KR100348247B1 - micro passive element and fabrication method - Google Patents

Abstract

The present invention is to provide a micro passive device capable of satisfying high quality and low price by reducing adverse effects such as parasitic capacitance, dielectric loss, and conductive loss from the substrate. The semiconductor device may include a conductive line formed at a predetermined height on a substrate in a predetermined shape, and a via part connecting the signal connection part and the conductive line to manufacture a micro passive device having high conductivity and low cost.

Description

Micro passive element and fabrication method

The present invention relates to a micro passive device, and more particularly, to a high frequency micro inductor passive device and a manufacturing method.

To date, many consumer electronic products such as portable handheld pagers, cellular phones, GPS receivers, camcorders, radio frequencies (RF), and mixed signal systems As each inductor is used in combination with IC chips in separate form, improvements in system cost, size, weight, and reliability have been required.

Therefore, much research has been conducted to integrate these inductors with IC chips to satisfy the above requirements, and as a result, spiral two-dimensional inductors using planar technology Became the actual commercial product.

However, because these inductors are formed directly on the substrate, they exhibit poor effects such as parasitic capacitance, dielectric loss, and conductive loss (especially when using a silicon substrate) from the substrate, resulting in poor performance of planar conductivity. .

Therefore, in order to improve the performance of planar conductivity, these inductors were initially implemented using a thin Au film sputtered or evaporated, and now Au films having a thickness of 2-3 μm deposited using electroplating are used. Flat spiral inductors made are commercially available.

However, these inductors still show poor effects on high frequency characteristics due to the bad effects generated from the substrate.

As described above, the micro inductor according to the related art has the following problems.

First, since the inductor element is formed directly on the substrate, adverse effects such as parasitic capacitance, dielectric loss, and conductive loss generated from the substrate appear, thereby degrading the performance of planar conductivity.

Second, since expensive Au is thickly formed on the substrate for conductive performance, there is a problem that is not appropriate to implement a low cost system.

Accordingly, an object of the present invention is to provide a micro inductor device capable of satisfying a high quality and a low price by reducing an effect generated from a substrate.

1 is a schematic diagram of a spiral-type micro inductor according to the present invention.

2 is a plan view showing an embodiment of a micro inductor according to the present invention;

3 is a cross-sectional view of the micro inductor of the portion shown in FIG.

4 is a configuration in which the signal connection portion is formed in the air of a certain height from the substrate in accordance with the present invention

5 is a cross-sectional view of the micro inductor of the portion shown in FIG.

6 is a cross-sectional view of the conductive line of the micro inductor according to the present invention.

7 is a block diagram showing a structure of a solenoid-type micro inductor according to the present invention

8 is a plan view of the micro inductor of FIG.

9 and 10 are helical microinductor process diagrams shown in FIG.

11 and 12 are helical microinductor process diagrams shown in FIG.

13 is a process diagram of the micro inductor of the solenoid type shown in FIG.

* Explanation of symbols for main parts of the drawings

1 Substrate 2 Via Part

3, 8: conduction line 4: signal connection part

5: post 11: thin film layer

12: protective layer 13: upper conductive line

14: lower conductive line 15, 22: seed metal layer

16, 18, 21: sacrificial layer

Features of the micro passive device according to the present invention for achieving the above object is a signal connection portion formed on a substrate, a conductive line formed in a predetermined shape at a predetermined height on the substrate, and a via connecting the signal connection portion and the conductive line It is configured to include (via).

A feature of the method for manufacturing a micro passive device according to the present invention for achieving the above object is a micro inductor passive device consisting of a conductive line having a predetermined shape, a signal connection portion, a via portion, and a post. A method of forming a sacrificial layer on a substrate on which a seed metal layer is formed and patterning to form a first mold for signal connection and a post, depositing a conductive metal on the first mold, and then depositing a sacrificial layer on the front surface. Forming and patterning a second mold for via and post, and depositing a conductive metal on the second mold, and then forming and patterning a sacrificial layer on the entire surface to form a patterned conductive line. Forming a third mold for the step, and after depositing a conductive metal on the third mold, removing the sacrificial layer and selectively removing the seed metal layer Makin it done.

The action according to the characteristics of the present invention is to form a spiral inductor in the air a certain distance from the substrate to minimize the adverse effects generated in the substrate to implement a high quality and low cost micro passive device.

Other objects, features and advantages of the present invention will become apparent from the detailed description of the embodiments with reference to the accompanying drawings.

A preferred embodiment of the micro passive device and the manufacturing method according to the present invention will be described with reference to the accompanying drawings.

1 is a configuration diagram of a spiral-type micro inductor according to the present invention. Referring to FIG. 1, a signal connection part 4 formed on a substrate 1 and an air gap on the substrate 1 are shown. And a conductive line 3 formed in a spiral type at a distance of) and a via portion 2 connecting the signal connection portion 4 and the conductive line 3 to each other.

As such, an air gap of a certain distance from the substrate 1 is used to reduce adverse effects such as parasitic capacitance, dielectric loss, and conductive loss (especially when using a silicon substrate) generated in the substrate 1. The spiral inductor element 3 was implemented in the air spaced apart by a gap).

2 is an embodiment of a plan view of a micro inductor according to the present invention.

Figure 2 (a) is a spiral type conductive line that can float in the air without bending without a post (5) serving as a support in the middle of the conductive line (3) due to the low number of windings or turns (3) is shown, and FIG. 2 (b) (c) (d) shows an increase in the number of windings on the spiral-shaped conductive line 3 in order to have a higher inductance than FIG. 2 (a). As a result, the elastic force in the middle of the conductive line 3 is weakened and bent toward the substrate below.

2 (b) (c) (d) thus shows a spiral-shaped conductive line 3 floating in the air with a post 5 serving as a support in the middle of the conductive line 3 to resolve the bending. Shown).

3 is a cross-sectional view of the micro inductor of the portion shown in FIG. 2 in a circle, FIG. 3 (a) is a side view of the portion 6 shown in a circle in FIG. 2 (c), and FIG. 3 (b) is a view in FIG. The part 7 circled in the figure is a side view.

Referring to FIG. 3 (a), the signal connection part 4 and the conductive line 8 are connected by using the via part 2.

3 (b), the conductive line 8 is supported by using a post 5.

4 is a configuration diagram in which the signal connection portion is formed in the air of a certain height from the substrate according to the present invention, which is another embodiment for removing more adverse effects of the substrate 1.

Referring to FIG. 4, a post 5 formed on the substrate 1 and serving as a support, a signal connection part 4 formed at a predetermined distance from the substrate 1 as a support for the post 5, A conductive line 3 having a spiral type on the substrate 1 and having a higher spiral shape than the signal connection part 4, and connecting the signal connection part 4 to the conductive line 3. It consists of a via part 2.

As such, in order to float the signal connection part 4 formed in contact with the substrate 1 in the air in the air, posts 5 serving as a supporter are formed under the signal connection part 4.

FIG. 5 is a cross-sectional view of the micro inductor of the portion shown in FIG. 4 in a circle, FIG. 5 (a) is a side view of the portion shown in circle in FIG. 4 (c), and FIG. 5 (b) is in a circle in FIG. The part shown is a side view.

Referring to FIG. 5 (a), the signal connection part 4 having a predetermined distance from the substrate 1 by the support of the post 5, and the conductive line having a predetermined shape with a predetermined distance on the signal connection part 4 ( 8) and a via portion 2 connecting the signal connection portion 4 and the conductive line 8 to each other.

5 (b), the conductive line 8 includes a conductive line 8 having a predetermined distance on the substrate 1 and a post supporting the conductive line 8.

In this case, the height of the post of FIG. 5B is equal to the sum of the heights of the post 5, the signal connection part 4, and the via part 2 in FIG. 5A.

6 is a cross sectional view of the conductive line of a micro inductor according to the invention, wherein the conductive lines 8 are arranged vertically or horizontally.

6 (a) (b) is a metal (metal) having a high conductivity (conductivity) such as Au, Cu, Ag deposited by electroplating, Figure 6 (c) (d) is like Cu Inexpensive metal was used as a conductive line material, and then Au or Ag was coated with low oxidation rate and high conductivity.

The reason for the conducting line as shown in FIG. 6 is to use the cross section through which the current flows, since most of the current flowing in the conductive line is conducted to the surface at high frequency due to a skin effect.

However, Cu (8 '), which occupies most of the conductive line, is easy to oxidize, and cladding a material such as Ni film 11 because the Au film 12 coated on the surface and the migration of atoms to each other are severe. A conductive line 8 is formed by coating on Cu (8 ') and plating Au film 12 thereon using the material as a material.

FIG. 7 is a block diagram illustrating a structure of a solenoid-type micro inductor according to the present invention. Referring to FIG. 7, a lower electrode 14 and a lower electrode 14 formed on a substrate 1 at a predetermined distance are shown. The upper electrode 13 formed at a predetermined distance on the 14, the via part 2 connecting the lower electrode 14 and the upper electrode 13, and the post 5 supporting the lower electrode 14. It consists of.

As described above, the solenoid type micro inductor may have a predetermined distance from the substrate by supporting the metal post 5, thereby reducing the adverse effect generated from the substrate.

FIG. 8 is a plan view of the micro inductor of FIG. 7, and FIG. 8 (a) shows a solenoid type conductive line structure floating in the air without bending even without a support in the middle of the conductive line due to the low number of windings or turns.

8 (b) is a solenoid type conductive line structure having increased winding number in order to have a higher inductance than FIG. 8 (a).

As the number of windings increases, as shown in FIG. 8 (b), the middle of the conductive line is weakened in the elastic force and bent toward the substrate. To solve this problem, the posts 5 serve as a support using the posts 5 to float in the air without bending. Form conductive lines.

When described in detail with reference to the accompanying drawings a method for manufacturing a micro passive device according to the present invention having such a structure as follows.

9 and 10 are process diagrams for implementing the spiral type micro inductor shown in FIG. 2, which is a process diagram of making a micro inductor formed in the air without a post 5 as shown in FIG. 10 is a process diagram of making a micro inductor having a post 5 floating in the air as shown in FIG. 2 (b) (c) (d).

The process sequence of FIGS. 9 and 10 is the same, and when designing, the pattern for forming the posts 5 is different from that of FIG. 9 and that of FIG.

Then, in the process sequence, first, as shown in FIG. 9 (a) (FIG. 10 (a)), the seed metal layer 15 is coated on the insulating substrate 1, and then a photoresist or polyimide, which is a sacrificial layer 16, is formed. Patterning forms an electroplating mold for the signal connection 4 and the post 5.

Subsequently, as shown in FIG. 9 (b) (FIG. 10 (b)), a metal 17 such as Au, Cu, and Ag is deposited on the formed mold by electroplating, and FIG. 9 (c) (FIG. 10 (c)). The photoresist or polyimide, which is the sacrificial layer 18, is again formed and patterned to form a mold for electroplating.

And as shown in Figure 9 (d) (Fig. 10 (d)) by depositing a metal 19, such as Au, Cu, Ag using the electroplating in the formed mold.

At this time, the pattern formed by the electroplating is the via (2) and the post (post) (5).

Subsequently, as shown in FIG. 9 (e) (FIG. 10 (e)), a sacrificial layer is formed to form a mold by forming a photoresist or polyimide and patterning to form a helical conductive line 3. Metal plating, such as Au, Cu, Ag, is deposited using plating.

9 (f) (FIG. 10 (f)), the sacrificial layers 16 and 18, which are formed of a multi layer, are seeded using acetone or dry etching. The metal layer 15 is removed until it is exposed, and then the exposed seed metal layer 15 is removed using a wet etching technique.

At this time, when manufacturing a micro inductor using the conductive line (3) coated with a protective film as shown in Fig. 6 (c) (d) before the exposed seed metal layer 15 is removed using a thin film layer such as Ni using electrolytic electroplating A cladding 11 and a protective layer 12 such as Au are sequentially formed, and then the exposed seed metal layer 15 is removed.

After removing the exposed seed metal layer 15 by another method, the thin film layer 11 such as Ni and the protective layer 12 such as Au are sequentially formed by using electroless electroplating.

As described above, a spiral type micro passive device using a conductive line coated with a protective film is completed by using one of two methods.

11 and 12 are process diagrams for implementing the spiral type micro inductor shown in FIG. 4, and FIG. 11 is a process diagram of forming a micro inductor floating in the air without a post 5 as shown in FIG. 4 (b) is a process diagram of making a micro inductor having a post 5 floating in the air as shown in FIG. 4 (b) (c) (d).

The process sequence of FIGS. 11 and 12 is the same and the patterns for forming the posts 5 are different only when designed.

The process sequence is as follows.

First, as shown in FIG. 11A (FIG. 12A), the seed metal layer 15 is coated on the insulating substrate 1, and then the photoresist or polyimide, which is the sacrificial layer 16, is formed and patterned to form a post 5. To form a mold.

Subsequently, the formed mold is deposited with a metal 17 such as Au, Cu, Ag, Ni, or alloys using electroplating.

As shown in FIG. 11B and FIG. 12B, the seed metal layer 22 and the sacrificial layer photoresist or polyimide are sequentially formed and patterned to form the signal connection part 4 and the via. ) Forms an electroplating mold for the part 2 and the post 5.

Subsequently, a metal 19 such as Au, Cu, and Ag is deposited using electroplating on the formed mold.

And as shown in Fig. 11 (c) (Fig. 12 (c)) by forming and patterning the photoresist or polyimide as the sacrificial layer 21 to form a mold for electroplating and using the electroplating in the mold Au, Cu And deposited with a metal (23), such as Ag.

In this case, the patterns formed by electroplating are vias 2 and posts 5.

Subsequently, a photoresist or polyimide, which is a sacrificial layer, is formed on the front surface as shown in FIG. 11 (d) (FIG. 12 (d)), and patterned to form a spiral conductive line 3 to form a mold for electroplating. Electroplating is used to mold metals such as Au, Cu, and Ag.

And the sacrificial layers 16, 18, 21 formed of a multi layer as shown in Fig. 11 (e) (Fig. 12 (d)) is removed using acetone, dry etching, or the like. In addition, the seed metal layers 15 and 22 are removed using a wet etching technique.

At this time, when manufacturing a micro inductor using the conductive line 3 is coated with a protective film as shown in Fig. 6 (c) (d) before the seed metal layer 15 is removed using a thin film layer such as Ni (electrolytic electroplating) cladding) 11 and a protective layer 12 such as Au are sequentially formed, and then the seed metal layer 15 is removed.

Alternatively, the seed metal layer 15 is removed, and then a thin film layer 11 such as Ni and a protective layer 12 such as Au are sequentially formed by using electroless electroplating.

As described above, a spiral type micro passive device using a conductive line coated with a protective film is completed by using one of two methods.

FIG. 13 is a process diagram of the solenoid type micro inductor shown in FIG. 8. First, as shown in FIG. 13 (a), the seed metal layer 15 is coated on the insulating substrate 1, and then the sacrificial layer 16 is a photoresist or polyimide. And pattern to form a mold for post 5.

Subsequently, a metal 5 such as Au, Cu, Ag, Ni, and an alloy is deposited on the formed mold as shown in FIG. 13 (b) by using electroplating.

As shown in FIG. 13C, a mold for the lower conductive line 14 is formed by forming and patterning the photoresist or polyimide, which is the sacrificial layer 18.

And as shown in Figure 13 (d) by depositing a metal 14, such as Au, Cu, Ag using the electroplating in the formed mold.

Subsequently, as shown in (e) of FIG. 13, a sacrificial layer 18 is formed of photoresist or polyimide and patterned to form a mold for electroplating, and as shown in FIG. Metals 2 such as Cu and Ag are deposited.

In this case, the pattern formed by electroplating is a via part 2 for electrically connecting the lower conductive line 14 and the upper conductive line 13.

Then, as shown in FIG. 13 (g), a sacrificial layer is formed and patterned to form a mold for forming the upper conductive line 13, and then metals such as Au, Cu, and Ag are formed using electroplating on the mold. Deposit.

Subsequently, the seed metal layer 15 may be exposed to the sacrificial layers 16 and 18 and 21 formed of a multi layer as shown in FIG. 13 (h) using acetone or dry etching. Until it is removed, and then the exposed seed metal layer 15 is removed using a wet etching technique.

At this time, when manufacturing a micro inductor using the conductive line 3 is coated with a protective film as shown in Fig. 6 (c) (d) before the seed metal layer 15 is removed using a thin film layer such as Ni (electrolytic electroplating) cladding) 11 and a protective layer 12 such as Au are sequentially formed, and then the seed metal layer 15 is removed.

In another method, the seed metal layer 15 is removed, and then a protective thin film layer 11 such as Ni and a protective layer 12 such as Au are sequentially formed by using electroless electroplating.

As described above, a solenoid type micro passive device using conductive lines coated with a protective film is completed by using one of two methods.

The micro passive device and the manufacturing method according to the present invention as described above has the following effects.

First, since the inductor device is formed at a certain distance from the substrate, adverse effects such as parasitic capacitance, dielectric loss, and conductive loss generated from the substrate can be reduced, thereby improving the performance of the conductivity. .

Second, it is possible to realize a low cost system because expensive lines are not formed thick on a substrate, and conductive lines are formed to have a predetermined space with the substrate by using posts.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

Claims (10)

Substrate, A signal connection portion formed on the substrate; Conductive lines formed in a predetermined shape at a predetermined height on the substrate; A via part connecting the signal connection part and the conductive line; And a plurality of first posts supporting the conductive line. delete The method of claim 1, The conductive line is a micro-passive device, characterized in that it is configured having a shape of any one of the spiral-type (soleal-type) or (solenoid-type). The method of claim 1, The conductive line is a micro passive device, characterized in that consisting of a protective layer having a high conductivity and a thin film layer of a conductive material on the surface. The method of claim 4, wherein The thin film layer is a micro passive device, characterized in that formed of Ni. The method of claim 4, wherein The protective layer is a micro passive device, characterized in that formed of Au, Ag. The method of claim 1, The signal connection part is supported by the second posts (posts) formed in a predetermined thickness on the substrate is a micro passive device, characterized in that configured to have a predetermined height on the substrate. In a micro passive device consisting of a conductive line having a predetermined shape, a signal connection portion, a via portion, and a post, Forming and patterning a sacrificial layer on the substrate on which the seed metal layer is formed to form a first mold for signal connection and a post; Depositing a conductive metal on the first mold and then forming and patterning a sacrificial layer on the entire surface to form a second mold for the via portion and the post; Depositing a conductive metal on the second mold and then forming and patterning a sacrificial layer on the entire surface to form a third mold for a conductive line having a predetermined shape; And depositing a conductive metal on the third mold to remove the sacrificial layer and selectively removing the seed metal layer. The method of claim 8, The conductive metal is Au, Cu, Ag, Ni, or a method of manufacturing a micro passive device, characterized in that formed of any one of the alloys (alloys). The method of claim 8, And the sacrificial layer is formed of photoresist or polyimide.