KR100238232B1 - Apparatus for wet treatment of wafer and cleaning method of the same - Google Patents

Abstract

A wafer wet processing apparatus having a structure in which no contaminants remain in a wet processing tank and a cleaning method thereof are disclosed. The wafer wet processing apparatus includes a supply nozzle body for injecting liquid into a wet processing tank, and a first inlet and a second inlet connected to the supply nozzle body to selectively supply different fluids to the wet processing tank through the supply nozzle body, respectively. And an inlet and a first control valve and a second control valve installed to open and close the inflow of the fluid at the first inlet and the second inlet, respectively, wherein the first control valve and the second control valve are any one of them. Is opened, the other is configured to close. In order to clean the wafer wet processing apparatus, the inside of the wet processing tank is washed with an organic solvent containing alcohol, and then the inside of the wet processing tank is washed with pure water at 40 to 70 ° C, and the pure water at room temperature is again washed. Wash using.

Description

Apparatus for wet treatment of wafer and cleaning method of the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a cleaning method thereof, and more particularly, to a wafer wet processing apparatus having a structure in which no contaminants remain in the wet processing tank and a cleaning method thereof.

In a process requiring a wet process using chemicals in a semiconductor manufacturing process, there are cases where high temperature toxic substances are used or chemicals that are not completely dissolved in pure water. For example, in the case of using a strip solution made of a specific chemical in a strip process performed in a wet processing tank provided in a wafer wet processing apparatus after etching a metal layer, if the strip process is performed for a long time, it is generated during the etching process. Residues are dissolved in the strip solution. In the case where the strip solution in which the etch residues are dissolved is repeatedly used for a long time, a larger amount of the etch residue is continuously dissolved and eventually becomes impossible to use as the strip solution.

Accordingly, in the conventional wet process for manufacturing a semiconductor device, the strip solution is used for a predetermined time, and then the strip solution already used for exchanging with a new strip solution is drained through a drain line, and the inside of the wet treatment tank is pure water. After washing with water, the fresh strip solution is again filled in the wet treatment bath and the subsequent strip process is restarted.

In the conventional wafer wet processing method as described above, a wet strip for removing residues remaining after a wet processing process for manufacturing a semiconductor device, for example, a metal film etching process or an etching process for forming a via hole. In the process, using commercially available commercial chemicals as the strip solution can provide excellent solubility for common materials, but in the cleaning process using pure water, It cannot be raised.

In the usual case, a composition obtained by mixing a viscous chemical such as ethylene glycol with a strongly basic chemical is used as the strip solution. Therefore, when replacing the chemicals as described above, when the inside of the wet treatment tank is washed only by pure water as in the prior art, the cleaning is not effectively performed, and contaminants remaining in the strip solution remain on the surface of the wet treatment tank. When such a phenomenon accumulates, an excessive amount of contaminants are dissolved in the strip solution, causing problems such as reverse contamination of the wafer during the strip process.

In addition, when the wet treatment tank is washed by hand, when the pure water at room temperature is brought into contact with the wet treatment tank maintained at a relatively high temperature, for example, 60 to 80 ° C. for the strip process, the chemicals remaining in the wet treatment tank The exothermic reaction may occur, or an irritant fuming phenomenon may occur from the above-mentioned chemical substances, which may spring up or remain as described above. Thus, it is possible to adversely affect the working environment and safety of workers and management personnel and to promote corrosion of the facility. And contaminants of organic components insoluble in water remain on the inner surface of the wet treatment tank even after washing with pure water. In addition, these excessively contaminated contaminants greatly shorten the life of the scraper recycling system, which has been widely applied in the strip process recently.

Accordingly, it is an object of the present invention to provide a wafer wet processing apparatus capable of preventing contaminants from remaining in the wet processing tank during the wet processing for manufacturing a semiconductor device.

It is another object of the present invention to provide a cleaning method of a wafer wet processing apparatus for preventing the influence of contaminants in the wet processing tank of the wafer wet processing apparatus as described above.

1 schematically illustrates a wet processing tank of a wafer wet processing apparatus according to a preferred embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along line 2-2 'of FIG. 1.

3 is a view schematically showing a pipe state of a supply nozzle according to the present invention.

4 is a flowchart for explaining a wafer wet processing method according to the present invention.

<Explanation of symbols for main parts of the drawings>

10: wet cleaning tank, 20: supply nozzle

22: supply nozzle body, 24, 26: first and second inlet

28: injection hole, 34, 36: first and second control valve

42, 44: branch line, 46, 48: on / off valve

In order to achieve the above object, the present invention provides a wafer wet processing apparatus having a wet processing tank capable of performing a wet processing necessary for manufacturing a semiconductor device, comprising: a supply nozzle body for injecting liquid into the wet processing tank, and the supply; It is possible to open and close the inflow of the fluid at the first inlet and the second inlet connected to the supply nozzle body and the first inlet and the second inlet, respectively, to selectively supply different fluids to the wet treatment tank through the nozzle body. And a first control valve and a second control valve, wherein the first control valve and the second control valve are configured to be closed when one of them is opened. .

At least one of the first control valve and the second control valve has two branch lines for selectively supplying two kinds of fluids, and each of the branch lines for turning on / off the flow of fluid into the branch lines. It includes two on / off valves installed.

The feed nozzle body is substantially circular in cross section and has a pipe shape extending along the open end of the wet treatment tank. A plurality of injection holes are formed in the supply nozzle body, and the injection holes are formed such that the injection angle of the fluid supplied from the injection holes into the wet processing tank is 2 to 90 °.

In order to achieve the above another object, the present invention provides a cleaning method of a wafer wet processing apparatus for wet processing a wafer using a processing liquid made of a predetermined chemical substance in a wet processing tank for manufacturing a semiconductor device. Draining the treatment liquid in a wet treatment tank, washing the inside of the wet treatment tank using an organic solvent containing alcohol, and washing the inside of the wet treatment tank using pure water at 40 to 70 ° C. And cleaning the inside of the wet processing tank using pure water at room temperature.

Preferably, the organic solvent is isopropyl alcohol.

According to the present invention, contaminants of organic components in a wet cleaning tank can be removed in a safe and effective manner by a washing method using an organic solvent containing alcohol.

Next, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 schematically illustrates a wet processing bath of a wafer wet processing apparatus according to a preferred embodiment of the present invention used to wet a wafer in the manufacture of a semiconductor device.

Referring to FIG. 1, the wet treatment tank 10 of the wet treatment apparatus according to the present invention includes a supply nozzle 20 capable of selectively supplying at least two kinds of liquids. The supply nozzle 20 is a supply nozzle body 22 for injecting liquid into the wet treatment tank, and two or more kinds of liquids, for example, inside the wet treatment tank 10 through the supply nozzle body 22. At least two inlets connected to the supply nozzle body 22, that is, the first inlet 24 and the second inlet 26, are provided to selectively supply the organic solvent and pure water containing alcohol. The feed nozzle body 22 is preferably substantially circular in cross section and has a pipe shape extending along the open end of the wet treatment tank.

The organic solvent may be introduced into the first inlet 24, and the second inlet 26 is closed. Similarly, pure water may flow into the second inlet 26 while the first inlet 24 is closed.

A plurality of injection holes 28 are formed in the supply nozzle body 22.

FIG. 2 is a cross-sectional view taken along line 2-2 'of FIG. 1.

As shown in FIG. 2, the plurality of injection holes 28 formed in the supply nozzle main body 22 are injected while the fluid injected from the injection holes 28 maintains a predetermined angle so that the wet treatment tank 10 is formed. ) It is formed to evenly contact inside. Preferably, the injection angle θ of the fluid injected from the injection hole 28 is 2 to 90 °. Therefore, the organic solvent or pure water supplied through the first or second inlets 24 and 26 is injected into the wet treatment tank 10 through the injection hole 28.

3 is a view schematically showing a pipe state of the supply nozzle 20. As shown in FIG. 3, the first and second inlets 24 and 26 have a first control valve 34 installed at the first inlet 24 so as to selectively open and close a fluid path. It consists of a second control valve 36 installed in the second inlet 26, the first control valve 34 and the second control valve 36 is the first control valve 34 and the second control valve ( If one of the 36 is open, the other is configured to close. At least one of the first and second control valves 34 and 36, for example, the second control valve 36, may include at least two branch lines 42 to selectively supply at least two types of fluids. 44 and at least two on / off valves 46 and 48 provided in the branch lines 42 and 44 so as to turn on / off the flow of fluid into the branch lines 42 and 44, respectively. Include. Accordingly, fluids having different properties, for example, relatively high temperature pure water and relatively low temperature pure water, may be selectively supplied into the wet treatment tank 10 through the branch lines 42 and 44.

Next, the cleaning method of the wafer wet processing apparatus for wet-processing a wafer by the process liquid which consists of predetermined chemical substances in the above-mentioned wafer wet processing apparatus is demonstrated.

4 is a flowchart for explaining a cleaning method of the wafer wet processing apparatus according to the present invention.

First, the processing liquid which consists of a predetermined chemical substance is supplied into the wet processing tank 10 (step 100). Thereafter, a predetermined wet process necessary for the manufacture of the semiconductor device is performed on the wafer using the processing liquid for a predetermined time (step 200).

Thereafter, the used treatment liquid is drained (step 300), and the inside of the wet treatment tank 10 is first washed with an organic solvent containing alcohol, preferably isopropyl alcohol (step). 400). To this end, the wet control tank (36) is opened from the first inlet (24) through the supply nozzle body (22) while the second control valve (36) is closed and the first control valve (34) is open. 10) by spraying and supplying the organic solvent in the organic solvent so as to evenly contact the inner surface of the wet treatment tank (10).

Subsequently, the inside of the wet treatment tank 10 is secondly washed with pure water (step 500). To this end, first the first control valve 34 and the on / off valve 48 is closed, the second control valve 36 and the on / off valve 46 is open, the first The wet treatment by spraying and supplying a relatively high temperature pure water of about 40 to 70 ° C. supplied from the branch line 42 on the side of the inlet 26 through the supply nozzle body 22 into the wet treatment tank 10. Clean the inside of the tank (10). After that, the first control valve 34 and the on / off valve 46 are closed again, and the second control valve 36 and the on / off valve 48 are opened, and the 2 The inside of the wet treatment tank 10 is washed by spraying and supplying the pure water at room temperature supplied from the branch line 44 on the side of the inlet 26 into the wet treatment tank 10 through the supply nozzle body 22. do.

Thereafter, the process returns to the step (step 100) of supplying a new treatment liquid into the wet treatment tank 10, and the subsequent steps are repeated as many times as necessary.

As described above, according to a preferred embodiment of the present invention, the contaminants of the organic components remaining in the wet treatment tank during the wet treatment for the manufacture of the semiconductor device are washed using an organic solvent containing alcohol, and then purified by high temperature pure water. Since the pure water at room temperature is washed one after another, various contaminants remaining in the wet treatment tank can be removed in a safe and effective manner, and thus the semiconductor device can be manufactured without being affected by the contaminants.

The present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications can be made by those skilled in the art within the scope of the technical idea of the present invention. Do.

Claims (6)

In the wafer wet processing apparatus provided with the wet processing tank which can perform the wet process required for manufacture of a semiconductor device, A supply nozzle body for injecting liquid into the wet treatment tank; First and second inlets connected to the supply nozzle body to selectively supply different fluids to the wet treatment tank through the supply nozzle body, And a first control valve and a second control valve installed to open and close the inflow of the fluid at the first inlet and the second inlet, respectively. And the first control valve and the second control valve are configured to close one when the other is open. The method of claim 1, wherein at least one of the first control valve and the second control valve is configured to turn on / off two branch lines and flow of fluid into the branch lines so as to selectively supply two kinds of fluids. And two on / off valves respectively installed on the branch lines so as to be provided. The wafer wet processing apparatus according to claim 1, wherein the supply nozzle body has a substantially circular cross section and has a pipe shape extending along an open end of the wet processing tank. The method of claim 1, wherein the supply nozzle body is formed with a plurality of injection holes, the injection hole is formed so that the injection angle of the fluid supplied from the injection hole into the wet treatment tank is 2 to 90 ° Wafer wet processing device. In the cleaning method of the wafer wet processing apparatus for wet-processing a wafer using the process liquid which consists of predetermined chemical substances in a wet processing tank for manufacture of a semiconductor device, Draining the treatment liquid in the wet treatment tank; Washing the inside of the wet treatment tank using an organic solvent containing alcohol, Washing the inside of the wet treatment tank using pure water at 40 to 70 ° C., And cleaning the inside of the wet processing tank using pure water at room temperature. The cleaning method of a wafer wet processing apparatus according to claim 5, wherein the organic solvent is isopropyl alcohol.

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