KR100215544B1 - Fabrication of metallized plastic thin films - Google Patents
Fabrication of metallized plastic thin films Download PDFInfo
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- KR100215544B1 KR100215544B1 KR1019970017660A KR19970017660A KR100215544B1 KR 100215544 B1 KR100215544 B1 KR 100215544B1 KR 1019970017660 A KR1019970017660 A KR 1019970017660A KR 19970017660 A KR19970017660 A KR 19970017660A KR 100215544 B1 KR100215544 B1 KR 100215544B1
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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Abstract
본발명은 플라스틱 필름의 표면에 알루미늄박막을 증착하기 전 또는 증착한 후에, 알루미늄/구리 합금박막을 증착하는 것으로 이루어지는 알루미늄증착플라스틱 필름의 제조방법에 관한 것으로, 본 발명에 따른 알루미늄증착 플라스틱 필름은 자기회복 특성이 우수하면서 장기간 사용하여도 캐패시턴스가 일정하게 유지되는 MF 콘덴서를 제조할 수 있으며, 또한 식품 저장용 용기를 제조하는데 이용될 수 있다.The present invention relates to a method for producing an aluminum deposited plastic film comprising depositing an aluminum / copper alloy thin film before or after depositing an aluminum thin film on the surface of a plastic film. It is possible to manufacture an MF condenser that has excellent recovery characteristics and maintains a constant capacitance even after long-term use, and can also be used to manufacture a food storage container.
Description
본 발명은 알루미늄증착 플라스틱 필름 및 그것의 제조방법에 관한 것이다.The present invention relates to an aluminum deposited plastic film and a method of manufacturing the same.
본 발명에 따른 알루미늄증착 플라스틱 필름은 금속증착 플라스틱 필름콘덴서(이하, MF 큰덴서라 칭함), 식품 저장용 필름 등의 제조에 이용될 수 있다.The aluminum-deposited plastic film according to the present invention can be used for the production of metal-deposited plastic film capacitors (hereinafter referred to as MF capacitor), food storage films and the like.
일반적으로 MF 콘덴서에 흔히 사용되고 있는 종래의 알루미늄증착 플라스틱 필름은 유전체로 작용하는 2-12 μm 두께의 플라스틱 필름의 일면 또는 양면상에 전극으로 사용되는 알루미늄 금속을 면저항 10-2 Ω/□, 두께 150-300Å로 진공증착하여 제조된다.Conventional aluminum-deposited plastic films commonly used in MF condensers include aluminum metals used as electrodes on one or both sides of 2-12 μm-thick plastic films acting as dielectrics. It is manufactured by vacuum deposition at -300Å.
알루미늄 MF 콘덴서는, 알루미늄이 낮은 전기저항 (2.65×10-6Ω·cm) 가진다는 특성을 이용하여, 증착 박막의 두께를 얇게 형성할 수 있기 때문에 자기회복특성이 우수하여 신뢰성이 높은 MF 콘덴서 제조용으로 적합하다고 알려져있다. 또한 플라스틱 필름에 대한 알루미늄증착 박막의 접착강도가 높아서 건식 MF 콘덴서 제조용으로 적합하며, 알루미늄은 내식특성이 우수하므로 알루미늄 MF 콘덴서는 보관이 용이하다.Aluminum MF Capacitors have a low electrical resistance (2.65 × 10 -6Ω · cm) and can be used to form thin film thicknesses. It is known to be suitable. In addition, the adhesive strength of the thin film of aluminum deposition on the plastic film is high, suitable for manufacturing dry MF capacitors, and the aluminum MF capacitor is easy to store because aluminum has excellent corrosion resistance.
알루미늄증착 플라스틱 필름을 이용한 종래의 알루미늄 MF 콘덴서의 개략적인 구조는 도 1에 도시된 바와 같다.A schematic structure of a conventional aluminum MF capacitor using aluminum deposition plastic film is shown in FIG.
도시된 바와 같이 알루미늄 MF 콘덴서를 제조하기 위해 일정한 폭을 갖는 테이프상 플라스틱 필름(1)의 표면에 알루미늄 박막(2)을 증착시킬 때, 필름에지 부분에는 증착이 이루어지지 않도록 하여 비증착부(1a)를 남겨놓은 상태로 알루미늄 박막(2)을 형성하고, 이 알루미늄증착 플라스틱 필름(3)을 원통형으로 연속 적층 권회하여 원통형의 몸체(4)를 제작한 다음 그 몸체의 양단부에 아연합금을 용사하여 전극(5)을 형성함과 아울러 그 전극(5)상에 리드선(6)(6')을 용접함으로써 알루미늄 MF 콘덴서를 제조한다.As shown, when the aluminum
이와 같은 방법을 통하여 제조된 종래의 알루미늄증착 박막을 사용하여 제조된 MF 콘덴서는, 사용 기간이 경과함에 따라 전기 스트레스에 의해 증착면적이 줄어들어, 사용 기간의 경과에 따라 캐패시턴스가 감소하는 단점이 있다.The MF capacitor manufactured using the conventional aluminum deposition thin film manufactured by the above method has a disadvantage in that the deposition area is reduced by electric stress as the use period elapses, and the capacitance decreases as the use period elapses.
이러한 종래의 알루미늄 MF 콘덴서의 문제점을 개선하기 위한 방편으로, 증착 금속의 성분을 변화시키는 방법이 제시되었다. 예를 들어 프랑스특허출원공개 제 8413964 호에는 증착 금속으로 알루미늄과 아연의 합금을 사용하는 것이 제시되었다. 그러나, 이 방법에서는 합금으로 사용되는 알루미늄과 아연의 증착조건이 서로 상이하고 일정온도에서 두 금속의 증기압 차이가 커서 증착된 합금층에서 성분의 균일성을 유지하기 어려우며 생산성도 낮다는 문제점이 지적되었다.As a way to improve the problems of the conventional aluminum MF capacitor, a method of changing the composition of the deposited metal has been proposed. For example, French Patent Application Publication No. 8413964 discloses the use of an alloy of aluminum and zinc as the deposition metal. However, in this method, it was pointed out that the deposition conditions of aluminum and zinc used as alloys are different from each other, and the vapor pressure difference between the two metals at a certain temperature is large, so that it is difficult to maintain uniformity of components in the deposited alloy layer and low productivity. .
미국특허 4,920,452, 일본공개특허공보 소 59-103323에는 알루미늄에 소량의 다른 금속, 예를 들면 구리나 구리와 크롬, 하프늄 등을 첨가하여 증착시키는 방법이 제시되었다. 이 방법에서, 다른 금속으로 구리를 사용하는 경우, 합금으로 사용되는 알루미늄과 구리의 증착조건이 유사하고 일정온도에서 증기압 차이도 작아서 증착된 합금층에서 성분이 균일하며 생산성도 높다는 장점이 있으나 알루미늄에 구리가 첨가됨에 따라 면저항값이 높아져서 일정한 면저항을 얻기 위해서는 증착층의 두께가 두꺼워야 하며 이에 따라 자기회복 특성이 나빠지고 플라스틱 필름에 열적손상이 가하여져 내전압이 낮아질 우려가 있다는 문제점이 있다.U.S. Patent 4,920,452 and Japanese Laid-Open Patent Publication No. 59-103323 disclose a method of depositing by adding a small amount of another metal, such as copper, copper, chromium, hafnium, or the like to aluminum. In this method, when copper is used as another metal, the deposition conditions of aluminum and copper, which are used as alloys, are similar, and the vapor pressure difference is small at a constant temperature, so that the components are uniform in the deposited alloy layer and the productivity is high. As copper is added, the thickness of the deposition layer must be thick in order to obtain a constant sheet resistance by increasing the sheet resistance, thereby deteriorating self-recovery characteristics and thermal damage to the plastic film, thereby lowering the breakdown voltage.
본 발명은 종래의 MF 콘덴서 제조용 알루미늄증착 플라스틱 필름이 지니고 있는 상기의 제반 문제점을 해결하고자, 자기특성이 우수하면서 장기간 사용하여도 캐패시턴스가 일정하게 유지되는 MF 콘덴서를 제조할 수 있는, 알루미늄증착 플라스틱 필름을 제공한다.The present invention is to solve the above problems of the conventional aluminum film-deposited plastic film for MF capacitor manufacturing, to produce an MF capacitor having excellent magnetic properties and constant capacitance even for long-term use, aluminum-deposited plastic film To provide.
이와 같은 본발명의 목적을 달성하기 위하여, 플라스틱 필름의 표면에 알루미늄박막을 증착하기 전 또는 증착한 후에, 알루미늄/구리 합금박막을 증착하는 것으로 이루어지는 제조방법이 제공된다.In order to achieve the object of the present invention, there is provided a manufacturing method comprising depositing an aluminum / copper alloy thin film before or after depositing an aluminum thin film on the surface of a plastic film.
도 1은 일반적인 권취형 MF콘덴서의 구조를 보인 사시도이다.1 is a perspective view showing the structure of a general winding-type MF capacitor.
도 2는 본 발명의 실시예 및 비교예로 제조된 권취형 콘덴서의 용적변화율 거동을 나타내는 그래프이다.Figure 2 is a graph showing the volume change rate behavior of the wound capacitors prepared in Examples and Comparative Examples of the present invention.
본발명에 따른 알루미늄증착 플라스틱 필름의 제조방법은, 플라스틱 필름의 표면에 알루미늄박막을 증착하기 전 또는 증착한 후에, 알루미늄/구리 합금박막을 증착하는 것으로 이루어진다.The method for producing an aluminum vapor-deposited plastic film according to the present invention consists of depositing an aluminum / copper alloy thin film before or after depositing an aluminum thin film on the surface of the plastic film.
예를 들어, 본발명에 따른 방법은 플라스틱 필름의 표면에 알루미늄/구리합금박막을 증착한 다음 그 위에 전기저항이 낮은 알루미늄 박막을 연속적으로 증착하는 것으로 이루어진다.For example, the method according to the present invention consists of depositing an aluminum / copper alloy thin film on the surface of a plastic film and subsequently depositing an aluminum thin film having low electrical resistance thereon.
또다른 예로써, 알루미늄 박막을 증착한 다음 그 위에 알루미늄/구리 합금박막을 연속적으로 증착하는 것으로 이루어진다.As another example, it consists of depositing an aluminum thin film followed by successively depositing an aluminum / copper alloy thin film thereon.
알루미늄-구리 합금박막은 플라스틱 필름에 알루미늄 박막을 적층하기전 또는 후에 증착되며, 알루미늄 박막과 알루미늄-구리 합금박막을 연속적으로 증착시킬 수 있다.The aluminum-copper alloy thin film is deposited before or after the aluminum thin film is laminated on the plastic film, and the aluminum thin film and the aluminum-copper alloy thin film may be continuously deposited.
본 발명의 방법에서 알루미늄 박막 또는 알루미늄/구리 합금박막은 기존에 금속박막을 증착하는데 이용되는 방법을 이용하여 증착할 수 있다. 예를 들어, 진공증착, 스퍼터링법, 화학기체증착법 등을 이용할 수 있으며, 바람직하게는 진공증착법을 이용한다.In the method of the present invention, an aluminum thin film or an aluminum / copper alloy thin film may be deposited using a method used to deposit a metal thin film. For example, vacuum deposition, sputtering, chemical gas deposition, or the like can be used, and preferably, vacuum deposition is used.
본 발명의 방법에서, 알루미늄 박막 및 알루미늄/구리 합금박막의 전체면저항값이 2-15 Ω/□가 되도록 하는 것이 바람직하다.In the method of the present invention, it is preferable that the total sheet resistance values of the aluminum thin film and the aluminum / copper alloy thin film be 2-15 mA / □.
본 발명의 방법에서, 알루미늄-구리 합금박막은 구리를 알루미늄에 대해 0.5∼10 중량%를 함유하며, 합금박막의 면저항값이 4-300 Ω/□ 범위가 되는 두께로 증착시킨다.In the method of the present invention, the aluminum-copper alloy thin film contains copper in an amount of 0.5 to 10% by weight with respect to aluminum, and is deposited to a thickness such that the sheet resistance value of the alloy thin film is in the range of 4-300 kPa / square.
본 발명에서 알루미늄에 대한 구리의 첨가량이 0.5 %보다 낮은 경우 구리의 첨가 효과가 거의 없으며,10 % 이상이면, 구리의 응축잠열이 72.7 kcal/mole로 알루미늄의 응축잠열 69.5 kcal/mole보다 크므로, 플라스틱 필름에 열적손상이 가하여져 내전압이 낮아질 우려가 있고 전기저항도 너무 커진다.In the present invention, when the amount of copper added to aluminum is less than 0.5%, there is almost no effect of adding copper, and if it is 10% or more, the latent heat of copper condensation is 72.7 kcal / mole, which is greater than 69.5 kcal / mole. Thermal damage is applied to the plastic film, which may lower the withstand voltage and the electrical resistance is too large.
알루미늄/구리 합금박막의 면저항값을 4-300 Ω/□범위로 한정한 이유는, 면저항값이 4 Ω/□보다 낮으면 합금박막의 두께가 상대적으로 두꺼워져 알루미늄의 증착두께가 너무 얇아지며, 합금박막의 면저항이 300 Ω/□보다 높으면 합금박막의 증착두께가 너무 얇아져서 본 발명에서 얻고자 하는 2층 박막의 효과를 얻기 어렵기 때문이다.The reason why the sheet resistance value of the aluminum / copper alloy thin film is limited to the range of 4-300 Ω / □ is that when the sheet resistance value is lower than 4 Ω / □, the thickness of the alloy thin film becomes relatively thick, and the deposition thickness of aluminum becomes too thin, This is because when the sheet resistance of the alloy thin film is higher than 300 GPa / square, the deposition thickness of the alloy thin film becomes too thin to obtain the effect of the two-layer thin film to be obtained in the present invention.
한편, 본 발명에서 진공증착시 플라스틱 필름으로는 폴리에틸렌 테레프탈레이트, 폴리프로필렌이나 폴리카보네이트 등이 사용될 수 있다. 플라스틱 필름의 두께는 2내지 10 ㎛가 바람직하다.Meanwhile, in the present invention, polyethylene terephthalate, polypropylene or polycarbonate may be used as the plastic film during vacuum deposition. The thickness of the plastic film is preferably 2 to 10 mu m.
플라스틱 필름의 종류와 두께에 따라서 MF 콘덴서의 전기적 특성이 변화하게 되므로, 요구되는 특성에 맞추어 플라스틱 필름의 종류와 두께를 선택할수 있다.Since the electrical properties of the MF capacitor change according to the type and thickness of the plastic film, the type and thickness of the plastic film can be selected according to the required properties.
이하, 본 발명을 실시예를 들어 자세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to Examples.
[실시예 1]Example 1
8 ㎛ 두께의 폴리프로필렌 필름상의 비증착부의 폭을 2 mm로 하고 증착폭을 48 mm로 하여,5 중량% 구리를 함유하는 알루미늄/구리 합금박막을 면저항값으로 15 Ω/□의 두께로 진공증착시킨 다음, 그 위에 알루미늄 박막을, 전체면저항값이 4 Ω/□가 되도록 연속적으로 증착시켜 알루미늄증착 플라스틱 필름을 제조하였다.얻어진 알루미늄증착 플라스틱 필름을 사용하여 통상적인 MF콘덴서 제조공정에 따라, 권취→압축→용사→리드선 결선으로 이어지는 일련의 공정을 수행하여 10 μF용량의 MF 콘덴서를 제조하였다.Vacuum deposition of an aluminum / copper alloy thin film containing 5% by weight copper with a thickness of 15 Ω / □ with a sheet resistance of 2 mm and a deposition width of 48 mm on a polypropylene film having a thickness of 8 μm. After that, the aluminum thin film was continuously deposited thereon so as to have a total surface resistance of 4 kW / square, to prepare an aluminum vapor-deposited plastic film. The obtained aluminum-deposited plastic film was wound in accordance with a conventional MF capacitor manufacturing process. A series of processes leading to compression → spray → lead wire connection were performed to prepare a 10 μF capacitor.
[실시예 2]Example 2
8 μm 두께의 폴리프로필렌 필름상의 비증착부의 폭을 2 mm로 하고 증착폭을 48 mm로 하여, 알루미늄박막을 면저항값으로 4 Ω/□의 두께로 진공증착시킨 다음, 그 위에 0.5 중량% 구리를 함유하는 알루미늄/구리 합금박막을, 전체면저항값이 2 Ω/□가 되도록 연속적으로 증착시켜 알루미늄증착 플라스틱 필름을 제조하였다.얻어진 알루미늄증착, 플라스틱 필름을 사용하여 통상적인 MF콘덴서 제조공정에 따라, 권취→압축→용사→리드선 결선으로 이어지는 일련의 공정을 수행하여 10 μF용량의 MF 콘덴서를 제조하였다.An aluminum thin film was vacuum-deposited to a thickness of 4 Ω / □ with a sheet resistance of 2 mm and a deposition width of 48 mm on a polypropylene film having a thickness of 8 μm, and 0.5 wt% copper was placed thereon. The aluminum / copper alloy thin film contained was continuously deposited so as to have a total surface resistance of 2 kPa / square. An aluminum vapor-deposited plastic film was produced. The obtained aluminum vapor-deposited plastic film was wound in accordance with a conventional MF capacitor manufacturing process. A series of processes followed by compression, spraying and lead wire connection were performed to prepare a 10 μF capacitor.
[실시예 3]Example 3
8 ㎛ 두께의 폴리프로필렌 필름상의 비증착부의 폭을 2 mm로 하고 증착폭을 48 mm로 하여,10 중량% 구리를 함유하는 알루미늄/구리 합금박막을 면저항값으로 300 Ω/□의 두께로 진공증착시킨 다음, 그 위에 알루미늄 박막을, 전체 면저항값이 8 Ω/□가 되도록 연속적으로 증착시켜 알루미늄증착 플라스틱 필름을 제조하였다. 얻어진 알루미늄증착 플라스틱 필름을 사용하여 통상적인 MF 콘덴서 제조공정에 따라, 권취→압축→용사→리드선 결선으로 이어지는 일련의 공정을 수행하여 10 μF용량의 MF 콘덴서를 제조하였다.Vacuum deposition of an aluminum / copper alloy thin film containing 10% by weight copper with a thickness of 300 Ω / □ with a sheet resistance of 2 mm and a deposition width of 48 mm on a polypropylene film having a thickness of 8 μm. After that, an aluminum thin film was deposited thereon, so that the total sheet resistance value was 8 kPa / square, and subsequently, an aluminum vapor-deposited plastic film was prepared. Using the obtained aluminum vapor-deposited plastic film, a series of processes ranging from winding to compression to spraying to lead wire connection were carried out according to a conventional MF capacitor manufacturing process to prepare a 10 μF capacitor.
[실시예 4]Example 4
8 μm 두께의 폴리프로필렌 필름상의 비증착부의 폭을 2 mm로 하고 증착폭을 48 mm로 하여, 알루미늄박막을 면저항값으로 17.7Ω /□의 두께로 진공증착시킨 다음, 그 위에 5 중량% 구리를 함유하는 알루미늄/구리 합금박막을, 전체 면저항값이 15 Ω/□가 되도록 연속적으로 증착시켜 알루미늄증착 플라스틱 필름을 제조하였다. 얻어진 알루미늄증착 플라스틱 필름을 사용하여 통상적인 MF 콘덴서 제조공정에 따라, 권취→압축→용사→리드선 결선으로 이어지는 일련의 공정을 수행하여 10 μF용량의 MF 콘덴서를 제조하였다.With the width of the non-deposited portion on the polypropylene film having a thickness of 8 μm being 2 mm and the deposition width being 48 mm, the aluminum thin film was vacuum-deposited to a thickness of 17.7 Ω / □ as a sheet resistance value, and 5 wt% copper was deposited thereon. The aluminum / copper alloy thin film containing was vapor-deposited continuously so that the total sheet resistance might be set to 15 kPa / square, and the aluminum vapor-deposited plastic film was produced. Using the obtained aluminum vapor-deposited plastic film, a series of processes ranging from winding to compression to spraying to lead wire connection were carried out according to a conventional MF capacitor manufacturing process to prepare a 10 μF capacitor.
[비교예][Comparative Example]
8 ㎛ 두께의 폴리프로필렌 필름상의 비증착부의 폭을 2 mm로 하고 증착폭을 48 mm로 하여, 알루미늄박막을 면저항값으로 4 Ω/□의 두께로 진공증착시켜 알루미늄증착 플라스틱 필름을 제조하였다. 얻어진 알루미늄증착 플라스틱 필름을 사용하여 통상적인 MF 콘덴서 제조공정에 따라, 권취→압축→용사→리드선 결선으로 이어지는 일련의 공정을 수행하여 10 μF용량의 MF 콘덴서를 제조하였다.An aluminum vapor-deposited plastic film was produced by vacuum-depositing an aluminum thin film to a thickness of 4 dl / square with a sheet resistance value of 2 mm and a deposition width of 48 mm on a polypropylene film having a thickness of 8 µm. Using the obtained aluminum vapor-deposited plastic film, a series of processes ranging from winding to compression to spraying to lead wire connection were carried out according to a conventional MF capacitor manufacturing process to prepare a 10 μF capacitor.
[실시예 5]Example 5
이상의 실시예 및 비교예에서 얻어진 MF 콘덴서의 특성을 알아보기 위하여 이들 MF 콘덴서를 60 ℃,90 % 상대습도의 항온항습조 안에 넣고 정격전압 440볼트의 1.4배인 616V,60Hz의 교류를 인가하면서 방치시간 변화에 따른 캐패시턴스의 변화를 측정하였으며, 그 결과를 도 2에 나타낸다.In order to examine the characteristics of the MF capacitors obtained in the above examples and comparative examples, these MF capacitors were placed in a constant temperature and humidity chamber at 60 ° C. and 90% relative humidity, and allowed to stand while applying alternating current of 616V and 60Hz, which is 1.4 times the rated voltage of 440 volts. The change in capacitance with change was measured, and the result is shown in FIG. 2.
도 2의 그래프에서와 같이 본 발명의 실시예 콘덴서가 종래의 MF콘덴서에 비해 시간의 경과에 따른 캐패시턴스 변화가 적음을 알 수 있다.As shown in the graph of Figure 2 it can be seen that the embodiment capacitor of the present invention is less capacitance change over time than the conventional MF capacitor.
본 발명에 따른 알루미늄증착 플라스틱 필름은, 자기특성이 우수하면서 장기간 사용하여도 캐패시턴스가 일정하게 유지되는 MF 콘덴서를 제조할 수 있으며, 또한 식품 저장용 필름을 제조하는데 이용될 수 있다.The aluminum-deposited plastic film according to the present invention can produce an MF capacitor having excellent magnetic properties and a constant capacitance even for long-term use, and can also be used to produce a film for food storage.
Claims (6)
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