JP2002331667A - Recording head, its manufacturing method and ink jet recorder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress overflow of adhesive from an electrical joint to the orifice plate side. SOLUTION: An electrode part 1104 is provided with bumps 1105 of Au, or the like, around which an insulation film 1111 is provided in order to prevent short circuit between different electrodes of electric wiring on the recording element board 1100 side and an electric wiring board 1300 in a thermocompression region. In a region of the insulation film 1111 facing the element side face 1113, a plurality of parts 1112 communicating with the element side face 1113 are provided in order to discharge excess adhesive at the time of thermocompression. The insulation film 1111 formed on the ejection opening group 1108 side is provided with no communicating part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording head having a recording element substrate, an electric wiring substrate for connecting the recording element substrate to a power supply, etc., and for discharging a recording liquid such as ink. The present invention relates to a manufacturing method and an inkjet recording device.

The present invention relates to a general printing apparatus, a facsimile having a communication system, a facsimile having a communication unit, a word processor having a printing section, and an industrial application combined with various processing apparatuses. It can be applied to a recording device.

[0003]

2. Description of the Related Art An ink jet recording apparatus is a recording apparatus of a so-called non-impact recording system, and can perform high-speed recording and recording on various recording media.
It has the feature that almost no noise is generated during recording. For this reason, the ink jet recording apparatus is
It is widely used as a device that carries a recording mechanism such as a printer, a word processor, a facsimile, and a copying machine.

As a typical ink discharging method in this ink jet recording apparatus, there is a method using an electrothermal transducer. In this method, recording is performed on a recording medium by discharging minute droplets from minute discharge ports. Generally, an ink jet recording nozzle for forming droplets and a head for this head are used. And a supply system for supplying ink.

In an ink jet recording head using an electrothermal conversion element, an electrothermal conversion element is provided in a recording liquid chamber, and thermal energy is applied to the recording liquid by applying an electric pulse serving as a recording signal to the recording medium, thereby performing recording. The bubble pressure at the time of bubbling (at the time of boiling) of the recording liquid caused by the phase change of the liquid is used for discharging the recording liquid droplets. Further, a method of ejecting ink in parallel to the substrate on which the electrothermal transducers are arranged (edge shooter) and a method of ejecting ink perpendicularly to the substrate on which the electrothermal transducers are arranged (side shooter) are available. is there. These ink jet recording heads basically include a recording element unit, a tank holder unit, and an ink tank.

FIG. 12 is an exploded perspective view of an example of a recording head of a side shooter conventionally used. FIG.
As shown in FIG. 2, the printing element unit 3002 includes a printing element substrate 3100, a first plate 3200, an electric wiring board 3300, and a second plate 3400, and the tank holder unit 3003 includes the tank holder 3
500, a flow path forming member 3600, and a filter 3700
And a seal rubber 3800. The printing element substrate 3100 is bonded and fixed to the second plate 3400 with high positional accuracy. Electric wiring board 3300
Is for applying an electric signal for ejecting ink to the recording element substrate 3100.
00 for incorporating the recording element substrate 3100
And an external signal input terminal 3301 for receiving an electric signal from the main unit.
And Then, the electric wiring substrate 3300 is connected to the recording element substrate 3100 via the second plate 3400.
And the recording element substrate 3
100 is electrically connected. As an electrical connection method, thermocompression bonding using an anisotropic conductive adhesive has recently been used.

FIG. 13 is a view for explaining the recording element substrate 3100 shown in FIG. 12, and FIG. 14 is a view for explaining the electric wiring board 3300 shown in FIG.
14A is a plan view of the front surface of the electric wiring board, FIG. 14B is a plan view of the back surface of the electric wiring substrate, and FIG.
It is an enlarged view of the D section shown in (b).

[0008] As shown in FIG.
A bump 3105 is formed on the 0 electrode portion 3104, and an insulating film 3111 is formed around the bump 3105. The insulating film 3111 prevents the electrode terminals 3302 of the electric wiring board 3300 from short-circuiting with the electric wiring of the other electrodes routed on the recording element substrate 3100 even during thermocompression bonding. As a method of thermocompression bonding, the second plate 320 to which the recording element substrate 3100 is adhered and fixed is used.
0 is fixed on a flat stage, and an electric wiring board 3300 in which an anisotropic conductive adhesive is applied to the electrode terminals 3302 is positioned and temporarily adhered to the printing element substrate 3100, and the printing element is set from the base film 3312 side of the electric wiring board 3300. Heat and pressure are applied to the substrate 3100 using a heat tool.

[0009]

However, there are the following problems in the ink jet recording head including the above-described recording element unit.

That is, with the recent increase in the number of colors and high image quality represented by photo grades, the number of nozzles, the pitch of the nozzles, and the like have been reduced in ink jet recording heads. The number of electrodes of the recording element substrate tends to increase due to an increase in the number of electrothermal conversion elements of the recording element substrate, enhancement of functions, and the like, and the number of recording element substrates themselves tends to increase. For this reason, when performing thermocompression bonding using an anisotropic conductive adhesive, FIG. 15 and FIGS. 16A and 16B, which are side sectional views taken along line AA of FIG. As described above, it is general that all the electrode portions 3104 of the plurality of recording element substrates 3100a, 3100b, and 100c are collectively pressed with one tool, but the bumps 31 provided on the electrode portions 3104 are collectively pressed.
05 is formed by a stud bump method from the viewpoint of cost and a nozzle manufacturing method, and a bump height variation of about 8 μm occurs. In addition, the second plate 32
A variation in the thickness of the adhesive layer of the recording element substrate 3100 adhered and fixed at 00 also occurs. To compensate for these variations, a Teflon (registered trademark) sheet having a thickness of several tens of μm serving as a buffer material is sandwiched between the heat tool and the electric wiring board 3300 to perform thermocompression bonding. The excess thermosetting adhesive 3304 is removed by performing thermocompression bonding over the device side, and the excess adhesive 3304a on the side surface of the element is removed.
In some cases, the excess adhesive 3304b protrudes around the thermocompression bonding area. Therefore, the orifice plate 311 is formed by the discharge port side excess adhesive 3304b.
It is necessary to design a large recording element substrate 3100 in consideration of the width of the adhesive so that the ejection port 3107 formed at 0 is not blocked.

Therefore, the present invention relates to a connection method for electrically connecting a recording element substrate and an electric wiring substrate by thermocompression bonding using a thermosetting adhesive such as an anisotropic conductive adhesive. In addition to minimizing the size of the print element substrate by suppressing the adhesive from sticking to the print head, the print head can be made more compact, and the number of print element substrates produced per wafer can be increased. It is an object of the present invention to provide a head manufacturing method and an ink jet recording apparatus.

[0012]

In order to achieve the above object, a recording head according to the present invention has an orifice plate having a plurality of ejection openings formed by a plurality of ejection openings from which ink is ejected, and a bump. A recording element substrate having an electrode portion on a main surface, and electrode terminals electrically connected to the bumps by thermocompression bonding using a thermosetting adhesive, and ink is ejected to the recording element substrate. An electric wiring board for applying an electric pulse for applying the electric pulse to the insulating film formed in a thermocompression bonding area around the electrode portion of the recording element substrate. At least one communicating portion communicating with the side surface of the second member is formed.

In the recording head of the present invention configured as described above, since at least one communicating portion communicating with the side surface of the recording element substrate is formed in the insulating film, the recording head may protrude from the thermocompression bonding area during thermocompression bonding. The thermosetting adhesive having the property can be discharged to the side of the recording element substrate.

The recording head of the present invention may have a thickness such that the thickness of the insulating film is lower than the height of the bump.

The thermosetting adhesive may be an anisotropic conductive adhesive. In this case, the thickness of the insulating film is larger than the diameter of the conductive particles contained in the anisotropic conductive adhesive. The thickness may be such that it increases.

The recording head of the present invention may have an insulating film formed on the recording element substrate. In this case, the insulating film is made of the same material as the material of the orifice plate. There may be.

Further, in the recording head of the present invention, the insulating film may be formed on the electric wiring board.

The method of manufacturing a recording head according to the present invention is a method of manufacturing a recording head for manufacturing the recording head of the present invention, wherein the insulating film formed in a region near the ejection port group is formed by the thermocompression bonding. In this case, the method further includes a step of applying the thermosetting adhesive to the thermocompression bonding area in which the thermosetting adhesive is not directly pressed, and then performing the thermocompression bonding.

In the method of manufacturing a recording head according to the present invention as described above, since the thermosetting adhesive is applied in the thermocompression bonding area where the thermosetting adhesive is not directly pressed, the recording head is formed in the area close to the ejection port group. The applied insulating film does not directly press the thermosetting adhesive against the recording element substrate or the electric wiring substrate. For this reason, the protrusion of the thermosetting adhesive from the insulating film side formed in the region near the ejection port group can be reduced.

Further, the method of manufacturing a recording head according to the present invention comprises:
The method may include a step of forming the insulating film with a photoresist.

Further, the method of manufacturing a recording head according to the present invention comprises:
The method includes a step of forming an insulating film by opening a region where the electrode terminal is formed by laser processing a cover resist that covers a surface on which the electrode terminal is formed, and forming a communication portion. You may.

An ink jet recording apparatus according to the present invention has an ink jet recording apparatus having a conveying means for conveying a recording medium, and a recording head provided with a discharge port for discharging ink so as to face a recording surface of the recording medium. In a recording apparatus, the recording head is the recording head of the present invention.

Further, the ink jet recording apparatus of the present invention comprises a conveying means for conveying a recording medium, and a recording head provided with a discharge port for discharging ink so as to face a recording surface of the recording medium. In the inkjet recording apparatus, the recording head is manufactured by the method for manufacturing a recording head of the present invention.

As described above, the ink jet recording apparatus of the present invention is capable of discharging the thermosetting adhesive which is likely to protrude from the thermocompression bonding area to the side of the recording element substrate during thermocompression bonding. Alternatively, a recording head manufactured by the method for manufacturing a recording head of the present invention is used. That is, since the recording head has a configuration in which the thermosetting adhesive hardly protrudes to the ejection port group side, the recording head can be downsized by the amount that the thermosetting adhesive does not protrude to the ejection port group side. Accordingly, the size of the ink jet recording apparatus can be reduced accordingly.

[0025]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a partially exploded perspective view for explaining a configuration of a printing element substrate used for a printing head of the present embodiment.

FIG. 2 is a view for explaining the thermocompression bonding of the printing element substrate shown in FIG. 1. FIG. 3 is a side sectional view of the printing element substrate taken along line BB in FIG. 2 for explaining the thermocompression bonding. 3A shows a state before thermocompression bonding, and FIG. 3B shows a state after thermocompression bonding.

FIG. 4 is an exploded perspective view of a tank holder unit and a recording element unit, and FIG. 5 is a side sectional view of a recording head with an ink tank mounted thereon.
FIG. 6 is a perspective view illustrating the assembling of the tank holder unit and the recording element unit. FIG. 7 is a perspective view illustrating the recording head of the present embodiment completed by assembling the recording element unit to the tank holder unit. is there.

The recording head 1001 of this embodiment performs a bubble jet (registered trademark) method in which recording is performed using an electrothermal transducer that generates thermal energy for causing film boiling to occur in ink according to an electric signal. Is a side shooter type recording head.

The recording head 1001 includes a recording element unit 1002 and a tank holder unit 1003 as shown in an exploded perspective view of FIG. Further, as shown in the exploded perspective view of FIG.
It is composed of a recording element substrate 1100, a first plate 1200, an electric wiring substrate 1300, and a second plate 1400. The tank holder unit 1003 includes a tank holder 1500, a flow path forming member 1600, and a filter 1
700, and a seal rubber 1800.

Hereinafter, a method of manufacturing the recording head configured as described above will be described. (1-1) Printing Element Unit The printing element substrate 1100 has, for example, a thickness of 0.5 to 1 mm.
A thin film is formed on the Si substrate 1101 of FIG. In addition, the ink flow path 11 having a long groove-shaped through hole as the ink flow path.
No. 02 is formed, and the electrothermal conversion elements 1103 are arranged in a row in a staggered manner on both sides of each of the ink flow paths 1102. The electrothermal conversion elements 1103 and Al that supply power to the electrothermal conversion elements 1103 are formed. Are formed by a film forming technique.

The electrode portion 1104 for supplying electric power to the electric wiring is provided with a bump 1105 of Au or the like, and further, around the bump 1105, the electric wiring on the recording element substrate 1100 side in the thermocompression bonding area is provided. And electric wiring board 130
0 to prevent short circuit between different electrodes.
Are provided on the main surface 1114. In the region of the insulating film 1111 facing the element side surface 1113, the element side surface 1113 is formed.
13, a plurality of communicating portions 1112 are formed, and the excess adhesive at the time of thermocompression bonding is applied to the side surface of the recording element substrate as shown in FIG. It is configured to be able to discharge as. In order to prevent excess adhesive from being discharged to the ejection port group 1108 side, the ejection port group side insulating film 1111a is provided with:
No communication part is formed. In the configuration of this embodiment, the thickness of the insulating film 1111 is smaller than the height of the bump 1105, and the height of the bump 1105 is, for example, 30 to 50 μm.
Has a thickness of, for example, 20 to 25 μm. The ink channel 1102 performs anisotropic etching using the crystal orientation of the Si substrate 1101. <100 on wafer surface
> In the case of having a <111> crystal orientation in the thickness direction, etching proceeds at an angle of about 54.7 degrees by anisotropic etching of an alkaline system (KOH, TMAH, humanrazine, etc.). Etching is performed to a desired depth using this method. Further, the electrothermal transducer 1 is provided on the Si substrate 1101.
An orifice plate 1110 including an ink flow path wall 1106 and an ejection port 1107 for forming an ink flow path corresponding to 103 is formed by photolithography. The insulating film 1111 is formed on the orifice plate 1110.
By using the same material and the same thickness, it becomes possible to form them simultaneously. The electrothermal conversion element 1103 is provided so as to face the ejection port 1107, and converts the ink supplied from the ink flow path 1102 into the electrothermal conversion element 1110.
03 is to generate bubbles to eject ink. In the present embodiment, as shown in FIG. 2, three printing element substrates 1100 having ejection port groups for ejecting two colors of ink are provided to correspond to six colors of ink.

The first plate 1200 has, for example, a thickness
0.5-10 mm alumina (A1 _TwoO_Three) Formed of material
Have been. The material of the first plate 1200 is
The material of the recording element substrate 1100 is not limited to lumina.
Having a linear expansion coefficient equal to the linear expansion coefficient of the material, and a recording element
Equivalent to or higher than the thermal conductivity of the substrate 1100 material
It may be made of a material having thermal conductivity. First play
The material of the gate 1200 is, for example, silicon (Si), nitrided
Aluminum (AlN), zirconia, silicon nitride (Si
_ThreeN_Four), Silicon carbide (SiC), molybdenum (Mo),
Any of tungsten (W) may be used. First
The plate 1200 has six colors on the printing element substrate 1100.
Six ink supply ports 1201 for supplying ink are provided.
6 inks of the recording element substrate 1100
Channels 1102 are the six inks of first plate 1200
A recording element substrate corresponding to each of the supply ports 1201;
1100 has good positional accuracy with respect to the first plate 1200
Adhesively fixed. First adhesive 12 used for bonding
02 is a substantially print element substrate shape on the first plate 1200
In addition, an air path is generated between adjacent ink supply ports.
It is applied so that it does not grow. The first adhesive 1202
For example, the viscosity is low, the adhesive layer formed on the contact surface
Thin and has a relatively high hardness after curing, and
It is desirable to use an ink. The first adhesive 12
02 is, for example, a thermosetting contact mainly containing an epoxy resin.
It is an adhesive, and the thickness of the adhesive layer is desirably 10 μm or less.

The electric wiring substrate 1300 is a recording element substrate 1
An electric signal for ejecting ink is applied to the recording element substrate 100, an opening for incorporating the recording element substrate 1100, an electrode terminal 1302 corresponding to the electrode portion 1104 of the recording element substrate 1100, and a wiring terminal And an external signal input terminal 1301 for receiving an electric signal from the main unit. The electric wiring substrate 1300 and the printing element substrate 1100 are electrically connected as shown in FIGS. 2 and 3.
As shown in (a), the electrode portion 11 of the printing element substrate 1100
After the thermosetting adhesive 1304 is applied between the electrode part 1104 of the electric wiring board 1300 and the electrode terminal 1302 of the electric wiring board 1300, as shown in FIG. By heating and pressurizing all together to cure the thermosetting adhesive 1304, the bumps 1105 formed on the electrode portions 1104 and the electrode terminals 1302 are electrically connected collectively. Further, when an anisotropic conductive adhesive containing conductive particles 1315 is used as the thermosetting adhesive 1304, the same is possible.

In the configuration of the present embodiment, for example, recording is performed by using an anisotropic conductive adhesive film composed of conductive particles 1315 having a single particle diameter of nickel of 2 to 6 μm and an adhesive mainly composed of epoxy resin. Electrode section 110 of element substrate 1100
4 and the electric wiring board 1300
Of the gold-plated electrode terminal 1302 at a temperature of 170 to
When thermocompression bonding was performed at 250 ° C., electrical connection was suitably performed. Most of the excess adhesive 1304 at the time of thermocompression bonding is connected to the communication portion 1 communicating with the side surface of the recording element substrate 1100.
Since the excess adhesive 1304a was discharged from the element 112 as a side surface side element of the element, the excess adhesive 1304b on the ejection port side, which protrudes toward the ejection port group 1108, could be significantly reduced.

As shown in FIG. 3A, the application position of the thermosetting adhesive 1304 is applied by a distance a from the end face of the electrode terminal 1302 to the electrode portion rather than the insulating film 1111 on the discharge port group side. That is, the discharge port group side insulating film 1111
a, a thermosetting adhesive 1304 is applied in a thermocompression bonding area where the thermosetting adhesive 1304 is not directly pressed during thermocompression bonding, and then thermocompression bonding is performed, so that the adhesive 13
04 can be further reduced. As a material of the electric wiring board 1300, for example, a flexible wiring board having a two-layer wiring structure is used, and the surface layer is covered with a resist film. In the configuration of the present embodiment, for example, the thickness of the base film 1312 including the adhesive layer is 30 to 50 μm, and the thickness of the electrode terminal is 30 to 4 μm.
0 μm, and the thickness of the cover resist 2313 is 30
５０50 μm is used. Further, a reinforcing plate 1303 is adhered to the back surface side of the external signal input terminal 1301 to improve the flatness of the external signal input terminal 1301 part. As a material of the reinforcing plate 1303, for example, 0.5 to
A heat-resistant material such as 2 mm glass epoxy or aluminum is used.

The second plate 1400 is formed of, for example, an alumina (A1 ₂ O ₃ ) material having a thickness of 0.5 to 1 mm. The material of the second plate 1400 is not limited to alumina, has a linear expansion coefficient equivalent to that of the recording element substrate 1100 and the first plate 1200, and is equal to or higher than their thermal conductivity. May be made of a material having a thermal conductivity of The second plate 1400 has a shape having an opening larger than the outer dimensions of the recording element substrate 1100 bonded and fixed to the first plate 1200. Also, the recording element substrate 11
The second adhesive 1203 is attached to the first plate 1200 so that the electrical wiring board 1300 and the electrical wiring board 1300 can be electrically connected in a planar manner.
The back surface of the electric wiring board 1300 is adhered and fixed by a third adhesive 1306. Further, the electric wiring board 1300 is bonded to the second plate 1400 and, at the same time, is bent on one side of the first plate 1200 and the second plate 1400, and the third bonding is performed on the side of the first plate 1200. Adhered with agent 1306. As the second adhesive 1203, for example, an adhesive having a low viscosity, a thin adhesive layer formed on the contact surface, and ink resistance is used. Further, the third adhesive 1306 is
For example, a thickness of 10 to 100 mainly composed of epoxy resin
A μm thermosetting adhesive film is used.

The printing element substrate 1100 and the electric wiring board 130 of the printing element unit 1002 configured as described above.
The electrical connection portion 0 is sealed with a first sealant (not shown) and a second sealant 1308 to protect the electrical connection portion from corrosion by ink and external impact. The first sealant mainly seals the outer peripheral portion of the recording element substrate 1100, and the second sealant 1308 seals the edge of the opening of the electric wiring substrate 1300. The bent electric wiring board 1300 is further formed according to the shape of the holder unit 1003. (1-2) Tank Holder Unit The tank holder 1500 is formed by, for example, resin molding. The tank holder 1500 is, as shown in FIG.
A detachable ink tank 1900 is held, and the recording element unit 100 is removed from the ink tank 1900.
2 is one component of a tank holder unit 1003 that forms an ink flow path 1501 for guiding ink to the ink passage 2, and the ink flow path 1501 is formed by ultrasonically welding a flow path forming member 1600. Also, the ink tank 19
A filter 1700 for preventing dust from entering from the outside is joined to the joint 1517 engaged with the joint 00 by heat welding, and a seal rubber 1800 is provided for preventing evaporation of ink from the joint 1517. It is installed. (1-3) Coupling of Print Head Unit and Tank Holder Unit The print head 1001 shown in FIG.
The recording head unit 1002 is replaced with the tank holder unit 1
003 is completed.

The coupling is performed as follows. The ink supply port of the recording element unit 1002 (the first plate 120
0 ink supply port 1201) and tank holder unit 1
The fourth ink supply port 003 (see FIG. 5) communicates with the ink supply port 003 (the ink supply port 1601 of the flow path forming member 1600).
Is applied and fixed by bonding. In addition to the ink supply port portion, there are several places where the printing element unit 1002 and the tank holder unit 1003 are in contact with each other.
Is fixed by an adhesive 1603. When the recording element unit 1002 is bonded to the tank holder unit 1003 with the fourth adhesive 1602 and the fifth adhesive 1603, the recording element unit 1002 is attached to the sixth adhesive 1603.
4. Position and fix. The external signal input terminal 1301 portion of the recording element unit 1002 is positioned on one side surface of the tank holder 1500 by the terminal positioning pins 1515 (two places) and the terminal positioning holes 1309 (two places), and the terminal connection passed through the terminal connection hole 1310 The pin 1516 is fixed by heat welding.

The recording head 1001 according to the present embodiment having the above-described configuration has the electrode portion 1104 of the recording element substrate 1100.
The recording element substrate 1100 is formed on the insulating film 1111 provided therearound.
It is manufactured by providing a communication portion 1112 communicating with the side surface of the substrate and performing thermocompression bonding using an anisotropic conductive adhesive. Therefore, most of the surplus adhesive 1304 is transferred to the communication portion 11.
The excess adhesive 1304b that is discharged from the element 12 as the element side surface side excess adhesive 1304a and protrudes the adhesive to the ejection port group 1108 side can be reduced. Therefore, since the discharge port side excess adhesive 1304b does not block the discharge port 1107 formed in the orifice plate 1110, the insulating film 1 shown in FIG.
As a result, the distance c between the data 111 and the submission deadline 1107 can be shortened, so that not only the size of the recording element substrate can be reduced, but also the yield of the recording element substrate per wafer can be improved and the cost can be reduced. It can be a recording head. (Second Embodiment) FIG. 8 is a plan view of an electric wiring board used for the recording head of this embodiment, FIG. 8A is a plan view of the surface of the electric wiring board, and FIG. FIG. 8C is an enlarged view of a portion E shown in FIG. 8B. FIG. 9 is a partially enlarged view showing a thermocompression bonding portion of the electric wiring board shown in FIG. 8, and FIG.
FIG. 9 is a side sectional view for explaining thermocompression bonding in the C section, and FIG.
9A illustrates a state before thermocompression bonding, and FIG. 9B illustrates a state after thermocompression bonding.

In the recording head of this embodiment, as shown in FIG. 8C, insulation of the thermocompression bonding region 2314 is provided by a cover resist 2313 which covers the back surface of the electric wiring board 2300 on which the electrode terminals 2302 are formed. A part to be a film is formed. As a forming method, since the width of the insulating film is required to be about 0.3 to 0.5 mm in the punching process by the press due to the processing accuracy, it is not suitable for the miniaturization of the recording element substrate which is the object of the present invention. However, fine processing with a width of about 0.1 mm can be performed by laser processing or photolithography using a photoresist.
Then, the thermocompression bonding region 2314 is applied to the cover resist 2313 serving as an insulating film from the element side surface 2 of the recording element substrate 2100.
A discharge groove 2316 communicating with 113 is provided.

The configuration of the recording head of this embodiment is as follows.
The recording head 1 described in the first embodiment except for the above
101 is basically the same as that of FIG.

The thermocompression bonding of the present embodiment is shown in FIGS.
As shown in the figure, a thermosetting adhesive 2304 containing no conductive particles is applied to the thermocompression bonding area 2314 of the cover resist 2313 provided on the back surface of the electric wiring board 2300, and then heat and pressure is applied by a heat tool. . In the thermocompression bonding using the thermosetting adhesive 2304 containing no conductive particles, as shown in FIG. 10B, the recording element substrate 2100
The bump 2105 formed on the electrode portion 2104 is directly electrically connected to the electrode terminal 2302 of the electric wiring board 2300, and the thermosetting adhesive 2304 is filled around the electric connection portion, and the electric connection between the bump 2105 and the electrode terminal 2302 is made. Hold and fix the connection. The excess thermosetting adhesive 2304 in the thermocompression bonding region 2314 is discharged to the ejection port group 2108.
The discharge port side excess adhesive 2304b slightly protrudes to the side, and almost all of the discharge groove 231 of the electric wiring board 2300
6 and is discharged to the side surface of the recording element substrate 2100 as an element side surface side excess adhesive 2304a.

In particular, as shown in FIGS. 10A and 10B, the ejection port group side cover resist 2313a is
At the time of thermocompression bonding, the thermosetting adhesive 2304 is applied in a thermocompression bonding area where the thermosetting adhesive 2304 is not directly pressed, and then thermocompression bonded, whereby the adhesive 2
The protrusion of 304 can be further reduced.

The recording head of the present embodiment having the above-described configuration is provided with a cover resist 2313 of the electric wiring board 2300.
Forming an insulating film in the thermocompression bonding region 2314, and a discharge groove 2316 extending from the thermocompression bonding region 2314 to the side surface of the recording element substrate 2100. With this, the excess thermosetting adhesive 2304 from the thermocompression bonding area 2314 during thermocompression bonding can be discharged to the side surface of the recording element substrate 2100 as the element side surface side excess adhesive 2304a, so that it is directed to the ejection port group 2108 side. The protrusion is reduced. Therefore, as in the first embodiment, the distance between the thermocompression bonding region and the ejection port can be reduced, and the size of the recording element substrate can be reduced.

The recording head of this embodiment has a cover resist 231 which is an insulating film on the electric wiring board 2300 side.
3, the thickness of the insulating film is set to the orifice plate 2
There is no need to adjust the thickness to 110, and even when the thickness of the orifice plate 2600 is changed, it is not necessary to change the thermocompression bonding conditions.

The numerical values used in the description of the first and second embodiments are merely examples, and the present invention is not limited to these.

Next, FIG. 11 shows a perspective view of an ink jet recording apparatus on which the recording heads of the first and second embodiments can be mounted. In the following description, an example in which the recording head 1101 described in the first embodiment is mounted will be described.

A guide shaft 4003 is attached to the main body chassis 4012, and a carriage 4008 is supported on the guide shaft 4003 so as to be slidable in the direction of the arrow B ". Timing belt 4 stretched between pulley 4006 and idler pulley 4007
005, a part of the carriage 4008 is fixed,
It can reciprocate in the direction of arrow B "along the guide shaft 4003 according to the rotation of the drive motor.

The print head cartridge 4017 is removably mounted on the carriage 4008, and is attached to the back of the main body chassis 4012 via a flexible cable 4002 for transmitting and receiving a current and a signal for driving the print head cartridge 4017. Is electrically connected to a control board (not shown) which is a board for controlling the printing apparatus main body.

The recording head 1001 of the recording head cartridge 4017 has a discharge port 1107 formed downward in the figure.

The conveyance roller (not shown) is connected to a recording medium conveyance motor (not shown) via a gear, and conveys the recording paper 4004 in the sub-scanning direction indicated by arrow A ″.

The ink supplied from the ink tank 1900 is applied to the ejection port 110 of the recording head 1001 on the recording sheet 4004 which is the recording medium conveyed to the recording area.
The recording is performed by being ejected from.

[0053]

As described above, in a recording head in which a recording element substrate and an electric wiring board are electrically connected by thermocompression bonding using a thermosetting adhesive, the recording element substrate is formed on an insulating film provided around the electric connection portion. By providing the communicating portion on the side surface (outer peripheral portion), the adhesive overflowing from the thermocompression bonding region at the time of thermocompression bonding can be discharged to the side surface of the recording element substrate. As a result, the amount of the adhesive that protrudes toward the discharge port group side is greatly reduced, and the protruded adhesive does not block the discharge port, so that the distance between the thermocompression bonding area and the discharge port can be reduced. In addition, the size of the recording element substrate can be reduced. Therefore, the recording head can be made compact, the number of recording element substrates produced per wafer can be increased, and a recording head that is inexpensive can be provided.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a part of a print element substrate mounted on a print head according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating thermocompression bonding of the recording element substrate shown in FIG.

FIG. 3 is a side sectional view of the recording element substrate taken along line BB in FIG. 2 for describing thermocompression bonding.

FIG. 4 is an exploded perspective view of a tank holder unit and a print element unit of the print head according to the first embodiment of the present invention.

FIG. 5 shows a first embodiment of the present invention in which an ink tank is mounted.
FIG. 4 is a side sectional view of a recording head according to the embodiment.

FIG. 6 is an exploded perspective view of the recording head shown in FIG.

FIG. 7 is a perspective view showing a recording head according to the first embodiment of the present invention, which is completed by assembling a recording element unit to a tank holder unit.

FIG. 8 is a plan view of an electric wiring board used for a recording head according to a second embodiment of the present invention.

9 is a partially enlarged view showing a thermocompression bonding portion of the electric wiring board shown in FIG.

10 is a side sectional view of the recording element substrate taken along line CC in FIG. 9 for explaining thermocompression bonding.

FIG. 11 is a perspective external view of an example of the ink jet recording apparatus of the present invention.

FIG. 12 is an example of an exploded perspective view of a tank holder unit and a recording element unit of a conventional recording head.

13 is an exploded perspective view of a part of a print element substrate mounted on the conventional print head shown in FIG.

FIG. 14 is a plan view of an electric wiring board mounted on the conventional recording head shown in FIG.

15 is a partially enlarged view showing a thermocompression bonding portion of the electric wiring board shown in FIG.

FIG. 16 is a side sectional view of the recording element substrate taken along line AA in FIG. 15 for explaining thermocompression bonding.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1001 recording head 1002 recording element unit, 1003 tank holder unit 1100, 2100 recording element substrate 1101 Si substrate 1102 ink flow path 1103 electrothermal conversion element 1104, 2104 electrode section 1105, 2105 bump 1106 ink flow path wall 1107 ejection port 1108, 2108 Discharge port group 1110, 2110 Orifice plate 1111, 2111 Insulating film 1111a Discharge port side insulating film 1112 Communication part 1113, 2113 Element side surface 1114 Main surface 1200 First plate 1201 Ink supply port 1202 First adhesive 1203 Second adhesive Agent 1300, 2300 Electric wiring board 1301 External signal input terminal 1302, 2302 Electrode terminal 1303 Reinforcement plate 1304, 2304 Thermosetting adhesive 1304a, 2304a Element side surplus adhesive 1304b, 2304b Discharge port side surplus adhesive 1306 Third adhesive 1308 Second sealant 1309 Terminal positioning hole 1310 Terminal coupling hole 1311 Sealant reservoir 1312 Base film 1315 Conductive particles 1316 Discharge Groove 1400 Second plate 1500 Tank holder 1501 Ink flow path 1515 Terminal positioning pin 1516 Terminal connection pin 1600 Flow path forming member 1601 Ink supply port 1602 Fourth adhesive 1603 Fifth adhesive 1604 Sixth adhesive 1700 Filter 1800 Seal rubber 2313 Cover resist 2314 Thermocompression bonding area 2316 Discharge groove 4002 Flexible cable 4003 Guide shaft 4004 Recording paper 4005 Timing belt 4006 Drive pulley 4007 Eye Pulley 4008 carriage 4011 carriage motor 4012 body chassis 4017 recording head cartridge

Claims (13)

[Claims] 1. An orifice plate having a plurality of ejection ports formed by a plurality of ejection ports from which ink is ejected, and a recording element substrate having, on its main surface, an electrode portion having bumps formed thereon, and a thermosetting adhesive. A printing head, comprising: an electrode terminal electrically connected to the bump by thermocompression bonding using an agent; and an electric wiring board for applying an electric pulse for discharging ink to the printing element substrate. In the above, at least one communicating portion communicating from the electrode portion to a side surface of the recording element substrate is formed in an insulating film formed in a thermocompression bonding region around the electrode portion of the recording element substrate. A recording head characterized by the above-mentioned. 2. The recording head according to claim 1, wherein the thickness of the insulating film is smaller than the height of the bump. 3. The recording head according to claim 1, wherein the thermosetting adhesive is an anisotropic conductive adhesive. 4. The recording head according to claim 3, wherein the thickness of the insulating film is set to be larger than the diameter of conductive particles contained in the anisotropic conductive adhesive. 5. The recording head according to claim 1, wherein the insulating film is formed on the recording element substrate. 6. The recording head according to claim 5, wherein the insulating film is made of the same material as the material of the orifice plate. 7. The recording head according to claim 1, wherein the insulating film is formed on the electric wiring board. 8. The method for manufacturing a print head according to claim 1, wherein the insulating film formed in a region close to the ejection port group includes the thermal film. A method for manufacturing a recording head, comprising: a step of applying the thermosetting adhesive in the thermocompression bonding area which does not directly press the thermosetting adhesive during the pressure bonding, and then performing the thermocompression bonding. 9. The method of manufacturing a print head according to claim 7, wherein the insulating film formed in a region close to the ejection port group is formed by the thermosetting type during the thermocompression bonding. A method for manufacturing a recording head, comprising a step of applying the thermosetting adhesive in the thermocompression bonding area where the adhesive is not directly pressed, and then performing the thermocompression bonding. 10. The method according to claim 9, further comprising the step of forming the insulating film with a photoresist. 11. A cover resist covering a surface on which the electrode terminals are formed is opened by laser processing in a region where the electrode terminals are formed, and the insulating film is formed by forming the communication portion. The method for manufacturing a recording head according to claim 9, comprising a step of forming a recording head. 12. An ink jet recording apparatus, comprising: a conveyance unit for conveying a recording medium; and a recording head provided with a discharge port for discharging ink so as to face a recording surface of the recording medium. An ink jet recording apparatus, wherein the head is the recording head according to any one of claims 1 to 7. 13. An ink jet recording apparatus, comprising: a conveying unit that conveys a recording medium; and a recording head provided with an ejection port that ejects ink to face a recording surface of the recording medium. 12. An ink jet recording apparatus, wherein the head is manufactured by the method of manufacturing a print head according to claim 8.