KR0174328B1 - Adhesive tape - Google Patents

Abstract

The present invention relates to a thermal adhesive tape for a carrier tape, more specifically, a thermal adhesive tape in which a transparent thermoplastic film layer, a metal vapor deposition layer and a sealant layer are continuously laminated is used as a cover tape of a carrier tape, , An appropriate peel strength, an antistatic property, a transparency, and the like.

Description

Thermal Adhesive Tape for Carrier Tape

1 is a cross-sectional view of a typical carrier tape,

FIG. 2 is a cross-sectional view of the thermoadhesive tape according to the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS

1: Support body 2: Cover tape

3: Bottom tape 4: Transport drilling

5: chip-type electronic component mounting hole 2a: transparent thermoplastic film layer

2b: metal vapor deposition layer 2c: sealant layer

The present invention relates to a thermal adhesive tape for a carrier tape, more specifically, a thermal adhesive tape in which a transparent thermoplastic film layer, a metal vapor deposition layer and a sealant layer are continuously laminated is used as a cover tape of a carrier tape, , An appropriate peel strength, an antistatic property, a transparency, and the like.

Conventionally, a chip-type electronic component has been merely assembled on a printed circuit board (a PCB) using tweezers or the like, but workability such as reliability and promptness has been poor and improvement thereof has been urgently required. In recent years, technologies for automatic packaging and assembling of such chip-type electronic parts have been developed. Packing forms for storing and transporting such chip-type electronic parts have also been developed in various ways such as bulk packaging, magazine packaging and tape reel.

A typical carrier tape introduced into the tape reel system of the packaging method of the chip-type electronic component is shown in Fig. The carrier tape has a constitution in which a support 1 and a thermal adhesive tape on which a thermosetting adhesive agent is uniformly applied on one side are attached as a cover tape 2 on the upper side of the support 1, Another supporting member 1 is provided with a transporting perforation 4 for transporting and a plurality of chip-type electronic components mounted in a longitudinally central portion of the support in a shape suitable for chip-type electronic component shape, And has a hole 5 for use.

Further, in the packaging process using the carrier tape, a thermal adhesive tape is heated and pressed on one surface of the support body 1, the chip-type electronic component is housed in an opened hole on the other surface of the support body 1, The adhesive tape is heated and pressed to be packaged by a taping process in which the support body 1 on which the chip-type electronic component is placed is packaged in a sandwich shape. The carrier tape on which such chip-type electronic components are packed is manufactured by peeling off the adhesive tape on one surface at the surface mounting surface on the circuit board and sucking the exposed chip-type electronic component by the suction tool, Lt; / RTI >

The following properties are required for the thermal adhesive tape used in the production of such a tape reel type carrier tape.

First, as described above, since the thermoadhesive tape is adhered by thermocompression bonding and peeled off again in the surface mounting process, a peel strength by an appropriate thermal adhesive force is required. Second, the antistatic property of the thermally adhesive tape is required to control the generation of static electricity generated by the interaction between the chip-type electronic component and the thermally adhesive tape. Thirdly, transparency and the like for identifying mounted chip type electronic parts are basically required. Fourthly, environmental tolerance is required for long-term storage after manufacture of carrier tape. Fifth, anti-blocking property is required to provide a good releasability when the thermo-adhesive tape wound on the reel before being packaged is used.

In the above-mentioned physical properties, if the thermal bonding strength is too low, the bonding portion is detached due to the stress generated on the bonding surface when the finished carrier tape in which the chip is embedded is wound on the reel, If the thermal bond strength is too high, if the support is not peeled off from the tape or if the support is made of cardboard, the paper is caught and caused to hinder the mounting process by the automated line. In general, It is preferable to maintain 10 to 60 gf / mm. In addition, when excessive static electricity is generated, a chip type electronic part seated in a hole for mounting a chip type electronic component in the packaging process is caused to protrude by a repulsive force, and a chip is stuck to the surface of the thermal adhesive tape during the mounting process, do. In addition, if the thermal adhesive tape has a low softening point, there is a possibility that the chip-type electronic component and the thermal adhesive tape are adhered to each other due to stickiness of the adhesive layer.

A conventional method for producing a thermal adhesive tape for a carrier tape is largely divided into a method of improving the antistatic property and a method of improving the thermal adhesion by changing the composition of the sealant layer.

As a method for improving the antistatic property, a method of mixing an antistatic agent into a sealant layer (Japanese Utility Model Application Sho 63-149868, Japanese Patent Application Laid-Open No. 5-8339) and a conductive powder are dispersed in an aqueous solution together with a water- (Japanese Patent Application Laid-Open Nos. 4-367457, 7-251860, and European Patent Publication No. 0501068 Al (1992)). However, in the case of the former, it is difficult to control transparency and control the adhesive strength The quality control is difficult. In the latter case, the manufacturing cost of the water dispersion coating solution and the drying process are increased.

The improvement of the sealant layer is a method of improving the environmental resistance by using a relatively high softening point and a low melting point sealant as a method for improving the environmental resistance of the sealant layer and a method of using a tackifier having a high softening point Japanese Patent Application Laid-open No. 60-105260) and an ethylene copolymer as an adhesive layer (JP-A No. 7-130899), an adhesive layer is applied with an organic solution in which styrene-butadiene and hydrogenated styrene-butadiene rubber are dissolved (Japanese Patent Application Laid-Open No. 4-139287). However, each of these methods is a cause of an increase in manufacturing cost and an environmental problem, so that there is room for improvement.

Accordingly, in the present invention, efforts have been made to solve the problems of the conventional thermoadhesive tape and to manufacture a thermoadhesive tape for a carrier tape by a more economical manufacturing method. As a result, a conventional thermoadhesive tape comprising a transparent thermoplastic film layer and a sealant layer A metal deposition layer of aluminum, copper, zinc or the like was introduced into a thermal adhesive tape for carrier tapes to provide antistatic properties. A resin having a low melting point and a high softening point was used as the sealant layer, and corona discharge treatment or plasma treatment And thus the present invention has been completed.

Hereinafter, the present invention will be described in detail.

The present invention is characterized by a thermal adhesive tape for a carrier tape comprising a transparent thermoplastic film layer and a sealant layer, wherein the metal adhesive layer selected from aluminum, copper and zinc is introduced.

Hereinafter, the present invention will be described in detail.

The present invention relates to a thermally adhesive tape comprising a transparent thermoplastic film layer, a metal vapor deposition layer and a sealant layer, wherein the metal vapor deposition layer is newly introduced to obtain an antistatic effect, and the sealant layer comprises a resin having a low melting point and a high softening point Corona discharge treatment or plasma treatment was performed to greatly improve the thermal adhesion.

The laminated state of the thermoadhesive tape according to the present invention is shown in FIG. 2, which will be described in more detail as follows.

In order to maintain sufficient tensile strength of the transparent thermoplastic film layer 2a and prevent curling, it is preferable to use a polyester film, a polypropylene film and a nylon film of biaxially stretching, and more preferably, A polyester film is used, and most preferably, the biaxially stretched polyester film body is subjected to corona discharge treatment. The transparent thermoplastic film layer 2a preferably has a thickness of 6 to 30 占 퐉 or one or more films of different materials and preferably has a total thickness of 10 to 60 占 퐉. It is very effective in preventing tensile strength and curl.

In the metal deposition layer 2b, a metal selected from aluminum, copper, and zinc is deposited as a newly introduced antistatic layer to prevent electrification, so that the metal deposition layer 2b has a surface resistivity of 10 ¹³ Ω or less, thereby exhibiting an antistatic effect. The metal deposition method used in the present invention may be a conventional method, for example, by vacuum deposition, sputtering, ion plating or the like, and particularly preferably by vacuum deposition To deposit the metal in a semi-continuous manner. The deposition rate of the metal is maintained in the range of 50 to 100 angstroms. If the metal deposition is less than 50 angstroms, the uniformity of the deposition is somewhat reduced, and the electrostatic charge generation rate is increased.

The sealant layer 2c was subjected to a corona discharge treatment or a plasma treatment to impart polarity to the surface to thereby complement the thermal adhesiveness and to use a resin having a low melting point of 90 to 110 占 폚 and a high softening point of 85 to 100 占 폚 The possibility that the sealant layer of the thermal adhesive tape becomes sticky due to the heat accumulated during the packaging and transportation and is adhered to the chip-type electronic component is excluded.

The resin that can be used for the sealant layer 2c according to the present invention is low density polyethylene, ethylene copolymer, modified polyethylene, and the like. At this time, the ethylene copolymer may be ethylene-vinyl acetate, ethylene-acrylic acid, ethylene-ethylene acrylate, ethylene-methacrylate and the like. It is preferable that the content of comonomer is less than 5 wt% . As the modified polyethylene, polyethylene in which maleic anhydride or vinyl acetate is grafted is preferable. Further, in order to improve the blocking resistance of the thermally adhesive tape, it is preferable that the surface of the sealant layer 2a is subjected to a mat treatment when the resin is applied.

An anchor effect can also be obtained by priming the metal deposition layer 2b and the sealant layer 2c. At this time, as the resin for the primer, polyurethane or polyester resin generally used is used, and a sufficient effect can be exhibited even with a thin layer of 5 탆 or less.

As described above, in the present invention, a metal deposition layer is introduced to obtain an antistatic effect. A resin having a low melting point and a high softening point is used as a sealant layer for thermal adhesion, and the resin is subjected to corona discharge treatment or plasma treatment. This makes it possible to produce a thermo-adhesive tape with a lower processing cost than the prior art.

The thermal adhesive tape of the present invention is required for thermally adhering a carrier tape containing a chip-type electronic component, but it is desirable that the peel strength is maintained in the range of 10 to 60 gf / mm in order to mount the chip-type electronic component on a circuit board.

Hereinafter, the present invention will be described in further detail with reference to the following examples, but the present invention is not limited thereto.

[Examples 1 to 6 and Comparative Example 6]

A biaxially stretched polyester film (SP 65) was used as the transparent thermoplastic film layer 2a, and a metal was deposited thereon by a semi-continuous vacuum deposition method as shown in Table 1 below.

A primer coating was performed on the metal deposition layer 2b using a polyurethane anchor (MOLTON Co., AA 5455). Then, a resin as shown in the following Table 1 was laminated to 30 mu m, and then subjected to a corona discharge treatment to form a sealant layer 2c) to form a thermally adhesive tape.

[Comparative Example 1]

A thermal adhesive tape was produced in the same manner as in Example 1 except that the sealant layer 2c was not subjected to the corona discharge treatment.

[Comparative Example 2 and Comparative Example 4]

A biaxially stretched polyester film (SP 65) was used as the transparent thermoplastic film layer 2a and laminated on the transparent thermoplastic film layer 2a without a metal deposition process to a thickness of 30 μm as shown in Table 1, A corona discharge treatment was performed to form a sealant layer 2c, thereby manufacturing a thermally adhering tape.

[Comparative Example 3 and Comparative Example 5]

A biaxially stretched polyester film (SP 65) was used as the transparent thermoplastic film layer 2a, and primer coating was performed using a polyurethane anchor (Morton Co., AA 5455). 6% by weight of an antistatic master batch (Chaoyang, ASL 510) was mixed with the resin as shown in the following Table 1 on the primer layer 3 to form a 30 占 퐉 laminate, and then subjected to a corona discharge treatment to form a sealant layer 2c, To prepare an adhesive tape.

[Experimental Example]

The properties of the thermoadhesive tapes prepared in Examples 1 to 6 and Comparative Examples 1 to 6 were measured by the following methods.

180 ° peel strength: An adhesive tape cut to a width of 5.2 mm was thermocompression bonded (with a heating temperature of 160 ° C, a pressure of 2 kg / cm 2, and a pressure of 2 kg / cm 2) using a TWA- At a rate of 4 m / min), and then left at 23 캜 for 1 day, and then measured using a tensile strength meter (INSTRON, UTM) at 23 캜 and a tensile rate of 300 mm / min.

Surface resistivity: The RH of 50% set in the packaging process and the surface resistivity after aging at 60 ° C for 24 hours were measured.

Transparency: Judged by visual confirmation of mounted chip-type electronic parts.

○: Can be confirmed with the naked eye ×: Can not be confirmed with the naked eye

· Environmental test: chip-type electronic components were packed with carrier tape, and aging test was conducted at constant temperature for changes in transportation and storage.

○: chip and adhesive tape do not adhere, ×: chip and adhesive tape are bonded.

· Blocking resistance: When the carrier tape was wrapped around the roll tape, it was tested whether it could block the workability because it was not loosened freely in the packaging process due to block kinking due to the environmental changes during storage and transportation.

○: Blocking did not occur, ×: Blocking occurred.

According to Table 2, the thermal adhesive tape having the metal deposition layer 2b deposited with 50 to 100 Å of metal according to the present invention has a surface resistivity of 10 OMEGA or less and has an antistatic function. However, in the case of Comparative Example 2 and Comparative Example 4 which are not subjected to the antistatic treatment, it is difficult to perform a desired taping process due to the generation of static electricity. In order to obtain an antistatic effect by incorporating an antistatic master batch in place of the metal deposition layer 2b In Comparative Examples 3 and 5, the peel strength is reduced by half, and the surface resistivity increases with time.

The sealant (2c) layer is formed by using low-density polyethylene or ethylene-vinyl acetate (not more than 5% by weight of vinyl acetate) having a relatively low melting point (90 to 110 ° C) and a high softening point (85 to 100 ° C) The polarity of the surface was added to compensate for the thermal adhesiveness and the adhesiveness of the sealant layer of the thermal adhesive tape to the chip type electronic component due to the heat accumulated during the packaging and transportation was excluded. In Comparative Example 6, the ethylene copolymer having a vinyl acetate comonomer content exceeding 5% by weight had a softening point of 70 캜 and had a problem that the electronic component and the thermal adhesive tape adhered after aging at 60 캜 for 24 hours As the tape is blocked on the roll, blockking can occur when the tape is wound in the packaging process, which is a problem.

Claims (5)

Wherein a metal vapor deposition layer in which at least one metal selected from the group consisting of aluminum, copper and zinc is deposited at a thickness of 50 to 100 angstroms is introduced in the thermal adhesive tape for carrier tape comprising a transparent thermoplastic film layer and a sealant layer, And a sealant layer having a corona discharge treatment or a plasma treatment is formed thereon. The transparent thermoplastic film layer according to claim 1, wherein the transparent thermoplastic film layer is formed by laminating one to three layers of films of the same or different materials selected from a biaxially stretched polyester film, a polypropylene film and a nylon film. Adhesive tape. The thermally adhesive tape for carrier tape according to claim 1 or 2, wherein the transparent thermoplastic film layer has a thickness of 10 to 60 占 퐉. The thermal adhesive tape for a carrier tape according to claim 1, wherein the sealant layer is made of a resin selected from polyethylene, ethylene copolymer and modified polyethylene having a softening point of 90 to 110 캜. The thermal adhesive tape for carrier tape according to claim 1, wherein a primer treatment is applied between the metal deposition layer and the sealant layer.