KR100226714B1 - Apparatus for mounting electrical device - Google Patents

Abstract

The present invention relates to a component mounting apparatus, comprising: a substrate support stage for supporting a substrate on which a component is mounted, and a nozzle installed to be movable with respect to the substrate support stage and for adsorbing the component and / or spraying an adhesive onto the substrate; A plurality of mounting heads, a probe installed on the one side of the nozzle to extend vertically longer than the tip of the nozzle and vertically movable to control a vertical distance between the end of the nozzle and the substrate to a predetermined distance; and the probe When it reaches the substrate is provided with an inductive detection unit for outputting an electrical signal corresponding thereto to control the motor drive from the electrical signal to control the separation distance between the substrate and the nozzle. Therefore, even for a substrate where bending occurs due to an uneven or supported external force on the surface thereof, the component for controlling the separation distance between the substrate and the nozzle is simple in a certain distance range, and the amount of impact applied to the substrate is negligibly small. The work can be speeded up.

Description

Component mounting device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting an electronic component on a printed board. In detail, the separation distance between the nozzle and the substrate which absorbs the component or sprays the adhesive is controlled by an electrical signal generated by the movement of the contact probe. It is related with the component mounting apparatus.

Component mounting apparatus is a generic term for devices that automatically mount electronic components such as ICs, LSIs, semiconductor integrated devices, diodes, capacitors, resistors, and the like to the printed board for configuring the mounting board. An inserting device inserted into and mounted in a hole formed in the hole, a dispenser for spraying an adhesive on the surface of the substrate, a surface mounter for attaching the electronic component on the substrate on which the adhesive is applied, and the like.

Here, the functionally separated dispenser and the surface mount may be configured as separate systems, or a plurality of adsorption nozzles for adsorbing parts and an injection nozzle for spraying an adhesive may be mounted on a mounting head provided in one system.

A typical component mounting apparatus includes a guide rail for guiding a printed board, positioning at a predetermined position, constituting a substrate support stage, and a component stage for supporting various components mounted on the printed board, respectively. In order to convey and mount a component to a printed circuit board, the mounting head is moved horizontally in two XY directions.

The mounting head is provided with a plurality of suction nozzles for sucking electronic components under negative pressure, and the suction nozzles are provided on the mounting head so as to move up and down with respect to the substrate supporting stage and the component stage, respectively.

The suction nozzle has a hollow hole, and the hollow hole communicates with the vacuum pump, and the electronic component is sucked by the negative pressure at the tip of the suction nozzle.

The dispenser is a device for applying an adhesive to bind the component to the substrate before mounting the component on the substrate. The spray nozzle employed in the dispenser has a structure similar to that of the adsorption nozzle, and sprays the adhesive through the hollow of the spray nozzle. .

In the case of the dispenser, the process of applying the adhesive to the substrate using a nozzle installed in the mounting head shows that the nozzle is lowered toward the substrate supported on the substrate stage in the vertical direction and a predetermined amount is applied to the surface of the substrate when the nozzle reaches the proper distance. The spraying is carried out continuously by vertically rising again and moving to the next controlled position. At this time, it is important to apply the appropriate amount of the adhesive material applied to the substrate, the application area, etc. to a predetermined area because it determines the binding force of the component to be mounted.

However, the substrate fixed to the substrate support stage is inherently curved on its surface or when the support pin provided on the substrate support stage is inserted through the through-hole formed at the edge of the substrate conveyed and introduced to the center of the support pin. When the center of the through hole is shifted outward, the substrate is warped.

The bending of the substrate is such that the mutual separation distance between the nozzle and the substrate is changed by maintaining the vertical position of the fixed substrate relative to the vertical falling distance of the set nozzle. If the application area of the adhesive, the applied shape becomes unstable, and if severe, there is a problem that the impact-resistant substrate such as a ceramic substrate is damaged by the impact of the nozzle and the substrate. Even in the case of chip mounter, due to the variation of the separation distance between the board and the nozzle, the adsorbed parts are not maintained at a certain level of pressure on the board, so that the mounting of the parts is poor, or the parts and the board are cracked or damaged due to mutual collision. do.

Conventionally, when the stopper is fixed to one side of the injection nozzle and the stopper end vertically lowered together with the injection nozzle reaches the substrate, its advance is forcibly cut off and the separation distance between the injection nozzle and the substrate is controlled within a predetermined distance range. However, in the conventional vertical distance control method, the impact amount due to the mass of the movable part which is vertically lowered is applied between the substrate and the movable part, and such an impact factor prevents the speed of work.

In order to control the separation distance between the substrate and the nozzle in a non-contact manner, a distance measuring device such as optical means or ultrasonic wave is mounted, and at each coating point on the substrate, the measured distance between the nozzle and the substrate is measured in real time before application. It is also possible to control the motor drive to be stopped at the set value, but in reality, it not only increases the overall price of the product but also the structure is complicated, so the cost increase factor is reduced and it is simply structured to control the vertical distance of the nozzle. Component mounting apparatus is required.

The present invention was devised to improve the above problems, and it is easy to control the separation distance between the component suction and / or adhesive injection nozzle and the substrate even when the substrate is warped, and the impact amount applied to the substrate during the separation distance control process. It is an object of the present invention to provide a component mounting apparatus which is designed to reduce the number of parts.

1 is a plan view showing a component mounting apparatus which is an embodiment of the present invention,

2 is a front view of the component mounting apparatus of FIG.

Explanation of symbols for main parts of the drawings

10: substrate 11, 12: guide member

13, 14: horizontal support member 15: crossbar

16, 17: guide rail 18: head unit

19, 27: Motor 20, 26: Ball screw

21: interlock shaft 22, 23: pinion gear

24, 25: rack gear 30: nozzle

31: mounting head 32: probe

33: contact switch 35: spring

In order to achieve the above object, a component mounting apparatus according to the present invention includes a substrate support stage for supporting a substrate on which a component is mounted, a substrate support stage movably mounted to the substrate support stage, and adsorbing the component and / or applying an adhesive to the substrate. In a component mounting apparatus having a mounting head provided with a plurality of nozzles for spraying on the nozzle, a predetermined distance longer than the tip of the nozzle on one side of the nozzle to control the vertical separation distance between the end of the nozzle and the substrate to a predetermined distance And an incidence detector which extends and is installed to be vertically movable, and an incidence detector which outputs an electrical signal corresponding to the probe when it reaches the substrate.

Hereinafter, with reference to the accompanying drawings will be described in detail the component mounting apparatus according to a preferred embodiment of the present invention.

1 is a plan view showing a component mounting apparatus which is an embodiment of the present invention, and FIG. 2 is a front view of FIG.

Referring to this, the component mounting apparatus includes a mounting head 31 equipped with a nozzle 30 for spraying adhesive or adsorbing components, and a driving unit and a substrate 10 for transferring the mounting head 31 in X and Y directions. And a probe 32 and a contact switch 33 for generating a signal for controlling a separation distance between the substrate supporting stage, the substrate 10, and the nozzle 30.

First, two guide members 11 and 12 installed in parallel to each other in the X direction form a conveyor for conveying the printed board 20, and are guided to the guide members 11 and 12 to be printed on the printed board 10. ) Is conveyed in the X direction. The printed board 10 is guided to the guide members 11 and 12 and positioned at the position of the predetermined substrate support stage. The substrate support stage is provided with a fixing member (not shown) such as a support pin for fixing the printed board 10. Corresponding to the size of the printed board 10, one of the guide members 11 can approach and separate with respect to the other guide member 12.

In the driving unit for transferring the head unit 18 in the X and Y directions, first, two guide members 11 and 12 are disposed in parallel with each other in a direction orthogonal to the guide members 11 and 12. Horizontal support members 13 and 14 are provided, and guide rails 16 and 17 are attached to each of the horizontal support members 13 and 14, as shown in FIG. Crossbars 15 extending in a direction perpendicular to the horizontal support members 13 and 14 are mounted to the guide rails 16 and 17 at both ends thereof and guided to the guide rails 16 and 17 so as to be horizontally supported. It is movable in the Y direction along the members 13 and 14. The crossbar 15 is guided to this and the head unit 18 is perturbably mounted, and the head unit 18 is movable in the direction in which the crossbar 15 extends, that is, in the X direction.

In order to drive the crossbar 15 in the Y direction, a ball screw 20 driven by the motor 19 is rotatably attached to one horizontal support member 14, and the ball screw 20 is crossbar ( It is screwed to one end of 15). The crossbar 15 is provided with an interlocking shaft 21 parallel thereto, and pinion gears 22 and 23 fixed to both ends of the interlocking shaft 21 are fixed to the horizontal support members 13 and 14. Meshes with rack gears 24 and 25. Therefore, when the ball screw 20 is driven by the motor 19, the crossbar 15 moves in the Y direction, and the pinion gear 22 meshes with the respective rack gears 24 and 25 according to this movement. Since the 23 is rotated, the crossbar 15 moves in the Y direction while maintaining a predetermined right angle with respect to the horizontal support members 13 and 14.

The crossbar 15 is rotatably provided with a ball screw 26 for driving the head unit 18 in the X direction, and the ball screw 26 is screwed to the head unit 18. The ball screw 26 is driven through a timing belt spanning the pulley provided on the main shaft of the motor 27 and the pulley provided on the ball screw 26.

At least one mounting head 31 is installed in the head unit 18.

As shown in FIG. 2, the mounting head 31 has the injection nozzle 30 provided so that the movement to the up-down direction was possible. The nozzle 30 is a printed board determined while the crossbar 15 moves in the Y direction along the horizontal support members 13 and 14, and the mounting head 31 moves in the X direction along the crossbar 15. It sprays at the predetermined coating position of (10).

One side of the injection nozzle 30 is provided with a contact switch 33 as an incidence detection unit for generating an electrical signal by vertical movement of the probe 32 and the vertical movement of the probe 32 is installed vertically. The probe 32 is installed through a through hole formed between the support portions 34 in which the nozzles 30 are supported at one side thereof, and one side of the probe 32 having vertical movement penetrated under the support portion 34. And a spring 35 sandwiched between the support portion 34. When the spray nozzle 30 is vertically lowered, the probe 32 reaches the substrate 10 before the nozzle 30, and at this time, the probe 30 is sprayed while its advance is blocked by contact with the substrate 10. Retracted relative to the nozzle 30, one end of the contact switch 33 connected to the probe 32 is raised and connected to the other end to generate an electrical signal.

Therefore, the vertical drive control unit (not shown) for driving control of the vertical raising and lowering of the injection nozzle 30 receives the electric signal of the contact switch 33 and stops the driving of the motor, thereby stopping the injection nozzle 30 and the substrate ( 10) Control the separation distance within a certain range. At this time, the vertical drive control unit completely stops the driving of the motor at the position where the separation distance between the nozzle 30 and the substrate 10 is about 0.2 to 0.3 mm, immediately from the electrical signal input from the contact switch 33. If the deceleration stop of the motor is impossible, the data is decelerated at the same time as the input of the electrical signal to calculate data on the falling distance until the motor stops completely, and the tip and injection of the probe 32 are compensated for the falling distance during this deceleration section. The distance from the tip of the nozzle 30 and the drive control procedure of the motor may be determined and controlled.

Although the vertical movement distance control of the injection nozzle 30 according to the present invention is performed by an electrical signal generated when the tip of the probe 32 is in contact with the upper surface of the substrate, the probe 32 is in contact with the substrate 10 when descending. Since the silver is retracted relative to the injection nozzle 30, the amount of impact applied to the substrate 10 is negligibly small. As such, while minimizing the amount of impact applied to the substrate 10, the distance between the top surface of the substrate 10 and the tip of the injection nozzle 30 is in contact with the probe 32 at a predetermined distance regardless of the warpage of the substrate 10. Because the electrical signal is generated by the control of the separation distance is maintained accurately.

In the illustrated embodiment, the case of the spray nozzle has been described as an example, but the suction nozzle and the substrate 10 may be used even when the component is sucked from the component cartridge in which the component is stored and mounted on the substrate 10 supported by the substrate support stage. The method of controlling the motor drive using the probe 32 and the incidence detection unit described above for controlling the separation distance from the above is applied.

Further, in addition to the contact switch 33 applied to the embodiment as an incidence detection unit, optical means for detecting a position change of the probe 32 which is vertically retracted with respect to the nozzle 30 and generating an electrical signal corresponding thereto is employed. It will be appreciated that various embodiments are possible.

As described above, by providing the component mounting apparatus according to the present invention, the components for controlling the separation distance between the substrate and the nozzle are simple, and the amount of impact applied to the substrate is negligibly small, thereby speeding up the work.

Claims (3)

A component mounting apparatus having a substrate support stage for supporting a substrate on which components are mounted, and a mounting head provided with a plurality of nozzles installed to be movable relative to the substrate support stage, and having a plurality of nozzles for adsorbing the components and / or spraying an adhesive onto the substrate. To A probe which extends a predetermined distance longer than a tip of the nozzle and is vertically movable on one side of the nozzle to control the vertical separation distance between the end of the nozzle and the substrate to a predetermined distance; and the probe reaches the substrate And an incidence detector for outputting an electrical signal corresponding thereto. The method of claim 1, wherein the probe is installed through a through hole formed between the support portion for supporting the nozzles, and inserted between one side of the probe and the support portion penetrated to the support load side, the mutual repulsive force on the support portion and the probe Component mounting apparatus characterized in that the spring provided to provide. The component mounting apparatus according to claim 1, wherein the incidence detecting unit is a contact switch which is in contact with or separated from each other by the movement of the probe and outputs an electrical signal corresponding thereto.