KR100329016B1 - transfer apparatus - Google Patents
transfer apparatus Download PDFInfo
- Publication number
- KR100329016B1 KR100329016B1 KR1019990024490A KR19990024490A KR100329016B1 KR 100329016 B1 KR100329016 B1 KR 100329016B1 KR 1019990024490 A KR1019990024490 A KR 1019990024490A KR 19990024490 A KR19990024490 A KR 19990024490A KR 100329016 B1 KR100329016 B1 KR 100329016B1
- Authority
- KR
- South Korea
- Prior art keywords
- guide rails
- bracket
- product
- roller
- chains
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0208—Control or detection relating to the transported articles
- B65G2203/0233—Position of the article
Abstract
Description
본 발명은 이송장치에 관한 것으로서, 보다 상세하게는 제품의 손상을 방지할 수 있을 뿐 아니라, 제품을 손쉽게 정렬할 수 있도록 된 새로운 구조의 이송장치에 관한 것이다.The present invention relates to a conveying apparatus, and more particularly, to a conveying apparatus of a new structure that can not only prevent the damage of the product, but also to easily align the product.
일반적으로, 반도체 패키지의 리드프레임 또는 PCB기판의 제조공정에 사용되는 이송장치는 테이블의 상면에 장착된 로울러에 금속망으로 구성된 메쉬벨트를 걸고, 구동모터로 상기 로울러를 회전시켜, 메쉬벨트의 상면에 배치되는 제품을 이송할 수 있도록 구성된다.In general, a transfer device used in the manufacturing process of a lead package or a PCB substrate of a semiconductor package is fastened to a roller mounted on an upper surface of a table by a mesh belt made of a metal mesh, and rotates the roller with a driving motor, thereby providing an upper surface of the mesh belt. It is configured to be able to transport the products that are placed in.
그런데, 이러한 이송장치는 금속망으로 구성된 메쉬밸트를 이용하므로, 제품의 하측면이 메쉬벨트에 의해 손상될 수 있을 뿐 아니라, 이 이송장치의 전후에 설치된 이송장치와 연계하여 제품을 연속적으로 이송하기 어려운 문제점이 있었다. 특히, 배면에 접점용 볼을 부착배열시킨 볼그리드 어레이 회로기판(이하 BGA 회로기판이라 칭함)을 이송하는 BGA 회로기판용 이송장치의 경우, 상기 메쉬벨트의 상하측에 히터를 장착하여, 히터의 열로 접점용 볼을 용해시키는데, 히터에 의해 메쉬벨트가 가열되어 메쉬벨트의 강도가 약해지므로 수명이 단축되는 문제점이 있었다.However, since the transfer device uses a mesh belt composed of a metal mesh, the lower side of the product may not only be damaged by the mesh belt, but also continuously transfer the product in connection with the transfer device installed before and after the transfer device. There was a difficult problem. Particularly, in the case of a BGA circuit board transfer device which transfers a ball grid array circuit board (hereinafter referred to as a BGA circuit board) in which a contact ball is arranged on the rear surface, a heater is mounted on the upper and lower sides of the mesh belt. Dissolving the contact ball with heat, the mesh belt is heated by the heater, the strength of the mesh belt is weakened, there was a problem that the life is shortened.
본 발명은 상기의 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 제품의 하측면이 손상되는 것을 방지함과 동시에 제품을 손쉽게 정렬할 수 있을 뿐 아니라, 히터에 의해 수명이 단축되는 것을 방지할 수 있도록 된 새로운 구조의 이송장치를 제공하는 것이다.The present invention is to solve the above problems, the object of the present invention is to prevent the damage to the lower side of the product and at the same time easy to align the product, it is possible to prevent the life is shortened by the heater. It is to provide a conveying device of a new structure.
도 1은 본 발명에 따른 이송장치의 측면구성도1 is a side configuration diagram of a transport apparatus according to the present invention
도 2는 도 1의 평면도2 is a plan view of FIG. 1
도 3은 도 1의 정면도3 is a front view of FIG. 1
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
4. 테이블 6. 가이드레일4. Table 6. Guide rail
8. 로울러 12. 체인8. Roller 12. Chain
14. 스프로켓 18. 가로대14. Sprocket 18. Rung
20. 브라켓20. Bracket
본 발명에 따르면, 테이블(4)과, 이 테이블(4)의 상면에 상호 평행하게 설치된 복수개의 가이드레일(6)과, 이 가이드레일(6)의 대향면에 연속적으로 장착되어 그 상측에 공급되는 제품의 양측을 지지하는 다수개의 로울러(8)와, 상기 테이블(4)의 상면 양측에 장착된 스프로켓(14)에 걸려 상기 가이드레일(6)과 평행하게 설치된 한쌍의 체인(12)과, 그 양단이 상기 체인(12)에 각각 결합된 다수개의 가로대(18)와, 이 가로대(18)의 하측으로 연장된 브라켓(20)을 포함하여 구성되며, 상기 스프로켓(14)의 구동에 따라, 상기 가로대(18)의 하측으로 연장된 브라켓(20)이 상기 로울러(8)에 지지된 제품을 밀어 전진시킬 수 있도록 된 것을 특징으로 하는 이송기구가 제공된다.According to the present invention, the table 4, a plurality of guide rails 6 provided in parallel with each other on the upper surface of the table 4, and the opposing surfaces of the guide rails 6 are continuously mounted and supplied to the upper side thereof. A plurality of rollers 8 supporting both sides of the product, a pair of chains 12 mounted in parallel with the guide rails 6 by sprockets 14 mounted on both sides of the upper surface of the table 4; Both ends thereof include a plurality of cross bars 18 coupled to the chain 12, and brackets 20 extending downward of the cross bars 18. As the sprocket 14 is driven, A conveying mechanism is provided, characterized in that the bracket 20 extending downward of the crosspiece 18 can push forward the product supported by the roller 8.
이하, 본 발명의 바람직한 실시예를 첨부한 도면에 의거하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
도 1내지 도 3은 본 발명에 따른 이송기구를 도시한 것으로, 상면에 히터가구비되어 BGA 회로기판(10)의 접점용 볼을 용해시킬 수 있도록 된 볼그리드 어레이 회로기판(10)용 이송기구를 예시한 것이다.1 to 3 illustrate a transfer mechanism according to the present invention, wherein a heater is provided on an upper surface of the transfer mechanism for a ball grid array circuit board 10 to dissolve a ball for contact of the BGA circuit board 10. It is an example.
다수개의 히터(1)가 구비된 히팅챔버(2)가 장착된 테이블(4)의 상면에는 이 히팅챔버(2)를 통과하도록 두쌍의 가이드레일(6)이 상호 평행하게 설치된다. 이 가이드레일(6)은 상호간의 간격을 조절할 수 있도록 측방향으로 슬라이드가능하게 장착된 것으로, 이 가이드레일(6)의 대향면에는 이 가이드레일(6)의 길이방향으로 다수개의 로울러(8)가 연속적으로 장착된다. 이 로울러(8)는 그 상측으로 공급되는 BGA 회로기판(10)의 하측면 양단을 지지하는 것으로, 열에 강한 세라믹으로 제작된다.Two pairs of guide rails 6 are installed in parallel on the upper surface of the table 4 on which the heating chamber 2 equipped with a plurality of heaters 1 is passed so as to pass through the heating chamber 2. The guide rails 6 are slidably mounted in a lateral direction so as to adjust the distance therebetween. On the opposite surface of the guide rails 6, a plurality of rollers 8 are provided in the longitudinal direction of the guide rails 6. Are mounted continuously. The rollers 8 support both ends of the lower surface of the BGA circuit board 10 supplied upward, and are made of ceramics resistant to heat.
그리고, 상기 테이블(4)의 상면에는 상기 가이드레일(6)과 평행하게 한쌍의 체인(12)이 설치된다. 이 체인(12)은 테이블(4)의 상면 양단에 각각 설치된 스프로켓(14)에 걸려 상기 가이드레일(6)의 외측에 위치되도록 설치되는 것으로, 이 스프로켓(14)에 연결된 구동모터(16)에 의해 작동된다. 그리고, 이 체인(12)에는 일정 간격으로 다수개의 가로대(18)가 설치된다. 이 가로대(18)는 그 양단이 상기 체인(12)에 결합되는 것으로, 그 중간부는 브라켓(20)이 각각 하향연장된다. 이 브라켓(20)은 상기 체인(12)과 함께 이송되는 것으로, 그 하단이 상기 로울러(8)에 지지되는 BGA 회로기판(10)의 후단을 밀어 이송할 수 있다.In addition, a pair of chains 12 are provided on the upper surface of the table 4 in parallel with the guide rails 6. The chain 12 is mounted on the sprockets 14 provided at both ends of the upper surface of the table 4 so as to be positioned outside the guide rails 6. The chain 12 is connected to the drive motor 16 connected to the sprocket 14. Is operated by The chain 12 is provided with a plurality of cross bars 18 at regular intervals. Both ends of the crosspiece 18 are coupled to the chain 12, and the middle portion of the crossbar 18 extends downward. The bracket 20 is transported together with the chain 12, and the lower end of the bracket 20 may push the rear end of the BGA circuit board 10 supported by the roller 8.
도면번호 22는 상기 체인(12)의 장력을 조절하는 보조스프로켓을 도시한 것이다. 따라서, 상기 가이드레일(6)의 간격을 BGA 회로기판(10)의 사이즈에 맞게 조절한 후, 가이드레일(6)의 사이로 BGA 회로기판(10)을 공급하면, 가이드레일(6)의대향면에서 내향돌출된 로울러(8)에 의해 BGA 회로기판(10)의 양단이 지지되며, 상기 가로대(18)의 브라켓(20)이 상기 BGA 회로기판(10)을 밀어 이송시킨다. 그리고, 이와같이 이송된 BGA 회로기판(10)이 상기 히팅챔버(2)를 통과하여, 그 배면에 배열된 접점용 볼이 용해시킬 수 있다.Reference numeral 22 shows an auxiliary sprocket for adjusting the tension of the chain 12. Therefore, after adjusting the spacing of the guide rails 6 to the size of the BGA circuit board 10, and then supplying the BGA circuit board 10 between the guide rails 6, on the opposite side of the guide rail 6 Both ends of the BGA circuit board 10 are supported by the inwardly protruding roller 8, and the bracket 20 of the crossbar 18 pushes the BGA circuit board 10. Then, the BGA circuit board 10 transferred in this manner passes through the heating chamber 2, and the contact balls arranged on the rear surface thereof can be dissolved.
이와같이 구성된 이송기구는 상기 로울러(8)로 BGA 회로기판(10)의 하측면 양측을 지지하므로, 메쉬벨트를 이용하여 BGA 회로기판(10)의 하측면이 손상될 수 있는 종래의 이송기구와는 달리, 제품이 손상될 염려가 없을 뿐 아니라, 상기 체인(12)에 일정간격으로 장착된 가로대(18) 및 이 가로대(18)에 장착된 브라켓(20)을 이용하여 제품을 이송하므로, 제품을 정확하게 정렬할 수 있는 장점이 있다. 또한, 제품을 지지하는 로울러(8)가 열에 강한 세라믹으로 구성되므로, 상기 히팅챔버(2)의 열에 의해 수명이 단축되는 문제점이 없는 특징이 있다. 또한, 상기 로울러(8)와 가로대(18) 및 이 가로대(18)에 장착된 브라켓(20)을 이용하여 볼을 이송하므로, 전후측에 설치된 다른 이송기구와 연계하여, BGA 회로기판(10)을 연속적으로 이송할 수 있는 특징이 있다.The transfer mechanism configured as described above supports both sides of the lower side of the BGA circuit board 10 by the roller 8, and thus, the transfer mechanism may be damaged by using a mesh belt. Otherwise, there is no fear of damage to the product, and the product is transported using the crossbar 18 mounted on the chain 12 at a predetermined interval and the bracket 20 mounted on the crossbar 18, thereby transferring the product. The advantage is that you can align correctly. In addition, since the roller 8 supporting the product is made of a heat resistant ceramic, there is no problem that the life of the heating chamber 2 is shortened by the heat. In addition, since the ball is transferred using the roller 8 and the crossbar 18 and the bracket 20 mounted on the crossbar 18, the BGA circuit board 10 is linked with other transfer mechanisms installed at the front and rear sides. There is a feature that can be transported continuously.
본 실시예의 경우, 그 상면에 히팅챔버(2)가 구비되어, BGA 회로기판(10)의 접점용 볼을 용해시킬 수 있도록 된 BGA 회로기판(10)용 이송기구를 예시하였으나, 상기 히팅챔버(2)를 제거하여, PCB기판 등과 같은 기타 제품의 이송에 사용하는 것도 가능하다.In the present embodiment, the heating chamber (2) is provided on the upper surface, the transfer mechanism for the BGA circuit board 10 to dissolve the ball for contact of the BGA circuit board 10 is illustrated, but the heating chamber ( 2) can be removed and used for the transfer of other products such as PCB and so on.
이상에서와 같이 본 발명에 의하면, 테이블의 상면에 장착된 한쌍의 가이드레일의 대향면에 다수개의 로울러를 설치하고, 이 가이드레일과 평행하게 설치된 한쌍의 체인에 다수개의 가로대를 설치하여, 이 가로대의 하측으로 연장된 브라켓이 로울러에 의해 지지된 제품을 밀어 이송할 수 있도록 구성하므로써, 제품의 하측면이 손상되는 것을 방지함과 동시에 제품을 손쉽게 정렬할 수 있을 뿐 아니라, 히터에 의해 수명이 단축되는 것을 방지할 수 있도록 된 새로운 구조의 이송장치를 제공할 수 있다.As described above, according to the present invention, a plurality of rollers are provided on opposing surfaces of a pair of guide rails mounted on the upper surface of the table, and a plurality of cross bars are provided on a pair of chains installed in parallel with the guide rails. The bracket extended to the lower side of the product can be configured to push and transport the product supported by the roller, which prevents damage to the lower side of the product and at the same time makes it easy to align the product. It is possible to provide a feed structure of a new structure that can be prevented from becoming.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990024490A KR100329016B1 (en) | 1999-06-26 | 1999-06-26 | transfer apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990024490A KR100329016B1 (en) | 1999-06-26 | 1999-06-26 | transfer apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990073254A KR19990073254A (en) | 1999-10-05 |
KR100329016B1 true KR100329016B1 (en) | 2002-03-18 |
Family
ID=37479092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990024490A KR100329016B1 (en) | 1999-06-26 | 1999-06-26 | transfer apparatus |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100329016B1 (en) |
-
1999
- 1999-06-26 KR KR1019990024490A patent/KR100329016B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19990073254A (en) | 1999-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR890001848A (en) | Bottle feeder | |
EP0960863B1 (en) | Furnace for the continuous heat treatment of glass containers | |
KR100329016B1 (en) | transfer apparatus | |
JP3161944B2 (en) | Elevating conveyor and substrate coating and drying equipment | |
KR100257096B1 (en) | Continuos dryer for flat material | |
KR101922902B1 (en) | Reflow Soldering Machine Having Droop Prevention Structure For Circuit Board | |
KR100820069B1 (en) | Lamp loading apparatus | |
KR101548375B1 (en) | Substrate moving apparatus of chemical treatment | |
KR101156646B1 (en) | Vertical cure oven | |
JP2000054197A (en) | Electroplating system enabling uniform plating | |
JP4635350B2 (en) | Transport device | |
JP2682149B2 (en) | Reflow soldering equipment | |
JP2012124337A (en) | Component mounting facility including reflow device, substrate conveyance mechanism, and substrate conveyance pallet | |
JP2008159961A (en) | Board transfer apparatus | |
JP4229580B2 (en) | Reflow soldering equipment | |
JP2023020097A (en) | Conveyor device and roller attaching member | |
JP2998110B2 (en) | Glass tube heating and conveying equipment | |
JPH09167821A (en) | Thermal treatment method of electronic parts lead frame continuous body | |
JP3947929B2 (en) | Linked seedling transport device in transplanter | |
JPH02137666A (en) | Reflow soldering device and heating method | |
JP2001044619A (en) | Continuous heat treatment furnace | |
JPH09237967A (en) | Conveying method and equipment of board in reflow automatic soldering equipment | |
CN116555875A (en) | Synchronous conveying system for multiple steel belts and flying targets and electroplating equipment | |
JPH10163623A (en) | Conveyor type substrate heating furnace | |
JPH0244795A (en) | Method and apparatus for securely heating printed circuit board, assembly and so forth uniformly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090306 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20120307 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20150306 Year of fee payment: 14 |
|
LAPS | Lapse due to unpaid annual fee |