KR20010006830A - Semiconductor treatment device and methode thereof - Google Patents

Abstract

PURPOSE: To prevent treatment liquid or rinsing water from remaining at a substrate or a substrate retention part by providing a supply path for supplying chemical liquid or pure water into a treatment tank while a semiconductor material retaining tool is connected to the supply source of the chemical liquid or the pure water. CONSTITUTION: A substrate retaining tool 3 is provided with a substrate 4 and three substrate connection parts 5 that are connected to the substrate 4, and the substrate part 4 is provided with an introduction line 8 that is connected to the supply source of external chemical liquid or pure water. The substrate 4 and the substrate contact part 5 of the substrate retaining tool 2 is formed to be hollow or to have a pipeline inside, chemical liquid or pure water that is supplied from the introduction line 8 is circulated inside, and the chemical liquid or rinsing water is allowed to flow out of a supply port 6 that is provided at the substrate contact part 5. A treatment chemical introduction port 9 is provided to introduce the chemical or rinsing water for treatment to a treatment tank 2, and a dry chemical introduction port 10 is provided to introduce drying chemicals or the like from the upper portion of the treatment tank 2.

Description

Semiconductor Processing Equipment & Processing Methods {SEMICONDUCTOR TREATMENT DEVICE AND METHODE THEREOF}

TECHNICAL FIELD This invention relates to the improvement of the processing apparatus and processing method of a semiconductor material. Specifically, It is related with the batch processing apparatus and processing method.

4 is a diagram showing an example of a treatment tank structure in a conventional batch type washing apparatus. In Fig. 4, reference numeral 1 denotes a semiconductor substrate, reference numeral 2 denotes a processing tank, reference numeral 3A denotes a substrate holding tool for holding the semiconductor substrate 1, reference numeral 4A denotes a base portion, and reference numeral 5A denotes a semiconductor. The board | substrate contact part which mounts the board | substrate 1, 9 is an introduction port of processing chemicals, etc., and 10 is an introduction port of drying chemicals.

In such a conventional batch cleaning apparatus, for example, in the IPA drying apparatus (isopropyl alcohol drying apparatus), there is a tendency for pure water to remain in the gap between the semiconductor substrate 1 and the substrate contacting portion 5A during substrate drying. There was this. It is known that the residual water droplets easily adsorb contaminants in the vicinity and cause foreign matters on the substrate.

Fig. 5 shows an example of a substrate map of the foreign matter 1A attached to the semiconductor substrate 1 due to residual water droplets upon drying.

In addition, during the washing of water after etching or washing with a highly viscous chemical liquid such as phosphoric acid or sulfuric acid, the etching or cleaning liquid remains in the substrate holding portion. These chemical residues have a phenomenon in which the pure water substitution efficiency in the substrate holding part deteriorates during the water flow after etching, and the etching amount in the portion increases.

Generation | occurrence | production of these particle | grains and the nonuniformity of the etching have become a factor which reduces the manufacture yield of a semiconductor device.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and prevents the processing liquid during substrate processing from remaining in the substrate or the substrate holding portion, and also prevents the washing water from washing from remaining in the substrate or the substrate holding portion, It is an object of the present invention to provide a processing apparatus and processing method for a semiconductor material for the purpose of suppressing particle generation and improving etching uniformity.

1 is a perspective perspective view of a processing tank of a semiconductor material according to Embodiment 1 of the present invention.

2 is a perspective view of a semiconductor material holding tool according to Embodiment 1 of the present invention.

Fig. 3 is a perspective perspective view of the processing tank of semiconductor material according to the second embodiment of the present invention.

4 is a perspective perspective view showing an example of a treatment tank structure in a conventional batch type washing apparatus.

Fig. 5 shows a substrate map of foreign matter attached to a semiconductor substrate in a conventional batch cleaning method.

<Description of the code | symbol about the principal part of drawing>

1: semiconductor substrate (semiconductor material)

2: treatment tank

3: substrate holding tool (semiconductor material holding tool)

4: base part

5: substrate contact

6: supply port (opening)

7: direction of chemical or washing water

8: introduction line

9: treatment chemical inlet

10: dry chemical inlet

11: cleaning water liquid level sensor

12: introduction line

13: supply port

14: chemical inlet

15: direction of chemical or washing water

A semiconductor processing apparatus according to claim 1 of the present invention includes a processing tank for semiconductor materials, a semiconductor material holding tool disposed in the processing tank to hold the semiconductor material, and a treatment or cleaning chemical or pure water introduced into the processing tank. The introduction material means is provided, and the said semiconductor material holding | maintenance tool is connected with the supply source of chemical liquid or pure water, It is characterized by having the supply path which supplies chemical liquid or pure water in the said processing tank.

The semiconductor processing apparatus according to claim 2 is characterized in that the semiconductor material holding tool has a plurality of supply ports for chemical liquid or pure water on the holding surface for holding the semiconductor material.

The semiconductor processing apparatus according to claim 3 is characterized in that the semiconductor material holding tool supplies a drying chemical liquid, its vapor or its mist.

The semiconductor processing apparatus according to claim 4 is characterized in that the semiconductor material holding tool supplies a cleaning chemical or pure water.

The semiconductor processing apparatus according to claim 5 is the semiconductor processing apparatus according to claim 1, wherein the semiconductor material holding tool supplies the chemical liquid for etching.

Further, in the semiconductor processing apparatus according to claim 6, the semiconductor processing apparatus according to claim 1 is disposed in the processing tank, and detects the chemical liquid or the pure water in the processing tank so that the semiconductor material holding tool emerges above the liquid level of the chemical liquid or the pure water. It is characterized by including the detection means for detecting.

In addition, the semiconductor processing apparatus according to claim 7 introduces a processing tank for semiconductor materials, a semiconductor material holding tool disposed in the processing tank and holding the semiconductor material, and a chemical liquid or pure water for treatment or cleaning in the processing tank. And a supply means arranged in the processing tank and connected to a source of chemical liquid or pure water to supply the chemical liquid or pure water to the vicinity of the holding surface of the semiconductor material of the semiconductor material holder. .

In addition, the semiconductor processing method according to claim 8 includes the steps of: treating a semiconductor material held in a semiconductor material holding tool with a processing liquid or pure water in a processing tank of semiconductor material; and holding the semiconductor material and material holding after the processing. Supplying cleaning or drying chemicals or pure water in the vicinity of the contact surface with the sphere.

Further, the semiconductor processing method according to claim 9 further comprises the step of treating the semiconductor material held by the semiconductor material holding tool with a processing liquid or pure water in the processing tank of the semiconductor material. Pure water is introduced, and a treatment chemical or pure water is supplied from the vicinity of the contact surface between the semiconductor material and the semiconductor material holding tool toward the contact surface.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings.

<Embodiment 1>

1 is a perspective perspective view of a processing tank of a semiconductor material for explaining Embodiment 1 of the present invention. 2 is a perspective view of the semiconductor material holding tool. 1 and 2, reference numeral 1 denotes a semiconductor substrate (generally a semiconductor material) to be processed, reference numeral 2 denotes a processing tank for treating or cleaning the semiconductor substrate 1, and reference numeral 3 denotes a semiconductor substrate 1 Substrate holder (generally a semiconductor material holder) for holding the substrate, reference numeral 4 denotes a base portion thereof, and reference numeral 5 denotes a substrate of the substrate holder 2 that contacts and supports the semiconductor substrate 1. The contact portion, 6 denotes a supply port (opening) for supplying chemicals or washing water from the substrate contact portion 5 of the substrate holding opening 2, and the reference numeral 7 denotes a supply opening 6 of the substrate contacting portion 5. The direction of chemicals or washing water supplied into the treatment tank is shown.

In addition, reference numeral 8 denotes an introduction line (piping) for introducing a chemical or washing water into the substrate holding tool 2 from the outside, and reference numeral 9 denotes a treatment chemical or washing water for introducing the treatment chemical into the treatment tank 2. Conventionally installed treatment chemical introduction port, reference numeral 10 denotes a conventionally installed dry chemical introduction port, reference numeral 11 denotes a washing water liquid level sensor in order to introduce a drying chemical or the like from the upper portion of the treatment tank 2.

As shown in FIG. 2, the board | substrate holding tool 3 is equipped with the base part 4 and the three board | substrate contact parts 5 connected to this base part 4. As shown in FIG. In addition, the base portion 4 is provided with an introduction line 8 connected to a source of external chemical liquid or pure water.

The base portion 4 and the substrate contact portion 5 of the substrate holding device 2 are hollow or formed to have a conduit therein, and the chemical liquid or pure water supplied from the introduction line 8 flows through the substrate contact portion. The chemical liquid or the washing water flows out from the supply port 6 provided in (5).

Next, the operation of this processing apparatus will be described.

First, chemicals are introduced from the processing chemical introduction port 9 at the time of etching with the chemical liquid of the semiconductor substrate 1 or cleaning with the chemical liquid or the like, but at the same time, the semiconductor substrate (from the supply port 6 of the substrate contact portion 5) is introduced. The same chemical | medical agent is supplied toward or near the contact part of 1) and the board | substrate contact part 5. Thereby, the chemical | medical agent distribute | circulates well and does not stay in the part which the semiconductor substrate 1 contacts with the board | substrate contact part 5, either. Therefore, the process of the semiconductor substrate 1 by chemical liquid etc. can be performed uniformly.

Next, when the etching of the semiconductor substrate 1 or the cleaning of the chemical liquid is finished and the washed chemical liquid is washed with water, the washing water is introduced from the processing chemical inlet 9 and the substrate contact portion 5 is supplied. Washing water is also supplied from the sphere 6 to actively replace the chemicals remaining in the substrate contacting portion 5 with the washing water.

In particular, when the semiconductor substrate 1 is cleaned with a highly viscous etching or cleaning solution such as phosphoric acid or sulfuric acid, the chemicals of the substrate contact portion 5 are difficult to be replaced during subsequent water washing, so that the residue remains and is etched or cleaned. Unevenness tends to occur.

Therefore, in this embodiment, washing | cleaning water is also supplied from the supply port 6 toward the part which the board | substrate contact part 5 contacts with the semiconductor substrate 1, and residual chemical liquid etc. are removed and replaced with washing water, and etching or the like is performed. The uniformity of the cleaning is improved.

In this case, the pressure of the chemicals or pure water introduced into the substrate holding part 2 can be adjusted as necessary, and the chemicals or the water washing liquid can be ejected from the supply port 6 at a predetermined flow rate to improve the water washing effect.

In this case, the water washing may be performed in a treatment tank separate from that in the same treatment tank in which the treatment such as etching is performed, but the present embodiment can be applied in any case.

In addition, you may make it introduce the water washing | cleaning liquid from the supply opening 6 only at the time of the water washing of a process chemical, without using the supply opening 6 at the time of an etching and washing | cleaning. In this case as well, the uniformity of etching and cleaning can be improved.

Next, after the washing | cleaning of the water of the semiconductor substrate 1 is complete | finished, it enters into the drying process of the semiconductor substrate 1.

For example, the drying method of the semiconductor substrate currently performed by the LSI batch cleaning apparatus etc. is a drying chemical | medical agent from the drying chemical introduction port 10 to the space above the processing tank 2, while the semiconductor substrate 1 is in water. (Isopropyl alcohol, etc.) are introduced. At this time, the dry chemical is often introduced in the form of a liquid, steam or mist, together with a single substance or a gas such as nitrogen.

After the introduction of the dry chemical, the washing water immersed in the semiconductor substrate 1 is removed to dry the semiconductor substrate 1. At that time, water droplets remain in the substrate contacting portion 5 of the substrate holding tool 2 due to surface tension, and foreign matter tends to be adsorbed there.

In order to avoid this, in the present embodiment, during drying of the substrate, a drying chemical such as isopropyl alcohol or its vapor or mist is introduced together with a single substance or a gas such as nitrogen from the supply port 6 of the substrate contact portion 5. The remaining water droplets of the contact portion 5 are actively dried to improve the drying efficiency of the portion where the substrate contact portion 5 is in contact with the semiconductor substrate 1 and the semiconductor substrate 1 that is in contact therewith.

Next, in this embodiment, the liquid level sensor 11 which detects the presence of wash | cleaning water etc. in the processing tank 2 is provided. In the example shown in FIG. 1, the liquid level sensor 11 is provided at the same position as or lower than the substrate contacting portion 5 at the bottom of the processing tank 2.

After the semiconductor substrate 1 is immersed in the washing water and a dry chemical (isopropyl alcohol, etc.) is introduced into the upper space in the treatment tank 2, the washing water is removed to gradually lower the liquid level and drying is performed. At this time, it is determined by the liquid level sensor 11 that the liquid level is lower than the substrate contact portion 5, and the dry chemical liquid is supplied from the supply port 6 of the substrate contact portion 5 from the time when the substrate contact portion 5 is exposed in the dry chemical. Control to start the supply of. In this way, it becomes possible to reduce the amount of dry chemical used.

In addition, the above description demonstrated the case where the washing water which stayed was removed from the lower part of the processing tank 2, and the level of the washing liquid surface is lowered.

However, in some cases, the semiconductor substrate 1 is pulled out of the cleaning liquid together with the substrate holding tool 2 and moved into the upper dry chemical. In this case, the liquid level sensor 11 is connected to the substrate holding tool 2 and pulled out of the cleaning liquid together with the substrate holding tool 2. Thereby, the timing which flows out a dry chemical from the supply port 6 of the board | substrate contact part 5 can be controlled similarly.

As described above, according to the present embodiment, foreign matter adsorbed to the residual water droplets of the substrate holding tool 3, which has been a problem in the prior art, does not occur with the reduction of the residual water droplets, thereby preventing a decrease in product yield due to the foreign matter. It becomes possible.

In addition, such a method improves the chemical substitution or drying efficiency of the substrate holding part, thereby improving the etching uniformity in the substrate, shortening the washing time of water, suppressing foreign matter adhesion during drying, and shortening the drying time. There is.

<Embodiment 2>

Fig. 3 is a perspective perspective view of a processing tank of semiconductor material for explaining the second embodiment of the present invention.

In Fig. 3, reference numeral 12 denotes an introduction line of a chemical or washing water, reference numeral 13 denotes a supply port (opening) provided in the introduction line 13, and reference numeral 14 introduces a chemical or washing water into the introduction line 12. The chemical liquid introduction port for the purpose, reference numeral 15 denotes the direction of the chemicals or the washing water supplied from the supply port 13 of the introduction line 12 into the treatment tank.

In this case, the substrate holding means 3 itself may not be provided with a supply means for the chemical liquid. Other components are the same as those in Fig. 1, and the same or equivalent parts are denoted by the same reference numerals and the description thereof is omitted.

In this embodiment, the introduction line 12 is arrange | positioned in the vicinity of the board | substrate contact part 5 of the board | substrate holding tool 3, and many supply ports 6 are provided so that the board contact part 5 may face.

Chemicals from an external source of chemical or pure water are introduced into the introduction line 12 from the chemical solution introduction port 14 and flow out from the supply port 13 toward the substrate contacting portion 5.

In Embodiment 1 mentioned above, although the chemical liquid etc. were outflowing from the supply port 6 provided in the board | substrate contact part 5 of the board | substrate holding tool 3, in this Embodiment 2, the introduction line 12 is separately provided. It is installed. By doing in this way, there exists an advantage which is easy to adjust the arrangement | positioning of the introduction line 12, or the flow direction, such as chemical | medical agent.

Since the functions, operations, and effects are the same as those described in the first embodiment, detailed description is omitted.

In addition, in Embodiment 1 and 2, the process and cleaning of a semiconductor substrate were demonstrated as an example. However, the present invention can also be applied to the processing and cleaning of semiconductor materials such as semiconductor wafers, liquid crystal components, and other materials.

In this specification, the term "semiconductor material" is intended to mean inclusively including such things.

As described above, according to the present invention, the treatment or cleaning chemicals or the washing water are actively supplied toward the contact portion between the semiconductor material and the semiconductor material holding tool holding the same, and thus the vicinity of the contact surface between the semiconductor material and the semiconductor material holding tool. It is possible to improve the substitution efficiency of chemicals or pure water, or residual residual liquids, to improve the etching, cleaning or drying performance, and to improve the processing capability of the processing apparatus (generally a semiconductor manufacturing apparatus). Can be.

Claims (9)

A processing tank for semiconductor materials, a semiconductor material holding tool disposed in the processing tank for holding the semiconductor material, and introduction means for introducing a processing or cleaning chemical liquid or pure water into the processing tank, and holding the semiconductor material holding. A sphere is connected to a source of chemical liquid or pure water, and has a supply path for supplying chemical liquid or pure water into the processing tank. The semiconductor processing apparatus according to claim 1, wherein the semiconductor material holding tool has a plurality of supply ports for chemical liquid or pure water on a holding surface for holding the semiconductor material. The semiconductor processing apparatus according to claim 1, wherein the semiconductor material holding tool supplies a drying chemical liquid, its vapor, or its mist. 2. The semiconductor processing apparatus according to claim 1, wherein the semiconductor material holding tool supplies a cleaning liquid or pure water. The semiconductor processing apparatus according to claim 1, wherein the semiconductor material holding tool supplies an etching chemical. 2. The apparatus according to claim 1, further comprising: detecting means disposed in the processing tank and detecting the chemical liquid or the pure water in the processing tank to detect that the semiconductor material holding tool emerges above the liquid level of the chemical liquid or pure water. A semiconductor processing apparatus. A processing tank for semiconductor materials, a semiconductor material holding tool disposed in the processing tank and holding the semiconductor material, introducing means for introducing a processing or cleaning chemical liquid or pure water into the processing tank, and disposed in the processing tank. And a supply means connected to a supply source of the chemical liquid or the pure water to supply the chemical liquid or the pure water to the vicinity of the holding surface of the semiconductor material of the semiconductor material holding tool. Treating a semiconductor material held in the semiconductor material holding tool with a treating agent or pure water in a processing tank of the semiconductor material, and for cleaning or drying in the vicinity of the contact surface between the semiconductor material and the material holding tool after the treatment; A method of processing a semiconductor comprising supplying a drug or pure water. Treating the semiconductor material held by the semiconductor material holding tool in the processing tank of the semiconductor material with the processing liquid or pure water, while introducing the processing liquid or pure water into the processing tank, A processing liquid or pure water is supplied from the vicinity of the contact surface with the semiconductor material holding tool toward the contact surface.