KR100201170B1 - Vapor drying apparatus, cleaning apparatus incorporating the same and vapor drying method - Google Patents

Vapor drying apparatus, cleaning apparatus incorporating the same and vapor drying method Download PDF

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Publication number
KR100201170B1
KR100201170B1 KR1019950040162A KR19950040162A KR100201170B1 KR 100201170 B1 KR100201170 B1 KR 100201170B1 KR 1019950040162 A KR1019950040162 A KR 1019950040162A KR 19950040162 A KR19950040162 A KR 19950040162A KR 100201170 B1 KR100201170 B1 KR 100201170B1
Authority
KR
South Korea
Prior art keywords
vapor drying
same
cleaning apparatus
drying method
incorporating
Prior art date
Application number
KR1019950040162A
Other languages
English (en)
Inventor
Hirosy Danaka
Nobuaky Doi
Masasy Omory
Hiroaky Isikawa
Original Assignee
Ryoden Semiconductor Syst Eng
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryoden Semiconductor Syst Eng, Mitsubishi Electric Corp filed Critical Ryoden Semiconductor Syst Eng
Application granted granted Critical
Publication of KR100201170B1 publication Critical patent/KR100201170B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • F26B21/145—Condensing the vapour onto the surface of the materials to be dried
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
KR1019950040162A 1994-11-07 1995-11-07 Vapor drying apparatus, cleaning apparatus incorporating the same and vapor drying method KR100201170B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27210294 1994-11-07
JP7003247A JPH08189768A (ja) 1994-11-07 1995-01-12 蒸気乾燥装置、それを組込んだ洗浄装置および蒸気乾燥方法

Publications (1)

Publication Number Publication Date
KR100201170B1 true KR100201170B1 (en) 1999-06-15

Family

ID=26336784

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950040162A KR100201170B1 (en) 1994-11-07 1995-11-07 Vapor drying apparatus, cleaning apparatus incorporating the same and vapor drying method

Country Status (3)

Country Link
US (2) US5608974A (ko)
JP (1) JPH08189768A (ko)
KR (1) KR100201170B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100753091B1 (ko) 2006-09-28 2007-08-31 성신공업 주식회사 엘피지용 외장형 펌프의 냉각 장치

Families Citing this family (33)

* Cited by examiner, † Cited by third party
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US5715612A (en) * 1995-08-17 1998-02-10 Schwenkler; Robert S. Method for precision drying surfaces
US5862605A (en) * 1996-05-24 1999-01-26 Ebara Corporation Vaporizer apparatus
US6045624A (en) * 1996-09-27 2000-04-04 Tokyo Electron Limited Apparatus for and method of cleaning objects to be processed
JP3230051B2 (ja) * 1997-05-16 2001-11-19 東京エレクトロン株式会社 乾燥処理方法及びその装置
JPH10321585A (ja) * 1997-05-22 1998-12-04 Mitsubishi Electric Corp 乾燥装置および乾燥方法
JPH10321584A (ja) * 1997-05-22 1998-12-04 Mitsubishi Electric Corp 乾燥装置および乾燥方法
KR19990010200A (ko) * 1997-07-15 1999-02-05 윤종용 감압식 건조 장치를 이용하는 반도체장치 건조방법
JPH11176798A (ja) * 1997-12-08 1999-07-02 Toshiba Corp 基板洗浄・乾燥装置及び方法
US6108932A (en) * 1998-05-05 2000-08-29 Steag Microtech Gmbh Method and apparatus for thermocapillary drying
JP2963443B1 (ja) * 1998-06-19 1999-10-18 キヤノン販売株式会社 半導体装置の製造装置
US6219936B1 (en) * 1998-11-24 2001-04-24 Toho Kasei Co., Ltd. Wafer drying device and method
JP2001291698A (ja) * 2000-04-10 2001-10-19 Nec Corp 処理装置および処理方法
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
KR100447285B1 (ko) * 2002-09-05 2004-09-07 삼성전자주식회사 기판 건조 장치
JP4275488B2 (ja) * 2002-10-28 2009-06-10 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US6918192B2 (en) * 2002-11-07 2005-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate drying system
DE102004044394A1 (de) * 2003-11-04 2005-06-16 Samsung Electronics Co., Ltd., Suwon Vorrichtung und Verfahren zum Trocknen von Halbleitersubstraten
JP3960332B2 (ja) * 2004-11-29 2007-08-15 セイコーエプソン株式会社 減圧乾燥装置
US7637029B2 (en) * 2005-07-08 2009-12-29 Tokyo Electron Limited Vapor drying method, apparatus and recording medium for use in the method
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP4762835B2 (ja) 2006-09-07 2011-08-31 東京エレクトロン株式会社 基板処理方法、基板処理装置、プログラムおよびプログラム記録媒体
JP4805862B2 (ja) * 2007-02-21 2011-11-02 富士通セミコンダクター株式会社 基板処理装置、基板処理方法、及び半導体装置の製造方法
EP2568243B1 (en) * 2011-09-12 2013-11-13 ABB Technology AG Vapour phase drying apparatus
JP2012039163A (ja) * 2011-11-24 2012-02-23 Jet Co Ltd 基板処理装置
JP6543481B2 (ja) 2015-02-23 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 蒸気供給装置、蒸気乾燥装置、蒸気供給方法および蒸気乾燥方法
US9829249B2 (en) * 2015-03-10 2017-11-28 Mei, Llc Wafer dryer apparatus and method
JP2018053299A (ja) * 2016-09-28 2018-04-05 株式会社日立国際電気 基板処理装置、及び断熱配管構造
JP6568838B2 (ja) * 2016-10-18 2019-08-28 上村工業株式会社 乾燥装置
US10890377B2 (en) * 2018-05-01 2021-01-12 Rochester Institute Of Technology Volcano-shaped enhancement features for enhanced pool boiling
US10801777B2 (en) * 2018-09-30 2020-10-13 HKC Corporation Limited Baking device
CN111578680B (zh) * 2019-02-15 2022-01-11 北京北方华创微电子装备有限公司 一种晶圆的干燥方法
JP7386120B2 (ja) * 2020-04-02 2023-11-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11287185B1 (en) 2020-09-09 2022-03-29 Stay Fresh Technology, LLC Freeze drying with constant-pressure and constant-temperature phases

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4736758A (en) * 1985-04-15 1988-04-12 Wacom Co., Ltd. Vapor drying apparatus
US5371950A (en) * 1990-02-23 1994-12-13 S & K Products International, Inc. Isopropyl alcohol vapor dryer system
JP2639771B2 (ja) * 1991-11-14 1997-08-13 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
US5273589A (en) * 1992-07-10 1993-12-28 Griswold Bradley L Method for low pressure rinsing and drying in a process chamber
JP2902222B2 (ja) * 1992-08-24 1999-06-07 東京エレクトロン株式会社 乾燥処理装置
JP3003016B2 (ja) * 1992-12-25 2000-01-24 東京エレクトロン株式会社 処理装置及び処理方法
US5575079A (en) * 1993-10-29 1996-11-19 Tokyo Electron Limited Substrate drying apparatus and substrate drying method
US5539995A (en) * 1994-03-16 1996-07-30 Verteq, Inc. Continuous flow vapor dryer system
US5535525A (en) * 1994-03-17 1996-07-16 Vlsi Technology, Inc. Vapor/liquid phase separator for an open tank IPA-dryer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100753091B1 (ko) 2006-09-28 2007-08-31 성신공업 주식회사 엘피지용 외장형 펌프의 냉각 장치

Also Published As

Publication number Publication date
US5709037A (en) 1998-01-20
US5608974A (en) 1997-03-11
JPH08189768A (ja) 1996-07-23

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A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
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Payment date: 20070223

Year of fee payment: 9

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