KR100206093B1 - 초미소 피치 검사용 적층 콘택트 프로우브 - Google Patents
초미소 피치 검사용 적층 콘택트 프로우브 Download PDFInfo
- Publication number
- KR100206093B1 KR100206093B1 KR1019960017863A KR19960017863A KR100206093B1 KR 100206093 B1 KR100206093 B1 KR 100206093B1 KR 1019960017863 A KR1019960017863 A KR 1019960017863A KR 19960017863 A KR19960017863 A KR 19960017863A KR 100206093 B1 KR100206093 B1 KR 100206093B1
- Authority
- KR
- South Korea
- Prior art keywords
- contact probe
- contact
- ultra
- probe
- needle
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 93
- 238000007689 inspection Methods 0.000 title claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910000760 Hardened steel Inorganic materials 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229920001410 Microfiber Polymers 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000003658 microfiber Substances 0.000 claims 1
- 238000010791 quenching Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 10
- 238000005520 cutting process Methods 0.000 abstract description 4
- 239000011295 pitch Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (5)
- 다수개의 콘택트 프프로우브를 포함하여 구성되는 초미소 피치의 검사용 적층 콘택트 프로우브에 있어서, 상기 다수개의 콘택트 프로우브의 각각은 초박판으로 형성되며; 니들부의 접촉부분만을 제외하고 콘택트 프로우브에 절연체 피막이 피복되고; 콘택트 프로우브는 상기 니들부로부터 연장되는 가늘고 긴 세그먼트부를 가지며; 상기 가늘고 긴 세그먼트부는 니들부의 뒤쪽의 초박판을 절결 형성하여 마련되어, 상기 니들부가 절결형성의 방향에 대하여 수직으로 교차하는 방향으로 탄성적으로 이동가능하며; 상기 다수개의 콘택트 프로우브들이 적층된 초미소 피치 검사용 적층 콘택트 프로우브.
- 제1항에 있어서, 상기 초박판은 강(鋼), 동합금, 텅스텐 또는 담금질 경화된 강판으로 만들어지는 초미소 피치 검사용 적층 콘택트 프로우브.
- 제1항에 있어서, 상기 초박판의 두께는 120㎛ 이하인 초미소 피치 검사용 적층 콘택트 프로우브.
- 제1항에 있어서, 상기 적층 콘택트 프로우브에는 안내핀이 삽입되는 구멍이 마련되며, 그 안내핀은 콘택트 프로우브를 수용하기 위한 프레임몸체상에 고정됨으로써, 상기 적층 콘택트 프로우브가 고정되는 초미소 피치 검사용 적측 콘택트 프로우브.
- 제1항에 있어서, 니들부의 탄성력을 제어하도록, 상기 니들부와 결합된 가늘고 긴 세그먼트의 하부끝나상에 홈형상의 절결부가 형성되는 초미소 피치 검사용 적층 콘택트 프로우브.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7149789A JP2819452B2 (ja) | 1994-07-21 | 1995-05-25 | 超微小ピッチ検査用積層プローブコンタクト |
JP95-149789 | 1995-05-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960043076A KR960043076A (ko) | 1996-12-23 |
KR100206093B1 true KR100206093B1 (ko) | 1999-07-01 |
Family
ID=15482757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960017863A KR100206093B1 (ko) | 1995-05-25 | 1996-05-25 | 초미소 피치 검사용 적층 콘택트 프로우브 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100206093B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102212982B1 (ko) * | 2015-10-15 | 2021-02-04 | 한국전기연구원 | 반도체 검사용 프로브 핀 제조방법 |
-
1996
- 1996-05-25 KR KR1019960017863A patent/KR100206093B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR960043076A (ko) | 1996-12-23 |
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