KR100255556B1 - Solder ball bumping method of semiconductor package and its apparatus - Google Patents

Solder ball bumping method of semiconductor package and its apparatus Download PDF

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KR100255556B1
KR100255556B1 KR1019970072035A KR19970072035A KR100255556B1 KR 100255556 B1 KR100255556 B1 KR 100255556B1 KR 1019970072035 A KR1019970072035 A KR 1019970072035A KR 19970072035 A KR19970072035 A KR 19970072035A KR 100255556 B1 KR100255556 B1 KR 100255556B1
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South Korea
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solder ball
tool
bumping
seating
semiconductor package
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KR1019970072035A
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Korean (ko)
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KR19990052543A (en
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조윤채
박민후
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김규현
아남반도체주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: A method for pumping solder balls and an apparatus thereof are provided to seek a compatability of an equipment and simplify the work process by locating solder balls at the bottom of a material and then pumping them. CONSTITUTION: A method for pumping solder balls locates a tool for seat(5) at the bottom of a material in which solder ball lands are formed. With the solder balls seated onto a seat groove in which the tool for seat(5) is formed, the tool for seat(5) is raised to locate the solder balls at the solder ball lands of the material. Then, the tool for seat(5) and the material are rotated by 180 degree/pumped. The tool for seat(5) and the material are again rotated by 180 degree to locate them at their original location.

Description

반도체패키지의 솔더볼 범핑 방법 및 그 장치Solder ball bumping method and apparatus for semiconductor package

본 발명은 반도체 패키지의 솔더볼 범핑 방법 및 그 장치에 관한 것으로, 더욱 상세하게는 솔더볼을 입출력 단자로 사용하는 반도체 패키지의 배면에 솔더볼을 범핑시 상기한 솔더볼을 자재의 저면에 위치시켜 범핑함으로서 정확한 범핑을 할 수 있도록 함과 동시에, 직경이 다른 솔더볼을 하나의 툴(Tool)로서 범핑할 수 있도록 함으로서 장비의 호환성을 꾀할 수 있고, 작업 공정을 간단히하며 생산성을 향상시키도록 된 것이다.The present invention relates to a method and apparatus for bumping a solder ball of a semiconductor package, and more particularly, to bumping a solder ball on a bottom surface of a material when bumping a solder ball on a back surface of a semiconductor package using the solder ball as an input / output terminal. In addition, by making it possible to bump solder balls of different diameters as a tool, the compatibility of the equipment can be achieved, the work process is simplified, and the productivity is improved.

일반적으로 솔더볼을 입출력 단자로 사용하는 반도체 패키지는 그 배면에 다수의 솔더볼랜드가 형성되어 있고, 이 솔더볼랜드에 솔더볼을 범핑하여 접속시킴으로서, 신호 입출력 단자로 사용하는 것이다.In general, a semiconductor package using a solder ball as an input / output terminal has a plurality of solder ball lands formed on a back side thereof, and is used as a signal input / output terminal by bumping and connecting the solder ball to the solder ball land.

이러한 반도체 패키지의 배면에 범핑되는 솔더볼은 솔더볼랜드에 정확하게 안착되어야 하는데, 종래에는 반도체 패키지의 배면에 솔더볼을 안착시킬 때 솔더볼을 일일이 손으로 하나씩 안착시키거나, 티져(Tweezer)나 핀셋 등으로 안착시켰던 것이다. 이렇게 함으로서 다수의 솔더볼랜드에 솔더볼을 안착시키는 데는 작업시간이 많이 소요되어 생산성이 저하되고, 솔더볼을 패키지의 솔더볼랜드에 정확히 안착시키지 못하여 많은 불량을 초래하게 되는 문제점이 있었다.The solder balls bumped on the back surface of the semiconductor package should be seated correctly on the solder borland. In the past, when solder balls are seated on the back surface of the semiconductor package, the solder balls are placed one by one by hand or by a teaser or tweezers. will be. By doing so, it takes a lot of work time to settle the solder balls on a plurality of solder borland, the productivity is reduced, there is a problem that the solder ball is not seated correctly on the solder borland of the package, causing a lot of defects.

이러한 문제점을 해결 보완하기 위하여 반도체 패키지의 배면에 솔더볼을 범핑하는 장비가 개발되어 있으나, 이러한 범핑 장비는 배큠에 의해 솔더볼을 흡착한 상태에서 자재를 뒤집어 놓고, 자재의 상부에서 솔더볼을 안착시켜 범핑하도록 되어 있음으로서, 솔더볼의 안착위치가 틀려지는 등의 불량이 발생될 뿐 만 아니라, 배큠에 의해 솔더볼을 흡착하여야 함으로서, 장비의 구성이 복잡해지는 등의 문제점이 있었던 것이다.In order to solve this problem, a device for bumping solder balls on the back of a semiconductor package has been developed, but such a bumping device is used to bump a solder ball on the top of the material by inverting the material while the solder ball is absorbed by the backing. As a result, not only defects such as incorrect seating positions of the solder balls are generated, but also the solder balls need to be sucked by the soldering, which leads to a complicated configuration of the equipment.

또한, 이러한 종래의 범핑 장비는 직경이 다른 솔더볼을 범핑하기 위해서는 솔더볼을 흡착하는 툴을 교체 사용하여야 됨으로서, 작업성이 저하되는 등의 문제점도 있었던 것이다. 즉, 솔더볼을 흡착하는 툴과 솔더볼 간의 직경이 서로 다르게 되면 배큠으로 솔더볼을 흡착할 수 없음으로서 솔더볼의 직경에 따라 항상 툴을 교체 사용하여야 된다. 따라서, 툴 교체 작업에 따른 작업 공수가 추가되어 생산성을 저하시키고, 작업 공정을 복잡하게 하는 등의 단점이 내포되어 있었던 것이다.In addition, such a conventional bumping equipment has a problem in that workability is deteriorated because a tool for adsorbing solder balls needs to be replaced to bump solder balls having different diameters. In other words, if the diameter between the solder ball and the tool and the solder ball is different from each other, the solder ball can not be adsorbed by the vacuum, so the tool must always be replaced according to the diameter of the solder ball. Therefore, the labor cost of the tool replacement work is added to reduce productivity and complicate the work process.

본 발명의 목적은 이와같은 문제점을 해소하기 위하여 발명된 것으로서, 솔더볼을 입출력 단자로 사용하는 반도체 패키지의 배면에 솔더볼을 범핑시 상기한 솔더볼을 자재의 저면에 위치시켜 범핑함으로서, 정확한 범핑을 할 수 있도록 함과 동시에, 직경이 다른 솔더볼을 하나의 툴(Tool)로서 범핑할 수 있도록 함으로서, 장비의 호환성을 꾀할 수 있고, 작업공정을 간단히하며 생산성을 향상시킬 수 있도록 된 반도체 패키지의 솔더볼 범핑 방법 및 그 장치를 제공함에 있다.An object of the present invention was invented to solve such a problem, by bumping the solder ball on the bottom surface of the material when bumping the solder ball on the back of the semiconductor package using the solder ball as an input and output terminal, it is possible to accurately bump In addition, the solder ball bumping method of the semiconductor package, which enables the bumping of solder balls of different diameters as a tool, can improve the equipment compatibility, simplify the work process and improve productivity. In providing the device.

도 1은 본 발명에 따른 솔더볼 범핑 장치의 구성을 나타낸 측면도1 is a side view showing the configuration of a solder ball bumping device according to the present invention

도 2는 본 발명에 따른 솔더볼 범핑 장치의 평면도2 is a plan view of a solder ball bumping device according to the present invention;

도 3은 본 발명에 따른 솔더볼 범핑 장치의 정면도3 is a front view of a solder ball bumping device according to the present invention;

도 4는 본 발명에 따른 솔더볼 범핑용 툴(Tool)을 나타낸 도면4 is a view showing a solder ball bumping tool according to the present invention.

- 도면의 주요 부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawing-

1 - 스텝모터 2 - 로테이트 브라켓1-Step Motor 2-Rotate Bracket

3 - 완충재 4 - 그립퍼3-Buffer 4-Gripper

5 - 안착용툴 5' - 안착홈5-Mounting tool 5 '-Mounting groove

6 - 실린더6-cylinder

이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

본 발명에 따른 반도체 패키지의 솔더볼 범핑 방법은, 솔더볼랜드가 형성되어 있는 자재의 저면에 안착용툴(5)이 위치되고, 이 안착용툴(5)에 형성된 안착홈(5')에 솔더볼을 안착시킨 상태로 상기한 안착용툴(5)을 상승시켜 솔더볼을 자재의 솔더볼랜드에 위치시킨 후, 상기한 안착용툴(5)과 자재를 180°회전시켜 범핑하고, 다시 안착용툴(5)과 자재를 180°회전시켜 원위치 시키는 방법에 의해 솔더볼을 범핑하는 것이다.In the solder ball bumping method of the semiconductor package according to the present invention, the seating tool 5 is positioned on the bottom of the material on which the solder ball land is formed, and the solder ball is placed in the seating groove 5 'formed in the seating tool 5. After raising the above-mentioned seating tool 5 in the seated state and placing the solder ball on the solder ball land of the material, the seating tool 5 and the material are rotated by 180 ° and bumped, and the seating tool 5 ) And bumping the solder ball by rotating the material 180 °.

상기에 있어서, 안착용툴(5)과 자재를 180°회전시켜 솔더볼을 범핑할 때 상기한 안착용툴(5)에 진동을 줄 수 있다. 또한, 상기한 안착용툴(5)에 형성된 안착홈(5')은 자재의 솔더볼랜드와 동일한 수로 형성된다.In the above, the mounting tool 5 and the material can be rotated 180 ° to vibrate the mounting tool 5 when bumping the solder ball. Further, the mounting grooves 5 'formed in the mounting tool 5 are formed in the same number as the solder ball lands of the material.

이와같은 솔더볼 범핑방법에 의한 본 발명의 장치는, 스텝모터(1)에 의해 180°씩 회전 제어되는 로테이트 브라켓(2)과, 상기한 로테이트 브라켓(2)의 상부 내측으로 설치된 완충재(3)와, 상기한 완충재(3)의 양측부에 위치하도록 설치되어 자재의 양측면을 그립하는 그립퍼(4)와, 상기한 로테이트 브라켓(2)의 하부 내측으로 상기한 완충재(3)와 대향되도록 설치되고, 자재의 솔더볼랜드와 동일한 수의 안착홈(5')이 형성된 안착용툴(5)과, 상기한 안착용툴(5)을 승하강시키는 실린더(6)로 이루어진다.The apparatus of the present invention according to the solder ball bumping method includes a rotate bracket 2 which is rotated and controlled by 180 ° by a step motor 1, a cushioning material 3 provided inside the upper portion of the rotate bracket 2, and The gripper 4 is installed to be positioned at both sides of the cushioning material 3 and grips both sides of the material, and is installed to face the cushioning material 3 in the lower inner side of the rotate bracket 2. It consists of the mounting tool 5 in which the same number of mounting grooves 5 'as the solder ball land of material, and the cylinder 6 which raises and lowers the said mounting tool 5 are mentioned.

상기한 안착용툴(5)에 형성된 안착홈(5')은 솔더볼의 자중에 의하여 정확한 위치로 세팅(정렬)되도록 반구형상의 홈으로 형성된다.The seating grooves 5 'formed in the seating tool 5 are formed as hemispherical grooves to be set (aligned) to the correct position by the weight of the solder balls.

이와같이 구성된 본 발명의 작동은, 먼저 자재를 로딩하여 그립퍼(4)로 고정시킨 상태에서 상기한 안착용툴(5)의 안착홈(5')에 솔더볼을 안착시킨다. 이 상태에서 상기한 안착용툴(5)을 실린더(6)에 의해 상승시켜 안착홈(5')에 안착된 솔더볼이 자재의 솔더볼랜드에 위치되면 상기한 로테이트 브라켓(2)을 스텝모터(1)에 의해 180°회전시켜 안착용툴(5)과 자재의 상하 위치가 바뀌도록 한다. 이와같이 상태에서 범핑이 이루어지고, 범핑이 완료되면 상기한 로테이트 브라켓(2)을 스텝모터(1)에 의해 180°회전시켜 원위치 시킴으로서 범핑 공정이 종료된다.In the operation of the present invention configured as described above, the solder ball is seated in the seating groove 5 'of the seating tool 5 in the state where the material is first loaded and fixed by the gripper 4. In this state, the mounting tool 5 is lifted by the cylinder 6, and when the solder ball seated in the seating groove 5 'is positioned in the solder ball land of the material, the rotation bracket 2 is moved to the step motor 1. Rotate by 180 ° so that the top and bottom positions of the seating tool (5) and the material are changed. In this manner, bumping is performed, and when bumping is completed, the bumping process is completed by rotating the rotate bracket 2 by 180 ° by the step motor 1 to the original position.

상기에 있어서, 안착용툴(5)이 상승되어 안착홈(5')에 안착된 솔더볼이 자재의 솔더볼랜드에 위치될 때, 상기한 완충재(3)에 의해 충격을 흡수하여 불량을 방지하는 것이다.In the above, when the mounting tool (5) is raised and the solder ball seated in the seating groove (5 ') is positioned in the solder ball land of the material, the shock absorbed by the cushioning material (3) to prevent failure. .

이와같은 작동에 의해 범핑이 이루어지는 본 발명은 상기한 안착용툴(5)에 형성된 안착홈(5')이 반구형상으로 형성되어 있음으로서 직경이 다른 솔더볼을 범핑할 수 있다. 즉, 상기한 안착홈(5')에 안착되는 솔더볼은 자중에 의하여 상기한 안착홈(5')의 중심부로 정확하게 위치 정렬됨으로서 가능하다.In the present invention in which bumping is performed by such an operation, the mounting grooves 5 'formed in the seating tool 5 are formed in a hemispherical shape to bump bumps having different diameters. That is, the solder ball seated in the seating groove 5 'can be accurately aligned by the center of the seating groove 5' by its own weight.

이상의 설명에서 알 수 있듯이 본 발명에 의하면, 솔더볼을 입출력 단자로 사용하는 반도체 패키지의 배면에 솔더볼을 범핑시 상기한 솔더볼을 자재의 저면에 위치시켜 범핑함으로서, 정확한 범핑을 할 수 있도록 함과 동시에, 직경이 다른 솔더볼을 하나의 툴(Tool)로서 범핑할 수 있도록 함으로 장비의 호환성을 꾀할 수 있고, 작업공정을 간단히하며 생산성을 향상시킬 수 있는 효과가 있다.As can be seen from the above description, according to the present invention, when bumping the solder ball on the back surface of the semiconductor package using the solder ball as an input and output terminal, by placing the solder ball on the bottom surface of the material, while allowing accurate bumping, By bumping solder balls with different diameters as a tool, the compatibility of equipment can be achieved, and the work process can be simplified and productivity can be improved.

Claims (3)

솔더볼랜드가 형성되어 있는 자재의 저면에 안착용툴이 위치되고, 이 안착용툴에 형성된 안착홈에 솔더볼을 안착시킨 상태로 상기한 안착용툴을 상승시켜 솔더볼을 자재의 솔더볼랜드에 위치시킨 후, 상기한 안착용툴과 자재를 180°회전시켜 범핑하고, 다시 안착용툴과 자재를 180°회전시켜 원위치 시키도록 된 것을 특징으로 하는 반도체 패키지의 솔더볼 범핑 방법.The seating tool is positioned on the bottom of the material on which the solder ball land is formed, and the soldering tool is raised in the state where the solder ball is seated in the seating groove formed in the seating tool. The solder ball bumping method of the semiconductor package, characterized in that the mounting tool and the material is rotated 180 ° bumping, and the mounting tool and the material is rotated 180 ° to the original position. 제 1 항에 있어서, 상기한 안착용툴과 자재를 180°회전시켜 솔더볼을 범핑할 때 상기한 안착용툴에 진동을 주도록 된 것을 특징으로 하는 반도체 패키지의 솔더볼 범핑 방법.The solder ball bumping method of claim 1, wherein the mounting tool and the material are rotated by 180 ° to vibrate the mounting tool when bumping the solder ball. 스텝모터에 의해 180°씩 회전 제어되는 로테이트 브라켓과, 상기한 로테이트 브라켓의 상부 내측으로 설치된 완충재와, 상기한 완충재의 양측부에 위치하도록 설치되어 자재의 양측면을 그립하는 그립퍼와, 상기한 로테이트 브라켓의 하부 내측으로 상기한 완충재와 대향되도록 설치되고, 자재의 솔더볼랜드와 동일한 수의 안착홈이 형성된 안착용툴과, 상기한 안착용툴을 승하강시키는 실린더로 이루어진 것을 특징으로 하는 반도체 패키지의 솔더볼 범핑 장치.A rotate bracket controlled by a step motor by 180 °, a cushioning material provided in the upper inside of the rotating bracket, a gripper installed on both sides of the cushioning material to grip both sides of the material, and the rotating bracket. The solder ball of the semiconductor package, characterized in that it is installed so as to face the buffer material in the lower inner side, the seating tool is formed with the same number of seating grooves and the cylinder for lifting up and down the seating tool Bumping device.
KR1019970072035A 1997-12-22 1997-12-22 Solder ball bumping method of semiconductor package and its apparatus KR100255556B1 (en)

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