KR100273247B1 - Semiconductor memory capable of reproducing for address - Google Patents

Semiconductor memory capable of reproducing for address Download PDF

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KR100273247B1
KR100273247B1 KR1019970068132A KR19970068132A KR100273247B1 KR 100273247 B1 KR100273247 B1 KR 100273247B1 KR 1019970068132 A KR1019970068132 A KR 1019970068132A KR 19970068132 A KR19970068132 A KR 19970068132A KR 100273247 B1 KR100273247 B1 KR 100273247B1
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address
low
buffer
fuse
resistor
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KR1019970068132A
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KR19990049232A (en
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김태형
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김영환
현대반도체주식회사
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70Masking faults in memories by using spares or by reconfiguring
    • G11C29/88Masking faults in memories by using spares or by reconfiguring with partially good memories
    • G11C29/883Masking faults in memories by using spares or by reconfiguring with partially good memories using a single defective memory device with reduced capacity, e.g. half capacity

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Abstract

PURPOSE: A semiconductor memory is provided to use a small-volume DRAM of a region where no defect is generated, if a defect is generated when testing a large-volume DRAM using the same protocol of the same package. CONSTITUTION: An address switch part(11) receives a row address and switches an address if a defect arises when testing a large-volume DRAM. A row decoder(12) decodes an output of the address switch part(11) to select a word line of a memory cell array(13). A column decoder(15) receives and decodes a column address through a column buffer(14) to select a bit line of the memory cell array(13). A sense amplifier(16) senses data at a region of the memory cell array(13) appointed by the selected word line and the selected bit line. An input/output buffer(17) performs a buffer function so that the sense amplifier and an input/output pad(18) can input and output data. The address switch part(11) comprises row buffers(BUF0-BUF9) for receiving and buffering row address bits from address pads(PAD0-PAD9) by switches(SW0-SW9), and switches(SW10-SW19) enable the row address bits to be connected between the switch(SW9) and the row buffer(BUF9).

Description

어드레스의 재생이 가능한 반도체메모리{SEMICONDUCTOR MEMORY CAPABLE OF REPRODUCING FOR ADDRESS}Semiconductor memory capable of reproducing addresses {SEMICONDUCTOR MEMORY CAPABLE OF REPRODUCING FOR ADDRESS}

본 발명은 어드레스의 재생이 가능한 반도체메모리에 관한 것으로, 특히 대용량(예로 256M) 디램의 테스트시 어느 한 어드레스의 셀에서 불량이 발생했을 때, 그 어드레스를 다른 셀로 대체하여 불량이 발생하지 않은 소용량(예로 128M) 디램을 사용하기에 적당하도록 한 어드레스의 재생이 가능한 반도체메모리에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor memory capable of reproducing an address. In particular, when a defect occurs in a cell of one address during a test of a large capacity (for example, 256M) DRAM, a small capacity in which the defect does not occur by replacing the address with another cell ( For example, the present invention relates to a semiconductor memory capable of reproducing an address suitable for use with 128M DRAM.

도1은 종래의 64M 램을 보인 블록구성도로서, 이에 도시한 바와같이 로우어드레스를 로우버퍼(1)를 통해 입력받아 디코딩하여 메모리셀어레이(3)의 워드라인(word line)을 선택하는 로우디코더(2)와; 컬럼어드레스를 컬럼버퍼(4)를 통해 입력받아 디코딩하는 컬럼디코더(5)와; 상기 로우디코더(2)를 통해 선택된 워드라인과 컬럼디코더(5)를 통해 선택된 비트라인(bit line)에 해당하는 셀의 데이터를 센싱하여 출력하는 센스앰프(6)와; 그 센스앰프(6)와 입출력패드(8)가 데이터를 입출력하도록 버퍼링하는 입출력버퍼(7)로 구성된다. 이하, 상기한 바와같은 종래 회로의 동작을 설명한다.FIG. 1 is a block diagram showing a conventional 64M RAM. As shown in FIG. 1, a row for selecting a word line of a memory cell array 3 by decoding a low address through a low buffer 1 is shown. A decoder 2; A column decoder 5 for receiving and decoding the column address through the column buffer 4; A sense amplifier 6 for sensing and outputting data of a cell corresponding to a bit line selected through the row decoder 2 and the column decoder 5; The sense amplifier 6 and the input / output pad 8 are composed of an input / output buffer 7 which buffers data to input and output data. The operation of the conventional circuit as described above will be described below.

먼저, 읽기동작일 경우는 로우어드레스가 로우버퍼(1)를 통해 버퍼링된 후, 로우디코더(2)를 통해 디코딩되어 메모리셀어레이(3)의 워드라인을 선택하며, 이때 컬럼어드레스는 컬럼버퍼(4)를 통해 버퍼링된 후, 컬럼디코더(5)를 통해 디코딩되어 메모리셀어레이(3)의 비트라인을 선택한다.First, in the case of a read operation, the low address is buffered through the low buffer 1, and then decoded by the low decoder 2 to select a word line of the memory cell array 3, wherein the column address is a column buffer ( After buffering through 4), it is decoded by the column decoder 5 to select a bit line of the memory cell array 3.

이와같이 선택된 워드라인과 비트라인에 해당하는 메모리셀어레이(3) 셀의 데이터를 센스앰프(6)가 센싱하여 입출력버퍼(7)를 통해 입출력패드(8)에 출력한다.As described above, the sense amplifier 6 senses data of the memory cell array 3 cells corresponding to the selected word line and the bit line and outputs the data to the input / output pad 8 through the input / output buffer 7.

그리고, 쓰기동작일 경우는 상기와 같이 로우디코더(2)와 컬럼디코더(5)가 로우어드레스와 컬럼어드레스를 디코딩하여 메모리셀어레이(3)의 워드라인과 비트라인을 선택하여 목적 셀을 설정한 후, 쓰고자 할 데이터를 입출력패드(8) 및 입출력버퍼(7)를 통해 인가하여 메모리셀어레이(3)의 목적 셀에 데이터를 쓰게된다.In the case of a write operation, the row decoder 2 and the column decoder 5 decode the low address and the column address as described above, select a word line and a bit line of the memory cell array 3, and set a target cell. Thereafter, the data to be written is applied through the input / output pad 8 and the input / output buffer 7 to write the data to the target cell of the memory cell array 3.

그러나, 상기한 바와같은 종래의 회로는 대용량 디램의 테스트시 불량으로 판정되면 불량이 발생하지 않는 영역의 소용량 디램을 사용할 수 있는데도 불구하고, 리젝트(reject) 처리되어 생산효율이 감소하는 문제점이 있었다.However, in the conventional circuit as described above, if it is determined that the defect is a defect in the test of the large-capacity DRAM, there is a problem in that the production efficiency is reduced due to the reject process despite the use of the small-capacity DRAM in the region where the defect does not occur. .

본 발명은 상기한 바와같은 문제점을 해결하기 위하여 창안한 것으로, 본 발명의 목적은 동일한 패키지(package)의 동일한 프로토콜(protocol)을 사용하는 대용량 디램의 테스트시 불량이 판정되었을 때, 불량이 발생하지 않은 영역의 소용량 디램을 사용할 수 있는 어드레스의 재생이 가능한 반도체메모리를 제공하는데 있다.The present invention was devised to solve the above problems, and an object of the present invention is that when a defect is determined during the test of a large capacity DRAM using the same protocol of the same package, the defect does not occur. An object of the present invention is to provide a semiconductor memory capable of reproducing an address that can use a small capacity DRAM in an unoccupied area.

도1은 종래의 64M 램을 보인 블록구성도.Figure 1 is a block diagram showing a conventional 64M RAM.

도2는 본 발명의 일 실시예를 보인 블록구성도.Figure 2 is a block diagram showing an embodiment of the present invention.

도3은 도2에 있어서, 스위치의 상세회로도.3 is a detailed circuit diagram of a switch in FIG.

***도면의 주요 부분에 대한 부호의 설명****** Description of the symbols for the main parts of the drawings ***

11:어드레스절환부 12:로우디코더11: Address change part 12: Low decoder

13:메모리셀어레이 14:컬럼버퍼13: Memory cell array 14: Column buffer

15:컬럼디코더 16:센스앰프15: Column decoder 16: Sense amplifier

17:입출력버퍼 18:입출력패드17: I / O buffer 18: I / O pad

상기한 바와같은 본 발명의 목적은 로우어드레스 및 컬럼어드레스를 입력받아 버퍼링하는 로우버퍼 및 컬럼버퍼와; 상기 로우버퍼 및 컬럼버퍼의 출력을 입력받아 디코딩하여 메모리셀어레이의 워드라인 및 비트라인을 선택하는 로우디코더 및 컬럼디코더와; 상기 워드라인 및 비트라인이 선택된 메모리셀어레이 셀의 데이터를 센싱하여 출력하는 센스앰프로 구성되는 대용량 반도체메모리에 있어서, 대용량 반도체메모리의 테스트시 어느 한 로우어드레스에서 불량이 발생했을 때, 그 로우어드레스를 스위치를 통해 절환하여 상기 로우버퍼로 출력함으로써, 대용량 반도체메모리의 불량이 발생한 영역 이외의 영역을 소용량으로 사용할 수 있도록 하는 어드레스절환부를 더 포함하여 구성함으로써 달성되는 것으로, 본 발명에 의한 어드레스의 재생이 가능한 반도체메모리를 첨부한 도2 및 도3을 참조하여 상세히 설명하면 다음과 같다.An object of the present invention as described above is a low buffer and a column buffer for receiving and buffering the low address and column address; A row decoder and a column decoder for receiving word lines and bit lines of a memory cell array by receiving and decoding the outputs of the low and column buffers; A large capacity semiconductor memory comprising a sense amplifier that senses and outputs data of a memory cell array cell in which the word line and the bit line are selected, and when a defect occurs in any one of the low addresses during the test of the large capacity semiconductor memory, the low address. It is achieved by further comprising an address switching unit for switching the output via the switch to the low buffer, so that a region other than the region where the defect of the large-capacity semiconductor memory has occurred can be used in a small capacity, the address reproduction according to the present invention. A detailed description will now be given with reference to FIGS. 2 and 3 to which the semiconductor memory can be attached.

먼저, 도2는 본 발명의 일 실시예를 보인 블록구성도로서, 이에 도시한 바와같이 로우어드레스를 입력받아 대용량 디램의 테스트시 불량이 발생되면 어드레스를 절환하는 어드레스절환부(11)와; 그 어드레스절환부(11)의 출력을 디코딩하여 메모리셀어레이(13)의 워드라인을 선택하는 로우디코더(12)와; 컬럼어드레스를 컬럼버퍼(14)를 통해 입력받아 디코딩하여 메모리셀어레이(13)의 비트라인을 선택하는 컬럼디코더(15)와; 그 로우디코더(12)와 컬럼디코더(15)를 통해 선택된 워드라인과 비트라인에 해당하는 메모리셀어레이(13)의 데이터를 센싱하여 출력하는 센스앰프(16)와; 그 센스앰프(16)와 입출력패드(18)가 데이터를 입출력하도록 버퍼링하는 입출력버퍼(17)로 구성되며, 상기 어드레스절환부(11)는 어드레스패드(PAD0∼PAD9)로부터 각기 입력되는 로우어드레스를 스위치(SW0∼SW9)를 통해 각기 입력받아 버퍼링하는 로우버퍼(BUF0∼BUF9)와; 그 어드레스패드(PAD0∼PAD8)로부터 입력되는 로우어드레스가 상기 스위치(SW9)와 로우버퍼(BUF9)의 사이에 접속되도록 하는 스위치(SW10∼SW19)로 구성된다.First, Figure 2 is a block diagram showing an embodiment of the present invention, the address switching unit 11 for switching the address when a failure occurs during the test of a large capacity DRAM by receiving a low address as shown therein; A row decoder 12 for decoding the output of the address switching unit 11 and selecting a word line of the memory cell array 13; A column decoder 15 which receives the column address through the column buffer 14 and decodes the bit address of the memory cell array 13 to select the bit line; A sense amplifier 16 for sensing and outputting data of the memory cell array 13 corresponding to the selected word line and the bit line through the row decoder 12 and the column decoder 15; The sense amplifier 16 and the input / output pad 18 are configured with an input / output buffer 17 for buffering the input and output of data. The address switching section 11 receives the low addresses input from the address pads PAD0 to PAD9, respectively. Low buffers BUF0 through BUF9 that receive and buffer the switches SW0 through SW9, respectively; The low addresses input from the address pads PAD0 to PAD8 are constituted by switches SW10 to SW19 such that the low addresses are connected between the switch SW9 and the low buffer BUF9.

그리고, 도3a는 상기 스위치(SW0∼SW9)의 상세회로도이고, 도3b는 상기 스위치(SW10∼SW19)의 상세회로도로서, 이에 도시한 바와같이 스위치(SW0∼SW9)는 전원전압(VCC)과 접지사이에 직렬접속된 퓨즈(FU1) 및 저항(R1)과; 그 전원전압(VCC)과 접지사이에 직렬접속된 저항(R2) 및 퓨즈(FU2)와; 상기 퓨즈(FU1) 및 저항(R1)사이의 출력을 정단자에 입력받고, 저항(R2) 및 퓨즈(FU2)사이의 출력을 부단자에 입력받아 입력되는 로우어드레스를 전송하는 전송게이트(TG1)로 구성되며, 스위치(SW10∼SW19)는 상기 퓨즈(FU1) 및 저항(R1)사이의 출력을 부단자에 입력받고, 저항(R2) 및 퓨즈(FU2)사이의 출력을 정단자에 입력받아 입력되는 로우어드레스를 차단하는 전송게이트(TG2)로 구성된다.3A is a detailed circuit diagram of the switches SW0 to SW9, and FIG. 3B is a detailed circuit diagram of the switches SW10 to SW19. As shown therein, the switches SW0 to SW9 are connected to the power supply voltage VCC. A fuse FU1 and a resistor R1 connected in series between the grounds; A resistor R2 and a fuse FU2 connected in series between the power supply voltage VCC and ground; The transmission gate TG1 receives the output between the fuse FU1 and the resistor R1 at the positive terminal, receives the output between the resistor R2 and the fuse FU2 at the negative terminal, and transmits the low address. The switch SW10 to SW19 receive the output between the fuse FU1 and the resistor R1 at the negative terminal, and receive the output between the resistor R2 and the fuse FU2 at the positive terminal. It consists of a transmission gate (TG2) for blocking the low address.

이하, 상기한 바와같은 본 발명의 일 실시예에 대한 동작을 본 발명의 요지인 로우어드레스가 인가되어 비트라인을 선택하는 동작으로 한정하여 설명한다.Hereinafter, the operation of one embodiment of the present invention as described above will be limited to the operation of selecting a bit line by applying a low address, which is the subject of the present invention.

먼저, 메모리셀어레이(13)의 테스트시 불량이 없을때는 어드레스절환부(11) 내부의 스위치(SW0∼SW9)가 도통되고, 스위치(SW10∼SW19)가 차단되어 종래와 동일하게 어드레스패드(PAD0∼PAD9)를 통해 입력되는 각각의 로우어드레스는 로우버퍼(BUF0∼BUF9)를 통해 각기 버퍼링되어 로우디코더(12)에 입력되어 메모리셀어레이(13)의 비트라인을 선택한다.First, when there is no defect in the test of the memory cell array 13, the switches SW0 to SW9 in the address switching unit 11 are turned on, and the switches SW10 to SW19 are shut off, so that the address pad PAD0 is the same as before. Each low address input through ˜PAD9 is buffered through the low buffers BUF0 to BUF9 and input to the low decoder 12 to select a bit line of the memory cell array 13.

그리고, 메모리셀어레이(13)의 테스트시 일예로 어드레스패드(PAD8)에 불량이 발생했을때는 스위치(SW0∼SW7)는 도통되고, 스위치(SW10∼SW17)는 차단되며, 스위치(SW8,SW9)는 도3a에 도시한 퓨즈(FU1,FU2)를 끊어줌으로써, 전송게이트(TG1)가 전송상태에서 차단상태로 절환되어 스위치(SW8,SW9)는 차단되고, 스위치(SW18,SW19)는 도3b에 도시한 퓨즈(FU1,FU2)를 끊어줌으로써, 전송게이트(TG2)가 차단상태에서 전송상태로 절환되어 스위치(SW18,SW19)가 도통된다.When the memory cell array 13 is tested, for example, when a defect occurs in the address pad PAD8, the switches SW0 to SW7 are turned on, and the switches SW10 to SW17 are shut off, and the switches SW8 and SW9 are turned off. By cutting the fuses FU1 and FU2 shown in Fig. 3A, the transfer gate TG1 is switched from the transfer state to the cutoff state so that the switches SW8 and SW9 are cut off, and the switches SW18 and SW19 are shown in Fig. 3B. By disconnecting the illustrated fuses FU1 and FU2, the transfer gate TG2 is switched from the cutoff state to the transfer state so that the switches SW18 and SW19 are conducted.

따라서, 어드레스패드(PAD0∼PAD7)를 통해 입력되는 로우어드레스는 상기와 동일하게 로우버퍼(BUF0∼BUF7) 및 로우디코더(12)를 통해 메모리셀어레이(13)의 비트라인을 선택하고, 어드레스패드(PAD8)를 통해 입력되는 로우어드레스는 스위치(SW18,SW19)를 통해 로우버퍼(BUF9)에 입력되어 버퍼링된 후, 로우디코더(12)에 입력되어 메모리셀어레이(13)의 비트라인을 선택하게 된다.Therefore, the low address input through the address pads PAD0 to PAD7 selects the bit lines of the memory cell array 13 through the low buffers BUF0 to BUF7 and the low decoder 12 as described above, The low address input through the PAD8 is input to the low buffer BUF9 through the switches SW18 and SW19, buffered, and then input to the low decoder 12 to select the bit line of the memory cell array 13. do.

상기한 바와같은 본 발명에 의한 어드레스의 재생이 가능한 반도체메모리는 대용량의 메모리셀이 불량으로 판정되었을 때, 리젝트처리되던 것을 소용량으로 절환하여 사용할 수 있어 생산효율 및 경제적측면에서 향상되는 효과가 있다.The semiconductor memory capable of reproducing the address according to the present invention as described above can be used to switch the rejected process to a small capacity when a large memory cell is determined to be defective, thereby improving the production efficiency and economic aspects. .

Claims (3)

로우어드레스 및 컬럼어드레스를 입력받아 버퍼링하는 로우버퍼 및 컬럼버퍼와; 상기 로우버퍼 및 컬럼버퍼의 출력을 입력받아 디코딩하여 메모리셀어레이의 워드라인 및 비트라인을 선택하는 로우디코더 및 컬럼디코더와; 상기 워드라인 및 비트라인이 선택된 메모리셀어레이 셀의 데이터를 센싱하여 출력하는 센스앰프로 구성되는 대용량 반도체메모리에 있어서, 대용량 반도체메모리의 테스트시 어느 한 로우어드레스에서 불량이 발생했을 때, 그 로우어드레스를 스위치를 통해 절환하여 상기 로우버퍼로 출력함으로써, 대용량 반도체메모리의 불량이 발생한 영역 이외의 영역을 소용량으로 사용할 수 있도록 하는 어드레스절환부를 더 포함하여 구성되는 것을 특징으로 하는 어드레스의 재생이 가능한 반도체메모리.A low buffer and a column buffer which receive and buffer the low address and the column address; A row decoder and a column decoder for receiving word lines and bit lines of a memory cell array by receiving and decoding the outputs of the low and column buffers; A large capacity semiconductor memory comprising a sense amplifier that senses and outputs data of a memory cell array cell in which the word line and the bit line are selected, and when a defect occurs in any one of the low addresses during the test of the large capacity semiconductor memory, the low address. Is switched through a switch and outputted to the low buffer, and further comprising an address switching unit for using a region other than the region where the defect of the large-capacity semiconductor memory has occurred with a small capacity. . 제 1항에 있어서, 상기 어드레스절환부는 어드레스패드(PAD0∼PAD9)로부터 각기 입력되는 로우어드레스를 스위치(SW0∼SW9)를 통해 각기 입력받아 버퍼링하는 로우버퍼(BUF0∼BUF9)와; 그 어드레스패드(PAD0∼PAD8)로부터 입력되는 로우어드레스가 상기 스위치(SW9)와 로우버퍼(BUF9)의 사이에 접속되도록 하는 스위치(SW10∼SW19)로 구성되는 것을 특징으로 하는 어드레스의 재생이 가능한 반도체메모리.2. The apparatus of claim 1, wherein the address switching unit comprises: low buffers BUF0 to BUF9 which receive and buffer low addresses respectively inputted from the address pads PAD0 to PAD9 through the switches SW0 to SW9; A semiconductor capable of reproducing an address, characterized in that the low addresses inputted from the address pads PAD0 to PAD8 are constituted by switches SW10 to SW19 such that the low addresses are connected between the switch SW9 and the low buffer BUF9. Memory. 제 2항에 있어서, 상기 스위치(SW0∼SW9)는 전원전압(VCC)과 접지사이에 직렬접속된 퓨즈(FU1) 및 저항(R1)과; 그 전원전압(VCC)과 접지사이에 직렬접속된 저항(R2) 및 퓨즈(FU2)와; 상기 퓨즈(FU1) 및 저항(R1)사이의 출력을 정단자에 입력받고, 저항(R2) 및 퓨즈(FU2)사이의 출력을 부단자에 입력받아 입력되는 로우어드레스를 전송하는 전송게이트(TG1)로 구성되고, 스위치(SW10∼SW19)는 전원전압(VCC)과 접지사이에 직렬접속된 퓨즈(FU1) 및 저항(R1)과; 그 전원전압(VCC)과 접지사이에 직렬접속된 저항(R2) 및 퓨즈(FU2)와; 상기 퓨즈(FU1) 및 저항(R1)사이의 출력을 부단자에 입력받고, 저항(R2) 및 퓨즈(FU2)사이의 출력을 정단자에 입력받아 입력되는 로우어드레스를 차단하는 전송게이트(TG2)로 구성되는 것을 특징으로 하는 어드레스의 재생이 가능한 반도체메모리.3. The switch of claim 2, wherein the switches SW0 to SW9 include: a fuse FU1 and a resistor R1 connected in series between the power supply voltage VCC and ground; A resistor R2 and a fuse FU2 connected in series between the power supply voltage VCC and ground; The transmission gate TG1 receives the output between the fuse FU1 and the resistor R1 at the positive terminal, receives the output between the resistor R2 and the fuse FU2 at the negative terminal, and transmits the low address. The switches SW10 to SW19 include a fuse FU1 and a resistor R1 connected in series between the power supply voltage VCC and ground; A resistor R2 and a fuse FU2 connected in series between the power supply voltage VCC and ground; The transmission gate TG2 which receives the output between the fuse FU1 and the resistor R1 at the negative terminal and blocks the low address input by receiving the output between the resistor R2 and the fuse FU2 at the positive terminal. And a semiconductor memory capable of reproducing an address.
KR1019970068132A 1997-12-12 1997-12-12 Semiconductor memory capable of reproducing for address KR100273247B1 (en)

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