KR100271637B1 - Cooling fin for semiconductor package - Google Patents

Cooling fin for semiconductor package Download PDF

Info

Publication number
KR100271637B1
KR100271637B1 KR1019970068131A KR19970068131A KR100271637B1 KR 100271637 B1 KR100271637 B1 KR 100271637B1 KR 1019970068131 A KR1019970068131 A KR 1019970068131A KR 19970068131 A KR19970068131 A KR 19970068131A KR 100271637 B1 KR100271637 B1 KR 100271637B1
Authority
KR
South Korea
Prior art keywords
semiconductor package
cooling
heat sink
base
fixing
Prior art date
Application number
KR1019970068131A
Other languages
Korean (ko)
Other versions
KR19990049231A (en
Inventor
유영헌
Original Assignee
김영환
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김영환, 현대반도체주식회사 filed Critical 김영환
Priority to KR1019970068131A priority Critical patent/KR100271637B1/en
Publication of KR19990049231A publication Critical patent/KR19990049231A/en
Application granted granted Critical
Publication of KR100271637B1 publication Critical patent/KR100271637B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE: An apparatus for cooling a semiconductor package is provided to prevent damage to the semiconductor package and cooling pins, by easily exchanging the cooling pins, and by preventing excessive power from being applied to the semiconductor package in exchanging the cooling pins. CONSTITUTION: A base(12) for fixing a heat radiation plate is adhesively fixed to a body of a semiconductor package(11), having a coupling protrusion(12a) on its surface. The heat radiation plate is settled on the surface of the base. The heat radiation plate has a coupling groove(13a) inserted into the coupling protrusion on its back surface, and a plurality of cooling pins(13b) on its surface.

Description

반도체 패키지의 냉각장치{COOLING FIN FOR SEMICONDUCTOR PACKAGE}Cooling device for semiconductor package {COOLING FIN FOR SEMICONDUCTOR PACKAGE}

본 발명은 반도체 패키지의 냉각장치에 관한 것으로, 특히 반도체 패키지의 몸체에 접착고정하는 방열판 고정용 베이스에 결합돌기를 형성하고, 그 결합돌기에 삽입장착되는 결합홈과 다수의 냉각핀을 갖는 방열판으로 구성함으로써 상기 핀이 형성된 본체를 상기 반도체 패키지에서 용이하게 착탈할 수 있도록 함과 아울러 재사용이 가능하도록 한 반도체 패키지의 냉각장치에 관한 것이다.The present invention relates to a cooling device for a semiconductor package, and more particularly, to a heat sink having a plurality of cooling fins and a coupling groove which is formed on a base for fixing a heat sink to be fixed to a body of the semiconductor package, and is inserted into the coupling protrusion. The present invention relates to a cooling apparatus for a semiconductor package that enables the pin-shaped main body to be easily detached from the semiconductor package and can be reused.

일반적으로, CPU와 같이 많은 데이터를 고속으로 처리하거나 고용량을 갖는 반도체 패키지는 많은 열을 동반하기 때문에 그 반도체 패키지가 장착고정된 피시비가 설치된 케이스내에 송풍기를 설치하거나 상기 도 1에 도시된 바와 같이 상기 반도체 패키지(1)의 몸체(1a)에 직접 방열판(2)을 고정부착하여 그 반도체 패키지(1)에서 발산한 열을 냉각하게 되는 것이다.In general, a semiconductor package that processes a large amount of data at high speed, such as a CPU, or has a high capacity is accompanied by a large amount of heat, so that a blower is installed in a case in which the PCB is mounted and the semiconductor package is fixed, or as shown in FIG. The heat dissipation plate 2 is directly fixed to the body 1a of the semiconductor package 1 to cool the heat dissipated from the semiconductor package 1.

상기와 같은 냉각핀(2)은 얇은 수개의 냉각핀(FIN)(2a)을 등간격으로 형성하고, 상기 피시비(3)에 장착고정된 반도체 패키지의 몸체(1a)의 상부면에 열경화성 에폭시수지를 도포하거나 접착테이프(4)를 이용하여 상기 냉각핀(2)을 고정하는 것이다.The cooling fins 2 as described above are formed with several thin cooling fins (FIN) 2a at equal intervals, and the thermosetting epoxy resin is formed on the upper surface of the body 1a of the semiconductor package fixed to the PCB 3. Applying or fixing the cooling fins (2) by using an adhesive tape (4).

상기와 같이 반도체 패키지의 몸체(1a)에 상기 냉각핀(2)을 상기 에폭시수지나 접착테이프(4)로 고정하므로써, 상기 반도체 패키지(1)에서 발산한 열은 상기 냉각핀(2)에 전달되어 냉각되는 것이다.As described above, by fixing the cooling fins 2 to the body 1a of the semiconductor package with the epoxy resin or the adhesive tape 4, heat emitted from the semiconductor package 1 is transferred to the cooling fins 2. And cooled.

도면상의 미설명 부호 1b는 리드이다.Reference numeral 1b in the drawings is a lead.

그러나, 상기와 같이 구성된 반도체 패키지용 냉각핀은 상기 반도체 패키지의 몸체에 접착고정하므로 상기 냉각핀의 용량이 잘못되었을 경우에는 상기 냉각핀을 교체하기가 난이하였고, 또 상기 냉각핀을 교체하기 위해서 상기 반도체 패키지에 무리한 힘을 가할 경우에는 그 반도체 패키지가 손상되는 문제점을 초래함과 아울러 상기 냉각핀이 손상되어 재사용이 불가능하게 되는 문제점을 초래하였다.However, since the cooling fins for the semiconductor package configured as described above are fixed to the body of the semiconductor package, it is difficult to replace the cooling fins when the capacity of the cooling fins is incorrect. If excessive force is applied to the semiconductor package, the semiconductor package may be damaged, and the cooling fin may be damaged, thereby causing a problem that it cannot be reused.

따라서, 본 발명의 목적은 상기의 문제점을 해결하여 반도체 패키지의 용량에 적절한 냉각핀의 손쉬운 교체와 그 반도체 패키지의 파손을 방지함과 더불어 재사용이 가능한 반도체 패키지의 냉각장치를 제공함에 있다.Accordingly, an object of the present invention is to solve the above problems and to provide a cooling apparatus for a semiconductor package that is reusable while preventing easy replacement of a cooling fin suitable for the capacity of the semiconductor package and damage to the semiconductor package.

도 1은 종래 기술에 의한 냉각핀이 설치된 반도체 패키지의 구조를 보인 측면도.1 is a side view showing the structure of a semiconductor package with a cooling fin according to the prior art.

도 2는 본 발명에 의한 냉각핀이 반도체 패키지에 장착되는 상태를 보인 분해도.Figure 2 is an exploded view showing a state in which the cooling fin is mounted on the semiconductor package according to the present invention.

도 3은 본 발명에 의한 반도체 패키지의 냉각장치의 구조를 보인 분해사시도.Figure 3 is an exploded perspective view showing the structure of the cooling device of the semiconductor package according to the present invention.

** 도면의 주요 부분에 대한 부호의 간단한 설명 **** Brief description of symbols for the main parts of the drawing **

11 : 반도체 패키지 12 : 방열판 고정용 베이스11: semiconductor package 12: base for fixing the heat sink

12a : 결합돌기 13 : 방열판12a: engaging projection 13: heat sink

13a : 결합홈 13b : 냉각핀13a: coupling groove 13b: cooling fin

본 발명의 목적은 반도체 패키지의 몸체에 접착고정되고 표면에 결합돌기가 형성된 방열판 고정용 베이스와, 상기 방열판 고정용 베이스의 표면에 안착되며 상기 결합돌기에 삽입되는 결합홈이 이면에 형성되고 표면에는 다수의 냉각핀이 형성된 방열판을 구비하여 구성된 것을 특징으로 하는 반도체 패키지용 냉각장치에 의해 달성된다.An object of the present invention is fixed to the body of the semiconductor package, the base for fixing the heat sink is formed with a coupling protrusion on the surface, and the coupling groove which is seated on the surface of the base for fixing the heat sink and inserted into the coupling protrusion is formed on the back and the surface It is achieved by a cooling device for a semiconductor package, characterized in that provided with a heat sink having a plurality of cooling fins.

다음은, 본 발명에 의한 반도체 패키지의 냉각장치의 일실시예를 첨부된 도면에 의거하여 상세하게 설명한다.Next, an embodiment of a cooling apparatus for a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 의한 냉각핀이 반도체 패키지에 장착되는 상태를 보인 분해도이고, 도 3은 본 발명에 의한 반도체 패키지의 냉각장치의 구조를 보인 분해사시도이다.2 is an exploded view showing a state in which a cooling fin according to the present invention is mounted on a semiconductor package, Figure 3 is an exploded perspective view showing the structure of a cooling device of a semiconductor package according to the present invention.

본 발명에 의한 반도체 패키지의 냉각장치는 상기 도 2와 도 3에 도시된 바와 같이 반도체 패키지(11)의 몸체(11a)에 부착고정될 수 있도록 소정의 크기를 갖는 방열판 고정용 베이스(12)가 형성되어 있고, 그 방열판 고정용 베이스(12)의 상부면에는 전후단부를 가로지르는 결합돌기(12a)가 형성되어 있으며, 그 결합돌기(12a)는 역삼각형으로 형성되어 있다.The cooling apparatus of the semiconductor package according to the present invention has a heat sink fixing base 12 having a predetermined size so as to be fixed to the body (11a) of the semiconductor package 11 as shown in FIG. The upper surface of the heat sink fixing base 12 is formed, and the engaging projection 12a is formed across the front and rear ends, and the engaging projection 12a is formed in an inverted triangle.

또, 상기 방열판 고정용 베이스(12)에 형성된 결합돌기(12a)에 삽입될 수 있도록 삼각형으로 형성된 결합홈(13a)이 형성됨과 아울러 외부의 공기와 접촉하여 방열할 수 있도록 다수의 냉각핀(13b)이 형성된 방열판(13)을 구비한다.In addition, the coupling groove (13a) formed in a triangle to be inserted into the coupling projection (12a) formed in the base for fixing the heat sink is formed and a plurality of cooling fins (13b) to be radiated in contact with the outside air ) Is provided with a heat sink (13).

상기와 같이 구성된 반도체 웨이퍼용 냉각핀은 피시비(14)에 장착고정된 반도체 패기지의 몸체(11a)의 상부면에 열경화성 에폭시수지를 도포하거나 접착테이프(15)를 이용하여 상기 방열판 고정용 베이스(12)를 접착고정한다.Cooling fins for semiconductor wafers configured as described above are coated with a thermosetting epoxy resin on the upper surface of the body 11a of the semiconductor package fixed to the PCB 14 or the base for fixing the heat sink using an adhesive tape 15 ))

상기의 상태에서, 상기 방열판(13)에 형성된 결합홈(13a)을 상기 방열판 고정용 베이스(12)에 형성된 결합돌기(12a)에 삽입함므로써 상기 냉각핀이 설치됨과 아울러 상기 반도체 패키지(11)에서 발산한 열이 상기 본체의 냉각핀(13b)에 전도되어 외부의 공기가 그 냉각핀(13b)과 접촉함으로써 방열되게 되는 것이다.In the above state, the cooling fin is installed and the semiconductor package 11 is inserted by inserting the coupling groove 13a formed in the heat sink 13 into the coupling protrusion 12a formed in the base 12 for fixing the heat sink. Heat radiated from is conducted to the cooling fins 13b of the main body so that the outside air is radiated by contact with the cooling fins 13b.

또, 다수개의 상기 냉각핀(13b)이 형성된 상기 방열판(13)에는 냉각효과를 증대하기 위하여 냉각팬이 설치될 수 있도록 되어 있다.In addition, a cooling fan may be installed in the heat sink 13 on which the plurality of cooling fins 13b are formed to increase a cooling effect.

도면상의 미설명 부호 11b는 리드이다.Reference numeral 11b in the drawings is a lead.

상기와 같이 본 발명에 의한 반도체 패키지의 냉각장치는 결합돌기를 형성한 방열판 고정용 베이스를 상기 반도체 패키지의 몸체에 접착고정하고, 상기 방열판 고정용 베이스의 결합돌기에 다수개의 냉각핀이 형성된 방열판의 결합홈을 삽입하여 상기 반도체 패키지를 냉각하는 냉각핀을 형성함으로써, 상기 냉각핀의 용량이 잘못되었을 경우에 그 냉각핀의 교체가 용이하게 되고, 또 상기 냉각핀의 교체시에도 상기 반도체 패키지에 무리한 힘이 가해지지 않게 되어 그 반도체 패키지가 손상되는 것을 방지할 수 있게 됨과 아울러 상기 냉각핀이 손상되지 않게 되어 재사용할 수 있게 되는 효과를 기대할 수 있다.The cooling apparatus of the semiconductor package according to the present invention as described above is fixed to the heat sink fixing base formed with the coupling protrusions to the body of the semiconductor package, the plurality of cooling fins formed on the coupling protrusion of the heat sink fixing base of the heat sink By inserting a coupling groove to form a cooling fin to cool the semiconductor package, when the capacity of the cooling fin is wrong, it is easy to replace the cooling fin, and even when the cooling fin is replaced, Since the force is not applied to prevent the semiconductor package from being damaged, the cooling fins are not damaged and can be expected to be reused.

Claims (1)

반도체 패키지의 몸체에 접착고정되고 표면에 결합돌기가 형성된 방열판 고정용 베이스와, 상기 방열판 고정용 베이스의 표면에 안착되며 상기 결합돌기에 삽입되는 결합홈이 이면에 형성되고 표면에는 다수의 냉각핀이 형성된 방열판을 구비하여 구성된 것을 특징으로 하는 반도체 패키지용 냉각장치.A base for fixing the heat sink is fixed to the body of the semiconductor package and the coupling protrusion is formed on the surface, and a coupling groove which is seated on the surface of the base for fixing the heat sink and inserted into the coupling protrusion is formed on the back side and a plurality of cooling fins on the surface. Cooling device for a semiconductor package, characterized in that provided with a heat sink formed.
KR1019970068131A 1997-12-12 1997-12-12 Cooling fin for semiconductor package KR100271637B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970068131A KR100271637B1 (en) 1997-12-12 1997-12-12 Cooling fin for semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970068131A KR100271637B1 (en) 1997-12-12 1997-12-12 Cooling fin for semiconductor package

Publications (2)

Publication Number Publication Date
KR19990049231A KR19990049231A (en) 1999-07-05
KR100271637B1 true KR100271637B1 (en) 2000-11-15

Family

ID=19527134

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970068131A KR100271637B1 (en) 1997-12-12 1997-12-12 Cooling fin for semiconductor package

Country Status (1)

Country Link
KR (1) KR100271637B1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101359669B1 (en) * 2012-08-17 2014-02-07 이종은 Heat dissipation assembly for??semiconductor package
KR20210109765A (en) 2020-02-28 2021-09-07 이지영 Hood for Kitchen Ventilation
KR20220057944A (en) 2020-10-30 2022-05-09 마이크로컴퍼지트 주식회사 hexagonal boron nitride nano particle coating heat radiation member and manufacturing method thereof
KR20220095995A (en) 2020-12-30 2022-07-07 마이크로컴퍼지트 주식회사 Coating method of coating solution comprising hexagonal boron nitride particles and heat dissipation member manufactured thereby
US11876083B2 (en) 2020-11-30 2024-01-16 Samsung Electronics Co., Ltd. Semiconductor package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326771A (en) * 1992-05-26 1993-12-10 Gurafuiko:Kk Heat radiator mounting structure for electronic device
JPH09153576A (en) * 1995-11-30 1997-06-10 Nec Corp Semiconductor device with heat sink

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326771A (en) * 1992-05-26 1993-12-10 Gurafuiko:Kk Heat radiator mounting structure for electronic device
JPH09153576A (en) * 1995-11-30 1997-06-10 Nec Corp Semiconductor device with heat sink

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101359669B1 (en) * 2012-08-17 2014-02-07 이종은 Heat dissipation assembly for??semiconductor package
KR20210109765A (en) 2020-02-28 2021-09-07 이지영 Hood for Kitchen Ventilation
KR20220057944A (en) 2020-10-30 2022-05-09 마이크로컴퍼지트 주식회사 hexagonal boron nitride nano particle coating heat radiation member and manufacturing method thereof
US11876083B2 (en) 2020-11-30 2024-01-16 Samsung Electronics Co., Ltd. Semiconductor package
KR20220095995A (en) 2020-12-30 2022-07-07 마이크로컴퍼지트 주식회사 Coating method of coating solution comprising hexagonal boron nitride particles and heat dissipation member manufactured thereby

Also Published As

Publication number Publication date
KR19990049231A (en) 1999-07-05

Similar Documents

Publication Publication Date Title
US7957141B2 (en) Heat-dissipating mechanism for use with memory module
US5838542A (en) Processor card assembly including a heat sink attachment plate and an EMI/ESD shielding cage
US20070091566A1 (en) Fan duct and heat dissipation module comprising the same
WO2001056346A1 (en) Retention module, heat sink and electronic device
US7304854B2 (en) Heat dissipating device for electronic component
KR100271637B1 (en) Cooling fin for semiconductor package
TWI342485B (en) Structure and method for efficient thermal dissipation in an electronic assembly
US6304442B1 (en) Actively cooled daughterboard system
US6327148B1 (en) Heatsink for actively cooled daughterboard system
US20060249280A1 (en) Electronic device with improved cooling mechanism
US5892655A (en) Hard disk drive heat sink
KR102624468B1 (en) Apparatus for irradiating ultraviolet light
WO2004061956A1 (en) Heat sink of electronic component
JP2020043129A (en) Semiconductor device
JP2004253406A (en) Module cover and memory module
KR200307396Y1 (en) Cpu cooler
KR19990055507A (en) Memory module and manufacturing method
KR200240581Y1 (en) Apparatus for protecting a heat of semiconductor device
JP3057021U (en) Heat dissipation device
TWM543532U (en) Heat dissipation module
JPH0730026A (en) Semiconductor sealing package and cooling method therefor
KR100730133B1 (en) Structure for heat dissipation of integrated circuit chip of plasma display module and plasma display module comprising the same
JPH01286455A (en) Integrated circuit case equipped with heat sink
JPH07183435A (en) Heat sink for electronic component
JPH04171995A (en) Air cooling structure of semiconductor device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
J201 Request for trial against refusal decision
B701 Decision to grant
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080728

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee