KR100223968B1 - Semiconductor chemical supply system - Google Patents

Semiconductor chemical supply system Download PDF

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KR100223968B1
KR100223968B1 KR1019960059058A KR19960059058A KR100223968B1 KR 100223968 B1 KR100223968 B1 KR 100223968B1 KR 1019960059058 A KR1019960059058 A KR 1019960059058A KR 19960059058 A KR19960059058 A KR 19960059058A KR 100223968 B1 KR100223968 B1 KR 100223968B1
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chemical
unit
supply
control unit
chemical supply
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KR1019960059058A
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Korean (ko)
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KR19980039940A (en
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최선집
이원동
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윤종용
삼성전자주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)

Abstract

반도체 케미컬 공급시스템에 관한 것이다.A semiconductor chemical supply system.

본 발명은, 공정수행시 케미컬을 버블링시켜 공정설비로 공급하는 케미컬공급부로 일정량의 케미컬을 공급하는 케미컬저장부가 구비되는 반도체 케미컬 공급시스템에 있어서, 상기 케미컬공급부의 수위를 감지하는 수위감지수단, 상기 수위감지수단의 센싱신호입력으로 상기 케미컬공급부로 케미컬이 공급되도록 상기 케미컬저장부를 제어하는 공급제어부 및 상기 센싱신호가 입력됨과 동시에 제공되는 상기 공급제어부의 제어신호를 입력받아 상기 공정설비를 제어하는 설비제어부를 구비하여 이루어짐을 특징으로 한다.The present invention is a semiconductor chemical supply system having a chemical storage unit for supplying a predetermined amount of chemical to the chemical supply unit for bubbling the chemical supply to the process equipment when performing the process, water level sensing means for detecting the water level of the chemical supply unit, The control unit controls the process equipment by receiving a control signal for controlling the chemical storage unit such that the chemical storage unit is supplied to the chemical supply unit through the sensing signal input of the water level sensing unit, and a control signal of the supply control unit provided at the same time as the sensing signal is input. Characterized in that it comprises a facility control unit.

따라서, 본 발명에 의하면 케미컬이 엠프티되면 공정수행이 중단되도록 하여 생산성이 향상되는 효과가 있다.Therefore, according to the present invention, when the chemical is empty, the process performance is stopped and productivity is improved.

Description

반도체 케미컬 공급시스템{Semiconductor chemical supply system}Semiconductor chemical supply system

본 발명은 반도체 케미컬 공급시스템에 관한 것으로서, 보다 상세하게는 케미컬(Chemical)을 버블링(Bubbling)시켜 공정설비로 공급하는 케미컬공급부의 수위가 엠프티(Empty)되었을 때 공정설비의 가동이 중단되도록 개선시킨 반도체 케미컬 공급시스템에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chemical supply system, and more particularly, to stop operation of a process facility when the level of the chemical supply unit supplying the process facility by bubbling the chemical is empty. The present invention relates to an improved semiconductor chemical supply system.

일반적으로, 반도체 제조에서는 웨이퍼(Wafer) 상에 다수의 케미컬처리를 가하는 공정은 필수적으로 수행된다.In general, in semiconductor manufacturing, a process of applying a plurality of chemical treatments on a wafer is essentially performed.

이러한 케미컬처리공정은 케미컬에 웨이퍼를 직접 담구거나, 케미컬을 웨이퍼 상에 도포시키거나 또는 케미컬을 버블링시켜 기체상태로 웨이퍼 상에 분사시키는 공정 등이 수행되고 있다.Such chemical treatment is performed by directly immersing a wafer in chemical, applying a chemical on the wafer, or bubbling the chemical and spraying the wafer in a gaseous state.

여기서 케미컬을 버블링시켜 기체상태로 웨이퍼 상에 분사시키는 공정에서의 케미컬 공급은 케미컬을 버블링시켜 공정설비로 공급하는 케미컬공급부에 일정량의 케미컬을 공급하는 케미컬저장부가 구비되는 케미컬 공급시스템을 이용하는 것이 일반적이다.Here, the chemical supply in the process of bubbling the chemical and spraying it on the wafer in a gaseous state is to use a chemical supply system having a chemical storage unit for supplying a predetermined amount of chemical to the chemical supply unit for bubbling the chemical and supplying it to the process equipment. It is common.

도1은 종래의 반도체 케미컬 공급시스템을 나타내는 구성도이다.1 is a block diagram showing a conventional semiconductor chemical supply system.

먼저, 공정이 수행되는 공정설비(10)로 케미컬을 버블링시켜 공급하는 케미컬공급부(12)에 일정량의 케미컬을 공급하는 케미컬저장부(14)가 구비되어 있다.First, there is provided a chemical storage unit 14 for supplying a predetermined amount of chemical to the chemical supply unit 12 for bubbling and supplying the chemical to the process equipment 10 in which the process is performed.

그리고 케미컬공급부(12)의 수위를 감지하는 수위감지부(16)의 센싱(Sensing)신호입력으로 케미컬저장부(14)를 제어하여 케미컬공급부(12)로 케미컬공급이 이루어지도록 하는 공급제어부(18)가 구비되어 있다.In addition, the supply control unit 18 controls the chemical storage unit 14 by the sensing signal input of the water level detection unit 16 that detects the water level of the chemical supply unit 12 to supply the chemical to the chemical supply unit 12. ) Is provided.

여기서 수위감지부(16)는 케미컬공급부(12)의 수위가 엠프티 또는 풀(Full)일 때 센싱신호를 공급제어부(12)로 입력시킨다.Here, the water level detection unit 16 inputs a sensing signal to the supply control unit 12 when the water level of the chemical supply unit 12 is empty or full.

그러나 종래의 공급시스템은 케미컬공급부(12)의 수위가 엠프티 또는 풀일 때의 판단여부를 공정설비(10)에는 제공하지 못하였다.However, the conventional supply system did not provide the process facility 10 with the determination of when the level of the chemical supply unit 12 is empty or pool.

즉, 공정수행시 케미컬공급부(12)의 케미컬이 엠프티되었을 때 수위감지부(16)에 의해 센싱신호가 공급제어부(18)로 입력되면 공급제어부(18)는 케미컬저장부(14)를 제어하여 케미컬공급부(12)에 케미컬이 공급되도록 하지만, 공정설비(10)는 계속적인 공정이 수행되는 것이었다.That is, when the sensing signal is input to the supply control unit 18 by the water level detection unit 16 when the chemical of the chemical supply unit 12 is empty during the process, the supply control unit 18 controls the chemical storage unit 14. Thus, the chemical is supplied to the chemical supply unit 12, but the process equipment 10 was a continuous process is performed.

다시 말해, 케미컬저장부(14)에서 케미컬공급부(12)로 케미컬이 공급되는 동안에는 공정설비(10)는 버블링된 기체상태의 케미컬의 공급없이 공정이 수행되는 것이었다.In other words, while the chemical is supplied from the chemical storage unit 14 to the chemical supply unit 12, the process facility 10 was performed without supplying the bubbled gaseous chemical.

이로 인해, 웨이퍼가 불량처리되거나 재작업을 수행하여야 했고, 특히 단위공정이 완전히 수행된 후 공정검사를 수행하는 반도체 제조공정의 특성으로 인해 많은 양의 웨이퍼를 불량처리하여야 하는 심각한 문제를 초래하였다.As a result, the wafers have to be defectively processed or reworked, and in particular, due to the characteristics of the semiconductor manufacturing process that performs the process inspection after the unit process is completely performed, it causes a serious problem that the large amount of wafers must be failed.

따라서 종래의 케미컬 공급시스템은 케미컬공급부의 수위가 엠프티되어도 공정설비제어가 이루어지지 않아 불량을 유발시켜 생산성을 저하시키는 문제점이 있었다.Therefore, in the conventional chemical supply system, even if the water level of the chemical supply unit is empty, the process equipment is not controlled, thereby causing a defect, thereby lowering productivity.

본 발명의 목적은, 케미컬공급부의 수위가 엠프티되었을 때 공정설비제어가 동시에 이루어지도록 하여 생산성을 향상시키기 위한 반도체 케미컬 공급시스템을 제공하는 데 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor chemical supply system for improving productivity by controlling process equipment at the same time when the level of the chemical supply unit is empty.

도1은 종래의 반도체 케미컬 공급시스템을 나타내는 구성도이다.1 is a block diagram showing a conventional semiconductor chemical supply system.

도2는 본 발명에 따른 반도체 케미컬 공급시스템의 실시예를 나타내는 구성도이다.2 is a block diagram showing an embodiment of a semiconductor chemical supply system according to the present invention.

※도면의 주요부분에 대한 부호의 설명※ Explanation of symbols for main parts of drawing

10, 20 : 공정설비 12, 22 : 케미컬공급부10, 20: process equipment 12, 22: chemical supply unit

14, 24 : 케미컬저장부 16, 26 : 수위감지부14, 24: chemical storage unit 16, 26: water level detection unit

18, 28 : 공급제어부 30 : 설비제어부18, 28: supply control unit 30: facility control unit

상기 목적을 달성하기 위한 본 발명에 따른 반도체 케미컬 공급시스템은, 공정수행시 케미컬을 버블링시켜 공정설비로 공급하는 케미컬공급부로 일정량의 케미컬을 공급하는 케미컬저장부가 구비되는 반도체 케미컬 공급시스템에 있어서, 상기 케미컬공급부의 수위를 감지하는 수위감지수단, 상기 수위감지수단의 센싱신호입력으로 상기 케미컬공급부로 케미컬이 공급되도록 상기 케미컬저장부를 제어하는 공급제어부 및 상기 센싱신호가 입력됨과 동시에 제공되는 상기 공급제어부의 제어신호를 입력받아 상기 공정설비를 제어하는 설비제어부를 구비하여 이루어짐을 특징으로 한다.In the semiconductor chemical supply system according to the present invention for achieving the above object, in the semiconductor chemical supply system is provided with a chemical storage unit for supplying a certain amount of chemical to the chemical supply unit for bubbling the chemical when the process is performed to supply to the process equipment, A level control means for sensing the level of the chemical supply unit, a supply control unit for controlling the chemical storage unit to supply the chemical to the chemical supply unit by inputting a sensing signal of the level detection unit, and the supply control unit provided at the same time as the sensing signal is input It characterized in that it comprises a facility control unit for receiving the control signal of the control the process equipment.

그리고, 상기 수위감지수단은 상기 케미컬공급부의 수위가 풀 또는 엠프티일 때 센싱신호를 제공하도록 구성되는 바람직하다.The water level detecting means is preferably configured to provide a sensing signal when the water level of the chemical supply unit is full or empty.

또한, 상기 센싱신호가 엠프티로 상기 공급제어부에 입력되면 상기 공급제어부는 상기 케미컬공급부로 케미컬공급이 이루어지도록 상기 케미컬저장부를 제어함과, 동시에 상기 설비제어부로 제어신호를 입력시켜 상기 설비제어부는 공정설비의 가동을 중단시키도록 구성되는 것이 바람직하다.In addition, when the sensing signal is input to the supply control part as an empty, the supply control part controls the chemical storage unit so that chemical supply is performed to the chemical supply part, and simultaneously inputs a control signal to the facility control part so that the facility control part is provided. It is preferably configured to shut down the process equipment.

여기서, 상기 공정제어부는 피엘씨(PLC)가 내장구성되는 것이 효율적이다.Here, it is efficient that the process control unit has a built-in PLC (PLC).

이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도2는 본 발명에 따른 반도체 케미컬 공급시스템의 실시예를 나타내는 구성도이다.2 is a block diagram showing an embodiment of a semiconductor chemical supply system according to the present invention.

먼저, 공정이 수행되는 공정설비(20)로 케미컬을 버블링시켜 공급하는 케미컬공급부(22)에 일정량의 케미컬을 공급하는 케미컬저장부(24)가 구비된다.First, a chemical storage unit 24 for supplying a predetermined amount of chemical to a chemical supply unit 22 for bubbling and supplying chemicals to a process facility 20 in which a process is performed is provided.

그리고 케미컬공급부(22)의 수위를 감지하는 수위감지부(26)의 센싱신호입력으로 케미컬저장부(24)를 제어하여 케미컬공급부(22)에 케미컬공급이 이루어지도록 하는 공급제어부(28)가 구비된다.In addition, the supply control unit 28 is configured to control the chemical storage unit 24 by the sensing signal input of the water level detection unit 26 for detecting the water level of the chemical supply unit 22 so that the chemical supply is made to the chemical supply unit 22. do.

또한 공급제어부(28)로 센싱신호가 입력됨과 동시에 제공되는 공급제어부(28)의 제어신호 입력으로 공정설비(20)를 제어하는 설비제어부(30)가 구비된다.In addition, the facility control unit 30 for controlling the process equipment 20 by the control signal input of the supply control unit 28 provided at the same time as the sensing signal is input to the supply control unit 28 is provided.

그리고 실시예의 수위감지부(26)는 케미컬공급부(22)의 수위가 엠프티 또는 풀일 때 센싱신호를 공급제어부(28)로 입력시키는 것으로, 케미컬공급부(22)의 수위가 엠프티되었을 때 수위감지부(26)에 의해 공급제어부(28)로 센싱신호가 입력되면 공급제어부(28)는 케미컬공급부(22)에 케미컬공급이 이루어지도록 케미컬저장부(24)를 제어함과 동시에 설비제어부(30)로 제어신호를 입력시켜 설비제어부(30)가 공정설비(30)를 제어하는 구성으로 이루어진다.In addition, the water level detection unit 26 of the embodiment inputs a sensing signal to the supply control unit 28 when the water level of the chemical supply unit 22 is empty or full, and the water level detection when the water level of the chemical supply unit 22 is empty. When the sensing signal is input to the supply control unit 28 by the unit 26, the supply control unit 28 controls the chemical storage unit 24 so that the chemical supply is made to the chemical supply unit 22 and at the same time the facility control unit 30. The facility control unit 30 is configured to control the process equipment 30 by inputting a control signal.

여기서 공급제어부(28)는 설비제어부(30)로 제어신호를 입력시킬 수 있도록 피엘씨(Programable Logic circuit)가 내장구성되는 것이 바람직하다.In this case, the supply control unit 28 is preferably a built-in programmable logic circuit (PLC) to input the control signal to the facility control unit (30).

또한 이러한 구성으로 이루어지는 케미컬 공급시스템의 케미컬을 공급받아 공정을 수행하는 공정설비(20)는 웨이퍼와 포토레지스트(Photo Resist)의 밀착력을 강화시키기 위하여 웨이퍼 상에 에이치엠디에스(Hexa Methyl Di Silazane)를 분사도포시킨다.In addition, the process equipment 20 that receives the chemical of the chemical supply system having such a configuration and performs the process is applied to the Hexa Methyl Di Silazane on the wafer to enhance the adhesion between the wafer and the photoresist. Spray spray.

전술한 구성에 따라 본 발명의 실시예에 대한 작용 및 효과에 대하여 설명한다.The operation and effects of the embodiment of the present invention according to the above-described configuration will be described.

먼저, 공정수행시 케미컬공급부(22)는 케미컬을 버블링시켜 기체상태로 공정설비(20)에 공급한다.First, during the process, the chemical supply unit 22 bubbles the chemical and supplies the chemical to the process facility 20 in a gaseous state.

이러한 공정이 계속적으로 반복수행되면 어느 일정시점에서는 케미컬공급부(22)의 수위는 엠프티된다.If such a process is continuously performed repeatedly, the water level of the chemical supply part 22 becomes empty at some time.

여기서 케미컬공급부(22)는 케미컬을 버블링시켜 공정설비(20)로 공급하기 때문에 외부에서 계속적인 케미컬의 공급없이 공정을 수행하다가 케미컬이 엠프티되었을 때 케미컬저장부(24)로부터 케미컬을 공급받아 공정을 다시 수행하는 것이다.Here, the chemical supply unit 22 is bubbling the chemical and supplies the chemical to the process facility 20 so that the chemical is supplied from the chemical storage unit 24 when the chemical is empty while performing the process without continuously supplying the chemical. To perform the process again.

이렇게 엠프티되었을 때 수위감지부(26)는 센싱신호, 즉 엠프티 센싱신호를 공급제어부(28)로 입력시키면 공급제어부(28)는 케미컬저장부(24)를 제어하여 케미컬공급부(22)에 케미컬공급이 수행되도록 한다.When the empty water level detection unit 26 inputs a sensing signal, that is, an empty sensing signal to the supply control unit 28, the supply control unit 28 controls the chemical storage unit 24 to the chemical supply unit 22. Allow chemical feed to be performed.

그리고 공급제어부(28)로 엠프티 센싱신호가 입력됨과 동시에 공급제어부(28)는 설비제어부(30)로 제어신호를 입력시킨다.The empty sensing signal is input to the supply control unit 28 and the supply control unit 28 inputs a control signal to the facility control unit 30.

그러면 설비제어부(30)는 제어신호입력으로 공정설비(20)를 제어하여 공정수행을 중단시킨다.Then, the facility control unit 30 controls the process facility 20 by the control signal input to stop the process performance.

즉, 케미컬공급부(22)의 케미컬이 엠프티되어 케미컬저장부(24)로부터 케미컬을 공급받는 동안에는 공정설비(20)는 가동이 중단되는 것이다.That is, the process equipment 20 is stopped while the chemical of the chemical supply part 22 is empty and the chemical is supplied from the chemical storage part 24.

이어서 케미컬공급부(22)에 케미컬공급이 수행되어 수위가 풀이 되면 수위감지부(26)의 풀 센싱신호에 의해 공급제어부(28)는 케미컬저장부(24)를 제어하여 케미컬공급을 중단시키고, 동시에 공정수행이 진행되도록 설비제어부(30)로 제어신호를 입력시키면 된다.Subsequently, when the chemical supply is performed to the chemical supply unit 22 and the water level becomes full, the supply control unit 28 controls the chemical storage unit 24 to stop the chemical supply by the full sensing signal of the water level detection unit 26, and at the same time The control signal may be input to the facility control unit 30 to proceed with the process.

이러한 구성으로 이루어지는 본 발명의 케미컬 공급시스템은 케미컬의 공급제어 뿐만 아니라 동시에 공정설비(20)의 제어가 이루어지도록 한다.The chemical supply system of the present invention having such a configuration allows the control of the process equipment 20 as well as the supply control of the chemical.

즉, 케미컬을 버블링시켜 기체상태로 공급하는 케미컬공급부(22)의 수위가 엠프티되면 공정수행이 중단되는 것이다.That is, when the water level of the chemical supply unit 22 that bubbles the chemical and supplies the gas in a gaseous state is empty, the process is stopped.

그러면 케미컬공급부(22)가 케미컬을 공급받는 동안에는 공정설비(20)의 가동중단으로 공정수행으로 인한 불량을 방지할 수 있다.Then, while the chemical supply unit 22 is supplied with the chemical, it is possible to prevent a defect due to the process performance by the operation stop of the process equipment 20.

따라서, 본 발명에 의하면 케미컬이 엠프티되면 공정수행이 중단되도록 하여 생산성이 향상되는 효과가 있다.Therefore, according to the present invention, when the chemical is empty, the process performance is stopped and productivity is improved.

이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (4)

(정정)케미컬 저장부로부터 공급된 케미컬을 버블링시켜 공정설비로 공급하는 케미컬 공급부를구비하는 반도체 케미컬 시스템에 있어서,(Correction) A semiconductor chemical system comprising a chemical supply unit for bubbling a chemical supplied from a chemical storage unit and supplying it to a process facility , 상기 케미컬공급부의 케미컬 수위를 감지하는 수위감지수단;Water level sensing means for sensing the chemical level of the chemical supply; 상기 수위감지수단의 상기 케미컬공급부의 케미컬 수위감지에 따른 센싱신호입력에 의해서 상기 케미컬저장부에서 상기 케미컬공급부로 공급되는 케미컬의 양을 조절하는 공급제어부; 및A supply control unit controlling an amount of chemical supplied from the chemical storage unit to the chemical supply unit by a sensing signal input according to the chemical level detection of the chemical supply unit of the water level sensing unit; And 상기 수위감지수단의 상기 케미컬공급부의 케미컬 수위감지에 따른 센싱신호입력가 입력된 상기 공급제어부의 제어신호에 의해서 상기 공정설비를 제어하는 설비제어부;A facility control unit controlling the process equipment by a control signal of the supply control unit to which a sensing signal input according to the chemical level detection of the chemical supply unit of the water level sensing unit is input; 를구비하여 이루어지는 것을 특징으로 하는 반도체 케미컬 공급시스템.Semiconductor chemical delivery system which comprises provided with a. 제 1 항에 있어서,The method of claim 1, 상기 수위감지수단은 상기 케미컬공급부의 수위가 풀(Full) 또는 엠프티(Empty)일 때 센싱신호를 제공하도록 구성됨을 특징으로 하는 상기 반도체 케미컬 공급시스템.And the level sensing means is configured to provide a sensing signal when the level of the chemical supply is full or empty. 제 2 항에 있어서,The method of claim 2, 상기 센싱신호가 엠프티로 상기 공급제어부에 입력되면 상기 공급제어부는 상기 케미컬공급부로 케미컬공급이 이루어지도록 상기 케미컬저장부를 제어함과, 동시에 상기 설비제어부로 제어신호를 입력시켜 상기 설비제어부는 공정설비의 가동을 중단시키도록 구성됨을 특징으로 하는 상기 반도체 케미컬 공급시스템.When the sensing signal is input to the supply control unit as an empty, the supply control unit controls the chemical storage unit so that chemical supply is performed to the chemical supply unit, and simultaneously inputs a control signal to the facility control unit so that the facility control unit is a process facility. Wherein said semiconductor chemical supply system is configured to stop operation of said semiconductor chemical supply. 제 1 항 또는 제 3 항에 있어서,The method according to claim 1 or 3, 상기 공급제어부는 피엘씨(PLC)가 내장구성됨을 특징으로 하는 상기 반도체 케미컬 공급시스템.The supply control unit is a semiconductor chemical supply system, characterized in that the built-in PLC (PLC).
KR1019960059058A 1996-11-28 1996-11-28 Semiconductor chemical supply system KR100223968B1 (en)

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KR20180002960A (en) * 2016-06-29 2018-01-09 (주)지오엘리먼트 Chemical recovery system

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KR970052837A (en) * 1995-12-26 1997-07-29 김광호 Method of forming nitride film of semiconductor device

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KR970052837A (en) * 1995-12-26 1997-07-29 김광호 Method of forming nitride film of semiconductor device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180002960A (en) * 2016-06-29 2018-01-09 (주)지오엘리먼트 Chemical recovery system
KR102506307B1 (en) 2016-06-29 2023-03-07 (주)지오엘리먼트 Chemical recovery system

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