KR100269015B1 - Semiconductor lead frame picker sending apparatus - Google Patents

Semiconductor lead frame picker sending apparatus Download PDF

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KR100269015B1
KR100269015B1 KR1019970031574A KR19970031574A KR100269015B1 KR 100269015 B1 KR100269015 B1 KR 100269015B1 KR 1019970031574 A KR1019970031574 A KR 1019970031574A KR 19970031574 A KR19970031574 A KR 19970031574A KR 100269015 B1 KR100269015 B1 KR 100269015B1
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picker
lead frame
holder
transfer device
block
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KR1019970031574A
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Korean (ko)
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KR19990009241A (en
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권오규
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최재준
한국도와주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

PURPOSE: A semiconductor lead frame picker transfer apparatus is provided to reduce the manufacture cost and to commercialize the equipment by using a separation type picker block that can be easily detachable and a picker holder the depth of which can be controlled. CONSTITUTION: A semiconductor lead frame picker transfer apparatus includes four pickers(25) connected to a vacuum horse(24). The pickers(25) adsorb the packages of two column lead frames(21). A pair of two column picker blocks(28) each fix the pickers(25) for two and has a mating screw hole at its bottom. An even column picker holder(23) has a length adjustment hole(29) of a rectangular parallelepiped shape at its both ends so that it moves the 2 two column picker blocks(28) in the length direction of the lead frame to mate it with the block mating screw(26). A pair of pneumatic cylinders(12) fix and raise/lower the even column picker holder(23) by means of a holder mating screw(27). A transfer device is connected to the pneumatic cylinder(12) and moves the pneumatic cylinder(12) in all directions. A controller controls the picker(25), the pneumatic cylinder(12) and the transfer device.

Description

반도체 리드프레임 픽커이송장치{Semiconductor lead frame picker sending apparatus}Semiconductor lead frame picker sending apparatus {Semiconductor lead frame picker sending apparatus}

본 발명은 반도체 리드프레임 픽커이송장치에 관한 것으로서, 보다 상세하게는 착탈이 용이한 분리형 픽커블록과 길이조절이 가능한 픽커홀더를 사용하여 설비의 범용을 가능하게 하는 반도체 리드프레임 픽커이송장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor lead frame picker transfer device, and more particularly, to a semiconductor lead frame picker transfer device that enables general use of a device by using a detachable picker block that is easily removable and a length adjustable picker holder. .

일반적으로 반도체 패키지는 리드프레임의 패드(Pad)상에 부착되는 반도체 칩(Chip)과 리드를 와이어 본딩(Wire Bonding)하고, 칩과 와이어 본딩된 부위를 몰딩 형성한 후 몰딩된 부위의 외측으로 돌출되는 리드를 요구되는 형상으로 절단 및 절곡하여 이루어진다.In general, a semiconductor package wire-bonds a semiconductor chip and a lead attached to a pad of a lead frame, forms a chip and a wire bonded portion, and protrudes out of the molded portion. It is made by cutting and bending the lead to the required shape.

상기 반도체 리드프레임은 프레스금형설비에 공급되고 로딩 및 언로딩시스템의 프레스금형에 의해 패키지가 분리됨으로써 하나의 제품으로 완성된다.The semiconductor lead frame is supplied to a press mold facility and the package is separated by the press mold of the loading and unloading system, thereby completing a single product.

이러한 과정에 있어서 리드프레임을 후속공정설비에 신속하고 정확하게 이송시키는 이송시스템이 요구되며, 반도체 리드프레임 이송시스템은 메가진에 적재된 다수의 리드프레임을 후속공정설비에 낱개로 공급하는 역할을 한다.In this process, a transfer system for quickly and accurately transferring lead frames to a subsequent process facility is required, and the semiconductor lead frame transfer system serves to supply a plurality of lead frames loaded in a magazine to a subsequent process unit individually.

상기 이송시스템에 설치되는 반도체 리드프레임 픽커이송장치는 운반된 리드프레임을 개별흡착하여 낱개로 이송라인에 위치시키는 역할을 한다.The semiconductor lead frame picker transfer device installed in the transfer system serves to individually suck the transferred lead frames and to individually position them in the transfer line.

이러한 종래의 반도체 리드프레임 픽커이송장치는, 도1에 나타낸 바와 같이, 진공호스(14)가 연결되어 리드프레임(11)을 낱개로 진공흡착하는 픽커(15)와, 상기 픽커(15)를 고정하며 지지하는 픽커홀더(13)와, 상기 픽커홀더(13)에 연결되며 상기 픽커홀더(13)가 승하강할 수 있도록 피스톤작용을 하는 공압실린더(12)와, 도시하지는 않았지만 상기 공압실린더(12)를 연결하고 상기 공압실린더(12)의 전후좌우 수평이동을 가능하게 하는 이송장치 및 이송장치를 제어하는 제어부를 구비한다.In the conventional semiconductor lead frame picker transferring device, as shown in FIG. 1, a picker 15 for vacuum suctioning the lead frame 11 by connecting a vacuum hose 14 and fixing the picker 15 is fixed. And a picker holder 13 supporting the picker holder, a pneumatic cylinder 12 connected to the picker holder 13 and acting as a piston to allow the picker holder 13 to move up and down, and the pneumatic cylinder 12 not shown in the drawing. And a control unit for controlling the transfer device and the transfer device to enable horizontal movement of the pneumatic cylinder 12 horizontally and horizontally.

따라서 픽커가 진공흡착되는 리드프레임의 반도체 패키지부위 상에 정확하게 일치되도록 제작되어 있는 픽커와 픽커홀더는 리드프레임을 진공흡착하고, 상기 공압실린더의 수축 및 팽창으로 상승 및 하강하며, 이송장치에 의해 전후좌우로 수평이동함으로써 리드프레임을 원하는 위치에 위치시킬 수 있게 된다.Therefore, the picker and the picker holder which are manufactured to be exactly matched on the semiconductor package portion of the lead frame in which the picker is vacuum-adsorbed are vacuum-adsorbed the lead frame, and rise and fall by contraction and expansion of the pneumatic cylinder, By horizontally moving left and right, the lead frame can be positioned at a desired position.

리드프레임의 이송위치는 상기 픽커와 상기 공압실린더 및 상기 이송장치를 전기적으로 제어하는 제어부에 미리 프로그램되어 있는 데이터에 의해 결정된다.The transfer position of the lead frame is determined by data pre-programmed in the control unit which electrically controls the picker, the pneumatic cylinder and the transfer device.

그러나, 상술한 종래의 반도체 리드프레임 픽커이송장치는 픽커와 픽커홀더의 위치를 변경할 수 없게 고정되어 1열, 2열, 3열, 4열, 5열 등 리드프레임의 다양한 패키지 형태에 따라 픽커의 위치조절이 불가능하기 때문에 설비의 공용화가 어렵고, 다른 형태의 리드프레임을 이송하기 위해 상기 픽커홀더를 공압실린더에서 분리하여 다른 픽커홀더로 교체하더라도 교체될 리드프레임의 개수만큼 픽커홀더를 특별하게 제작하여야 하기 때문에 교체에 따른 교체비가 상승하고 교체시간 및 제작시간이 허비되며, 더욱이 제작상의 오차로 발생하는 리드프레임과 픽커홀더의 위치오차가 허용치를 초과하게 되면 픽커홀더를 재제작하여야 하는 등의 문제점이 있었다.However, the above-described conventional semiconductor leadframe picker transfer device is fixed so that the positions of the pickers and the picker holders cannot be changed so that the pickers can be arranged according to various package types of leadframes such as 1st row, 2nd row, 3rd row, 4th row, and 5th row. Since it is impossible to adjust the position, it is difficult to use the equipment and the picker holder must be specially manufactured as many as the number of lead frames to be replaced even if the picker holder is separated from the pneumatic cylinder and replaced with another picker holder in order to transfer other types of lead frames. Therefore, the replacement cost increases due to replacement, replacement time and manufacturing time are wasted. Moreover, if the position error of lead frame and picker holder caused by manufacturing error exceeds the allowable value, the picker holder has to be remanufactured. there was.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위한 것으로, 그 목적은 착탈이 용이한 분리형 픽커블록과 길이조절이 가능한 픽커홀더를 사용하여 설비의 범용을 가능하게 하는 반도체 리드프레임 픽커이송장치를 제공함에 있다.The present invention is to solve the conventional problems as described above, the object of the present invention is to provide a semiconductor lead frame picker transfer device that enables the universal use of the detachable picker block and removable adjustable picker holder. Is in.

본 발명의 다른 목적은 짝수열 픽커홀더와 홀수열 픽커홀더만을 제작하여 모든 종류의 리드프레임에 다양하게 적용할 수 있으므로 제작비가 절감되고 교체시간 및 제작시간을 줄인 반도체 리드프레임 픽커이송장치를 제공함에 있다.Another object of the present invention is to provide a semiconductor lead frame picker transfer device that can reduce the manufacturing cost, replacement time and manufacturing time because it can be applied to all kinds of lead frame by making only even number picker and odd number picker holder only have.

본 발명의 또 다른 목적은 리드프레임의 제작오차에 따라 즉시 정밀조절하여 적용이 가능함으로써 추가제작이 필요없는 반도체 리드프레임 픽커이송장치를 제공함에 있다.Still another object of the present invention is to provide a semiconductor lead frame picker transfer device that does not require additional manufacturing because it can be immediately applied precisely according to the manufacturing error of the lead frame.

도1은 종래의 반도체 리드프레임 픽커이송장치를 나타낸 부분절개사시도이다.1 is a partial cutaway perspective view showing a conventional semiconductor lead frame picker transfer device.

도2는 본 발명의 짝수열 픽커홀더를 장착한 반도체 리드프레임 픽커이송장치를 나타낸 분해사시도이다.Figure 2 is an exploded perspective view showing a semiconductor lead frame picker transfer device equipped with an even-numbered picker holder of the present invention.

도3은 본 발명의 홀수열 픽커홀더를 장착한 반도체 리드프레임 픽커이송장치를 나타낸 분해사시도이다.3 is an exploded perspective view showing a semiconductor lead frame picker transfer device equipped with an odd number picker holder of the present invention.

※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing

11: 리드프레임 12: 공압실린더11: leadframe 12: pneumatic cylinder

13: 픽커홀더 14, 24, 34: 진공호스13: Picker holder 14, 24, 34: Vacuum hose

15, 25, 35: 픽커 21: 2열 리드프레임15, 25, 35: Picker 21: 2-row leadframe

23: 짝수열 픽커홀더 26, 36: 블록체결나사23: Even-numbered picker holder 26, 36: Block tightening screw

27, 37: 홀더체결나사 28: 2열 픽커블록27, 37: Tightening holder 28: Two-row picker block

29, 39: 길이조절구멍 31: 3열 리드프레임29, 39: Length adjusting hole 31: 3-row lead frame

33: 홀수열 픽커홀더 38: 3열 픽커블록33: odd number picker holder 38: 3 row picker block

40: 관통구멍40: through hole

상기의 목적은 진공호스가 연결되고 리드프레임을 진공흡착하는 픽커와, 이 픽커를 지지하는 픽커홀더와, 이 픽커홀더를 고정구로 고정하고 승하강시키는 한 쌍의 공압실린더와, 상기 공압실린더에 연결되어 상기 공압실린더를 전후좌우 수평이송시키는 이송장치, 및 상기 픽커, 공압실린더 및 이송장치를 제어하는 제어부를 구비하여 이루어진 반도체 리드프레임 픽커이송장치에 있어서, 상기 리드프레임의 열수에 따라 하나 또는 다수개의 상기 픽커를 삽입 고정시키는 한 쌍의 픽커블록이 마련되고, 이 픽커블록을 리드프레임의 길이방향으로 이동시켜서 체결구로 체결하는 것이 가능하도록 상기 픽커홀더에 장방향의 길이조절구멍이 형성된 것을 특징으로 하는 반도체 리드프레임 픽커이송장치에 의해 달성될 수 있다.The purpose of the above is to connect a vacuum hose to the picker for vacuum adsorption of the lead frame, a picker holder for supporting the picker, a pair of pneumatic cylinders for fixing and lifting the picker holder with a fixture, and connecting to the pneumatic cylinder. And a transfer device for horizontally moving the pneumatic cylinders horizontally, horizontally, and horizontally, and a control unit for controlling the picker, the pneumatic cylinder, and the transfer device, wherein one or more of the lead frames are picked up according to the number of rows of the lead frame. A pair of picker blocks for inserting and fixing the picker are provided, and the picker holder has a longitudinal length adjusting hole formed in the picker holder so that the picker block can be moved in the longitudinal direction of the lead frame and fastened with a fastener. Semiconductor Leadframe Picker Invoice Can be achieved by

이하, 본 발명의 구체적인 실시예를 첨부된 도면을 참조하여 상세히 설명 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도2는 본 발명의 짝수열 픽커홀더를 장착한 반도체 리드프레임 픽커이송장치를 나타낸 분해사시도이다.Figure 2 is an exploded perspective view showing a semiconductor lead frame picker transfer device equipped with an even-numbered picker holder of the present invention.

먼저 도2를 참조하여 설명하면 반도체 리드프레임 픽커이송장치는 진공호스(24)가 연결되어 2열 리드프레임(21)의 팩키지를 진공흡착하는 4개의 픽커(25)와, 상기 픽커(25)를 각각 2개씩 삽입 고정하고 밑면에 체결나사구멍이 형성된 한 쌍의 2열 픽커블록(28)과, 상기 2개의 2열 픽커블록(28)을 리드프레임의 길이방향으로 이동시켜서 블록체결나사(26)로 체결하는 것이 가능하도록 양단에 장방향의 길이조절구멍(29)이 형성된 짝수열 픽커홀더(23)와, 상기 짝수열 픽커홀더(23)를 홀더체결나사(27)로 고정하고 승하강시키는 한 쌍의 공압실린더(12)와, 상기 공압실린더(12)에 연결되어 상기 공압실린더(12)를 전후좌우 수평이송시키는 이송장치(도시하지 않음) 및 상기 픽커(25)와 상기 공압실린더(12)와 상기 이송장치를 제어하는 제어부(도시하지 않음)를 구비한다.First, referring to FIG. 2, a semiconductor lead frame picker transfer device includes four pickers 25 for vacuum suctioning a package of a second row lead frame 21 by connecting a vacuum hose 24, and the picker 25. A pair of two-row picker blocks 28 and two two-row picker blocks 28 each having a fastening screw hole formed at a bottom thereof and having two fastening screw holes formed thereon, and the two fastening block blocks 28 are moved in the longitudinal direction of the lead frame. As long as the even-numbered picker holder 23 and the even-numbered picker holder 23, each of which has long length adjustment holes 29 formed at both ends thereof, can be fastened with a holder fastening screw 27, and ascend and descend. A pair of pneumatic cylinders 12 and a transfer device (not shown) connected to the pneumatic cylinders 12 to horizontally move the pneumatic cylinders 12 horizontally and horizontally; and the picker 25 and the pneumatic cylinders 12 And the transfer site And a control unit (not shown) for controlling.

따라서, 새로운 리드프레임의 설비적용시에 리드프레임의 패키지 배열에 따라 2열, 4열, 6열 등의 짝수열인 경우, 상기 2열 픽커블록(28)을 상기 길이조절구멍(29)을 관통하는 상기 블록체결나사(26)로 체결한 후, 상기 블록체결나사(26)의 체결상태를 완화시켜 상기 2열 픽커블록(28)을 상기 길이조절구멍(29) 방향으로 이송 고정시킴으로써 새로운 리드프레임의 패키지의 위치에 맞추어 상기 픽커(25)가 위치되도록 한다.Therefore, when the new lead frame is applied, in the case of even rows such as 2 rows, 4 rows, 6 rows, etc. according to the package arrangement of the lead frames, the two rows of picker blocks 28 pass through the length adjusting holes 29. After tightening with the block tightening screw 26, the tightening state of the block tightening screw 26 is alleviated to transfer and fix the two-row picker block 28 in the direction of the length adjusting hole 29. The picker 25 is positioned in accordance with the position of the package.

또한, 상기 2열 픽커블록(28)은 짝수개의 상기 픽커(25)가 삽입되어 고정되는 삽입구를 추가로 형성하여 4열이나 6열 등의 픽커블록을 제작하는 것도 가능하나 리드프레임의 설계제작상의 한계가 대략 5열 정도이므로 사실상 거의 2열의 픽커블록으로 짝수열의 모든 리드프레임 적용이 가능하다.In addition, the two-row picker block 28 may be formed by inserting an even number of the pickers 25 to be inserted and fixed to manufacture four- or six-row picker blocks. The limit is approximately five rows, so virtually two rows of picker blocks can be applied to all even-numbered leadframes.

이러한 상기 2열 픽커블록(28)은 일반적인 리드프레임의 설계시에 적용되는 패키지 위치의 허용치를 고려하여 수치를 결정하는 것이 바람직하다.The two-row picker block 28 is preferably determined in consideration of the allowance of the package position applied in the design of the general lead frame.

도3은 본 발명의 홀수열 픽커홀더를 장착한 반도체 리드프레임 픽커이송장치를 나타낸 분해사시도이다.3 is an exploded perspective view showing a semiconductor lead frame picker transfer device equipped with an odd number picker holder of the present invention.

도3을 참조하여 설명하면 반도체 리드프레임 픽커이송장치는 진공호스(34)가 연결되어 3열 리드프레임(31)의 팩키지를 진공흡착하는 6개의 픽커(35)와, 상기 픽커(35)를 각각 3개씩 삽입 고정하고 밑면에 체결나사구멍이 형성된 한 쌍의 3열 픽커블록(38)과, 상기 2개의 3열 픽커블록(38)을 리드프레임의 길이방향으로 이동시켜서 블록체결나사(36)로 체결하는 것이 가능하도록 양단의 좌우에 장방향의 길이조절구멍(39)이 형성되고 중심부에 3열 픽커블록(38)의 중심 픽커가 관통하는 관통구멍(40)이 형성된 홀수열 픽커홀더 (33)와, 상기 홀수열 픽커홀더(33)를 홀더체결나사(37)로 고정하고 승하강시키는 한 쌍의 공압실린더(12)와, 상기 공압실린더(12)에 연결되어 상기 공압실린더(12)를 전후좌우 수평이송시키는 이송장치(도시하지 않음) 및 상기 픽커(35)와 상기 공압실린더(12)와 상기 이송장치를 제어하는 제어부(도시하지 않음)를 구비한다.Referring to FIG. 3, the semiconductor lead frame picker transfer device includes six pickers 35 for vacuum suctioning a package of a three-row lead frame 31 by connecting a vacuum hose 34 to the picker 35. A pair of three-row picker blocks 38 are inserted and fixed three by one, and a fastening screw hole is formed at the bottom, and the two three-row picker blocks 38 are moved in the longitudinal direction of the lead frame to the block fastening screws 36. Odd-row picker holders 33 having longitudinal adjustment holes 39 formed at both ends on the left and right sides thereof, and through-holes 40 through which the center picker of the three-row picker block 38 penetrates at the center thereof. And a pair of pneumatic cylinders 12 for fixing the odd-numbered picker holders 33 with a holder fastening screw 37 and raising and lowering them, and connected to the pneumatic cylinders 12 to back and forth the pneumatic cylinders 12. Horizontally The transmission device provided with a (not shown) and a control unit (not shown) for controlling the transfer device and the picker 35 and the pneumatic cylinder 12.

따라서, 새로운 리드프레임의 설비적용시에 리드프레임의 패키지 배열에 따라 1열 3열 5열 등의 홀수열인 경우, 상기 3열 픽커블록(38)을 상기 길이조절구멍(39)을 관통하는 상기 블록체결나사(36)로 체결한 후 상기 블록체결나사(36)의 체결상태를 완화시켜 상기 3열 픽커블록(38)을 상기 길이조절구멍(39)방향으로 이송 고정시킴으로써 새로운 리드프레임의 패키지의 위치에 맞추어 상기 픽커(35)가 위치되도록 한다.Therefore, in the case of odd number of rows such as one row, three rows, five rows, etc., depending on the package arrangement of the lead frames, the third row picker block 38 passes through the length adjusting hole 39 when the new lead frame is applied. After tightening with the block tightening screw 36, the tightening state of the block tightening screw 36 is alleviated to transfer and fix the three-row picker block 38 in the direction of the length adjusting hole 39. The picker 35 is positioned according to the position.

또한, 상기 3열 픽커블록(38)은 홀수개의 상기 픽커(35)가 삽입되어 고정되는 삽입구를 추가로 형성하여 5열이나 7열 등의 픽커블록을 제작하는 것도 가능하고 리드프레임의 설계제작상의 한계가 대략 5열 정도이므로 안정된 이송을 고려하여 사실상 거의 3열의 픽커블록으로 홀수열의 모든 리드프레임 적용이 가능하다.In addition, the three-row picker block 38 may further form an insertion hole into which the odd-numbered pickers 35 are inserted and fixed, to manufacture five- or seven-row picker blocks, and the like. Since the limit is about 5 rows, virtually all of the lead frames in odd rows can be applied with almost 3 rows of picker blocks in consideration of stable transport.

적용할 리드프레임이 1열인 경우, 상기 3열 픽커블록(38)을 그대로 사용하고 중앙의 삽입구에 1개의 픽커만을 삽입하여 체결하는 것도 가능하고 따로 양측에 길이조절구멍을 관통하는 2개의 블록체결나사가 고정되도록 고정편을 형성하고 중앙에 픽커가 삽입되도록 하는 1열 픽커블록을 제작하여 사용하는 것도 가능하다.If the lead frame to be applied is one row, the three-row picker block 38 can be used as it is, and only one picker can be inserted and inserted into the center insertion hole, and two block fastening screws penetrating the length adjusting holes on both sides are provided. It is also possible to manufacture and use a one-row picker block to form a fixing piece so that the fixing is fixed and the picker is inserted in the center.

이러한 상기 3열 픽커블록(38)은 일반적인 리드프레임의 설계시에 적용되는 패키지 위치의 허용치를 고려하여 수치를 결정하는 것이 바람직하다.The three-row picker block 38 is preferably determined in consideration of the allowance of the package position to be applied in the design of a typical lead frame.

따라서 상술한 본 발명의 반도체 리드프레임 픽커이송장치는 이송중에 오차가 발생하여 리드프레임이 흡착되지 않을 경우 체결나사를 풀어서 정밀조절하여 적용하는 것이 가능하게 된다.Therefore, the above-described semiconductor lead frame picker transfer device of the present invention can be applied by adjusting the precision by loosening the fastening screw when an error occurs during transfer and the lead frame is not absorbed.

이상에서와 같이 본 발명에 따른 반도체 리드프레임 픽커이송장치에 의하면, 설비의 범용을 가능하게 하고, 짝수열 픽커홀더와 홀수열 픽커홀더만을 제작하여 모든 종류의 리드프레임에 다양하게 적용할 수 있으므로 제작비를 절감하고 교체시간 및 제작시간을 줄이며, 리드프레임의 제작오차에 따라 즉시 정밀조절하여 적용이 가능함으로써 추가제작이 불필요하게 하는 효과를 갖는 것이다.As described above, according to the semiconductor lead frame picker transfer device according to the present invention, it is possible to make a general purpose of the equipment, and to manufacture only even-numbered picker holders and odd-numbered picker holders and apply them to all kinds of lead frames. It is possible to reduce the replacement time and manufacturing time, and to immediately apply precise adjustment according to the manufacturing error of the lead frame, which makes additional production unnecessary.

이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (4)

진공호스가 연결되고 리드프레임을 진공흡착하는 픽커와, 이 픽커를 지지하는 픽커홀더와, 이 픽커홀더를 고정구로 고정하고 승하강시키는 한 쌍의 공압실린더와, 상기 공압실린더에 연결되어 상기 공압실린더를 전후좌우 수평이송시키는 이송장치, 및 상기 픽커, 공압실린더 및 이송장치를 제어하는 제어부를 구비하여 이루어진 반도체 리드프레임 픽커이송장치에 있어서,A picker that is connected to a vacuum hose and vacuum-adsorbs the lead frame, a picker holder for supporting the picker, a pair of pneumatic cylinders for fixing and lifting the picker holder with a fixture, and the pneumatic cylinder connected to the pneumatic cylinder. In the semiconductor lead frame picker transfer device comprising a transfer device for horizontally moving the front, rear, left and right, and a control unit for controlling the picker, the pneumatic cylinder and the transfer device, 상기 리드프레임의 열수에 따라 하나 또는 다수개의 상기 픽커를 삽입 고정시키는 한 쌍의 픽커블록이 마련되고, 이 픽커블록을 리드프레임의 길이방향으로 이동시켜서 체결구로 체결하는 것이 가능하도록 상기 픽커홀더에 장방향의 길이조절구멍이 형성된 것을 특징으로 하는 반도체 리드프레임 픽커이송장치.A pair of picker blocks are provided for inserting and fixing one or a plurality of the pickers according to the number of rows of the lead frames, and the picker blocks are mounted on the picker holders so that the picker blocks can be moved in the longitudinal direction of the lead frames and fastened with fasteners. And a length adjusting hole in a direction. 제 1 항에 있어서,The method of claim 1, 상기 체결구 및 상기 고정구는 체결나사인 것을 특징으로 하는 상기 반도체 리드프레임 픽커이송장치.The fastener and the fastener is a semiconductor lead frame picker transfer device, characterized in that the fastening screw. 제 1 항에 있어서,The method of claim 1, 상기 픽커블록은 짝수개의 상기 픽커를 설치할 수 있는 짝수열 픽커블록과, 홀수개의 상기 픽커를 설치할 수 있는 홀수열 픽커블록으로 형성됨을 특징으로 하는 상기 반도체 리드프레임 픽커이송장치.And the picker block is formed of an even-numbered picker block for installing the even numbered pickers and an odd-numbered picker block for installing the odd numbered pickers. 제 1 항에 있어서,The method of claim 1, 상기 픽커홀더는 상기 짝수열 픽커블록을 설치할 수 있는 짝수열 픽커홀더와, 중심부에 픽커블록의 중심 픽커가 관통하는 관통구멍이 형성되고 상기 홀수열 픽커블록을 설치할 수 있는 홀수열 픽커홀더로 형성됨을 특징으로 하는 상기 반도체 리드프레임 픽커이송장치.The picker holder is formed of an even-numbered picker holder for installing the even-numbered picker block, a through-hole formed through the center picker of the picker block at the center thereof, and an odd-numbered picker holder for installing the odd-numbered picker block. And said semiconductor lead frame picker transfer device.
KR1019970031574A 1997-07-08 1997-07-08 Semiconductor lead frame picker sending apparatus KR100269015B1 (en)

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KR102625519B1 (en) 2023-08-22 2024-01-16 성우테크론 주식회사 lead frame transfer apparatus

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KR970019759A (en) * 1995-09-21 1997-04-30 만프레트 조벨·요아힘 그렘 Electroluminescent device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970019759A (en) * 1995-09-21 1997-04-30 만프레트 조벨·요아힘 그렘 Electroluminescent device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102625519B1 (en) 2023-08-22 2024-01-16 성우테크론 주식회사 lead frame transfer apparatus

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