzle 11n by driving the active portion 12x, but the ink supplied to each dummy pressure chamber 11md is not ejected from the dummy nozzle 11nd.

  As shown in FIG. 2, annular electrodes 12m and 12n are provided on the periphery of each through hole 12y. The annular electrode 12m surrounds each through-hole 12y corresponding to the pressure chamber row 11mR on the left side of FIG. 2, and the individual electrode 12d facing each pressure chamber 11m or each dummy pressure chamber 11md constituting the pressure chamber row 11mR. It is electrically connected to the wiring 12e connected to. On the other hand, the annular electrode 12n surrounds each through hole 12y corresponding to the pressure chamber row 11mR on the right side of FIG. 2 and is an individual electrode facing each pressure chamber 11m or each dummy pressure chamber 11md constituting the pressure chamber row 11mR. The wiring 12e connected to 12d is not electrically connected.

  As shown in FIG. 4, the COF 18 includes a plurality of individual wires 18f electrically connected to each of the plurality of individual contacts 12f and a plurality of dummy wires 18f electrically connected to each of the plurality of dummy contacts 12f ′. 'And a pair of common wirings 18g electrically connected to each of the pair of common contacts 12g. The dummy wiring 18f 'is not electrically connected to the individual contact 12f and the common contact 12g.

  The individual wiring 18f, the dummy wiring 18f ', and the common wiring 18g have the same shape and size as the individual contact 12f, the dummy contact 12f', and the common contact 12g, respectively, and face each other in the vertical direction. That is, the individual wiring 18f and the dummy wiring 18f ′ have the same shape and size as each other, are arranged at equal intervals (interval D) in the arrangement direction, and two dummy wirings 18f ′ are arranged at both ends of the arrangement direction. It is arranged so that. The pair of common wires 18g are arranged so as to sandwich a plurality of individual wires 18f and a plurality of dummy wires 18f 'in the arrangement direction. The width of each common wiring 18g (length in the arrangement direction) is larger than the width of each individual wiring 18f and each dummy wiring 18f '.

  The COF 18 is bonded to the flow path substrate 11 with a thermosetting adhesive A. The adhesive A is a film-like adhesive such as NCF (Non Conductive Film) and ACF (Anisotropic Conductive Film).

  One end of the COF 18 is electrically connected to the contacts 12f, 12f ', 12g, and the other end is electrically connected to the control device 5 (see FIG. 1).

  A driver IC 19 is mounted between one end and the other end of the COF 18 as shown in FIG. The driver IC 19 is electrically connected to each of the contacts 12f, 12f ', 12g and the control device 5 via wirings 18f, 18f', 18g. The driver IC 19 generates a drive signal for driving the active part 12x based on the signal from the control device 5, and supplies the drive signal to each individual electrode 12d. The potential of the common electrode 12b is maintained at the ground potential.

  Next, a method for manufacturing the head 1 will be described with reference to FIGS.

  First, the actuator 12 is formed (S1). Specifically, the vibration plate 12a made of a silicon dioxide film is formed on the surface of the silicon single crystal substrate to be the pressure chamber plate 11b by thermal oxidation or the like. Thereafter, a common electrode 12b is formed on the upper surface of the diaphragm 12a, a pair of piezoelectric bodies 12c is formed on the upper surface of the common electrode 12b, and a plurality of individual electrodes 12d are formed on the upper surface of each piezoelectric body 12c. Thereafter, a piezoelectric protective film 12h, an interlayer insulating film 12i, a plurality of wirings 12e, a plurality of contacts 12f, 12f ', 12g, annular electrodes 12m, 12n, a pair of alignment marks M, and a wiring protective film 12j are formed. Arbitrary techniques, such as sputtering and etching, may be used for forming each of the above parts. In the present embodiment, the plurality of wirings 12e, the plurality of contacts 12f, 12f ', 12g, the annular electrodes 12m, 12n, and the pair of alignment marks M are made of the same material and formed in the same process by etching.

  Next, the reservoir member 11a is bonded to the surface of the silicon single crystal substrate to be the pressure chamber plate 11b (S2).

  Next, after polishing the silicon single crystal substrate serving as the pressure chamber plate 11b to a predetermined thickness, etching is performed from the lower surface of the silicon single crystal substrate to form a plurality of pressure chambers 11m and a plurality of dummy pressure chambers 11md. (S3). At this stage, the silicon single crystal substrate becomes the pressure chamber plate 11b.

  Next, the nozzle plate 11c is bonded to the lower surface of the pressure chamber plate 11b (S4). At this stage, the flow path substrate 11 is completed.

  Next, the COF 18 is temporarily bonded to the flow path substrate 11 (S5: temporary bonding step).

  Regarding S5, specifically, as shown in FIG. 6A, first, the COF 18 is formed using a pair of alignment marks M in a state where the adhesive A is interposed between the flow path substrate 11 and the COF 18. The COF 18 is placed on the flow path substrate 11 in alignment with the flow path substrate 11. At this time, the plurality of individual contacts 12f and the plurality of individual wires 18f face each other, the plurality of dummy contacts 12f ′ and the plurality of dummy wires 18f ′ face each other, and the pair of common contacts 12g and the pair of common wires 18g. Are in a state of facing each other. In this state, the COF 18 and the flow path substrate 11 are heated at an uncured temperature (for example, 70 to 80 ° C.) that is lower than the curing temperature of the adhesive A and does not cure the adhesive A. At this time, the adhesive A exhibits tackiness but does not cure. At this time, since pressurization is not performed, the plurality of individual contacts 12f and the plurality of individual wires 18f are not electrically connected to each other, and the plurality of dummy contacts 12f ′ and the plurality of dummy wires 18f ′ are respectively electrically connected. The pair of common contacts 12g and the pair of common wires 18g are not electrically connected to each other.

  Next, the COF 18 is bonded to the flow path substrate 11 (S6: bonding step).

  In S6, the adhesive A is interposed between the flow path substrate 11 and the COF 18, the plurality of individual contacts 12f and the plurality of individual wirings 18f are opposed to each other, the plurality of dummy contacts 12f ′ and the plurality of dummy wirings 18f ′. And the pair of common contacts 12g and the pair of common wirings 18g are opposed to each other, the COF 18 and the flow path substrate 11 are heated and pressurized to cure the adhesive A. In heating and pressing, the COF 18 and the flow path substrate 11 are placed on a stage held at 100 ° C. or lower, and then the heating and pressing tools 51 and 52 (see FIGS. 6B and 6C) are placed in the COF 18. And it presses against the flow path substrate 11, and the adhesion part of COF18 and the flow path substrate 11 is 150-200 degreeC. As a result, the adhesive A is melted and then cured, whereby the plurality of individual contacts 12f and the plurality of individual wirings 18f are electrically connected to each other, and the plurality of dummy contacts 12f ′ and the plurality of dummy wirings 18f ′ are electrically connected. Are electrically connected to each other, and the pair of common contacts 12g and the pair of common wires 18g are electrically connected to each other.

  Regarding S6, specifically, as shown in FIG. 6B, first, the heating and pressing tool 51 is disposed on the pair of first regions R1 in the COF 18, and the adhesive A is placed on the pair of first regions R1. Heating and pressing is performed at a curing temperature for curing (S6a: first bonding step). The pair of first regions R1 is a region that does not include the plurality of individual wires 18f and includes at least a part of each common wire 18g in an overlapping region that overlaps the flow path substrate 11 in the COF 18, and is separated from each other in the arrangement direction. Yes.

  Each first region R1 is greatly separated from the plurality of individual wirings 18f in the arrangement direction. Specifically, the shortest distance (distance S) from the outer edge of each first region R1 to the plurality of individual wirings 18f is equal to or greater than the minimum distance (interval D) between the plurality of individual wirings 18f. More specifically, the distance S is a distance (350 μm or more) at which 15 or more individual wirings 18f can be arranged.

  In addition, the width (length in the arrangement direction) of each first region R1 is smaller than the width of each common wiring 18g, and each first region R1 is located at the center in the arrangement direction of each common wiring 18g. That is, each first region R1 does not include an end portion (an inner end portion in FIG. 6B) 18gx adjacent to the plurality of individual wirings 18f in each common wiring 18g. However, it is preferable that the pressurization area of each common wiring 18g (that is, the area overlapping each first region R1 in each common wiring 18g) be equal to or larger than the area necessary for reducing the contact resistance of each common wiring 18g. .

  In S6a, in the adhesive A, the first region R1 is cured and the peripheral region of the first region R1 is semi-cured.

  Next, as shown in FIG. 6C, the heating and pressing tool 52 is disposed in the second region R2 of the COF 18, and the curing temperature at which the adhesive A cures the second region R2 (the same as the curing temperature of S6a). Or may be different.) (S6b: second bonding step). The second region R2 is a region that includes all of the plurality of individual wires 18f in the overlapping region of the COF 18 that overlaps the flow path substrate 11, and is sandwiched between the pair of first regions R1 in the arrangement direction, and includes a plurality of dummy wires 18f. 'And the pair of common wires 18g are not included.

  A non-pressurized region Rn that is not heated and pressurized is provided between the first region R1 and the second region R2 in the overlapping region of the COF 18 that overlaps the flow path substrate 11. A dummy wiring 18f 'is provided in the non-pressurized region Rn. An alignment mark M is provided in a portion corresponding to the non-pressurized region Rn.

  In S6b, in the adhesive A, the second region R2 is cured and the peripheral region of the second region R2 is semi-cured.

  The head 1 is completed by the above steps S1 to S6.

  As described above, according to this embodiment, in the bonding step S6, heating and pressing are performed in two stages (see S6a and S6b in FIG. 5). Thereby, when performing 2nd adhesion process S6b, the part (a pair of 1st field R1 shown in Drawing 6 (b)) already fixed by 1st adhesion process S6a will exist, and channel board 11 and COF18 are included. Misalignment (as a result, poor adhesion and reduced reliability) can be suppressed.

  Moreover, each first region R1 includes at least a part of each common wiring 18g, and the second region R2 includes all of the plurality of individual wirings 18f (see FIG. 6C). Therefore, the flow path substrate 11 and the COF 18 do not require an extra area for the bonding step S6, and the head 1 can be prevented from being enlarged. Further, the shortest distance (distance S) from the outer edge of each first region R1 to the plurality of individual wirings 18f is set to be equal to or larger than the minimum distance (interval D) between the plurality of individual wirings 18f. Thereby, it is possible to avoid the presence of the individual wiring 18f in a portion where the semi-curing outside the first region R1 occurs, and it is possible to reliably perform the electrical connection between the individual wiring 18f and the individual contact 12f.

  The distance S is a distance (350 μm or more) at which 15 or more individual wirings 18 f can be arranged. In this case, the first region R1 is further separated from the individual wiring 18f, and it is more reliably avoided that the individual wiring 18f exists in a portion where the semi-curing outside the first region R1 occurs. Electrical connection with the contact point 12f can be performed more reliably.

  A dummy wiring 18f 'is provided between the first region R1 and the plurality of individual wirings 18f (see FIG. 6C). In order to suppress a difference in the shape of the individual wiring 18f depending on the formation position (as a result, a difference occurs in the ejection characteristics (the size of the ink droplet ejected from the nozzle 11n, the ejection speed, the ejection direction, etc.)) A wiring 18f ′ may be provided. According to the above configuration, by providing the dummy wiring 18f ′ between the first region R1 and the plurality of individual wirings 18f, the area from the outer edge of the first region R1 to the plurality of individual wirings 18f is secured. Can be used effectively without wasting it.

  An alignment mark M is provided in a portion corresponding to between the first region R1 and the plurality of individual wirings 18f (see FIG. 6C). In this case, as described above, it is possible to effectively use the area without wasting it while securing the distance from the outer edge of the first area R1 to the plurality of individual wirings 18f. The alignment mark M is useful for alignment between the COF 18 and the flow path substrate 11.

  Each first region R1 does not include the end portion (the inner end portion in FIG. 6B) adjacent to the plurality of individual wirings 18f in each common wiring 18g. In this case, the first region R1 is further away from the individual wiring 18f. Thereby, it is possible to more reliably avoid the presence of the individual wiring 18f in the portion where the semi-curing outside the first region R1 occurs, and the electrical connection between the individual wiring 18f and the individual contact 12f can be more reliably performed. . Since the common wiring 18g is wider than the individual wiring 18f, it is possible to realize electrical connection between the common wiring 18g and the common contact 12g without pressurizing the entire common wiring 18g.

  A non-pressurized region Rn that is not heated and pressurized is provided between the first region R1 and the second region R2 in the overlapping region that overlaps the flow path substrate 11 in the COF 18 (see FIG. 6C). Steps due to pressurization may occur at the boundary between each first region R1 and another region and the boundary between the second region R2 and another region. When a portion having such a step is pressed, heat and pressure are not properly performed, and adhesion failure may occur. In this regard, according to the above configuration, the problem can be suppressed by setting the portion where the step can occur as the non-pressurized region Rn.

  The width of each common wiring 18g is larger than the width of each individual wiring 18f. In this case, the contact resistance of the common wiring 18g can be reduced.

  A pair of first regions R1 separated from each other in the arrangement direction in the COF 18 are heated and pressurized. In this case, not only one end of the COF 18 in the arrangement direction but also both ends are heated and pressurized, so that the COF 18 can be evenly bonded in the arrangement direction.

  After the pair of first regions R1 separated from each other in the arrangement direction in the COF 18 are heated and pressurized, the second region R2 sandwiched in the arrangement direction by the pair of first regions R1 in the COF 18 is heated and pressurized. In this case, the positional displacement between the flow path substrate 11 and the COF 18 during the heating and pressurization of the second region R2 is suppressed, and the individual wiring 18f disposed in the center can be securely bonded.

  Prior to the bonding step S6, a temporary bonding step S5 is performed (see FIGS. 5 and 6A). In this case, the positional deviation between the flow path substrate 11 and the COF 18 in the bonding step S6 is suppressed. More specifically, when the pair of first regions R1 are heated and pressurized in the first bonding step S6a, the adhesive A in each first region R1 is first melted into a liquid before curing, and at this time, the flow path substrate 11 And COF 18 may be misaligned. However, at this time, the adhesive A in the second region R2 is temporarily bonded by the temporary bonding step S5, and is not solidified because it is not heated and pressurized. For this reason, when the pair of first regions R1 is heated and pressurized in the first bonding step S6a, the occurrence of displacement due to melting of the adhesive A in each first region R1 is suppressed.

Second Embodiment
Subsequently, a head 201 according to a second embodiment of the present invention will be described with reference to FIG.

  In the present embodiment, the region to be heated and pressed in the first bonding step S6a and the second bonding step S6b is opposite to that in the first embodiment. Specifically, in the present embodiment, the second region R2 is heated and pressurized in the first bonding step S6a (the third bonding step in the second aspect) (see FIG. 7A), and the second bonding step S6b. The pair of first regions R1 is heated and pressurized in the (fourth bonding step in the second aspect) (see FIG. 7B).

  Also in the present embodiment, as in the first embodiment, by performing heating and pressurization in two stages, it is possible to suppress misalignment between the flow path substrate 11 and the COF 18 (and hence poor adhesion and reduced reliability). it can. In the present embodiment, the second region R2 including all of the plurality of individual wirings 18f is first heated and pressurized, and then the first region including the plurality of individual wirings 18f and including at least a part of the common wiring 18g. R1 is heated and pressurized. In this way, by including all of the plurality of individual wirings 18f in the region to be heated and pressurized first, the electrical connection failure between the individual wirings 18f and the individual contacts 12f due to the semi-curing of the adhesive A outside the pressing region. Is suppressed, and the electrical connection between the individual wiring 18f and the individual contact 12f can be reliably performed.

  After heating and pressurizing the second region R2 sandwiched between the pair of first regions R1 in the COF 18 in the arrangement direction, the pair of first regions R1 separated from each other in the arrangement direction in the COF 18 is heated and pressurized. In this case, the portion of the adhesive A provided with the individual wiring 18f is fixed by fixing the individual wiring 18f whose pitch is narrower than that of the common wiring 18g and is difficult to align first, and then heating and pressing the other portions later. The reliability of electrical connection between the individual wiring 18f and the individual contact 12f is improved without being semi-cured.

  Also in the present embodiment, as in the first embodiment, the temporary bonding step S5 is performed before the bonding step S6 (see FIGS. 5 and 6A). In this case, the positional deviation between the flow path substrate 11 and the COF 18 in the bonding step S6 is suppressed. More specifically, when the second region R2 is heated and pressurized in the first bonding step S6a, the adhesive A in the second region R2 is first melted into a liquid before curing, and at this time, the flow path substrate 11 and the COF 18 Can be misaligned. However, at this time, the adhesive A in the pair of first regions R1 is temporarily bonded by the temporary bonding step S5, and is not heated and pressurized, and thus remains solid. For this reason, when the second region R2 is heated and pressurized in the first bonding step S6a, it is possible to suppress the occurrence of displacement due to the melting of the adhesive A in the second region R2.

  Further, the pair of common wirings 18g is not included in the second region R2. In this case, it is suppressed that a level | step difference arises in the area | region where a pair of common wiring 18g is arrange | positioned in 1st adhesion process S6a.

<Third Embodiment>
Next, a head 301 according to a third embodiment of the invention will be described with reference to FIG.

  In the present embodiment, as in the second embodiment, a region in the center in the arrangement direction is heated and pressurized in the first bonding step S6a (third bonding step in the second aspect), and the second bonding step S6b (the second bonding step described above). In the fourth bonding step in view), the vicinity of both ends in the arrangement direction is heated and pressurized, but the second region R2 ′ heated and pressurized in the first bonding step S6a is larger than the second region R2 of the second embodiment (FIG. 7 ( a) and FIG. 8A), each of the pair of first regions R1 ′ heated and pressurized in the second bonding step S6b is larger than each first region R1 of the second embodiment (FIG. 7B and FIG. 8A). (Refer FIG.8 (b)).

  The second region R2 'includes an end portion (an inner end portion in FIG. 8A) 18gx adjacent to the plurality of individual wires 18f in the arrangement direction of each common wire 18g. That is, in the first bonding step S6a, the end portions of the pair of common wirings 18g are heated and pressurized, and in the second bonding step S6b, the remaining part of the pair of common wirings 18g is heated and pressurized. Thereby, a pair of common wiring 18g can be adhere | attached reliably.

  The pair of first regions R1 'are regions on both outer sides in the arrangement direction of the second region R2' in the overlapping region. The pair of first region R1 'and second region R2' are in contact with each other in the arrangement direction without overlapping each other, and the pair of first region R1 'and second region R2' constitute the entire overlapping region. That is, after the second region R2 ′ at the center in the arrangement direction is heated and pressed in the first bonding step S6a, the entire overlapping region is heated by heating and pressing the pair of first regions R1 ′ in the second bonding step S6b. The uncured portion of the adhesive A can be cured by being pressurized. Therefore, the uncured portion is prevented from absorbing moisture and peeling off, and the reliability of electrical connection is improved. After the bonding step S6, if an uncured portion of the adhesive A remains, a step of heating the whole is further required. However, in the present embodiment, this step is unnecessary and the number of steps can be reduced. .

<Fourth embodiment>
Subsequently, a head 401 according to a fourth embodiment of the present invention will be described with reference to FIG.

  In the present embodiment, in the overlapping region overlapping the flow path substrate 11 in the COF 18, the region including all of the plurality of individual wires 18f and not including at least a part of the common wire 18g is defined as the third region R3, and the entire overlapping region is defined. Let it be the fourth region R4. And after the 5th adhesion process (refer to Drawing 9 (a)) which heats and pressurizes the 3rd field R3 at the curing temperature which adhesives A cure, and adhesive 5 A cures 4th field R4 And a sixth bonding step (see FIG. 9B) for heating and pressing at the curing temperature (which may be the same as or different from the curing temperature in the fifth bonding step).

  Similarly to the second region R2 ′ (see FIG. 8A) of the third embodiment, the third region R3 has end portions adjacent to the plurality of individual wires 18f in the arrangement direction of the common wires 18g (see FIG. 9A). ) Including the inner end) 18gx.

  Thus, according to the present embodiment, the third region R3 includes all of the plurality of individual wires 18f, and the fourth region R4 includes the plurality of individual wires 18f and the pair of common wires 18g. Therefore, as in the first embodiment, the flow path substrate 11 and the COF 18 do not need an extra area for the bonding step S6, and the enlargement of the head 401 can be avoided. Further, each of the third region R3 and the fourth region R4 includes all of the plurality of individual wirings 18f. Thereby, poor electrical connection between the individual wiring 18f and the individual contact 12f due to the semi-curing of the adhesive A outside the pressurizing region is suppressed, and the electrical connection between the individual wiring 18f and the individual contact 12f is reliably performed. It is possible. Moreover, the uncured portion of the adhesive A can be cured by heating and pressurizing the entire overlapping region (fourth region R4) later. Therefore, the uncured portion is prevented from absorbing moisture and peeling off, and the reliability of electrical connection is improved. After the bonding step S6, if an uncured portion of the adhesive A remains, a step of heating the whole is further required. However, in the present embodiment, this step is unnecessary and the number of steps can be reduced. .

<Fifth Embodiment>
Subsequently, a head 501 according to a fifth embodiment of the present invention will be described with reference to FIG.

  In the present embodiment, as in the fourth embodiment, the central region in the arrangement direction is heated and pressurized in the fifth bonding step, and the entire overlapping region (fourth region R4) is heated and pressurized in the sixth bonding step. The third region R3 ′ that is heated and pressurized in the bonding step is smaller than the third region R3 of the fourth embodiment (see FIGS. 9A and 10A). Similar to the second region R2 (see FIG. 6C) of the first embodiment, the third region R3 ′ includes all of the plurality of individual wirings 18f, and includes the plurality of dummy wirings 18f ′ and the pair of common wirings 18g. Not included.

  The dummy wiring 18f 'is not included in the third region R3', but is included in a portion where the peripheral region of the third region R3 'is semi-cured. As described above, by providing the dummy wiring 18f ′ in the portion where the semi-curing occurs, the area can be effectively used without wasting, and as a result, the distance between the individual wiring 18f and the common wiring 18g in the arrangement direction can be reduced, and the flow can be reduced. The road substrate 11 can be reduced in size in the arrangement direction.

  According to the present embodiment, the third region R3 ′ includes all of the plurality of individual wirings 18f, and the fourth region R4 includes the plurality of individual wirings 18f and a pair of common wirings 18g. The enlargement of the head 401 can be avoided. Further, since each of the third region R3 ′ and the fourth region R4 includes all of the plurality of individual wirings 18f, the adhesive A outside the pressure region is semi-cured as in the fourth embodiment. Thus, the electrical connection failure between the individual wiring 18f and the individual contact 12f is suppressed, and the electrical connection between the individual wiring 18f and the individual contact 12f can be reliably performed.

<Sixth Embodiment>
Subsequently, a head 601 according to a sixth embodiment of the present invention will be described with reference to FIG.

  In the present embodiment, as in the first embodiment, the vicinity of both ends in the arrangement direction is heated and pressurized in the first bonding step S6a, and the central region (second region R2) in the arrangement direction is heated and pressurized in the second bonding step S6b. The width of the region (first region R61) to be heated and pressurized in the first bonding step S6a is larger than the width of the first region R1 of the first embodiment and is approximately half the width of each common wiring 18g (FIG. 6). (See (b) and FIG. 11 (a)). In addition, each first region R1 of the first embodiment is located at the center of the common wiring 18g in the arrangement direction, whereas each first region R61 of the present embodiment is in the arrangement direction of the common wiring 18g. It is located in a part separated from the individual wiring 18f. As a result, the shortest distance (distance S ′) from the outer edge of each first region R61 to the plurality of individual wirings 18f is larger than the distance S of the first embodiment. Therefore, the existence of the individual wiring 18f in the portion where the semi-curing outside the first region R1 occurs is more reliably avoided, and the electrical connection between the individual wiring 18f and the individual contact 12f can be more reliably performed.

<Seventh embodiment>
Subsequently, a head 701 according to a seventh embodiment of the present invention will be described with reference to FIG.

  In the present embodiment, as in the first embodiment, the vicinity of both ends in the arrangement direction is heated and pressurized in the first bonding step S6a, and the central region (second region R2) in the arrangement direction is heated and pressurized in the second bonding step S6b. The width of the region (first region R71) to be heated and pressed in the first bonding step S6a is larger than the width of the first region R1 of the first embodiment and is substantially the same as the width of each common wiring 18g (FIG. 6). (See (b) and FIG. 12 (a)). Thereby, the electrical connection between the common wiring 18g and the common contact 12g can be further ensured.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and various design changes can be made as long as they are described in the claims.

<Modification>
The adhesive is not limited to NCF, ACF, etc. as long as it is thermosetting, and may be any other adhesive. Further, the adhesive is not limited to a film shape, and may be a paste shape.

  The temporary bonding process may not be performed.

  Dummy wirings and alignment marks need not be provided between the first region and the plurality of individual wirings. For example, the alignment mark may be formed by unevenness on the surface of the actuator substrate. The non-pressurized region may not be provided between the first region and the second region (that is, the first region and the second region may be in contact). Further, the first region and the second region may partially overlap.

  The dummy wiring, dummy contact, dummy pressure chamber, and / or dummy nozzle may be omitted.

  The common wiring is not limited to being arranged so as to sandwich a plurality of individual wirings in the arrangement direction. For example, with respect to a plurality of individual wirings, the common wiring may be arranged on one side in the arrangement direction and the common wiring may not be arranged on the other side in the arrangement direction. In this case, the first area is not a pair of areas separated from each other in the arrangement direction, but is an area arranged in one of the arrangement directions with respect to a plurality of individual wirings.

  The second area may be an area including all of the plurality of individual wirings and the common wiring (for example, the entire overlapping area). That is, for example, in the first embodiment, in the second bonding step (see FIG. 6C), instead of heating and pressurizing the second region R2 at the center in the arrangement direction of the COF 18, the entire COF 18 may be heated and pressurized. .

  The actuator is not limited to the piezo type using the piezoelectric element as in the above-described embodiment, but other types (for example, a thermal type using a heating element, an electrostatic type using an electrostatic force, etc.) It may be.

  The head is not limited to the line type, and may be a serial type. An apparatus such as a printer is not limited to including a head unit including a plurality of heads, and may include a single head. The liquid ejected by the head is not limited to ink, and may be any liquid (for example, a treatment liquid that aggregates or deposits components in the ink). The recording medium is not limited to paper, and may be any recordable medium (for example, cloth). The present invention is not limited to a printer, but can also be applied to a facsimile machine, a copier, a multifunction machine, and the like. The present invention is not limited to an ink jet head, and can be applied to any actuator device (for example, a liquid crystal panel).

1; 201; 301; 401; 501; 601; 701 Head (actuator device)
12 Actuator 11 Flow path substrate (Actuator substrate)
12f Individual contact 12f 'Dummy contact 12g Common contact 18 COF (wiring board)
18f Individual wiring 18f 'Dummy wiring 18g Common wiring A Adhesive M Alignment mark R1, R1', R61, R71 First region R2, R2 'Second region R3, R3' Third region R4 Fourth region Rn Non-pressurized region

Claims (16)

An actuator substrate having a plurality of individual contacts and a common contact and a wiring substrate having a plurality of individual wires and a common wire are bonded via a thermosetting adhesive, and the plurality of individual contacts and the plurality of individual wires are bonded together. A bonding step of electrically connecting each of the common contacts and the common wiring;
In the overlapping region of the wiring board that overlaps the actuator substrate, a region that does not include the plurality of individual wires and includes at least a part of the common wires is a first region, and a region that includes all of the plurality of individual wires is a first region. In case of 2 areas,
The bonding step includes
A first bonding step of heating and pressing the first region at a curing temperature at which the adhesive is cured;
A second bonding step of heating and pressurizing the second region at the curing temperature after the first bonding step;
A method of manufacturing an actuator device, wherein a shortest distance from an outer edge of the first region to the plurality of individual wires is equal to or greater than a minimum distance between the plurality of individual wires.   The method for manufacturing an actuator device according to claim 1, wherein the shortest distance is 350 μm or more. Arranging the plurality of individual wires at equal intervals in the arrangement direction,
3. The method of manufacturing an actuator device according to claim 1, wherein the shortest distance is a distance at which 15 or more of the individual wirings can be arranged. 4.   4. The actuator device according to claim 1, wherein a dummy wiring different from the plurality of individual wirings and the common wiring is provided between the first region and the plurality of individual wirings. 5. Manufacturing method.   The plurality of individual wires and the dummy wires that are not electrically connected to the plurality of individual contacts and the common contact are arranged at equal intervals so that the dummy wires are positioned at the ends of the plurality of individual wires in the arrangement direction. The method of manufacturing an actuator device according to claim 4, wherein the actuator device is provided.   The alignment mark for aligning the said wiring board with the said actuator board | substrate is provided in the part corresponding between the said 1st area | region and these individual wiring, The any one of Claims 1-5 characterized by the above-mentioned. The manufacturing method of the actuator apparatus as described in a term.   The method for manufacturing an actuator device according to claim 1, wherein the first region does not include an end portion of the common wiring adjacent to the plurality of individual wirings. An actuator substrate having a plurality of individual contacts and a common contact and a wiring substrate having a plurality of individual wires and a common wire are bonded via a thermosetting adhesive, and the plurality of individual contacts and the plurality of individual wires are bonded together. A bonding step of electrically connecting each of the common contacts and the common wiring;
In the overlapping region of the wiring board that overlaps the actuator substrate, a region that does not include the plurality of individual wires and includes at least a part of the common wires is a first region, and a region that includes all of the plurality of individual wires is a first region. In case of 2 areas,
The bonding step includes
A third bonding step of heating and pressing the second region at a curing temperature at which the adhesive is cured;
A method for manufacturing an actuator device, comprising: a fourth bonding step of heating and pressurizing the first region at the curing temperature after the third bonding step.   The actuator device according to any one of claims 1 to 8, wherein a non-pressurized region that is not heated and pressurized is provided between the first region and the second region in the overlapping region. Method.   10. The method of manufacturing an actuator device according to claim 1, wherein a width of the common wiring is larger than a width of each of the plurality of individual wirings. The plurality of individual wires and the common wires are arranged in an arrangement direction, and a pair of the common wires are arranged so as to sandwich the plurality of individual wires in the arrangement direction,
11. The method of manufacturing an actuator device according to claim 1, wherein the first region is a pair of regions separated from each other in the arrangement direction.   The method for manufacturing an actuator device according to claim 11, wherein the second region is a region sandwiched between the pair of regions in the arrangement direction.   The method for manufacturing an actuator device according to claim 12, wherein the pair of common wires are not included in the second region.   13. The method of manufacturing an actuator device according to claim 12, wherein the second region includes an end portion adjacent to the plurality of individual wires in the arrangement direction of each of the pair of common wires. An actuator substrate having a plurality of individual contacts and a common contact and a wiring substrate having a plurality of individual wires and a common wire are bonded via a thermosetting adhesive, and the plurality of individual contacts and the plurality of individual wires are bonded together. A bonding step of electrically connecting each of the common contacts and the common wiring;
In the overlapping region of the wiring board that overlaps the actuator substrate, a region that includes all of the plurality of individual wires and does not include at least a part of the common wire is defined as a third region, and the entire overlapping region is defined as a fourth region. If
The bonding step includes
A fifth bonding step of heating and pressing the third region at a curing temperature at which the adhesive is cured;
A method of manufacturing an actuator device comprising: a sixth bonding step of heating and pressing the fourth region at the curing temperature after the fifth bonding step. Before the bonding process,
A temporary bonding step of interposing the adhesive between the actuator substrate and the wiring substrate, and temporarily bonding the wiring substrate to the actuator substrate at an uncured temperature lower than the curing temperature at which the adhesive is not cured. The method for manufacturing an actuator device according to claim 1, wherein the actuator device is provided.

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