KR0170953B1 - Method for fabricating air gap of optical projection system - Google Patents
Method for fabricating air gap of optical projection system Download PDFInfo
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- KR0170953B1 KR0170953B1 KR1019950025838A KR19950025838A KR0170953B1 KR 0170953 B1 KR0170953 B1 KR 0170953B1 KR 1019950025838 A KR1019950025838 A KR 1019950025838A KR 19950025838 A KR19950025838 A KR 19950025838A KR 0170953 B1 KR0170953 B1 KR 0170953B1
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- optical path
- path control
- control device
- air gap
- sacrificial film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
Abstract
본 발명은 광로 조절 장치의 에어갭 형성방법에 관한 것으로서, 포토레지스트로 액츄에이터의 상부표면과 양측면에 보호막을 형성한 후 질소기체에 운반된 불산으로 희생막을 제거한다. 그리고, 광로 조절 장치에 잔류하는 불산과 희생막 제거시 발생된 물을 제거하기 위하여 IPA로 세척하고 열처리하여 급속으로 건조하고 보호막을 산소 플라즈마로 제거한다. 따라서, 본 발명은 희생막 제거후 광로 조절 장치를 IPA로 세척하고 열처리하여 급속으로 건조하므로 표면장력으로 인하여 액츄에이터가 구동기판을 향해 기울어져 서로 접촉하는 스티킹을 방지할 수 있다.The present invention relates to a method for forming an air gap of an optical path control device, wherein a protective film is formed on the upper surface and both sides of an actuator by photoresist, and then the sacrificial film is removed by hydrofluoric acid carried in nitrogen gas. Then, in order to remove the hydrofluoric acid remaining in the optical path control device and the water generated during the removal of the sacrificial film, washing with IPA, heat treatment to rapidly dry and remove the protective film with oxygen plasma. Therefore, in the present invention, since the optical path control apparatus is washed with IPA and thermally dried after removing the sacrificial film, the actuator may be inclined toward the driving substrate due to the surface tension to prevent sticking.
Description
제1도는 종래 기술에 따라 스티킹이 발생된 광로 조절 장치의 단면도.1 is a cross-sectional view of an optical path control apparatus in which sticking is generated according to the prior art.
제2도는 본 발명에 따른 광로 조절 장치의 에어갭 형성방법에 대한 순서도.2 is a flow chart of the air gap forming method of the optical path control apparatus according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 구동기판 20 : 액츄에이터10: driving substrate 20: actuator
21 : 패드 22 : 멤브레인21: pad 22: membrane
23 : 개구 24 : 플러그23: opening 24: plug
25 : 하부전극 26 : 변형부25: lower electrode 26: deformation part
27 : 상부전극 28 : 에어갭27: upper electrode 28: air gap
29 : 보호막 30 : 광로 조절 장치29: protective film 30: optical path control device
본 발명은 투사형 화상 표시장치에 이용되는 광로 조절 장치의 에어갭 형성방법에 관한 것으로서, 특히, 희생막 제거시 발생하는 스티킹(sticking)을 방지할 수 있는 광로 조절 장치의 에어갭 형성방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air gap forming method of an optical path adjusting device used in a projection type image display device, and more particularly, to an air gap forming method of an optical path adjusting device capable of preventing sticking occurring when a sacrificial film is removed. will be.
화상 표시장치는 표시방법에 따라, 직시형 화상 표시장치의 투사형 화상 표시장치로 구분된다.The image display device is classified into a projection type image display device of the direct view type image display device according to the display method.
직시형 화상 표시장치는 CRT(Cathode Ray Tube)등이 있는데, 이러한 CRT 화상 표시장치는 화질은 좋으나 화면이 커짐에 따라 중량 및 두께의 증대와, 가격이 비싸지는 등의 문제점이 있어 대화면을 구비하는데 한계가 있다.The direct view type image display device includes a CRT (Cathode Ray Tube). The CRT image display device has a good image quality but has a problem such as an increase in weight and thickness as the screen is enlarged, and a price is expensive. There is.
투사형 화상 표시장치는 대화면 액정표시장치(Liquid Crystal Display : 이하 'LCD'라 칭함)등이 있는데, 이러한 대화면 LCD의 박형화가 가능하여 중량을 작게할 수 있다. 그러나, 이러한 LCD는 편광판에 의한 광의 손실이 크고 LCD를 구동하기 위한 박막 트랜지스터가 화소 마다 형성되어 있어 개구율(광의 투과면적)을 높이는데 한계가 있으므로 광의 효율이 매우 낮다.Projection type image display apparatuses include a large crystal display (Liquid Crystal Display: hereinafter referred to as "LCD"), and the like. Such a large-screen LCD can be thinned to reduce weight. However, such LCDs have a high loss of light due to a polarizing plate, and thin film transistors for driving the LCD are formed for each pixel, so that there is a limit in increasing the aperture ratio (light transmission area).
따라서, 미합중국 Aura사에 의해 액츄에이터드 미러 어레이(Actuated Mirror Arrays ; 이하 'AMA'라 칭함)를 이용한 투사형 화상 표시장치가 개발되었다. AMA를 이용한 투사형 화상 표시장치는 광원에서 발광된 백색광을 적색, 녹색 및 청색의 광으로 분리한 후, 이 광을 액츄에이터들로 이루어진 광로 조절 장치의 구동에 의해 광로를 변경시킨다. 즉, 액츄에이터들에 실장되어 이 액츄에이터들이 개별적으로 구동되는 것에 의해 기울어지는 거울들에 각각 반사시켜 광로(light path)를 변경시키는 것에 의해 광의 양을 조절하여 하면으로 투사시킨다. 그러므로, 화면에 화상이 나타나게된다. 상기에서, 액츄에이터는 압전 또는 전왜세라믹으로 이루어진 변형부가 인가되는 전압에 의해 전계가 발생되어 변형되는 것을 이용하여 거울을 기울게 한다. AMA는 구동방식에 따라 1차원 AMA와 2차원 AMA로 구별된다. 1차원 AMA는 거울들이 M×1 어레이로 배열되고, 2차원 AMA는 거울들이 M×N 어레이로 배열되고 있다. 따라서, 1차원 AMA를 이용한 투사형 화상 표시장치는 주사거울을 이용하여 M×1개 광속들을 선주사시키고, 2차원 AMA를 이용하는 투사형 화상 표시장치는 M×N개의 광속들을 투사시켜 화상을 나타나게 된다.Therefore, a projection type image display apparatus using Actuated Mirror Arrays (hereinafter referred to as 'AMA') has been developed by Aura, USA. A projection type image display apparatus using AMA separates white light emitted from a light source into red, green and blue light, and then changes the light path by driving an optical path adjusting device made of actuators. That is, the actuators are mounted on the actuators, and the actuators are individually driven to reflect to the inclined mirrors, thereby changing the light path, thereby controlling the amount of light to project to the lower surface. Therefore, an image appears on the screen. In the above, the actuator tilts the mirror by using an electric field generated and deformed by a voltage to which a deformable part made of piezoelectric or electrostrictive ceramic is applied. AMA is classified into one-dimensional AMA and two-dimensional AMA according to the driving method. The one-dimensional AMA has mirrors arranged in an M × 1 array, and the two-dimensional AMA has mirrors arranged in an M × N array. Therefore, the projection type image display device using the one-dimensional AMA pre-scans the M × 1 light beams using the scanning mirror, and the projection type image display device using the two-dimensional AMA displays the image by projecting the M × N light beams.
또한, 액츄에이터는 변형부의 형태에 따라 벌크형(bulk type)과 박막형(thin film type)으로 구분된다. 상기 벌크형은 다층세라믹을 얇게 잘라 내부에 금속전극이 형성된 세라믹웨이퍼(ceramic wafer)를 구동기판에 실장한 후 쏘잉(sawing)등으로 가공하고 거울을 실장한다. 그러나, 벌크형 액츄에이터는 액츄에이터들을 쓰임에 의해 분리하여야 하므로 긴 공정시간이 필요하며, 또한, 변형부의 응답속도가 느린 문제점이 있었다. 따라서, 반도체공정을 이용하여 제조할 수 있는 박막형의 액츄에이터가 개발되었다.In addition, the actuator is classified into a bulk type and a thin film type according to the shape of the deformable portion. The bulk type thinly cuts a multilayer ceramic, mounts a ceramic wafer having a metal electrode therein on a driving substrate, processes it by sawing, and mounts a mirror. However, bulk actuators require a long process time because they need to be separated by using actuators, and there is a problem that the response speed of the deformable portion is slow. Therefore, a thin-film actuator that can be manufactured using a semiconductor process has been developed.
제1도는 종래 기술에 따라 스티킹이 발생된 광로 조절 장치의 단면도이다.1 is a cross-sectional view of an optical path control apparatus in which sticking is generated according to the prior art.
광로 조절 장치(30)는 구동기판(10)과 이 구동기판(10)과 일측면이 접촉되고 타측이 에어갭(28)에 의해 소정거리 이격되어 형성된 액츄에이터(20)를 포함한다.The optical path control device 30 includes a driving substrate 10 and an actuator 20 formed in contact with one side of the driving substrate 10 and spaced apart by a predetermined distance by the air gap 28.
구동기판(10)은 표면에 트랜지스터(도시되지 않음)가 매트릭스(matrix) 형태로 내장되고, 이 트랜지스터와 전기적으로 연결된 패드(pad:21)가 있다.The driving substrate 10 includes a pad (21) in which a transistor (not shown) is embedded in a matrix on the surface thereof and electrically connected to the transistor.
액츄에이터(20)는 멤브레인(22), 개구(23), 플러그(24), 하부전극(25), 변형부(26), 상부전극(27) 및 보호막(29)를 포함한다.The actuator 20 includes a membrane 22, an opening 23, a plug 24, a lower electrode 25, a deformable portion 26, an upper electrode 27, and a protective layer 29.
멤브레인(22)은 일측이 패드(21) 주변의 구동기판(10)과 접촉되고 타측이 구동기판(10)과 에어갭(28)에 의해 이격되어 형성된다.The membrane 22 is formed so that one side is in contact with the driving substrate 10 around the pad 21 and the other side is spaced apart by the driving substrate 10 and the air gap 28.
그리고 플러그(24)는 패드(21)의 상부표면에 형성된 멤브레인(22)의 소정 부분에 형성된 개구(23)의 내부를 채우며 형성된다.The plug 24 is formed by filling the inside of the opening 23 formed in the predetermined portion of the membrane 22 formed on the upper surface of the pad 21.
하부전극(25)은 멤브레인(22)의 상부표면에 플러그(24)와 전기적으로 연결되도록 형성된다. 그러므로, 하부전극(25)은 플러그(24)를 통하여 패드(21)와 전기적으로 연결된다. 또한, 하부전극(25)의 상부에 변형부(26) 및 상부전극(27)이 순차적으로 형성된다.The lower electrode 25 is formed to be electrically connected to the plug 24 on the upper surface of the membrane 22. Therefore, the lower electrode 25 is electrically connected to the pad 21 through the plug 24. In addition, the deformation part 26 and the upper electrode 27 are sequentially formed on the lower electrode 25.
상술한 구조의 광로 조절 장치(30)는 구동기판(10)의 동일한 트랜지스터에 전기적으로 연결된 패드(21)와 플러그(24)를 통해 하부전극(25)에 동일한 화상신호가 인가되고, 상부전극(27)은 반사막으로 사용된다. 그러므로, 하부전극(25)과 상부전극(27) 사이에 개재되어 있는 변형부(26)에 전계가 발생되어 변형부(26)가 전계와 수직방향으로 수축하게 되어 액츄에이터(30)가 휘어져 경사진다.In the optical path adjusting device 30 having the above-described structure, the same image signal is applied to the lower electrode 25 through the pad 21 and the plug 24 electrically connected to the same transistor of the driving substrate 10, and the upper electrode ( 27 is used as a reflecting film. Therefore, an electric field is generated in the deformable portion 26 interposed between the lower electrode 25 and the upper electrode 27 so that the deformable portion 26 contracts in a direction perpendicular to the electric field so that the actuator 30 is bent and inclined. .
그러나 종래의 광로 조절 장치는 에어갭을 형성하는 공정에서 발생하는 물의 표면장력에 의해 액츄에이터가 구동기판을 향해 기울어져 서로 접촉하는 스티킹이 발생되는 문제점이 있었다.However, the conventional optical path control apparatus has a problem in that sticking occurs when the actuators are inclined toward the driving substrate by the surface tension of water generated in the air gap forming process.
따라서, 본 발명의 목적은 에어갭을 형성하는 공정에서 액츄에이터가 구동기판을 향해 기울어져 서로 접촉하는 스티킹을 방지할 수 있는 광로 조절 장치의 에어갭 형성방법을 제공함에 있다.Accordingly, it is an object of the present invention to provide an air gap forming method of an optical path control apparatus capable of preventing sticking of actuators inclined toward a driving substrate in contact with each other in the process of forming an air gap.
본 발명에 따른 광로 조절 장치의 에어갭 형성방법은 희생막을 질소기체에 의해 운반된 불산으로 제거하는 습식식각 단계와, 상기 단계에서 상기 희생막이 제거된 상기 광로 조절 장치에 잔류하는 불산과 상기 희생막 제거시 발생된 물을 제거하기 위하여 이소프로필 알콜로 상기 광로 조절 장치를 세척하는 단계와, 상기 단계에서 상기 광로 조절 장치가 상기 이소프로필 알콜로 세척된 후 상기 광로 조절 장치를 열처리하는 단계와, 상기 단계에서 상기 광로 조절 장치가 열처리된 후 산소 플라즈마로 보호막을 제거하는 건식식각 단계를 구비한다.The air gap forming method of the optical path control apparatus according to the present invention includes a wet etching step of removing the sacrificial film with hydrofluoric acid carried by nitrogen gas, and the hydrofluoric acid and the sacrificial film remaining in the optical path control device from which the sacrificial film is removed in the step. Washing the optical path control device with isopropyl alcohol to remove the water generated during the removal, and heat treating the optical path control device after the optical path control device is washed with the isopropyl alcohol in the step; And a dry etching step of removing the protective film with oxygen plasma after the optical path control device is heat treated in the step.
이하, 첨부한 도면을 참조하여 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제2도는 본 발명에 따른 광로 조절 장치의 에어갭 형성방법에 대한 순서도이다.2 is a flow chart of the air gap forming method of the optical path control apparatus according to the present invention.
먼저, PSG(Phospho-Silicate Glass)의 물질로 이루어진 희생막을 질소 기체에 운반된 불산으로 제거한다. 이때, 희생막이 제거되면서 물이 발생하여 구동기판(10)과 액츄에이터(20) 사이에 표면장력을 발생시켜 스티킹이 발생되므로 질소 기체에 운반된 불산의 농도를 줄여야 한다. 따라서, 불산의 농도를 줄이기 이해서 질소기체의 유입을 증가시키고 불산의 유입을 감소시킨다. 그러면, 액츄에이터(20)의 상부표면과 양측면을 덮고 있던 보호막(29)은 불산에 의한 손상이 줄어들고 희생막을 제거할 때 생성되는 물의 양도 감소한다(단계 200).First, a sacrificial film made of a material of Phospho-Silicate Glass (PSG) is removed by hydrofluoric acid carried in nitrogen gas. At this time, since the sacrificial film is removed and water is generated to generate surface tension between the driving substrate 10 and the actuator 20, sticking occurs, so that the concentration of hydrofluoric acid transported in nitrogen gas should be reduced. Therefore, reducing the concentration of hydrofluoric acid increases the inflow of nitrogen gas and reduces the influx of hydrofluoric acid. Then, the protective film 29 covering the upper surface and both sides of the actuator 20 reduces the damage caused by hydrofluoric acid and also reduces the amount of water generated when the sacrificial film is removed (step 200).
다음, 상기 단계(200)에서 희생막이 제거된 후 광로 조절 장치(30)에 잔류하는 불산과 희생막 제거시 발생된 물을 제거하기 위하여 휘발성과 친수성이 양호한 이소프로필 알콜(iso-prophyle alcohol: 이하 IPA라 칭함)을 사용하여 광로 조절 장치(30)를 상온에서 세척한다(단계 202).Next, in order to remove the hydrofluoric acid remaining in the optical path control device 30 and the water generated when the sacrificial film is removed after the sacrificial film is removed in step 200, isopropyl alcohol (iso-prophyle alcohol) below The optical path control device 30 is washed at room temperature using an IPA (step 202).
그 다음, 상기 단계(202)에서 광로 조절 장치(30)가 IPA로 세척된 후, 광로 조절 장치(30)에 잔류하는 IPA와 물을 제거하기 위하여 60~200℃로 열처리를 한다. 그러면, 열처리로 인하여 친수성과 휘발성이 양호한 IPA는 급속하게 건조되어 표면장력이 감소하므로 스티킹이 방지된다. 종래에는, 희생막을 제거한 후 광로 조절 장치(30)를 고속으로 회전건조하였지만 회전건조시 고속회전으로 인하여 액츄에이터(20)가 손상을 당하여 부러지는 경우가 발생하였다(단계204).Then, in step 202, the optical path control device 30 is washed with IPA, and then heat treated at 60 ~ 200 ℃ to remove the IPA and water remaining in the optical path control device 30. Then, IPA, which has good hydrophilicity and volatility due to heat treatment, is rapidly dried to reduce surface tension, thereby preventing sticking. Conventionally, although the optical path control device 30 is rotated and dried at a high speed after removing the sacrificial film, the actuator 20 is damaged and broken due to the high speed rotation during the rotation drying (step 204).
마지막으로 상기 단계(204)에서 광로 조절 장치를 열처리한 후 포토레지스트(photoresist)로 이루어진 보호막을 산소(O2) 플라즈마에 의해 제거한다(단계206).Finally, in step 204, the optical path control apparatus is heat-treated, and then a protective film made of photoresist is removed by oxygen (O 2 ) plasma (step 206).
상술한 바와 같이, 본 발명은 포토레지스트로 액츄에이터의 상부표면과 양측면에 보호막을 형성한 후 질소기체에 운반된 불산으로 희생막을 제거한다. 그리고, 광로 조절 장치에 잔류하는 불산과 희생막 제거시 발생된 물을 제거하기 위하여 IPA로 세척하고 열처리하여 급속으로 건조하고 보호막을 산소 플라즈마로 제거한다.As described above, the present invention forms a protective film on the upper surface and both sides of the actuator with a photoresist and then removes the sacrificial film with hydrofluoric acid carried in the nitrogen gas. Then, in order to remove the hydrofluoric acid remaining in the optical path control device and the water generated during the removal of the sacrificial film, washing with IPA, heat treatment to rapidly dry and remove the protective film with oxygen plasma.
따라서, 본 발명은 희생막 제거후 광로 조절 장치를 IPA로 세척하고 열처리하여 급속으로 건조하므로 표면장력으로 인하여 액츄에이터가 구동기판을 향해 기울어져 서로 접촉하는 스티킹을 방지할 수 있는 효과가 있다.Therefore, the present invention has the effect of preventing the sticking of the actuators inclined toward the driving substrate due to the surface tension because the optical path control device is washed with IPA and heat treated rapidly after removing the sacrificial film.
Claims (2)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950025838A KR0170953B1 (en) | 1995-08-22 | 1995-08-22 | Method for fabricating air gap of optical projection system |
| US08/698,383 US5706122A (en) | 1995-08-22 | 1996-08-15 | Method for the formation of a thin film actuated mirror array |
| JP8235896A JPH0961734A (en) | 1995-08-22 | 1996-08-19 | Manufacture of thin-film actuated mirror array |
| CN96109500A CN1166610A (en) | 1995-08-22 | 1996-08-22 | Method for formation of thin film actuated mirror array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950025838A KR0170953B1 (en) | 1995-08-22 | 1995-08-22 | Method for fabricating air gap of optical projection system |
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| Publication Number | Publication Date |
|---|---|
| KR970014273A KR970014273A (en) | 1997-03-29 |
| KR0170953B1 true KR0170953B1 (en) | 1999-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950025838A KR0170953B1 (en) | 1995-08-22 | 1995-08-22 | Method for fabricating air gap of optical projection system |
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| Country | Link |
|---|---|
| KR (1) | KR0170953B1 (en) |
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| KR970014273A (en) | 1997-03-29 |
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