JP2000349058A - Semiconductor treating device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent treatment liquid or rinsing water from remaining at a substrate or a substrate retention part by providing a supply path for supplying chemical liquid or pure water into a treatment tank while a semiconductor material retaining tool is connected to the supply source of the chemical liquid or the pure water. SOLUTION: A substrate retaining tool 3 is provided with a substrate 4 and three substrate connection parts 5 that are connected to the substrate 4, and the substrate part 4 is provided with an introduction line 8 that is connected to the supply source of external chemical liquid or pure water. The substrate 4 and the substrate contact part 5 of the substrate retaining tool 2 is formed to be hollow or to have a pipeline inside, chemical liquid or pure water that is supplied from the introduction line 8 is circulated inside, and the chemical liquid or rinsing water is allowed to flow out of a supply port 6 that is provided at the substrate contact part 5. A treatment chemical introduction port 9 is provided to introduce the chemical or rinsing water for treatment to a treatment tank 2, and a dry chemical introduction port 10 is provided to introduce drying chemicals or the like from the upper portion of the treatment tank 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a processing apparatus and a processing method for semiconductor materials, and more particularly to a batch processing apparatus and a processing method.

[0002]

2. Description of the Related Art FIG. 4 is a view showing an example of the structure of a processing tank in a conventional batch type cleaning apparatus. In FIG.
1 is a semiconductor substrate, 2 is a processing tank, 3A is a substrate holder for holding the semiconductor substrate 1, 4A is a base portion thereof, 5A is a substrate contact portion on which the semiconductor substrate 1 is placed, and 9 is an inlet for processing chemicals or the like. Reference numeral 10 denotes an inlet for a drying chemical or the like. In such a conventional batch type cleaning apparatus, for example, in an IPA drying apparatus (isopropyl alcohol drying apparatus), pure water tends to remain in the gap between the semiconductor substrate 1 and the substrate contact portion 5A when the substrate is dried. It is known that the residual water droplets easily adsorb contamination in the vicinity and cause foreign matter on the substrate. FIG. 5 shows an example of a substrate map of a foreign substance 1A attached to the semiconductor substrate 1 due to remaining water droplets during drying.

[0003] In addition, when washing with water after etching or washing with a highly viscous chemical solution such as phosphoric acid or sulfuric acid, the etching or washing solution remains on the substrate holding portion. The residual of these chemicals causes a phenomenon in which, when flowing water after etching, the efficiency of pure water replacement in the substrate holding portion is deteriorated, and the amount of etching in that portion is increased. The generation of these particles and the non-uniformity of etching have been factors that reduce the manufacturing yield of semiconductor devices.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and therefore, a processing solution during substrate processing remains on a substrate or a substrate holding portion, and a cleaning solution during substrate cleaning. An object of the present invention is to provide a semiconductor material processing apparatus and a processing method for preventing cleaning water from remaining on a substrate or a substrate holding portion, suppressing generation of particles, improving etching uniformity, and the like.

[0005]

According to a first aspect of the present invention, there is provided a semiconductor processing apparatus, comprising: a semiconductor material processing tank; a semiconductor material holder disposed in the processing tank to hold the semiconductor material; Introducing means for introducing a chemical or pure water for processing or cleaning into the processing tank, wherein the semiconductor material holder is connected to a supply source of the chemical or pure water to supply the chemical or pure water into the processing tank. Characterized in that it has a supply path for

According to a second aspect of the present invention, in the semiconductor processing apparatus according to the first aspect, the semiconductor material holder has a plurality of supply ports for chemical liquid or pure water on a holding surface for holding the semiconductor material. It is characterized by having.

In a third aspect of the present invention, in the semiconductor processing apparatus according to the first aspect, the semiconductor material holder supplies a chemical for drying, a vapor thereof, or a mist thereof.

According to a fourth aspect of the present invention, in the semiconductor processing apparatus according to the first aspect, the semiconductor material holder supplies a cleaning chemical or pure water.

According to a fifth aspect of the present invention, in the semiconductor processing apparatus according to the first aspect, the semiconductor material holder supplies an etching chemical.

According to a sixth aspect of the present invention, there is provided the semiconductor processing apparatus according to the first aspect, wherein the semiconductor material holder is disposed in the processing tank, and detects the chemical solution or pure water in the processing tank and sets the semiconductor material holder. It is characterized by comprising a detecting means for detecting that the liquid has come out above the liquid surface of the chemical or pure water.

According to a seventh aspect of the present invention, there is provided a semiconductor processing apparatus, comprising: a semiconductor material processing tank; a semiconductor material holder disposed in the processing tank to hold the semiconductor material; Introducing means for introducing a chemical solution or pure water for cleaning, and connected to a supply source of the chemical solution or pure water disposed in the treatment tank and bringing the chemical solution or pure water into the vicinity of the semiconductor material holding surface of the semiconductor material holder. And supplying means for supplying.

In a semiconductor processing method according to an eighth aspect of the present invention, in the semiconductor material processing tank, the semiconductor material held in the semiconductor material holder is treated with a processing chemical or pure water; Supplying a cleaning or drying chemical or pure water to the vicinity of the contact surface between the material and the material holder.

According to a ninth aspect of the present invention, in the semiconductor processing method, the semiconductor material held in the semiconductor material holder is treated with a processing chemical or pure water in the semiconductor material processing tank. Introducing the processing chemical or pure water, and supplying the processing chemical or pure water from the vicinity of the contact surface between the semiconductor material and the semiconductor material holder toward the contact surface. is there.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. Embodiment 1 FIG. FIG. 1 is a see-through perspective view of a processing tank for semiconductor material for describing Embodiment 1 of the present invention. FIG. 2 is a perspective view of the semiconductor material holder. 1 and 2, reference numeral 1 denotes a semiconductor substrate to be processed (generally, a semiconductor material), 2 denotes a processing tank for processing or cleaning the semiconductor substrate 1, and 3 denotes a substrate holder (generally, a semiconductor) for holding the semiconductor substrate 1. Material holder), 4 is a base portion thereof, 5 is a substrate contact portion of a substrate holder 2 that contacts and supports the semiconductor substrate 1, and 6 is a chemical or cleaning water supplied from the substrate contact portion 5 of the substrate holder 2. The supply port (opening) 7 indicates the direction of the chemical or cleaning water supplied from the supply port 6 of the substrate contact portion 5 into the processing tank.

Reference numeral 8 denotes an introduction line (piping) for introducing a chemical or cleaning water into the substrate holder 2 from the outside;
Is a conventionally provided processing chemical inlet for introducing a processing chemical or cleaning water into the processing tank 2, and 10 is a conventionally provided processing chemical introduction port for introducing a drying chemical or the like from above the processing tank 2. A certain dry chemical inlet 11, 11 indicates a cleaning water level sensor.

As shown in FIG. 2, the substrate holder 3 includes a base 4 and three substrate contacts 5 connected to the base 4. Further, the base portion 4 is provided with an introduction line 8 connected to an external supply source of a chemical solution or pure water. The base portion 4 and the substrate contact portion 5 of the substrate holder 2 are formed so as to be hollow or have a pipe inside, and a chemical solution or pure water supplied from the introduction line 8 flows through the inside, and the substrate contact portion 5 A chemical solution or washing water flows out of a supply port 6 provided in the hopper.

Next, the operation of the processing apparatus will be described. First, when the semiconductor substrate 1 is etched with a chemical solution or washed with a chemical solution, a chemical is introduced from the processing chemical introduction port 9, and at the same time, the semiconductor substrate 1 and the substrate contact portion 5 are supplied from the supply port 6 of the substrate contact portion 5. The same chemical is supplied toward or near the contact part of the. Thus, the chemical is well circulated and does not stay in the portion where the semiconductor substrate 1 is in contact with the substrate contact portion 5. Therefore, the processing of the semiconductor substrate 1 with a chemical solution or the like can be performed uniformly.

Next, when the etching of the semiconductor substrate 1 with the chemical solution or the cleaning with the chemical solution is completed and the treated chemical solution is washed with water, the cleaning water is introduced from the processing chemical introduction port 9 and the supply of the substrate contact portion 5 at the same time. Cleaning water is also supplied from the port 6, and the chemical remaining in the substrate contact portion 5 is positively replaced with the cleaning water.

In particular, when the semiconductor substrate 1 is washed with a highly viscous etching or cleaning solution such as phosphoric acid or sulfuric acid, the chemicals in the substrate contact portion 5 are usually hardly replaced during the subsequent washing with water, and the semiconductor substrate 1 remains. Tends to be uneven.

Therefore, in this embodiment, the supply port 6 is moved toward the portion where the substrate contact portion 5 contacts the semiconductor substrate 1.
Cleaning water is also supplied from the reactor to remove and replace residual chemicals and the like with the cleaning water, thereby improving the uniformity of etching and cleaning.
In this case, if necessary, the pressure of the chemical or pure water introduced into the substrate holding unit 2 is adjusted, and the chemical or rinsing liquid is ejected from the supply port 6 at a predetermined flow rate, so that the rinsing effect and the like can be improved.

In this case, the water washing may be performed in the same processing tank as the tank which has been subjected to the processing such as etching, or may be performed in another processing tank. This embodiment is applicable to both cases. it can.

In addition, the supply port 6 may not be used at the time of etching and cleaning, and a rinsing liquid may be introduced from the supply port 6 only at the time of rinsing the processing chemical with water. Even in this case, the uniformity of etching and cleaning can be similarly improved.

Next, after the washing of the semiconductor substrate 1 is completed, a drying step of the semiconductor substrate 1 is started. For example, a semiconductor substrate drying method currently used in an LSI batch cleaning apparatus or the like is based on a method in which a dry chemical (such as isopropyl alcohol) is introduced from a dry chemical inlet 10 into a space above the processing tank 2 while the semiconductor substrate 1 is in water. ). At this time, the dry chemical is often introduced in a liquid, vapor, or mist state, alone or together with a gas such as nitrogen. After the introduction of the dry chemical, the cleaning water in which the semiconductor substrate 1 is immersed is removed, and the semiconductor substrate 1 is dried. At this time, water droplets remain on the substrate contact portion 5 of the substrate holder 2 due to surface tension, and foreign matter tends to be adsorbed there.

In order to avoid this, in this embodiment,
At the time of substrate drying, a dry chemical such as isopropyl alcohol or a vapor or mist thereof is introduced from the supply port 6 of the substrate contact portion 5 together with a single substance or a gas such as nitrogen, and the residual water droplets of the substrate contact portion 5 are positively dried. The drying efficiency of the portion where the substrate contact portion 5 is in contact with the semiconductor substrate 1 and the semiconductor substrate 1 in contact therewith are improved.

Next, in this embodiment, a liquid level sensor 11 for detecting the presence of cleaning water or the like in the processing tank 2 is provided. In the example shown in FIG. 1, the liquid level sensor 11 is provided at the same position as the substrate contact part 5 or at a lower position at the bottom of the processing tank 2.

After the semiconductor substrate 1 is immersed in the cleaning water and a dry chemical (such as isopropyl alcohol) is introduced into the upper space in the processing tank 2, the cleaning water is drained and the liquid surface is gradually lowered to perform drying. . At this time, it is determined by the liquid level sensor 11 that the liquid level has dropped below the substrate contact portion 5, and from the time when the substrate contact portion 5 is exposed in the dry chemical, the dry chemical solution is supplied from the supply port 6 of the substrate contact portion 5. Control to start supply. This makes it possible to reduce the amount of dry chemical used.

In the above description, the case where the retained cleaning water is drained from the lower part of the processing tank 2 to lower the level of the cleaning liquid has been described. However, the semiconductor substrate 1 is not
At the same time, there is a case where it is pulled up from the cleaning liquid and transferred into the upper dry chemical. In this case, the liquid level sensor 11 is connected to the substrate holder 2 and is pulled up from the cleaning liquid together with the substrate holder 2. As a result, the substrate contact portion 5
The timing at which the dry chemical flows out of the supply port 6 can be controlled.

As described above, according to this embodiment, the foreign matter adsorbed on the remaining water droplets of the substrate holder 3, which is a problem in the prior art, is not generated with the decrease of the remaining water droplets. It is possible to prevent a decrease in product yield due to the above. In addition, because of such a method, the chemical replacement or drying efficiency of the substrate holding portion is improved, the etching uniformity in the substrate is improved, the washing time is shortened, the adhesion of foreign substances during drying is suppressed, and the drying time is shortened. Has action and effect.

Embodiment 2 FIG. 3 is a perspective view of a semiconductor material processing tank for explaining Embodiment 2 of the present invention. In FIG. 3, reference numeral 12 denotes a chemical or cleaning water introduction line, 13 denotes a supply port (opening) provided in the introduction line 13, 14 denotes a chemical solution introduction port for introducing a chemical or cleaning water into the introduction line 12, and 15 denotes Introduction line 12
Indicates the direction of the chemical or cleaning water supplied from the supply port 13 into the processing tank. In this case, the substrate holder 3 itself includes:
There is no need to provide a chemical liquid supply unit. Other components are the same as those in FIG. 1, and the same or corresponding portions are denoted by the same reference characters and description thereof is omitted.

In this embodiment, the introduction line 12 is arranged near the substrate contact portion 5 of the substrate holder 3, and a number of supply ports 6 are provided so as to face the substrate contact portion 5.
A chemical from an external chemical solution or pure water supply source is introduced into the introduction line 12 from the chemical solution introduction port 14, and is discharged from the supply port 13 toward the substrate contact portion 5.

In the first embodiment described above, a chemical solution or the like is discharged from the supply port 6 provided in the substrate contact portion 5 of the substrate holder 3, whereas in the second embodiment, the introduction line 12 is separately provided. Is provided. In this case, there is an advantage that the arrangement of the introduction line 12 or the flow direction of the chemical or the like can be easily adjusted. Its functions, operations and effects are
Since this is the same as that described in the first embodiment, a detailed description is omitted.

In Embodiments 1 and 2 described above,
The processing and cleaning of the semiconductor substrate has been described as an example. But,
The present invention is also applicable to processing and cleaning of semiconductor materials such as semiconductor wafers, liquid crystal components and other materials. In this specification, the term “semiconductor material” is meant to include all such materials.

[0033]

As described above, according to the present invention,
Actively supply processing or cleaning chemicals or cleaning water to the contact portion between the semiconductor material and the semiconductor material holder holding the semiconductor material, and the chemical near the contact surface between the semiconductor material and the semiconductor material holder. Alternatively, the replacement efficiency of pure water or the remaining liquid can be improved, so that the etching, cleaning or drying performance can be improved, and the processing capability of a processing apparatus (generally, a semiconductor manufacturing apparatus) can be improved. .

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor material processing tank according to Embodiment 1 of the present invention.

FIG. 2 is a perspective view of a semiconductor material holder according to the first embodiment of the present invention.

FIG. 3 is a perspective view of a semiconductor material processing tank according to a second embodiment of the present invention;

FIG. 4 is a perspective view showing an example of the structure of a processing tank in a conventional batch-type cleaning apparatus.

FIG. 5 is a view showing a substrate map of a foreign substance attached to a semiconductor substrate in a conventional batch-type cleaning method.

[Explanation of symbols]

 Reference Signs List 1 semiconductor substrate (semiconductor material), 2 processing tank, 3 substrate holder (semiconductor material holder), 4 base part, 5 substrate contact part, 6 supply port (opening), 7 direction of chemical or cleaning water, 8 introduction line , 9 treatment chemical inlet, 10 dry chemical inlet, 11 washing water level sensor, 12 introduction line, 13 supply port, 14 chemical inlet, 15 direction of chemical or washing water.

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[Procedure amendment]

[Submission date] June 5, 2000 (2006.5.5)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction contents]

[0005]

According to a first aspect of the present invention, there is provided a semiconductor processing apparatus, comprising: a semiconductor material processing tank; a semiconductor material holder disposed in the processing tank to hold the semiconductor material; and a means for introducing the chemicals for processing or drying processing tank, wherein the semiconductor material retainer wherein
The processing is connected to a source of chemicals processing or drying
It is characterized by having a supply path for supplying the same chemical as the chemical for treatment or drying into the treatment tank.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

According to a second aspect of the present invention, there is provided a semiconductor processing apparatus according to the first aspect, wherein the semiconductor material holder is provided.
Is to transfer the chemical in the supply path to a portion in contact with the semiconductor substrate.
It is characterized by having a supply port for supplying it toward .

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

According to a third aspect of the present invention, there is provided a semiconductor processing apparatus according to the first or second aspect , wherein the semiconductor material comprises
The holder is used to hold the chemical supply port to hold the semiconductor material.
It is characterized by having a plurality on the surface .

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction contents]

According to a fourth aspect of the present invention, there is provided a semiconductor processing apparatus according to the first or second aspect , wherein the semiconductor material is
Holders provide a chemical for drying, its vapor or its mist.
It is characterized by feeding .

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

According to a fifth aspect of the present invention, in the semiconductor processing apparatus according to the first or second aspect , the semiconductor material holder supplies an etching chemical .

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

Further, the semiconductor processing apparatus according to claim 6, in what according to claim 1 or 2, disposed in the processing bath, said semiconductor material holder by detecting the drug product in the processing bath is the it is characterized in that it comprises a detecting means for detecting that comes above the liquid surface of the drug product.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction contents]

According to a seventh aspect of the present invention, there is provided a semiconductor processing apparatus, comprising: a processing tank for a semiconductor material; a semiconductor material holder disposed in the processing tank to hold the semiconductor material; and introducing means for introducing chemicals or pure water use, is disposed in said processing bath, medicine the processing bath
It detects the goods or pure water wherein the semiconductor material retainer wherein agent
Detection means for detecting that the product or pure water has come out above the liquid level, wherein the semiconductor material holder is used for the processing or
It said processing being connected to a source of chemicals for cleaning or pure water
A supply path for supplying the same chemical or pure water as the chemical or pure water for cleaning or cleaning into the treatment tank.

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

Further, a semiconductor processing according to claim 8 is provided.apparatus
IsA semiconductor material processing tank, and a processing tank disposed in the processing tank.
Semiconductor material holder for holding semiconductor material by
Introduce chemicals or pure water for treatment or cleaning into the tank
Introducing means, which are configured separately from the semiconductor material holder
The treatment or cleaning agent disposed in the treatment tank.
Product or pure water supply for the treatment or washing
The same chemical or pure water as the cleaning chemical or pure water
Supply to supply the body material holder near the semiconductor material holding surface
With meansIt is characterized by the following.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction contents]

According to a ninth aspect of the present invention, in the semiconductor processing method according to the eighth aspect, the supply means includes:
Supply chemical or pure water to the contact area with the semiconductor substrate
It is characterized by having a number of supply ports for the supply . Further, the semiconductor processing method according to claim 10 is a semiconductor processing method.
The half held by the semiconductor material holder in the conductor material processing tank
For the step of treating conductor materials with treatment chemicals or pure water
The treatment chemical or pure water is introduced into the treatment tank.
The semiconductor material and the semiconductor material holding
From the vicinity of the contact surface with the tool toward the contact surface
The product or pure water is supplied .
Also, the semiconductor processing method according to claim 11 is a semiconductor material processing method.
Treatment tank and chemicals for treatment or drying in this treatment tank
Introduction means for introducing a gas,
The conductor material is held, and a processing or drying chemical is
Semiconductor material holder having a supply path for supplying into a bath
A semiconductor processing apparatus comprising:
The same processing or drying agent from the semiconductor material holder
It is characterized in that articles are supplied simultaneously . Ma
According to a twelfth aspect of the present invention, there is provided a semiconductor processing method according to the eleventh aspect.
The method according to claim 1, wherein the semiconductor material holder is provided with the chemical
Is supplied to the contact part with the semiconductor substrate
It is assumed that .

Claims (9)

[Claims] 1. A processing tank for semiconductor material, a semiconductor material holder disposed in the processing tank to hold a semiconductor material, and an introduction for introducing a chemical or pure water for processing or cleaning into the processing tank. Means, wherein the semiconductor material holder has a supply path connected to a supply source of a chemical or pure water to supply a chemical or pure water into the processing tank. 2. The semiconductor processing apparatus according to claim 1, wherein the semiconductor material holder has a plurality of supply ports for chemical liquid or pure water on a holding surface for holding the semiconductor material. 3. The semiconductor material holder, comprising:
The semiconductor processing apparatus according to claim 1, wherein the vapor or the mist is supplied. 4. The semiconductor processing apparatus according to claim 1, wherein the semiconductor material holder supplies a cleaning chemical or pure water. 5. The semiconductor processing apparatus according to claim 1, wherein the semiconductor material holder supplies an etching chemical. 6. A detection device disposed in the processing tank, for detecting a chemical solution or pure water in the processing tank and detecting that the semiconductor material holder has risen above the level of the chemical solution or pure water. 2. The semiconductor processing apparatus according to claim 1, further comprising means. 7. A processing tank for semiconductor material, a semiconductor material holder disposed in the processing tank for holding a semiconductor material, and introducing a chemical or pure water for processing or cleaning into the processing tank. An introduction unit, and a supply unit disposed in the processing tank, connected to a supply source of a chemical solution or pure water, and supplying a chemical solution or pure water to a vicinity of a semiconductor material holding surface of the semiconductor material holder. Characteristic semiconductor processing equipment. 8. A step of treating the semiconductor material held in the semiconductor material holder with a processing chemical or pure water in a semiconductor material processing tank, and near a contact surface between the semiconductor material and the material holder after the processing. Supplying a cleaning or drying chemical or pure water to the semiconductor device. 9. In the step of treating the semiconductor material held in the semiconductor material holder with a processing chemical or pure water in a semiconductor material processing tank, introducing the processing chemical or pure water into the processing tank. And a processing chemical or pure water is supplied from the vicinity of the contact surface between the semiconductor material and the semiconductor material holder toward the contact surface.