KR100259879B1 - Connector for testing semiconductor and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A connector for testing semiconductor devices and a manufacturing method of the same are provided to minimize the length of terminals electrically connecting leads and a tester as well prevent the degradation of elasticity of the terminal with excluding the influence of external high frequency. CONSTITUTION: A plurality of elastic pieces(9) are formed to be isolated from each other by cut parts(10) on one side of a non-conductor supporting block(8). Conductive terminals(12) are respectively coupled to front ends of the elastic pieces(9). Therefore, a bottom surface of the supporting block(8) and a bottom surface of the terminals(12) are positioned on a horizontal line. Conductive material is inserted into portions of a mold corresponding to the front ends of the connector(13) and is then injected. Next, the cut parts910) are formed in accordance with the number and pitch of leads for forming the terminals(12) and elastic pieces(9) from the inserted conductive material.

Description

Connector for semiconductor device tester and method of manufacturing the same {Connector for testing semiconductor and method for manufacturing the same}

The present invention relates to a connector (connector) installed in the test section of the handler electrically connected to the lead of the semiconductor (hereinafter referred to as "element") produced in the manufacturing process to check the performance of the device, and a method of manufacturing the same More specifically, the structure has been improved to be suitable for testing high capacity devices.

In general, the characteristics of the device are determined at the tester by transferring one or more devices produced in the production process to the tester part of the handler and electrically connecting the device leads with the connectors connected to the tester part. Is classified as good or bad, the good device is shipped, and the bad is discarded.

In recent years, due to the development of the industry, the capacity of devices, such as computers, and the rapid processing speed are required, so the capacity of devices is also increasing from MHz to GHz.

1 is an exploded perspective view illustrating a terminal in a conventional connector, and FIG. 2 is a longitudinal cross-sectional view of the coupled state of FIG. 1, in which a plurality of terminals 2 are integrally molded in the main body 1 of a synthetic resin material.

The terminal 2 has a connecting portion 4 connected to the lead 3a of the element 3, and an elastic force that reduces the connecting portion to an initial state when the external force is applied by compressing the external portion by pressing the lead and then the external force is removed. A portion 5 and a pin 6 for connecting the terminal to a terminal of a tester portion (not shown) by a lead wire are integrally formed.

Therefore, when a pair of main bodies 1 in which a plurality of terminals 2 are integrally molded is installed side by side in the tester part of the handler as shown in FIG. The lead 3a of the element is connected to the connecting portion 4 of the terminal 2.

In this state, when the push pin 7 such as sapphire, which is an insulator, presses the lead 3a in the direction of the arrow, the elastic part 5 is lowered under the compressive force as shown by the dashed line in FIG. 3a) and the connection part 4 are closely connected, and accordingly, the performance of the device produced in the tester part is judged and the result is informed to the CPU.

Then, when the tested element 3 is returned to the conveying track by the conveying means, the external force applied to the elastic portion 5 is removed, so that the connecting portion 4 is reduced to the initial state.

When the test is completed as described above, according to the determination result, the classification unit classifies the tested device as good or bad.

However, the conventional connector using the terminal 4 composed of the connecting portion 4, the elastic portion 5, and the pin 6 connected to the terminal and the lead wire of the tester portion has a long overall length of the terminal, thereby increasing the resistance value during the test. In addition, due to a lot of noise, there is a possibility that the time according to the signal and the measurement may be different. Therefore, in the high frequency test of the GHz capacitive device, the misjudgment of the device's performance frequently occurs, and in severe cases, the test itself is impossible. There was a problem.

In addition, the assembly of the parts was poor, and the elastic force of the terminal (2) is lowered with the use for a long time, causing contact failure during the test.

In view of the above problems, when the length of the terminal 2 is short, the elastic force is further lowered and the life is shortened.

The present invention has been made to solve such a problem of the prior art, while minimizing the length of the terminal that electrically connects the lead and the tester of the device, while preventing the phenomenon that the elastic force of the terminal is deteriorated, and at the same time high capacity The purpose of this test is to prevent the external high-frequency effect from testing the device.

According to an aspect of the present invention for achieving the above object, a semiconductor element characterized in that a plurality of elastic pieces are formed on each side of the support block which is a non-conductor, each separated by a notch, and a terminal made of a conductive material is fixed to the tip of the elastic piece. Connectors for testers are provided.

According to another aspect of the present invention, a first step of performing an injection operation by inserting a conductive material in a mold located at the tip of the elastic portion formed integrally with the connector, and according to the number and pitch of leads to be tested for the elastic portion There is provided a method of manufacturing a connector for a semiconductor device tester, which comprises the second step of cutting and forming a terminal from an elastic piece and an inserted conductive material.

1 is an exploded perspective view of a terminal in a conventional connector

Figure 2 is a longitudinal cross-sectional view of the engagement state of FIG.

3 is a perspective view showing one embodiment of the present invention

Figure 4 is a longitudinal cross-sectional view illustrating a state of use of the present invention

5a and 5b is a process chart for explaining the manufacturing method of the connector

Explanation of symbols for main parts of the drawings

8: support block 9: elastic piece

9a: elastic part 10: cutout

12: terminal 12a: conductive material

13: Connector

Hereinafter, with reference to the accompanying Figures 3 to 5 showing an embodiment of the present invention in more detail as follows.

Figure 3 is a perspective view showing an embodiment of the present invention, Figure 4 is a longitudinal cross-sectional view illustrating a state of use of the present invention and Figures 5a and 5b is a process diagram for explaining the manufacturing method of the connector, the present invention is a non-conductive support A plurality of elastic pieces 9 are formed on one side of the block 8 so as to be separated from each other by the cutouts 10, and respective patterns formed on the substrate 11 are not shown at the ends of the elastic pieces 9 (not shown). Terminal 12, which is a conductive material to be connected thereto, is fixed.

At this time, the bottom surface of the support block 8 and the bottom surface of the terminal 12 are located on the horizontal line. When the lead 3a of the element 3 is connected to the top surface of the terminal 12, the terminal is electrically connected with the pattern. This is to be passed through.

And the cross section of the terminal 12 electrically connected with the pattern of the board | substrate 11 is a "C" shape, which is a terminal when the lead of the element is pressed in the state where the lead 3a of the element 3 is connected. This is to make the elastic piece 9 have a restoring force by rotating 12 slightly.

The length of the terminal 12 applied to an embodiment of the present invention is set to about 4mm, which is when the terminal 12 serves to electrically connect the lead 3a of the device 3 and the tester part. This is to minimize the influence of high frequency from the outside.

Referring to Figure 5 attached to the manufacturing method of the present invention configured as described above are as follows.

First, the conductive material 12a is inserted into a mold corresponding to the distal end portion of the elastic part 9a integrally formed on the connector 13, and then injection is performed to obtain an injection product as shown in FIG. 5A.

Subsequently, the cutout portion 10 is formed according to the number and pitch of the leads to be tested to the elastic portion 9a of the injection molded product as shown in FIG. 5A, and the elastic piece 9 and the inserted conductive material 12a as shown in FIG. 5B. To form a terminal (12).

After the connector 13 is formed by the above operation, one device 3 to be tested is transferred by a transfer means or the multiple devices are installed in the state where the connector is installed as shown in FIG. When (3) is conveyed by the conveying means in the state held in the test tray, the lead 3a of the element 3 is inserted into the tip of the elastic piece 9 to be electrically connected with the pattern of the substrate 11. It is connected to the upper surface of the terminal 12.

In this state, if the push pin 7 such as sapphire, which is a non-conductor, pushes the lead 3a in the direction of the arrow, or the pushing means pushes the test tray toward the connector at the same time, the terminal 12 rotates slightly in the direction of the arrow on the drawing. The elastic piece 9 is compressed, so that the upper surface of the terminal 12 is intimately connected to the lead 3a of the element 3 and the lower surface of the elastic member 9 is closely connected to the pattern formed on the upper surface of the substrate 11. The performance of the CPU is determined and the result is reported to the CPU.

At this time, the cross section of the terminal 12 connected to the lead 3a and the pattern of the element 3 has a “C” shape, and the upper and lower surfaces are in point contact. The amount of wear is reduced as well as not easily contaminated by foreign matter.

Then, when the device or test tray tested by the conveying means is conveyed to the delivery side, the external force applied to the terminal 12 is removed, so that the terminal 12 slightly rotated inward by the restoring force of the elastic piece 9 is returned to its initial state. Reduced.

As described above, when the test of the device 3 is completed, the tester classifies the tested device as good or defective according to the determination result.

As described above, the present invention minimizes the length of the terminal 12 which electrically connects the lead 3a of the device and the tester to the device 3 when the device 3 is tested. Since the measurement error does not occur, the reliability of the test is improved, and the lead and the terminal 12 of the device are in point contact, and thus the life of the contact pin is extended.

In addition, when the connector is molded, the conductive material 12a is inserted, and then the elastic piece 9a and the terminal are simply cut at regular intervals according to the number and pitch of the leads 3a of the element 3. Since the 12 is formed, the workability according to the manufacture of the connector is also improved.

Claims (3)

A plurality of elastic pieces 9 are formed to be separated from each other by the notch 10 on one side of the support block 8, which is a non-conductor, and the terminal 12, which is a conductive material, is fixed to the front end of the elastic piece 9 to be supported. A connector for a semiconductor device tester, characterized in that the bottom surface of the block (8) and the bottom surface of the terminal (12) are positioned on a horizontal line. The method of claim 1 A connector for a semiconductor device tester, characterized in that the cross section of the terminal 12 has a "C" shape. The first step of inserting the conductive material 12a into a mold corresponding to the front end of the connector 13 in which the elastic part 9a is integrally formed and then performing an injection operation, and to test the elastic part 9a. And a second step of forming the terminal 12 from the elastic piece 9 and the inserted conductive material 12a by cutting the cutout portion 10 according to the number and pitch of the leads. Method for manufacturing a connector for

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