KR100300232B1 - Manufacturing method for rear panel of plasma display panel - Google Patents

Abstract

The present invention provides a PDP manufacturing method in which each functional layer of the PDP backplane is properly used by screen printing and photolithography and a chemically etched plastic body is formed to form a partition layer. Match the layer with the lower layer and bring the alignment mark to the same layer as in the case of photolithography, and in this process, correct and compensate the alignment error due to the deformation in each functional layer by printing and firing. The present invention relates to a method for manufacturing a plasma display panel back plate having reduced alignment error.

Description

Plasma Display Panel Backplane Manufacturing Method {MANUFACTURING METHOD FOR REAR PANEL OF PLASMA DISPLAY PANEL}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (PDP) backplane manufacturing method. More particularly, screen printing and photolithography are used to form the functional layers of the backplane and chemically etch the plastics. In the PDP manufacturing method in which the partition layer is formed, basically, when aligning each functional layer, the corresponding layer and the lower layer are matched, and when the photolithography is performed, the alignment mark is brought to be the same as the corresponding layer. The present invention relates to a method of manufacturing a plasma display panel back plate which reduces alignment errors by correcting and compensating alignment errors due to deformations generated in each functional layer by printing and firing.

The plasma display panel (PDP) is a device for displaying a screen by forming a discharge space between the front glass substrate and the rear glass substrate, and generates a plasma discharge between the electrodes to emit light to excite the phosphors present in the surroundings.

In general, a plasma display panel (PDP) can be divided into a direct current type and an alternating current (AC) type, and an AC type PDP is the mainstream.

1 is a cross-sectional configuration of a one-cell of a general AC PDP, and the sealing structure 36 is sealed between the front plate 100 and the rear plate 200.

First, the front plate 100 is formed on the front glass substrate 10, the sustain electrode 12 formed at the bottom of the front glass substrate 10, and the bottom of the sustain electrode 12 to reduce the resistance of the sustain electrode 12. The front dielectric layer 16 covering the bus electrode 14, the bus electrode 14 and the sustain electrode 12, and a lower portion of the front dielectric layer 16 to prevent sputtering of the front dielectric layer 16. The magnesium oxide (MgO) layer 18 is comprised.

The rear plate 200 is formed on the rear glass substrate 20, the rear glass substrate 20, and has a base layer 22 and a predetermined gap therebetween to prevent color smearing of the address electrode. Along the surface of the partition wall 28 formed on the top of the dielectric layer 26 between the address electrode 24, the rear surface dielectric layer 26 covering the address electrode 24, and the address electrode 24. It consists of red (R), green (G), and blue (B) phosphors 30, 32 and 34 coated and fired, respectively.

A gas causing plasma discharge is sealed between the front plate 100 and the back plate 200, and the sealing structure 36 seals between the front plate 100 and the back plate 200 for sealing thereof.

As a manufacturing method for forming the back plate 200, a screen printer method, a sand blast method, and the like are widely used.

In the screen printer method, a base plate is placed on the rear glass substrate 20, and then a base paste is placed on the base plate and pushed with a squeegee to pass the paste through the opening of the base plate to screen print. At this time, the printed base layer 22 is dried at a temperature of 120 to 150 ° C. for about 5 to 10 minutes, and then fired at 550 to 580 ° C. for about 10 minutes.

Subsequently, an electrode paste is placed on the electrode plate on the fired body, and electrode pattern printing is performed using a squeegee to form an electrode layer 24, which is dried at a temperature of 120 to 150 ° C. for 5 to 10 minutes and then 500 to 600. Firing is carried out at about 10 minutes.

Subsequently, a dielectric paste was placed on the dielectric plate on the fired body and the entire surface was printed with a squeegee to form a dielectric material 26. The dielectric material 26 was dried at a temperature of 120 to 150 ° C. for about 5 to 10 minutes, and then 550 to 580. Firing is carried out at about 10 minutes.

Then, the bulkhead paste is placed on the partition plate on the calcined body, and the partition pattern is printed by squeegee to form the partition layer 28, which is dried at a temperature of 120 to 150 ° C. for about 5 to 10 minutes, and then again. After the partition pattern printing process and the drying process are performed about 8-20 times on the partition layer 28, it bakes at 550-600 degreeC for about 10 minutes.

Thereafter, the red phosphor paste was placed on the red phosphor plate on the fired body, and a red phosphor pattern was printed by squeegee to form a red phosphor layer 30, which was dried at a temperature of 120 to 150 ° C. for about 5 to 10 minutes. After the green phosphor paste is placed on the green phosphor plate, the green phosphor layer 32 is formed in the same manner as described above. Then, the blue phosphor paste is placed on the blue phosphor plate to form the blue phosphor layer 34 in the same manner as described above, and then baked at 450 to 490 ° C. for about 30 to 60 minutes to complete the PDP back plate.

PDP backplane manufacturing method by the sandblasting method is as follows.

The method of forming the base layer 22 to the dielectric layer 26 on the back substrate 20 is the same as the screen printer method, and the method of forming the partition wall 28 is as follows.

The bulkhead paste is placed on the bulkhead plate on the fired body of the dielectric material 26, and the bulkhead layer is printed by squeegee to form the partition wall layer. The partition wall is dried for 5 to 10 minutes at a temperature of 120 to 150 ° C, and the partition wall is formed again. After the bulkhead front printing process and the drying process are performed on the layer about 8 to 10 times, the photoresist is coated on the dry body, subjected to exposure development, and then sandblasted with sand to form the partition layer, followed by 10 minutes at 550 to 600 ° C. The degree of calcination is performed to complete the partition wall 28. Then, the red, green, and blue phosphor layers 30, 32, and 34 are formed in the same manner as the screen printer method.

Here, in the manufacturing process of the PDP backplane by the screen printer method and the sand blast method, the alignment method according to the progress of the upper and lower layer printing and firing processes is as follows.

First, as shown in FIG. 2, as a result of screen printing during printing, each functional layer may be represented by a print area 40 and an alignment mark 42, and also during photolithography in the sandblasting method. A photo mask required for exposing the photoresist coated on the barrier rib body may also be indicated by the pattern forming region 40 and the alignment mark 42 as described above.

Here, the alignment mark 42 is generally disposed left and right about the diagonal extension line or the diagonal extension line of the printing area 40 or the pattern area 40, and the shape is represented by a circle, a square, or a cross.

In the printing process of the screen printer method and the sand blasting method, after the base layer 22 having the alignment mark 42 is printed, dried, and fired on the glass substrate 20, the alignment mark 42 for the fired body is ) And the alignment mark marked on the electrode plate are printed. Subsequently, after the electrode printed body is dried and fired, dielectric printing is performed by aligning the base alignment mark and the alignment mark displayed on the dielectric plate.

Then, after drying and firing the dielectric printed material, the alignment mark displayed on the base alignment mark and the barrier plate is aligned, and the barrier rib pattern printing (for the screen printer method) or the barrier rib front printing (for the sand blast method) are performed. It is then dried and fired (in the case of the screen printer method) or photolithography (in the case of the sand blast method).

At this time, in photolithography, the alignment mark of the electrode alignment mark and the alignment mask of the barrier rib photomask are aligned and exposed to light, followed by sand blasting to complete the barrier rib and firing.

Thereafter, the alignment mark displayed on the partition alignment mark of the fired body and the alignment plate of the red phosphor are aligned to perform red phosphor pattern printing and to be dried. The green and blue phosphors are formed in the same manner as the red phosphors, and the red, green, and blue phosphors are printed, dried, and calcined to form a PDP back plate.

However, the conventional plasma display panel rear panel alignment method has the following problems.

First, the glass substrate 20 used for the PDP back panel is generally used soda-lime glass (Soda-lime Glass) or PDP-only soda-lime glass (PD-200, ASahi) for general window glass, but this is 500 ℃ There was a problem that deformation occurs during the above heat treatment. That is, since the firing temperature between the base layer 22 and the partition layer 28 forming process is usually 550 to 600 ° C., deformation occurs during heat treatment, so that the alignment of the upper and lower layers is not aligned. There is a problem that the degree is further increased, the alignment is more misaligned.

Second, there is a problem that it is difficult to align the alignment between the upper and lower layers when a tension change, a viscosity change of a paste, and a mechanical state change of a screen printer occur.

Third, when the alignment for alignment is centered on the alignment mark of the underlying layer, the work for alignment mark display and the alignment of the electrode dielectric layer and the partition layer of the upper layer becomes easy, but the number of firings is increased and the printing process Due to the accumulation of phase errors, there is a problem in that the alignment is not really good.

Fourth, in the case of sandblasting, when the photoresist is coated and the exposure is not performed, if the correction of printing errors, deformation errors, etc. is not performed, the electrodes are not positioned between the partition walls and the electrodes are positioned below the partition walls or toward the side partition walls. There is a problem that the electrode is placed to bring the defect of the product.

Fifth, in the screen printer method and the sand blasting method, even if the alignment is completed perfectly before the firing of the partition wall, the glass substrate and the lower layer of the partition wall are deformed due to the partition wall firing process, which must be performed. There is a problem.

Accordingly, the present invention has been made to solve the above problems, in the present invention, by using the appropriate screen printing and photolithography to form each functional layer of the PDP backplane and chemically etched plastics to form a barrier layer layer formed PDP In the method, each of the functional layers is basically aligned with the corresponding layer and the lower layer, and during photolithography, the alignment mark is taken to be the same as the corresponding layer. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a plasma display panel rear panel which reduces alignment errors by correcting and compensating alignment errors due to deformations generated in the functional layer.

1 is a cross-sectional configuration diagram of one cell of a general AC PDP.

2 is a view showing the position of a conventional printing or pattern area and alignment mark.

3A to 3D are diagrams showing alignment marks on each plate of the PDP according to the present invention.

Figure 4 is an alignment step by step printing step according to the present invention.

5 shows an example of twisting in a printing or firing process.

6 is a view showing a configuration of a photomask according to the present invention.

Explanation of symbols on the main parts of the drawings

10: front glass substrate 12: sustain electrode

14 bus electrode 16 front dielectric layer

18: magnesium oxide (MgO) layer 20: back glass substrate

22: base layer 24: address electrode layer

26: rear dielectric layer 28: partition wall

30: red phosphor 32: green phosphor

34 blue phosphor 36 sealing structure

40: printing area or pattern forming area 42: alignment mark

44: Alignment mark of the lower surface of the lower plate

45: bottom alignment mark of electrode plate

46: Alignment mark for electrode of electrode plate

47: Alignment mark for electrode of dielectric plate

48: Dielectric alignment mark of dielectric plate

49: alignment mark for dielectric of bulkhead plate

50: alignment mark for red phosphor on bulkhead plate

52: alignment mark for green phosphor on bulkhead plate

54: alignment mark for blue phosphor on bulkhead plate

70: n-1th floor alignment mark 70 ': nth floor alignment mark

72: n-1 layer printing or plastic zone longitudinal axis center line

72 ': n-layer printing or plastic zone longitudinal centerline

74: n-1 layer printing or plastic zone horizontal axis center line

74 ': n-layer printing or plastic zone horizontal axis centerline

76: forge pattern 78: photo mask substrate

80: you pattern

In order to achieve the above object, the plasma display panel backplane manufacturing method of the present invention,

At least on a glass substrate, a base layer, an electrode layer, a dielectric layer, a partition layer, a red phosphor layer, a green phosphor layer, and a blue phosphor layer, wherein the base layer and the dielectric layer are processed in the order of front printing → drying → firing, and the electrode layer And the phosphor layer may be processed by pattern printing → drying → firing, or full surface printing → drying → photolithography → firing. The partition layer may be formed by front printing → drying → firing → photolithography. In the plasma display panel back plate manufacturing method to be processed in order,

During the front printing or pattern printing process, aligning the base layer with the glass substrate, aligning the electrode layer with the base layer, aligning the dielectric layer with the electrode layer, and Aligning the barrier layer with the dielectric layer, and sequentially aligning the red, green, and blue phosphor layers with the barrier layer, respectively, and during the photolithography process on the dry or fired body, Aligning the base layer with an electrode photomask having an alignment mark identical to that of the base layer, aligning the electrode layer with a barrier photomask having the same alignment mark as the electrode layer, and the barrier layer And a step of aligning the barrier layer with a photomask for phosphors having the same alignment mark as.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In addition, in all the drawings for demonstrating an embodiment, the thing with the same function uses the same code | symbol, and the repeated description is abbreviate | omitted.

First, the PDP backplane manufacturing method according to the present invention is as follows.

The base paste was placed on the glass substrate 20 on the glass substrate 20, and the base layer 22 was formed by squeegee printing. Then, the base layer 22 was dried at 120 to 180 ° C. for 10 to 20 minutes, and then 550 to 600 ° C. Baking is carried out in about 10 to 60 minutes.

The electrode layer 24 is then performed in one of the two steps below.

That is, one of the substrate is placed on the electrode plate on the base material, and the electrode pattern printing is performed with a squeegee to form the electrode layer 24, which is then dried for 10 to 20 minutes at 120 to 180 ° C. It bakes at 500-580 degreeC for about 10 to 60 minutes.

Another method is to put the electrode (U) V (V) paste for the electrode on the base plate on the electrode plate and to print the entire surface of the electrode with a squeegee to form the electrode layer 24 and to 10 to 120 ~ 180 ℃ After drying for about 20 minutes, development is carried out using a UV paste-dedicated developer, and baking is carried out at 550 to 600 ° C. for about 10 to 60 minutes.

Subsequently, the dielectric layer 26 forms a dielectric layer 26 by placing a dielectric paste on the dielectric plate on the electrode layer 24 and printing the entire surface with a squeegee. The dielectric layer 26 is formed at 120 to 180 ° C. for about 10 to 20 minutes. After drying, it bakes at about 550-600 degreeC for about 10 to 60 minutes.

Subsequently, the partition layer 28 is formed by placing a barrier paste on the partition plate on the dielectric layer plastic body and performing a front surface printing with a squeegee to form the partition layer 28 and drying at 120 to 180 ° C. for 10 to 20 minutes. After performing the bulkhead front printing process and the drying process on the partition layer 28 again about 8-10 times, baking is performed at 450-650 degreeC for about 10 to 30 minutes.

Then, a photoresist is formed on the fired body, the exposure is performed with an etching photo mask, and the etching layer is etched to complete the partition layer 28.

Subsequently, the phosphor layers 30, 32, and 34 are performed by one of the following two types.

One of them places a red (R) phosphor paste on the partition body on a phosphor plate and performs a red phosphor pattern printing with a squeegee to form a red phosphor layer 30, which is 10 to 20 minutes at 120 to 180 ° C. After drying, the green (G) and blue (B) phosphor layers are sequentially performed in the same manner as above, and the red, green, and blue phosphor layers are dried, and then fired at 450 to 490 ° C. for about 30 to 60 minutes.

In another method, the red phosphor layer 30 is formed by placing a red phosphor UV paste on the partition body on a plate of red phosphor, and performing red phosphor front printing with a squeegee, and forming the red phosphor layer 30 at 120 to 180 ° C. After drying for about a minute, the resultant is exposed with a red phosphor photomask, developed with a dedicated developer, and the green and blue phosphor layers are sequentially performed in the same manner as described above to complete the development of the red, green and blue phosphor layers, followed by 450 to 490 ° C. Firing in about 30 to 60 minutes

Here, in the manufacturing method of the PDP backplane according to the present invention, first, the alignment method according to the progress of the upper and lower layer printing and firing processes will be described with reference to FIGS. 3A to 3D.

3A to 3D show examples of the aligning mark on each plate according to the present invention.

The base plate has a base alignment mark 44 of one or two base plate outside the base area 22, and the base alignment mark 44 and the glass substrate 20 of the base plate. After aligning, put the base paste on the base plate and perform the squeegee underside front printing on the glass substrate 20. (Dummy printing, air printing)

Subsequently, the dummy printing is recognized by the alignment camera, and the glass substrate 20 is input to align the content of the alignment camera with the recognition of the dummy printing, and the front substrate is printed on the glass substrate 20. That is, the electrode layer 24, the dielectric layer 26, the partition layer 28, and the phosphor layers 30, 32, and 34 are applied in the manner as shown in FIGS. 3 and 4.

Here, as shown in FIGS. 3A to 3D, the alignment mark and the matching for each layer are as shown in FIGS. 3A to 3D, and the alignment mark of the electrode layer 24 is for the electrode of the electrode alignment plate 45 and the electrode alignment plate. It is composed of an alignment mark 46, and its components are about 2-5 (first 1-5). Among them, the base alignment marks 45 (one in FIG. 3B) of the electrode plate of about 1 to 2 are replaced by the base alignment marks 44 of the base plate of the base layer 22 (in FIG. 3A). The pairing is performed in the same manner as in Fig. 1 (see Figs. 3A and 3B).

The alignment mark of the dielectric layer 26 is composed of the electrode alignment mark 47 of the dielectric plate and the dielectric alignment mark 48 of the dielectric plate, and the number is 2 to 5 (1 to 1 at first). 2) about. Here, the electrode alignment marks 47 (three in FIG. 3C) of the dielectric plate of about 1 to 3 (first 1 to 2) are aligned with the electrode alignment marks 46 of the electrode plate of the electrode layer 22. (3 in FIG. 3B) are displayed in the same manner (see FIG. 3B and FIG. 3C) for matching.

The alignment mark of the partition layer 28 includes an alignment mark 49 for dielectrics of the partition plate and red, green and blue phosphor alignment marks 50, 52, and 54 of the partition plate. 7-15 each (1-5 initially). Here, the dielectric alignment marks 49 (one in FIG. 3D) of one or two partition plate plates are replaced by the dielectric alignment marks 48 (1 in FIG. 3C) of the dielectric plate of the dielectric layer 26. FIG. And match them with

The alignment marks of the red, green, and blue phosphors 30, 32, and 34 (see FIG. 1) consist of alignment marks for the red, green, and blue phosphors of the red, green, and blue phosphor plates, respectively. The red, green, and blue phosphor alignment marks 50, 52, and 54 are respectively the same and matched as described above.

Here, in the process of photolithography (Photo Lithograpy), that is, during the photolithography of the electrode layer 24, the partition layer 28, the phosphor layers 30, 32, 34, each photomask is matched and frozen as follows. Perform phosphorus.

That is, the electrode layer 24 displays the same alignment mark and number as that of the base layer 22 on the electrode photomask, aligns with the base layer 22 to align, and the partition layer 28 is the partition wall photo. The same alignment mark and number as that of the electrode layer are displayed on the mask to align with the electrode layer, and the phosphor layers 30, 32, and 34 are aligned with the corresponding barrier layer on each of the red, green, and blue phosphor photomasks. The mark and the number of marks are displayed to align with each of the partition walls.

However, when the alignment of the corresponding layer is actually performed as the upper and lower layers are printed and fired, the following problems occur and the alignment correction cannot be performed.

In other words, the screen tension of the screen plate of the corresponding layer during the actual printing operation, the properties of each lot of the paste used, the viscosity change during use, the mechanical error of the screen printer occurs, so that the alignment of the upper and lower layers are designed or plated Based on the alignment mark formed, it is distorted up, down, left and right.

In addition, since each layer formed on the soda lime glass is subjected to heat treatment over 500 ° C., most of the deformation occurs so that the above-described deformation occurs separately from the deformation by printing.

Therefore, alignment correction should be performed according to the deformation caused by printing and firing.

First, in the case of deformation by printing, as shown in FIG. 5, the matching alignment marks 70 and 70 'between each upper and lower layers have one to four alignment mark mismatches between four points at one point. Alignment inconsistency may occur by the number of cases according to the case where only one upper and lower alignment mark is matched each other). Therefore, the best way to uniformly align the entire backplate in response to the misalignment between the underlayer and the phosphor layer is to print the vertical center line (72,72 ') and the horizontal center line (74,74) in the upper and lower layers. ') To match.

By doing so, it is easy to align the correction as evenly as possible with respect to the alignment mismatch.

Then, in the case of deformation by plasticity, what may be particularly problematic is an alignment mismatch between the object to be photolithography and the corresponding photomask in the photolithography process. More specifically, it is necessary to align the correction in the process of forming a pattern by photolithography on the base pattern formation layer in the horizontal axis direction (however, in the case of forming the electrode layer on the underlying layer by photolithography, the pattern The need for alignment between large patterns is relatively low.)

That is, the case where a partition pattern is formed on the baking body in which the electrode layer was formed (more exactly, on a dielectric layer), and the case where a phosphor pattern is formed on the baking body in which the partition layer was formed.

First, when the relationship between the electrode layer and the partition layer, in view of the PDP backplane structure, the electrode layer and the alignment of the electrode layer is required in the partition layer photolithography because the electrodes are located between the partition walls. However, when heat treatment is performed on a glass substrate made of soda-lime glass in the order of bottom plasticity, electrode plasticity, dielectric plasticity, and bulkhead plasticity, thermal shrinkage occurs that becomes shorter than the original glass substrate for each step of firing. do. That is, the result as shown in Table 1 can be obtained.

(Unit: μm) Not plastic Electrode plastic body Dielectric plastic Bulkhead plastic Remarks The amount of shrinkage of the glass transverse length after the initial stacking on the glass substrate -100 to -1000 -20 to -300 -20 to -300 -20 to -300

here,

1) Substrate: Soda lime glass, 2.8t thick and 40 inches in size.

2) Length measuring point: Any two points connecting the ends of the horizontal axis outside the electrode printing area

3) The variation in each step is due to the characteristic difference of each glass substrate. Table 1 is the average value.

That is, when the plastic substrate is subjected to the firing in each step as described above, the glass substrate shrinks. Accordingly, the length shrinkage of the glass substrate immediately after the partition wall firing based on the electrode pattern is about -100 to -400 μm. Taking this into consideration with the unit pitch value of 420 μm, which is equivalent to the 40-inch VGA class, it proves that the electrode and the partition cannot be properly aligned. Moreover, it is easy to see that alignment mismatch can occur at higher resolutions over VGA level with smaller unit pitch.

At this time, deformation occurs in the longitudinal axis of the pattern formation region, but the mutual alignment correlation is weak in the longitudinal axis direction, and the effect thereof can be ignored.

Here, the partition layer and the phosphor layer are different from the relationship between the electrode layer and the partition layer.

That is, since the partition layer is partitioned in the state where baking is already completed unlike the case of the screen printing method or the sand blasting method, it is not necessary to consider thermal contraction in the horizontal axis direction as described above. Therefore, alignment correction of the phosphor photomask in the horizontal axis direction is not necessary due to thermal contraction by firing.

Based on the above facts, a method for correcting the alignment corresponding to plastic deformation is as follows.

First, in the photolithography process, alignment correction for exposure of a corresponding photomask and a corresponding layer of a photoresist-coated glass substrate is required to form an electrode layer, a partition layer, and a phosphor layer, respectively. That is, according to the above-mentioned deformation, since each of the alignment marks does not coincide exactly, correction is performed by matching the photolithographic object with the horizontal axis and the vertical axis center line of the photomask as in the alignment correction corresponding to the deformation by printing. will be.

However, as mentioned above, in photolithography, since the mutual alignment in the longitudinal axis is weak and consideration must be given to the deformation in the transverse direction, in practice, the longitudinal axis of the photolithographic object and the corresponding photomask This can be corrected by matching the center line of the vertical axis.

At this time, in the alignment process for alignment for alignment, the ease of alignment operation is a problem depending on the negative or posi type of the photomask.

That is, when the pattern of the electrode layer, the partition layer, and the phosphor layer is exposed, the photomask is fixed to the normal exposure machine and the substrate to be exposed is mounted on the mounting table, and then moved to perform a matching. The alignment mark of the photomask is negative pattern. (Negative Pattern: Refers to an effective closed drawing shape with data) (80) makes the operation difficult because the entire alignment mark is not easily identified in the alignment with the alignment mark of the substrate to be exposed. do. Therefore, when the alignment mark of the photomask becomes a positive pattern (representing an effective open shape having data) 76, the problem can be easily solved.

In addition, the pattern effective portion must have the negative pattern 80 as opposed to the alignment mark so that the electrode layer, the partition layer, and the phosphor layer can be properly formed after photolithography.

Therefore, it is most preferable to perform the pattern effective portion of the photomask with the negative pattern 80 and the alignment mark portion with the positive pattern 76.

Subsequently, in the alignment correction of the electrode and the partition wall by the above-mentioned plastic deformation, the etching partition wall photomask should be aligned in consideration of thermal shrinkage as shown in Table 1 above.

That is, in consideration of the shrinkage between the formation of the electrode pattern and the formation of the partition wall, a correction value must be given for each striper in the etching partition photomask (electrode or partition unit of the pattern assembly in the electrode or partition pattern).

In order to provide this, there are the same amount division and the partial deformation division, but the partial deformation division divides the whole partition area n equally, so that the partition index X partial deformation amount can be corrected by the partition striper for each division area. Application is difficult because it is the lower limit of the drawing limit of the plotting machine for drawing the pattern of the photomask. Therefore, the amount of deformation during the stepwise firing of the electrode pattern measured by applying the same amount division was averaged, that is, the amount of deformation of the total electrode pattern horizontal axis length was divided by the number of total bulkhead strippers to calculate the amount of deformation. The same correction can be achieved in the simplest and also within the alignment error range between the electrode and the partition wall.

As described above, according to the method of manufacturing a plasma display panel back plate of the present invention, alignment correction is possible in response to deformation caused by an increase in the firing frequency according to the firing process for each functional layer, and various alignment errors occurring in printing Correspondingly, the alignment correction can be easily performed, and the alignment error error can be easily reduced by a simple method. In addition, in the method of aligning to the PDP backplane manufacturing method, which includes screen printing and photolithography, and in particular, a process of chemically etching a fired body and processing a partition wall, the alignment operation can be made more efficient. It is possible to make a good product with no alignment mismatches throughout the PDP backplane. In addition, since the partition wall alignment can be performed after the barrier layer firing, the screen printing method and the sand blaster method have an excellent effect of easily aligning before and after the partition wall formation.

In addition, preferred embodiments of the present invention are disclosed for the purpose of illustration, those skilled in the art will be able to various modifications, changes, additions, etc. within the spirit and scope of the present invention, these modifications and changes should be seen as belonging to the following claims. something to do.

Claims (9)

Composed of at least a base layer, an electrode layer, a dielectric layer, a partition layer, a red phosphor layer, a green phosphor layer and a blue phosphor layer on a glass substrate, The base layer and the dielectric layer are processed in the order of front printing → drying → firing, The electrode layer and the phosphor layer may be subjected to any one of pattern printing → drying → firing, or full surface printing → drying → photolithography → firing. In the method of manufacturing a plasma display panel back plate to the barrier layer is processed in the order of front printing → drying → baking → photolithography, In the front printing or pattern printing process, Aligning the underlying layer with the glass substrate; Aligning the electrode layer with the base layer; Aligning the dielectric layer with the electrode layer; Aligning the barrier layer with the dielectric layer; Aligning the red, green, and blue phosphor layers sequentially with the barrier layer, In the photolithography process on the dry or fired body, Aligning with the underlying layer with an electrode photomask having the same alignment mark as the underlying layer; Aligning the electrode layer with a barrier photomask having the same alignment mark as that of the electrode layer; And aligning the barrier layer with a phosphor photomask having the same alignment mark as the barrier layer. The method of claim 1, The front printing or pattern printing, When a specific layer laminated on the glass substrate is called n-layer and its lower layer is called n-1 layer, The printing of the n-layer, dummy printing a functional layer corresponding to the n-layer, Recognizing the dummy printing position in an alignment camera; And inserting the fired body in which the n-1 layer is formed to recognize the position of the n-1 layer and the n layer to print the functional layer corresponding to the n layer. The plasma display panel backplane manufacturing method. The method of claim 1, When the alignment mark between the upper and lower layers is inconsistent due to the deformation caused by the printing, And aligning the upper and lower print area vertical and horizontal axis center lines of the upper layer and the lower printing area vertical and horizontal axis center lines to perform alignment correction. The method of claim 1, When the alignment mark between the electrode layer and the etching barrier rib mask is inconsistent due to the deformation caused by the firing, And aligning the longitudinal center line of the electrode layer with the longitudinal center line of the etching barrier rib fabric mask, thereby performing alignment correction. The method of claim 1, When the alignment mark between the barrier rib layer and the phosphor layer photomask is inconsistent due to deformation caused by the firing, And aligning the longitudinal center line of the barrier layer with the longitudinal center line of the phosphor layer photomask, thereby performing alignment correction. The method according to claim 1 or 4, In the electrode photosk, a plasma display panel backplane manufacturing method characterized by forming an electrode effective portion in a negative pattern and an alignment mark portion in a positive pattern. The method according to claim 1 or 4, In the etching barrier rib photomask, a partition effective portion is formed in a negative pattern, and an alignment mark portion is formed in a positive pattern. The method according to claim 1 or 5, In the phosphor photomask, a plasma display panel back panel manufacturing method comprising forming a phosphor effective portion in a negative pattern and an alignment mark portion in a positive pattern. The method of claim 1, The etching barrier photomask includes a step of aligning the electrode pattern and the barrier rib pattern by equally dividing and correcting the amount of deformation equal to the total variation of the transverse length of the total electrode pattern ÷ the total barrier striper stripper to all the barrier rib strippers. A plasma display panel backplane manufacturing method.