JPH0551053A - Heat resistant cover tape - Google Patents

Abstract

PURPOSE:To improve the heat resistance of a cover tape, and make it possible to perform baking process under a condition in which a lid is placed on a carrier tape in which a small sized electronic component, especially an active element such as an IC, etc., sealed by a resin is stored. CONSTITUTION:For a cover tape 1 which is attached on a carrier tape 2 with a large number of cavities to store an electronic component 4, a normal temperature adhesive resin layer 13 is formed on one surface of a transparent base film 11 of which the shrinkage factor under a heat treatment at 105 deg.C-30min is 0.5% or less, and the visible ray resin layer 13, a transparent mask film 14, which is wider than the width of the cavity 3 and narrower than said transparent base film 11, and of which the visible ray permeability is 50% or higher, is attached.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various small electronic parts, precision parts and surface mounting parts such as ICs, especially ICs, etc. The present invention relates to a heat-resistant cover tape that serves as a lid for a carrier tape that stores and conveys active electronic components whose water absorption of resin needs to be reduced by heat treatment.

[0002]

2. Description of the Related Art In recent years, with the sophistication of information, communication and OA equipment, the performance of electronic parts has been rapidly improved, and the information processing speed and processing amount have been increased. High-density packaging is being promoted. High-density mounting means high integration of semiconductor elements, miniaturization and thin package, and high-density mounting of these package elements on the substrate, especially surface mounting technology (SMT)
Has been steadily achieving results. The high integration of semiconductor elements is rapidly progressing as represented by semiconductor memory, and at the same time, the size and thickness of the package can be made smaller and thinner with the conventional single outline package (SO
From P), Thin Single Outline Packa with a thickness of about 1 mm
ge (TSOP), and even Tape Automatic
As represented by Bonding (TAB), thinning and downsizing are in progress.

In the SMT, however, these thin and miniaturized package parts, especially ICs, are
After using an automatic mounter to mount the solder paste on a printed circuit board with screen-printed solder paste at a predetermined connection part, the entire board is heated to a temperature of about 250 ° C., which is higher than the melting point of the solder (hereinafter referred to as a reflow process), Melting the solder I
The lead terminal such as C is connected to the substrate electrode. For this reason, resin-sealed surface-mounted components such as ICs are also exposed to the above high temperature, and if the sealing resin has a water absorption rate of 0.05% or more, the LSI chip is sealed in the reflow process. The moisture inside the package parts evaporates rapidly, the internal pressure of the package parts rises, and package cracks occur, which lowers the reliability of the IC and, in the worst case, renders it inoperable, resulting in a large decrease in product yield. Had.

In order to prevent the occurrence of package cracks in these reflow processes, in order to lower the water absorption of the sealing resin, the package components are mounted on a substrate at a temperature of 105 ° C. or higher for about 24 to 48 hours. Conventionally, heat treatment (hereinafter referred to as baking) is performed. This baking is carried out by placing the electronic components packaged in a tray made of a heat-resistant metal or resin, which can withstand the above-mentioned baking conditions, in an oven or the like for a predetermined time in a state of being aligned and stored. However, the processing method using these trays has a small number of pieces mounted per sheet and is complicated to handle, the positional accuracy of the stored parts is inferior to that of the carrier tape, and a problem is likely to occur in automatic mounting. Therefore, it is desired to realize a carrier tape that can be baked while the electronic parts are stored.

As a conventional cover tape for a carrier tape, a biaxially stretched polyester film having a thickness of 10 to 50 μm or a two-layer coextrusion film of polyester / polyolefin is used as a base film, and the base film is used as an easy-open adhesive layer. A styrene-butadiene-styrene block copolymer resin, an ethylene-vinyl acetate copolymer resin alone or a mixture thereof with polybutene,
Nylon (trade name) resin, polyurethane resin, etc.
A film having a thickness of up to 30 μm formed by a film laminating method or a coating method is widely used.

In this cover tape, each packaged electronic component (hereinafter referred to as a storage component) is placed on a carrier tape in which a cavity is continuously formed in an antistatic or conductive resin sheet, and then the lid is placed so as to cover it. The both ends of the carrier tape are heat-sealed to the carrier tape to prevent the stored parts from falling off during storage and transportation, but they are peeled off from the carrier tape main body during mounting of the parts by the automatic mounting machine.

[0007]

As described above, a base film such as a polyester film is used for the conventional cover tape, but the heat shrinkage rate of a general biaxially stretched polyester film is 105 ° C. for 30 minutes. Since it is 0.7% or more due to heating, when the above baking treatment is carried out, the polyester film thermally shrinks, and the one stuck on the carrier tape is greatly curled toward the cover tape,
If the shrinkage is large, there is a problem that the cover tape is peeled off from the carrier tape.

Further, since the conventional cover tape is provided with the heat-seal adhesive layer on one surface of the base film,
When baking is performed, the storage components inside the cavity adhere to the heat-seal adhesive layer, and when the cover tape is peeled off during automatic mounting, the storage components adhere to the cover tape, making it impossible to perform automatic mounting and storing it at the same time. There is a problem that the heat-seal adhesive adheres to the parts and stains them. Further, the conventional cover tape 1 is shown in FIG.
As shown in FIG. 3, the housing component 4 is housed in the cavity 3 of the carrier tape 2, and both sides of the cavity 3 are sealed by the seal heads 5 along the flow direction of the carrier tape 2. ), The heat-seal adhesive layer 8 on the base film 7 of the portion 6 which is not heat-sealed facing the carrier tape 2 is also adhered to the carrier tape 2, so that the peel strength is significantly increased and the cover There is a problem that the tape 1 breaks when the tape 1 is peeled off.

Further, as described in Japanese Utility Model Laid-Open No. 2-34469, when an adhesive or the like having a glass transition point of 90 ° C. or higher and high heat resistance is used, even if it is baked, the same period as described above is obtained. Although the number of problems is reduced, the temperature at which the heat seal is actually applied to the carrier tape becomes extremely high due to the increased heat resistance, the heating time for the heat seal adhesive layer to reach the temperature at which it can be bonded is long, and the sealing speed is slow. There is a problem of becoming. Furthermore, the environmental temperature for peeling the cover tape by automatic mounting is room temperature, which is equal to or lower than the glass transition point of the heat-sealing resin (Actual Kaihei 3-3877).
Therefore, when the cover tape is peeled off, there is a problem that the base film is broken due to a large variation in peeling strength, the storage components inside the cavity pop out from the cavity, and the baking tape is bakeable. The current situation is that no

Therefore, according to the present invention, the cover tape does not peel off or curl from the carrier tape main body due to the heat shrinkage of the base film even after the baking treatment, and the storage parts adhere to the cover tape, It is an object of the present invention to provide a heat-resistant cover tape that does not become soiled, and that the peel strength does not rise significantly, and that the cover tape can be sealed at a faster speed than before, and that the peel strength varies significantly. To do.

[0011]

In order to solve such a problem, the inventors of the present invention have made various studies on the material, structure, adhesive, etc. of the cover tape, and as a result, have a carrier having a large number of cavities for housing electronic components. The cover tape attached to the tape has a shrinkage ratio of 0.5% or less and a visible light transmittance of 50% in a heat treatment at 105 ° C. for 30 minutes.
The room temperature adhesive resin layer is formed on one surface of the transparent base film as described above, and the visible light transmittance is 50 on the surface of the adhesive resin layer, the width being wider than the cavity and narrower than the transparent base film. % Or more transparent mask film is attached, at least one of the transparent mask film and the transparent base film is antistatic treatment, the antistatic treatment is to apply a transparent antistatic agent, The room-temperature adhesive resin layer has a peel strength of 105 ° C.
The present invention has been completed by finding that a heat-resistant cover tape having a feature of 5 to 100 gf / mm may be used even if heat-treated at the above temperature.

The present invention will be described in detail below with reference to FIG. When the transparent base film 11 used in the present invention is heat-shrinked by the above-mentioned baking treatment, the carrier tape 2 to which the heat-resistant cover tape 12 is attached is curled toward the heat-resistant cover tape 12 side, and if the shrinkage is remarkable, it is an adhesive resin. The layer 13 is peeled off, and the electronic component 4 inside the cavity 3 adheres to the adhesive resin layer 13 or the cavity 3
The problem of popping out more occurs. Therefore, as the transparent base film 11, 105 ° C.-30
In order to confirm the marking and the storage direction of the storage component 4 inside the cavity 3 through the heat-resistant cover tape 12, the shrinkage rate in the heat treatment for 1 minute has a heat resistance of 0.5% or less, preferably 0.3% or less. , Base film 11
Must be transparent, and therefore have a visible light transmittance of 50.
% Or more is required.

When the material of the transparent base film 11 satisfying these conditions is a crystalline resin, the degree of crystallinity may be increased by sufficient heating so that the shrinkage ratio is not more than the above-mentioned shrinkage ratio. When the material is an amorphous resin, there is no change in shrinkage due to the degree of crystallinity, so any material that satisfies the above shrinkage may be used. As such a transparent base film, a crystalline material such as low shrinkage polyethylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polyetherimide, polyetherketone, polyetheretherketone, polyphenylene sulfide having a high degree of crystallinity and polycarbonate. , Polyarylate, polyimide, polyether sulfone, polysulfone, aramid resin, polyparabanic acid resin, polyamide resin, or other amorphous material alone or two or more kinds of composite resins, and composite films obtained by laminating individual films of each material. Is exemplified.

If the thickness of these transparent base films is too thick, the cost becomes high, and if it is too thin, wrinkles and the like occur in the step of sticking to the carrier tape 2 and it becomes difficult to handle, so the thickness is in the range of 12 to 200 μm. , Preferably in the range of 20 to 150 μm.

In the heat resistant cover tape 12 of the present invention, the room temperature adhesive resin layer 13 needs to be formed on one surface of the transparent base film 11, and the adhesive resin layer has a peel strength of 5 g.
If the heat-resistant cover tape 12 becomes smaller than f / mm, when the heat-resistant cover tape 12 is attached to the carrier tape 2 in which the storage parts are stored,
The heat-resistant cover tape 12 may be peeled off from the carrier tape 2 due to the weight of the stored parts or vibration during transportation. If the peel strength is more than 100 gf / mm, the peeling strength becomes too large and peeling becomes difficult. In the worst case, the transparent base film 11 may be broken. Therefore, the peel strength should be in the range of 5 to 100 gf / mm at room temperature. Is good. Further, since the heat-resistant cover tape 12 of the present invention needs to be baked, it may be heat-resistant at a temperature of 105 ° C. or higher so that the peel strength is within the above range of 5 to 100 gf / mm. ..
The adhesive resin layer 13 has a visible light transmittance of preferably 50% or more because it is necessary to check markings and the like through the adhesive resin layer 13 similarly to the base film.

Examples of heat-resistant adhesive resin layer agents having such characteristics include acrylic adhesives, rubber adhesives, silicone adhesives alone and mixed adhesives of two or more kinds. For the purpose of adjusting the temperature and improving the heat resistance, various fillers and curing agents, and various additives such as an antistatic agent for the purpose of preventing electrostatic breakdown of the stored parts may be blended in these adhesives. It is optional.

As a method for forming the adhesive resin layer 13, a conventionally known method may be used, and specifically, a melt extrusion method of forming on the transparent base film by melt extrusion, and further dissolving in a solvent. A known coating method of applying an adhesive to a transparent base film, for example, a direct gravure coater, an offset gravure coater, a reverse coater, a comma coater, an air knife coater, a Mayer bar coater, or the like is used for coating, and the solvent is scattered by heating. At the same time, the adhesive may be cured if it is thermosetting, or may be cured after the solvent is scattered. When the transparent base film is a solvent-free film, the adhesive resin layer is applied onto the transfer film using the above coating method, dried, and transferred to the transparent base film to form the film. You may.

When the thickness of the adhesive resin layer is too thin, sufficient adhesive force cannot be obtained, and conversely, when it is too thick, the cost becomes high. Since the resin layer causes a delamination phenomenon in which it protrudes from the edge of the base film, 1
˜50 μm, preferably 3 to 30 μm. In forming this adhesive resin layer, in order to improve the adhesiveness between the transparent base film and the adhesive resin layer, it is optional to subject the transparent base film to a corona treatment or a treatment such as a primer. It
Further, on the other surface of the surface on which the adhesive resin layer is formed, it is optional to perform a release treatment so that the adhesive resin layer cannot be unrolled so as to form a roll.

According to the present invention, a width wider than the width of the cavity 3 of the carrier tape 2 and narrower than the width of the transparent base film 11 is provided on the adhesive surface of the transparent base film 11 having the adhesive resin layer thus obtained. A mask film 14 made of transparent plastic having visible light transmittance of 50% or more is attached as shown in FIG. The mask film 14 for sticking may have the same properties as the transparent base film 11 described above, and the material may be selected from the materials exemplified above. Further, when the thickness is 50% or less of the transparent base film 11, it is 10
Even if the heat shrinkage in the heat treatment of 5 ° C. for 30 minutes is 0.5% or more, the thickness of the transparent base film 11 is 1.
It can be used because it has a heat shrinkage of 0% or less. Also 105 ℃
It goes without saying that any mask film that does not become tacky under the above baking conditions can be used.

The plastic used for the mask film 14 preferably has the same transparent heat resistance as the transparent base film. Further, if the thickness is too thin, the sticking work becomes very difficult, and if it is too thick, when the heat-resistant cover tape of the present invention is attached to a carrier tape, the mask film serves as a spacer and the width of the adhesive portion becomes uneven. Since the heat-resistant cover tape may peel off from the carrier tape due to the repulsive force of the mask film at the same time as the peeling strength varies, the thickness of the mask film may be set to 3 to 50 μm, preferably 9 to 30 μm. Also, if the width of the mask film is narrower than the width of the cavity of the carrier tape, the storage components inside the cavity may come into contact with the adhesive and stick to it, and if it is wider than the width of the transparent base film, it will stick to the carrier tape. As described above, the width of the carrier tape is wider than the width of the cavity of the carrier tape and narrower than the width of the transparent base film as described above. Peel strength of 1
The width of the mask film is set to be 0 to 70 gf / mm.

As for the position where the mask film is stuck to the adhesive resin layer, if the widths of the exposed adhesive resin layers at both ends are extremely different, the carrier tape may meander when peeling, and automatic mounting is performed. In that case, it may cause troubles, so that it may be set at approximately the center of the transparent base film.
Further, as a method for laminating the mask film, after the positions of the transparent base film and the mask film are aligned, the lamination may be carried out using a laminator, and heating at this time is optional. ..

Although the heat-resistant cover tape of the present invention is obtained by the above, it is unwound in the manufacturing process and the use process,
Since the tape is peeled off from the carrier tape at the same time when it is wound several times, electric charges are transferred during the peeling and the heat-resistant cover tape itself is easily charged. When the heat-resistant cover tape is peeled off from the carrier tape when it is charged, the stored components are electrostatically attached to the heat-resistant cover tape side and fall off the carrier tape cavity or become misaligned, making automatic mounting difficult. Problem, complementary MOS-IC, transistor, transistor logic, field effect MO
A semiconductor element such as an S-transistor, a bipolar transistor, and a Schottky diode (generally referred to as an active component), which is weak against static electricity, may have a problem of being electrostatically destroyed by discharge when it contacts a charged heat-resistant cover tape. .

Therefore, the heat-resistant cover tape of the present invention is also preferably subjected to an antistatic treatment, and the required surface resistance is 10 ⁹ Ω or less, preferably 10 ⁷ Ω or less. The antistatic film may be provided on at least one of the cavity-side surface of the mask film and the opposite surface of the adhesive resin layer attached to the transparent base film. FIG. 1 shows an example in which a bandproof film 15 is provided on both of them.

As a method for carrying out these antistatic treatments, conventionally known methods can be used. However, in order to confirm the markings of the parts housed inside the cavity as described above, this antistatic treatment is also used. It is necessary to have transparency.For these transparent antistatic treatments, a metal or metal oxide is vapor-deposited on the surface, or a transparent antistatic agent or a transparent conductive paint is coated on the surface to form a coating film. The method of doing is illustrated. Therefore, from the viewpoint of cost, it is preferable to apply a transparent antistatic agent or a transparent conductive coating material. As such a material, an organic conductor is contained in a binder resin dissolved in an organic solvent. , 8,8, -tetracyanoquinodimethane complex (hereinafter referred to as TCNQ complex) dissolved therein, tin oxide compound powder and indium oxide compound powder dispersed therein are preferable. Further, as a method of applying these transparent antistatic agents and transparent conductive paints, conventionally known methods may be used, and if the thickness of the coating film is too thick, the transparency is lowered and at the same time the cost is high. The film thickness may be appropriately selected as thin as possible to obtain the above-mentioned required surface resistance. Specifically, 0.
The thickness is in the range of 1 to 5 μm, preferably 0.2 to 2 μm.

[0025]

【Example】

(Example 1) As a transparent base film, 105 ° C-3
A polyarylate film "Enplate U1" (trade name, manufactured by Unitika Co., Ltd.) having a heat shrinkage of 0.3% or less in a heat treatment for 0 minutes of 25 μm is used, and a silicone-based adhesive “KR-120” is applied to the entire one surface. (Shin-Etsu Chemical Co., Ltd., trade name) 100 parts by weight of benzoyl peroxide (BPO) 1.2 parts by weight of an adhesive coating solution was dried at 150 ° C. for 15 minutes using a comma coater. Then, coating was applied so that the dry film thickness became 25 μm by curing to form an adhesive resin layer. Then, the glass transition point 9
30 parts by weight of a saturated copolyester having a ring and ball softening point of 185 ° C. at 0 ° C. and methyl ethyl ketone / toluene (50 /
70 parts by weight of the mixed solvent of 50) was dissolved using a high-speed disperser to prepare a binder resin solution having a solid content of 30% by weight.

After adding 30 parts by weight of this binder resin solution, 30 parts by weight of antimony-doped tin oxide compound fine powder produced in the following steps, and 240 parts by weight of a mixed solvent of methyl ethyl ketone / toluene = 1/1. After stirring with a disperser, sand milling was performed to complete dispersion, and the solid content was 13.0% and the viscosity was 200 c.
A transparent conductive ink of p was prepared.

The above antimony-doped tin oxide compound fine powder was prepared by dissolving 300 g of potassium stannate and 36.0 g of potassium antimonyl tartrate in 664 g of distilled water, and then dissolving this aqueous solution in distilled water having a volume of 2 liters adjusted to 45 ° C. The mixture was added while stirring and applying ultrasonic waves, and the sol liquid in which the conductive particles were dispersed by hydrolysis was prepared by adding nitric acid so that the pH of the temperature-controlled water bath was 8.5, and then this was added. What was filtered and left on the filter paper was washed with distilled water, and the obtained particles were dried and then dried in air at 200
Temperature rise from ℃ to 600 ℃ over 4 hours, 650
It was made by firing at ℃ for 2 hours. This is an average particle size of 0.17
The particles with a particle size of up to 90% were within 3.3 μm.

Then, as a mask film, a polyethylene terephthalate film (shrinkage rate 0.8%) 12 μm
On one entire surface of the above, 1.0 part by weight of an isocyanate curing agent "CAT-10" (trade name, manufactured by Toyo Morton Co., Ltd.) was added to 100 parts by weight of the transparent conductive ink and stirred, A gravure plate having a wire number of 200 mesh and a depth of 25 μm was set in a gravure coater, coated and dried, and then, aging was performed at 40 ° C. for 3 days. The thickness of the obtained dry coating film was 0.2 μm, and DC100V was applied to this transparent conductive coating film to measure the surface resistance. The average per unit area was 5.0 × 10 ⁶ Ω, and the maximum was 6.0. It was × 10 ⁶ Ω and the minimum was 4.5 × 10 ⁶ Ω, which were very stable, and had a visible light transmittance of 82% and a haze of 10 or less.

Then, the polyarylate film having the adhesive resin layer formed thereon is slit into a width of 21.5 mm,
The mask film obtained above was slit into a width of 20.0 mm, and the uncoated surface of the mask film was attached using a laminator while aligning the mask film so that the mask film is in the center of the adhesive resin layer. A heat-resistant cover tape of the present invention was produced. The heat-resistant cover tape thus obtained had a visible light transmittance of 75% and a haze of 10 and had good transparency.

Then, a carrier tape "heat resistant carrier tape" on which the obtained heat resistant cover tape can be baked
(Shin-Etsu Polymer Co., Ltd., trade name) using a taping machine "Model MET-100A" (Hope Seiki Co., Ltd., trade name), affixed at a seal head temperature of 1050C, 60 shots / minute, The change in peel strength before and after baking at 105 ° C. for 48 hours was measured. As a result, under the conditions of a peel rate of 300 mm / min and a peel angle of 180 °, it was 37 gf / mm before the baking and 55 gf / mm after the baking. It showed good peel strength. Furthermore, the TSO is placed inside the heat resistant carrier tape.
When the P-28 pin packaged IC was stored and a practical use test was conducted, there was no electrostatic damage to the IC,
There was no problem of the IC sticking to the heat-resistant cover tape.

Example 2 As a transparent base film,
Heat shrinkage during heat treatment at 105 ° C for 30 minutes is 0.3%
The following polycarbonate film of 30 μm was used.
Then, polyethylene terephthalate film 50 μm
A silicone release agent is applied to the entire one surface of the above, and a cured release film is coated with an acrylic pressure-sensitive adhesive described below using a comma coater to obtain a film thickness of 25 μm by drying at 150 ° C. for 5 minutes.
It was coated so that it would be m. The acrylic pressure-sensitive adhesive used here was prepared as follows. That is, 400 g of ethyl acetate and 17.0 of n-butyl acrylate.
g, ethyl methacrylate 17.0 g, 2-hydroxyethyl methacrylate 5.0 g, acrylic acid 1.0 g,
0.4 g of benzoyl peroxide (catalyst) was replaced with N ² gas in the reaction system to carry out a polymerization reaction at 80 ° C. for 6 hours. The weight average molecular weight was 50,000. 40 parts by weight (solid content ratio) of the obtained acrylic polymer, acrylic rubber “P
S220 (Toa Paint Co., Ltd., trade name) 200 parts by weight, isocyanate curing agent "Coronate L" (Nippon Polyurethane Industry Co., Ltd., trade name) 7.2 parts by weight to a solid content of 25% with toluene It was mixed with stirring.

Then, the above transparent base film was laminated and cured at 50 ° C. for 48 hours to transfer the adhesive resin layer to the transparent base film. The transparent base film having the adhesive resin layer thus formed has a width of 21.5 m.
The mask film prepared in Example 1 was slit to a width of 20.0 mm, and the uncoated surface of the mask film was aligned so that the mask film was in the center of the adhesive resin layer, and a laminator was used. Was applied to prepare a heat-resistant cover tape of the present invention. The heat-resistant cover tape thus obtained had a visible light transmittance of 80% and a haze of 10 or less, and had good transparency.

Next, a carrier tape "heat resistant carrier tape" which can be used to bake the obtained heat resistant cover tape.
(Shin-Etsu Polymer Co., Ltd., trade name) using a taping machine "Model MET-100A" (Hope Seiki Co., Ltd., trade name), affixed at a seal head temperature of 150 ° C. at a speed of 60 shots / minute, The change in peel strength before and after baking at 105 ° C. for 48 hours was measured. As a result, under the conditions of a peel rate of 300 mm / min and a peel angle of 180 °, it was 35 gf / mm before the baking and 60 gf / mm after the baking. mm, and a good peel strength was exhibited. Furthermore, the TSO is placed inside the heat resistant carrier tape.
When the P-28 pin packaged IC was stored and a practical use test was conducted, there was no electrostatic damage to the IC,
No problem was observed while the IC adhered to the heat resistant cover tape.

[0034]

INDUSTRIAL APPLICABILITY The heat-resistant cover tape of the present invention is less likely to be peeled off or curled from the carrier tape due to heat shrinkage, and even if it is heat-treated, the stored parts never adhere to the heat-resistant cover tape. Before and after, the peel strength of the heat-resistant cover tape is stable and stable. Furthermore, since it is possible to prevent electrostatic damage to the storage parts by applying antistatic treatment or conductivity, various resin-sealed storage parts, especially packaged ICs, are stored in a carrier tape, By performing a baking process before the reflow process to reduce the water content in the encapsulating resin, there is an advantage that the yield in SMT can be significantly improved, and in the baking process, a batch process using a conventional baking tray is performed. Unlike the above, a large amount of ICs can be stored and processed, and continuous tape-like handling is possible, enabling a significant labor saving in the process.

[Brief description of drawings]

FIG. 1 is a side view of a heat-resistant cover tape of the present invention in use.

2A is an explanatory view of a heat-sealing method for a conventional heat-resistant cover tape, and FIG. 2B is an explanatory view at the time of baking.

[Explanation of symbols]

 1 Heat Resistant Cover Tape 2 Carrier Tape 3 Cavity 4 Storage Parts 5 Seal Head 6 Non Heat Sealed Part 7 Base Film 8 Heat Seal Adhesive Layer 11 Transparent Base Film 12 Heat Resistant Cover Tape 13 Adhesive Resin Layer 14 Mask Film 15 Antistatic film

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] December 12, 1991

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0031

[Correction method] Change

[Correction content]

Example 2 As a transparent base film,
Heat shrinkage during heat treatment at 105 ° C for 30 minutes is 0.3%
The following polycarbonate film of 30 μm was used.
Then, polyethylene terephthalate film 50 μm
A silicone release agent is applied to the entire one surface of the above, and a cured release film is coated with an acrylic pressure-sensitive adhesive described below using a comma coater to obtain a film thickness of 25 μm by drying at 150 ° C. for 5 minutes.
It was coated so that it would be m. The acrylic pressure-sensitive adhesive used here was prepared as follows. That is, 400 g of ethyl acetate and 177.0 of n-butyl acrylate .
g , ethyl methacrylate 17.0 g , 2-hydroxyethyl methacrylate 5.0 g, acrylic acid 1.0 g,
0.4 g of benzoyl peroxide (catalyst) was replaced with N ² gas in the reaction system to carry out a polymerization reaction at 80 ° C. for 6 hours.
The weight average molecular weight was 50,000. 40 parts by weight (solid content ratio) of the obtained acrylic polymer, acrylic rubber "PS220 (trade name, manufactured by Toa Paint Co., Ltd.) 200"
Parts by weight and 7.2 parts by weight of an isocyanate curing agent "Coronate L" (trade name, manufactured by Nippon Polyurethane Industry Co., Ltd.) are mixed with toluene with stirring so that the solid content is 25%.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroyuki Ida 18 Satsuki Town, Kanuma City, Tochigi Prefecture Sony Chemical Corporation Kanuma Plant (72) Inventor Yoshiyuki Ishikawa 18 Satsuki Town, Kanuma City, Tochigi Prefecture Sony Chemical Corporation Kanuma Plant Within

Claims (5)

[Claims] 1. A cover tape attached to a carrier tape having a large number of cavities for accommodating electronic parts has a shrinkage ratio of 0.1 after heat treatment at 105 ° C. for 30 minutes.
A room temperature adhesive resin layer is formed on one surface of a transparent base film having a visible light transmittance of 5% or less and a visible light transmittance of 50% or more, and a transparent base film having a width wider than the width of the cavity is formed on the surface of the adhesive resin layer. A heat-resistant cover tape having a transparent mask film narrower than the width and having a visible light transmittance of 50% or more. 2. The film according to claim 1, wherein at least one of the transparent mask film and the transparent base film is subjected to antistatic treatment. 3. The film according to claim 2, wherein the antistatic treatment is coating a transparent antistatic agent. 4. The peel strength of the room temperature adhesive resin layer is 1
The film according to any one of claims 1 to 3, which has a temperature of 5 to 100 gf / mm even when subjected to a heat treatment of 05 ° C or higher. 5. The transparent mask film of 105 ° C.
The film according to any one of claims 1 to 4, which has a shrinkage ratio of 0.5% or less in a heat treatment for 30 minutes.