JP3062558U - Chip test connector - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To quickly replace only a damaged portion of an inspection pin, and to prevent performance degradation of the inspection pin due to a plating material plated on a chip lead being attached to the inspection pin during an inspection. And a chip test connector capable of extending the life of the test pin. SOLUTION: The chip test connectors according to the present invention are arranged on a base plate so as to face each other,
The body has a pair of housings of insulating material in which a plurality of insertion grooves are formed. Each of the plurality of test pins that are removably mounted in each of the insertion grooves has a notch formed by cutting off a part of a peripheral edge thereof. The terminal connection portion which is removably inserted into the notch of each inspection pin is supported on both sides by the wall of the notch and the wall of the insertion groove, and the upper end thereof has a predetermined height from the upper surface of the housing. And project upward to make inspection contact with the leads of the chip mounted on the housing.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a chip test connector for testing the performance of a chip by contacting a chip lead, and more specifically, when a test pin portion of a connector for testing an electronic component element is damaged, the entire connector is replaced. It is possible to quickly replace only the damaged part without any problems, and prevent the performance of the test pin from deteriorating due to the sticking of the material of the plating on the chip lead to the test pin part at the time of inspection. Further, the present invention relates to a chip test connector capable of extending the life.

[0002]

[Prior art]

 Generally, a large number of chips are mounted inside an electronic product, and these chips play an important role in determining the performance of the electronic product. In general, chips often consist of conductors that can pass current, but recently semiconductors with resistance between conductors and non-conductors (insulators) are often used.

A semiconductor has a resistivity of about 10-5 to 10-8 (Ωm). In general, a semiconductor chip has a rectangular body and a plurality of leads extending on both sides of the body. Therefore, an electrical signal is input to or output from the body through the lead.

[0004] Semiconductor chips are mounted on electronic products and play an important role in determining the performance of the products. Therefore, before a chip is mounted on an electronic product and assembly of the electronic product is completed, it is necessary to inspect whether the produced semiconductor chip is a good product having required performance.

For testing a semiconductor chip, a chip test connector is used.

FIG. 1 is an exploded perspective view of a conventional chip test connector, and FIG. 2 is a longitudinal sectional view of FIG. As shown in these drawings, a connector for testing an electronic element, for example, a semiconductor chip, is spaced apart from each other at a predetermined distance on a base plate 1 installed on a test apparatus (not shown). And a pair of housings 2a and 2b made of an insulating synthetic resin material. At the time of performance inspection of the semiconductor chip 3, the semiconductor chip 3 is placed on the upper end of each of the housings 2a and 2b so that both ends of the semiconductor chip 3 straddle the inspection. The semiconductor chip 3 includes a body and a large number of leads 4 extending on both sides of the body.

Each of the housings 2a, 2b is provided with a large number of pin insertion holes 6 penetrating in the vertical direction in the longitudinal direction of the housings 2a, 2b. After the test pins 10 are sequentially inserted into the respective pin insertion holes 6 formed in the housings 2a and 2b, the housings 2a and 2b are fixed on the base plate 1 to complete the assembly of the connector.

The inspection pin 10 has an inspection contact portion 11 that contacts the lead 4 of the semiconductor chip 3, and the external force is released after an external force is applied to the lead 4 to press and compress the inspection contact portion 11. For example, a bending elastic portion 12 for returning the inspection contact portion 11 to an initial state and a connection pin 13 electrically connected to a terminal of the test portion are integrally formed.

With this configuration, the connector is assembled such that the inspection contact portions 11 of the plurality of inspection pins 10 are exposed at the upper portions of the housings 2a and 2b, and at the same time, the connecting pins 13 are exposed at the lower portions of the housings 2a and 2b. When one semiconductor chip 3 to be tested is moved by a transfer means (not shown) in a state where the connector is set in the test section, the leads 4 of the semiconductor chip 3 are brought into contact with the inspection contact section 11 of the inspection pin 10. It comes into contact.

In this state, when the pressing pin 20 made of a non-conductor such as sapphire presses the lead 4 of the semiconductor chip 3 downward, the inspection pin 10 exposed at the upper part of the housings 2a and 2b is exposed. The bending elastic part 12 of the semiconductor chip 3 descends while receiving the compressive force as shown by the one-dot chain line, and the lead 4 of the semiconductor chip 3 and the inspection contact part 11 of the inspection pin 10 come into close contact. As a result, the test section judges the performance of the semiconductor chip 3 and notifies the central processing unit (CPU) of the result.

Thereafter, when the semiconductor chip 3 is transferred onto a transfer track (not shown) by the transfer means, the external force applied to the bending elastic portion 12 is removed, so that the test contact portion 11 of the test pin 10 is removed. Is returned to the initial state and is exposed at the upper part of the housings 2a and 2b.

When the test is completed and the semiconductor chip 3 is sent to the classification section through the sending track, the tested semiconductor chip 3 is classified into a non-defective product and a defective product according to the result of the determination.

However, in such a conventional connector, by repeating the test on the semiconductor chip 3 (about 30,000 times), the test contact portion 11 of the test pin 10 that comes into contact with the lead 4 of the semiconductor chip 3 is formed. The vertical movement with a predetermined radius of curvature causes the wear rate to increase, and the bending elastic portion 12 of the inspection pin 10 is in the form of a leaf spring. Therefore, there is a problem that the life is relatively short.

The lead 4 of the semiconductor chip 3 coated with tin is inspected by the curved movement of the test contact between the test pin 10 having the form of a leaf spring and the lead 4 of the semiconductor chip 3. The contact portion 11 scratches the tin and attaches the tin to the inspection pin 10. However, if the bell attached to the inspection pin 10 is oxidized, the connection terminal changes to a nonconductor and the performance of the connector deteriorates. Therefore, there was a problem that the inspection became impossible.

When the elastic force of the bending elastic portion 12 of the inspection pin 10 is reduced, it is necessary to replace the entire connector. Therefore, it is necessary to replace an expensive inspection pin (about 2,500 won per piece). Economic losses were brought.

Further, even when assembling the connector, the inspection pin 10 is inserted into the pin insertion hole 6 such that the inspection contact portion 11 of the inspection pin 10 is exposed above the housing 2a, 2b with the housing 2a, 2b turned upside down. Each connector has to be inserted into the base plate and then fixed to the base plate 1 again, so that there is a problem that the assembling work of the connector is complicated and reduces productivity.

[0017]

[Problems to be solved by the invention]

 The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a connector for testing an electronic component element in a case where a test pin portion is damaged, without replacing the entire connector. It is possible to quickly replace only the damaged part, and it is possible to prevent the deterioration of the inspection performance due to the plating material plated on the lead of the chip being attached to the inspection pin portion at the time of inspection, and An object of the present invention is to provide a chip test connector capable of extending the life.

[0018]

[Means for Solving the Problems]

 In order to achieve the above object, the chip test connector according to the present invention is arranged on a base plate and a base plate so as to face each other, and both ends of a chip to be inspected are placed at an upper end of a body portion. A pair of housings made of an insulating material and having a plurality of insertion grooves formed in the body portion; mounted in the insertion grooves so that they can be inserted and removed, and a part of the periphery is cut away. It has a notch formed and a sub-notch formed in an intermediate plate surface area at a point adjacent to the notch, and the notch has a notch so that the plate surface is curved, and a curved plate portion is formed. A plurality of test pins, which are inserted removably into the cutouts of the test pins, the outer surface on one side is supported by the end of the curved plate portion, and the outer surface on the other side is a cylindrical shape supported by the wall surface of the insertion groove. Sleeve; can be moved up and down within the sleeve, The inspection part is protruded upward from the upper surface of the housing at a predetermined height, and makes inspection contact with the lead of the chip mounted on the housing; and the inner bottom surface of the sleeve and the lower end of the elevation rod. And an elastic member interposed between the elastic member and the elastic member for holding the lifting rod.

Here, a sub notch may be formed on the inspection pin at a point adjacent to the notch so that an intermediate plate surface between the notch and the sub notch elastically holds the sleeve. desirable. Further, it is more desirable to form a plurality of sharp receiving projections on the upper end of each of the test elevating rods which are in direct test contact with the chip leads.

Accordingly, when the inspection pin portion of the connector for testing the components of the electronic component is damaged, it is not necessary to replace the entire connector, and it is possible to quickly replace only the damaged portion. In addition, it is possible to prevent the performance of the test pin from deteriorating due to the plating material plated on the lead of the chip being attached to the test pin at the time of the test, thereby extending the life of the test pin as compared with the related art.

[0021]

[Embodiment of the invention]

 Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 3 is an exploded perspective view of the chip test connector according to the present invention, FIG. 4 is an assembled perspective view of FIG. 3, and FIG. 5 is a longitudinal sectional view of FIG.

As shown in these drawings, a connector for testing an electronic element, that is, a semiconductor chip 53, is provided on a base plate 51 installed above a test unit (not shown), as in the related art. And a pair of housings 52a and 52b made of an insulating synthetic resin material. For this reason, the performance test of the semiconductor chip 53 is performed in a state where the semiconductor chip 53 is placed in the space between the housings 52a and 52b so that both ends of the semiconductor chip 53 straddle the upper ends of the housings 52a and 52b. Do. The semiconductor chip 53 includes a body portion and a number of leads 54 extending to both sides of the body portion.

A plurality of insertion grooves 55 penetrating vertically are formed in the body of each of the housings 52a and 52b in the longitudinal direction of the body. Accordingly, after the inspection pins 60 are sequentially inserted from below into the respective insertion grooves 55 formed in the housings 52a and 52b, the housings 52a and 52b are fixed on the base plate 51 and cover the upper covers 56a and 56b. After that, the terminal connector 71 described later is inserted through the insertion hole formed on the upper covers 56a and 56b, and is inserted into the inspection pin 60, whereby the assembly of the connector is completed.

The inspection pin 60 is manufactured so that a leaf (leaf) made of a conductive material has a predetermined shape, and as shown in FIG. A sub notch 62 is formed on the inspection pin at a point adjacent to the notch 61. Thus, the intermediate plate surface between the notch 61 and the sub notch 62 serves as an elastic piece 63. This is because by inserting the sleeve 72 into the insertion space of the notch 61 smaller than the diameter of the sleeve 72 described later in FIG. 7, the elastic piece 63 has a compressive force while deforming outward. This is to prevent the connection failure between the inspection pin 60 and the sleeve 72 and to prevent the sleeve 72 inserted into the notch 61 of the inspection pin 60 from being detached.

In a state where the inspection pin 60 is mounted in the insertion groove 55 of the housings 52 a and 52 b, the inspection pin 60 comes into contact with the lead 54 of the semiconductor chip 53, and the terminal connection part 71 having the sleeve 72 as a constituent element is The inspection pins 60 are removably fitted into the cutouts 61 of the inspection pins 60 through the insertion holes of the upper covers 56a and 56b.

A connection pin 64 electrically connected to a terminal of the test section is formed integrally with the test pin 60 below the test pin 60, and the housing 52 a on which the test pin 60 is mounted, When the base plate 52b is fixed to the base plate 51 on the upper side of the test unit, the connection pin 64 passes through a connection hole (not shown) formed on the base plate 51 and is connected to the test unit. Terminals (not shown) are energized.

As shown in FIG. 7, the terminal connection portion 71 is installed so as to be able to move up and down in a cylindrical sleeve 72 and a sleeve 72, and the upper end thereof is in contact with the lead 54 of the semiconductor chip 53. And a lifting rod 73 for use. An elastic member 74 such as a coil spring is interposed between the inner bottom surface of the sleeve 72 and the lower end of the elevating bar 73 so that the elevating bar 73 can move up and down elastically inside the sleeve 72. It is. A guide groove (not shown) having a predetermined length is formed in a predetermined region on the outer surface of the lifting rod 73 in the longitudinal direction, and a guide groove formed by the recess of the side wall of the sleeve 72 is formed in the guide groove. By inserting the stopper, the elevating rod 73 can secure a range of elevating only by the length of the guide groove, and is not separated from the outside of the sleeve 72 by the locking part. Further, the lifting rod 73 has a predetermined height and protrudes upward from the upper surface of the body portion of the housing 52a, 52b so as to be in inspection contact with the lead 54 of the semiconductor chip 53 mounted on the housing 52a, 52b. Has become. A large number of sharp receiving projections are formed on the upper surface of the lifting rod 73 so as to make point contact, not surface contact, when the semiconductor chip 53 comes into contact with the lead 54.

Therefore, the sleeve 72 of the terminal connection portion 71 mounted on the inspection pin 60 is supported by one side surface by surface contact with the wall surface of the insertion groove 55, and the lower region of the other side surface is inspected by the cutout portion 61. The pin 60 is supported by an end portion of a curved plate portion 65 which is cut out so that the plate surface is curved. At this time, the gap between the end of the curved plate portion 65 that supports the sleeve 72 and the wall surface of the insertion groove 55 of the inspection pin 60 is formed to be smaller than the diameter of the sleeve 72. When inserted into the gap, the curved plate portion 65 is pressed to the outside of the sleeve 72, so that the curved plate portion 65 elastically holds the sleeve 72.

Hereinafter, the operation and effect of the chip test connector according to the present invention will be described.

First, the steps of assembling the connector are as follows. That is, the inspection pins 60 are sequentially inserted into the insertion grooves 55 of the injection molded housings 52a, 52b so that the connection pins 64 of the inspection pins 60 are exposed in a zigzag manner below the housings 52a, 52b.

As described above, after the insertion of the inspection pins 60 into the insertion grooves 55 of the housings 52a and 52b is completed, the inspection pins 60 are formed on the inspection pins 60 through the insertion holes of the upper covers 56a and 56b. When the sleeve 72 is sequentially pushed in so as to be connected to the cutout 61, the end of the curved plate portion 65 of the inspection pin 60 elastically holds the outer surface of the sleeve 72, and at the same time, the gap between the cutout 61 and the sub cutout 62. The intermediate plate surface, that is, the elastic piece 63 spreads outward and has a restoring force, and the sleeve 72 is tightly connected to the inspection pin 60.

Accordingly, when an external force acts on the lifting rod 73 of the terminal connection part 71 exposed at the upper part of the housing 52, the lifting rod 73 moves up and down elastically inside the sleeve 72 by the elastic force of the elastic member 74. Will be.

With the above-described operation, the assembly of the housings 52a and 52b is completed, and one semiconductor chip 53 to be tested is placed in a state where the pair of housings 52a and 52b are juxtaposed on the base plate 51 of the test section. When the semiconductor chip 53 is transferred by the transfer means, the lead 54 of the semiconductor chip 53 comes into contact with the lifting rod 73 of the terminal contact part 71.

In this state, when the pressing pin 80 made of a non-conductor such as sapphire presses the lead 54 of the semiconductor chip 53 from above to below, the lifting rod 73 compresses the elastic member 74 while compressing the elastic member 74. Since the semiconductor chip 53 descends as shown by the one-dot chain line, the leads 54 of the semiconductor chip 53 and the upper surface of the lifting rod 73 are tightly connected, so that the test section determines the performance of the semiconductor chip 53 and determines the performance of the central processing unit ( Inform the CPU) of the result.

At this time, since a large number of sharp protrusions are formed on the upper surface of the elevating rod 73 in contact with the leads 54 of the semiconductor chip 53 and come into point contact with the bottom surface of the leads 54, the test of the semiconductor chip 53 is performed. Repeatedly, the amount of abrasion is reduced, and foreign matter is not easily contaminated. Therefore, it is possible to prevent the upper end of the lifting rod 73 from being made nonconductive due to the tin being oxidized due to a large amount of tin or the like plated on the lead 54 attached to the lifting rod 73.

Thereafter, when the semiconductor chip 53 is transferred onto the delivery track by the transfer means, the external force applied to the lifting rod 73 is removed, and the lifting rod 73 is moved to the initial state by the restoring force of the elastic member 74. Return to

When the test is completed as described above, the classification unit sorts the tested semiconductor chips 53 into non-defective products and defective products, respectively, based on the result of the determination.

On the other hand, if the terminal connection portion 71 inserted into the inspection pin 60 is worn or contaminated with foreign matter by performing a long-term test using the connector, the terminal connection portion 71 If the connector 71 is removed from the inspection pin 60 through the insertion hole of the upper cover 56 and then replaced with a new terminal connection portion 71, the connector can be used continuously.

As described above, when the terminal connection portion 71 is damaged due to long-term use of the connector, only the corresponding terminal connection portion 71 needs to be replaced, so that the conventional method has to replace the entire connector. There are economic advantages.

[0041]

[Effect of the invention]

 As described above, according to the chip test connector of the present invention, when the inspection pin of the connector for testing the chip of the electronic component is damaged, it is not necessary to replace the entire inspection pin, and only the damaged portion is replaced. Has the effect of being able to be quickly replaced.

Further, it is possible to prevent the performance of the inspection pin from being deteriorated due to the plating material plated on the lead of the chip being attached to the inspection pin during the inspection, and the life of the connector is extended.

As described above, the present invention has been specifically described based on the preferred embodiments. However, the present invention is not limited to this, and can be changed and improved without departing from the gist of the present invention. Of course.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a conventional chip test connector.

FIG. 2 is a longitudinal sectional view of FIG.

FIG. 3 is an exploded perspective view of the chip test connector according to the present invention.

FIG. 4 is an assembled perspective view of FIG. 3;

FIG. 5 is a longitudinal sectional view of FIG.

FIG. 6 is a side view of the inspection pin of FIG. 3;

FIG. 7 is a side view of the terminal connection part of FIG. 3;

[Explanation of symbols]

 51 Base plate 52a, 52b Housing 53 Semiconductor chip 54 Lead 55 Insertion groove 56a, 56b Upper cover 60 Inspection pin 61 Notch portion 62 Sub notch portion 63 Elastic piece 64 Connection pin 65 Curved plate portion 71 Terminal connection portion 72 Sleeve 73 Lifting rod 74 Elasticity Element

Claims (3)

[Utility model registration claims] 1. A base plate, which is disposed on the base plate so as to face each other, both ends of a chip to be inspected are placed on an upper end of a body for inspection, and a plurality of insertions are inserted into the body. A pair of housings made of an insulating material having a groove formed therein, a notch formed by being inserted into and removed from each of the insertion grooves, and a part of a peripheral portion being cut out; A plurality of inspection pins having a curved plate portion formed by notching the plate surface to be curved, the sub-cut portion being formed in an intermediate plate surface region at an adjacent point; A cylindrical sleeve inserted removably into the cutout portion, one outer surface supported by an end of the curved plate portion, and the other outer surface supported by surface contact with a wall surface of the insertion groove; It can be moved up and down, and its upper end is A test elevating rod protruding upward at a predetermined height from an upper surface of the housing to make test contact with a lead of a chip mounted on the housing, and an inner bottom surface of the sleeve and a lower end of the elevating rod An elastic member interposed between the first and second parts for elastically holding the lifting rod. 2. A sub notch is formed on the inspection pin at a point adjacent to the notch, and an intermediate plate surface between the notch and the sub notch elastically holds the sleeve. The chip test connector according to claim 1, wherein: 3. The chip testing device according to claim 1, wherein a plurality of sharp receiving projections are formed at an upper end of each of the test elevating bars that directly make contact with the leads of the chip. connector.