KR0163860B1 - Carbon and argentum pasting method in tantalum electrolytic condenser - Google Patents
Carbon and argentum pasting method in tantalum electrolytic condenser Download PDFInfo
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- KR0163860B1 KR0163860B1 KR1019940037104A KR19940037104A KR0163860B1 KR 0163860 B1 KR0163860 B1 KR 0163860B1 KR 1019940037104 A KR1019940037104 A KR 1019940037104A KR 19940037104 A KR19940037104 A KR 19940037104A KR 0163860 B1 KR0163860 B1 KR 0163860B1
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- tantalum
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 60
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 56
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 229910052715 tantalum Inorganic materials 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 59
- 239000004332 silver Substances 0.000 claims abstract description 59
- 239000003990 capacitor Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
본 발명은 탄탈콘덴서의 카본 및 은 도포방법에 관한 것으로, 더욱 상세하게는 탄탈콘덴서의 단자를 용이하게 인출하기 위한 공정인 탄탈콘덴서의 카본 및 은 도포방법에 관한 것이다.The present invention relates to a method for applying carbon and silver to tantalum capacitors, and more particularly, to a method for applying carbon and silver to tantalum capacitors, which is a step for easily withdrawing terminals of tantalum capacitors.
본 발명의 목적은 탄탈콘덴서의 제조공정에서 카본 및 은 도포를 실시할 때 에폭시 접착제를 사용하지 않음으로 탄탈콘덴서의 접촉저항을 줄일 수 있는 탄탈콘덴서의 카본 및 은 도포방법을 제공함이다.An object of the present invention is to provide a carbon and silver coating method of tantalum capacitors that can reduce the contact resistance of the tantalum capacitor by not using an epoxy adhesive when applying carbon and silver in the tantalum capacitor manufacturing process.
본 발명은 탄탈소자의 외주연에 카본 및 은을 도포하여 카본층 및 은층을 형성하는 탄탈콘덴서의 카본 및 은 도포방법에 있어서, 상기 탄탈소자의 외주연인 이산화망간층에 1차 공정으로 카본을 도포하여 카본층을 형성하고, 2차 공정으로 상기 카본층 상면에 은을 도포하고 반경화를 시켜서 은층을 형성하고, 3차 공정으로 상기 은층의 상면에 카본을 도포하여 카본층을 형성하고, 이후 4차 공정으로 상기 카본층 상면에 은을 도포하여 은층을 형성함을 특징으로 한다.The present invention provides a carbon and silver coating method for tantalum capacitors by coating carbon and silver on the outer circumference of the tantalum element to form a carbon layer and a silver layer. A carbon layer is formed, and a silver layer is formed by applying silver to the upper surface of the carbon layer in a secondary process and semi-curing to form a silver layer. A carbon layer is formed by applying carbon to the upper surface of the silver layer in a third process. The process is characterized in that the silver layer is formed by applying silver to the upper surface of the carbon layer.
Description
제1도는 종래의 실시예에 따른 탄탈소자를 도시하는 도면으로, 도면(a)는 탄탈소자의 사시도, 또한 도면(b)는 종래의 실시예에 따른 탄탈소자의 종단면도.1 is a view showing a tantalum element according to a conventional embodiment, (a) is a perspective view of the tantalum element, and (b) is a longitudinal cross-sectional view of the tantalum element according to the conventional embodiment.
제2도는 본 발명의 양호한 실시예에 따른 탄탈소자를 도시하는 종단면도.2 is a longitudinal sectional view showing a tantalum element according to a preferred embodiment of the present invention.
제3도는 탄탈콘덴서의 손실특성을 도시하는 도면으로, 도면(a)는 종래의 손실특성을 도시하는 그래프도, 또한 도면(b)는 본 발명의 손실특성을 도시하는 그래프도.3 is a diagram showing loss characteristics of a tantalum capacitor, (a) is a graph showing conventional loss characteristics, and (b) is a graph showing loss characteristics of the present invention.
본 발명은 탄탈콘덴서의 카본 및 은 도포방법에 관한 것으로, 더욱 상세하게는 탄탈콘덴서의 단자를 용이하게 인출하기 위한 공정인 탄탈콘덴서의 카본 및 은 도포방법에 관한 것이다.The present invention relates to a method for applying carbon and silver to tantalum capacitors, and more particularly, to a method for applying carbon and silver to tantalum capacitors, which is a step for easily withdrawing terminals of tantalum capacitors.
일반적으로 탄탈콘덴서의 제조방법은 탄탈분말에 바인더(binder)를 혼합하여 펠릿(pellet)를 성형하는 성형단계와 전술한 바인더를 제거하고 순수한 탄탈분말을 소결시키는 소결단계와, 전술한 소결된 펠릿을 알루미늄 벨트에 용접하는 소자 용접 단계와, 탄탈 표면에 유전체를 형성하는 화성단계가 순차 진행되어 소성로에서 이산화망간 고체 전해질층을 형성하는 소성단계로 진행되며, 이후 카본(carbon) 및 은(Ag)을 도포하는 카본 및 은 도포단계와 리드(lead) 용접 외장단계로 이루어진다.In general, a method of manufacturing a tantalum capacitor includes a molding step of forming pellets by mixing a binder with a tantalum powder, a sintering step of removing the binder and sintering pure tantalum powder, and the sintered pellets described above. The device welding step of welding to the aluminum belt and the chemical conversion step of forming a dielectric on the tantalum surface proceed sequentially to the firing step of forming a solid electrolyte layer of manganese dioxide in the kiln, and then applying carbon and silver (Ag). It consists of carbon and silver coating step and lead welding exterior step.
전술한 카본 및 은 도포단계는 탄탈콘덴서의 양극과 음극단자를 용이하게 인출하기 위하여 시행하는 단계이다.The carbon and silver coating step described above is a step for easily withdrawing the positive and negative terminals of the tantalum capacitor.
도면(a)에서, 탄탈소자(10)는 일반적인 탄탈콘덴서 제고방법을 거치기 위하여 상면에 와이어(12)를 구비하며, 도면(b)에서와 같이 전술한 화성단계를 거친후 산화피막(14)을 형성하고, 이후 소성단계를 거쳐서 이산화망간층(16)을 형성하며, 또한 카본 및 은을 도포하여 카본층(18) 은층(20)을 형성한다.In the figure (a), the tantalum element 10 is provided with a wire 12 on the upper surface in order to go through a general tantalum capacitor manufacturing method, and after the above-described chemical conversion step as shown in the figure (b) to form the oxide film 14 After the formation, and after the calcination step, the manganese dioxide layer 16 is formed, and carbon and silver are applied to form the carbon layer 18 and the silver layer 20.
전술한 은층(20)은 1차로 은(Ag)을 도포한 후 2차로 은(Ag)을 재 도포하여 납부착을 향상시키는데 전술한 은의 재도포에서는 하기와 같은 문제점이 발생한다.The above-described silver layer 20 improves lead adhesion by re-coating silver (Ag) secondly after applying silver (Ag) firstly, and the following problems occur in the re-application of silver described above.
카본층(18)의 상면에 도포하는 은층(20)은 1차로 은(Ag)을 도포한 위에 2차로 은을 재도포시 에폭시 접착제를 첨가하여 은층(20)의 접착력을 향상시키려 했으나 전술한 에폭시 접착제(은층에 포함)는 비전도체로서 탄탈콘덴서의 접촉저항을 증가시키는 문제점이 발생하여 탄탈콘덴서의 신뢰성을 저하시킨다.The silver layer 20 applied to the upper surface of the carbon layer 18 is intended to improve the adhesive force of the silver layer 20 by adding an epoxy adhesive when the silver is re-coated secondly after applying silver (Ag) first. (Included in the silver layer) is a non-conductor, which causes a problem of increasing the contact resistance of the tantalum capacitor, thereby lowering the reliability of the tantalum capacitor.
따라서 본 발명은 전술한 문제점을 해결하기 위하여 안출한 것이다.Accordingly, the present invention has been made to solve the above problems.
본 발명의 목적은 탄탈콘덴서의 제조방법에서 카본 및 은 도포를 실시할 때 에폭시 접착제를 사용하지 않음으로 탄탈콘덴서의 접촉저항을 줄일 수 있는 탄탈콘덴서의 카본 및 은 도포방법을 제공함이다.An object of the present invention is to provide a carbon and silver coating method of the tantalum capacitor to reduce the contact resistance of the tantalum capacitor by not using an epoxy adhesive when the carbon and silver coating in the manufacturing method of the tantalum capacitor.
전술한 목적을 달성하기 위하여 본 발명은 탄탈소자의 외주연에 카본 및 은을 도포하는 카본층 및 은층을 형성하는 탄탈콘덴서의 카본 및 은 도포방법에 있어서, 상기 탄탈소자의 외주연인 이산화망간층에 1차 단계로 카본을 도포하여 카본층을 형성하고, 2차 단계로 상기 카본층 상면에 은을 도포하고 반경화를 시켜서 은층을 형성하고, 3차 단계로 상기 은층의 상면에 카본을 도포하여 카본층을 형성하고, 이후 4차 단계로 상기 카본층 상면에 은을 도포하여 은층을 형성함을 특징으로 한다.In order to achieve the above object, the present invention provides a carbon layer and a carbon layer for coating carbon and silver on the outer circumference of the tantalum element, and a carbon and silver coating method for the tantalum capacitor, wherein the manganese dioxide layer is the outer circumference of the tantalum element. In the second step, the carbon layer is formed to form a carbon layer, and in the second step, silver is applied to the upper surface of the carbon layer and semi-cured to form a silver layer, and in the third step, carbon is applied to the upper surface of the silver layer. Forming and then, in the fourth step is characterized by forming a silver layer by applying silver on the upper surface of the carbon layer.
이하에서는 첨부한 도면을 참조하여 본 발명의 양호한 일실시예에 따른 탄탈콘덴서의 카본 및 은 도포방법을 상세히 설명하기로 한다.Hereinafter, with reference to the accompanying drawings will be described in detail the carbon and silver coating method of the tantalum capacitor according to an embodiment of the present invention.
제2도는 본 발명의 양호한 일실시예에 따른 탄탈콘덴서의 종단면도이다.2 is a longitudinal sectional view of a tantalum capacitor according to a preferred embodiment of the present invention.
동도면에서 상면에 와이어(12)를 형성한 탄탈소자(10)는 화성단계를 거쳐서 산화피막(14)을 형성하고, 소성단계를 거쳐서 이산화망간층(16)을 형성하며, 전술한 이산화망간층(16)의 상면인 탄탈소자(10)의 외주연에 1차 단계로 카본(carbon)을 도포하여 카본층(18)을 형성하고, 2차 단계로 전술한 카본층(18) 상면에 은(Ag)을 도포하고 반경화를 실시하여 은층(20)을 형성한다.The tantalum element 10 having the wire 12 formed on the upper surface in the same figure forms the oxide film 14 through the chemical conversion step, and forms the manganese dioxide layer 16 through the firing step, and the manganese dioxide layer 16 described above. Carbon is applied to the outer periphery of the tantalum element 10, which is the upper surface of the upper surface, in a first step to form a carbon layer 18, and silver (Ag) is formed on the upper surface of the carbon layer 18 described in the second step. Is applied and semi-cured to form the silver layer 20.
이후에는 3차 단계로 전술한 은층(20)의 외주연에 카본(carbon)을 도포하여 카본층(22)을 형성하고, 4차 단계로 전술한 카본층(22)의 상면에 은(Ag)을 도포하여 은층(24)을 형성한다.Thereafter, the carbon layer 22 is formed by applying carbon to the outer circumference of the silver layer 20 described above in the third step, and silver (Ag) is formed on the upper surface of the carbon layer 22 described above in the fourth step. Is applied to form the silver layer 24.
전술한 카본 및 은 도포방법을 거친 탄탈소자(10)는 이산화망간(16)의 상면에 카본층(18)을 형성하고 전술한 카본층(18)의 상면에 은층(20)을 형성하며, 전술한 은층(20)의 상면에는 카본층(22)을 형성하며 또한 전술한 카본층(22)의 상면에는 은층(24)을 형성함으로서 은층(20,24)에 대한 전도성을 은층(20,24)의 사이에 형성한 카본층(22)에 의하여 향상시킬 수 있다.Tantalum element 10 subjected to the carbon and silver coating method described above forms a carbon layer 18 on the upper surface of the manganese dioxide 16 and a silver layer 20 on the upper surface of the carbon layer 18 described above. The carbon layer 22 is formed on the upper surface of the silver layer 20, and the silver layer 24 is formed on the upper surface of the carbon layer 22 to provide conductivity to the silver layers 20 and 24. It can improve with the carbon layer 22 formed in between.
전술한 바와 같은 본 발명의 탄탈콘덴서의 카본 및 은 도포방법은 종래의 문제점인 은층(20)의 에폭시 접착제로 인한 접촉저항의 증가를 줄이기 위한 방법으로 종래의 손실특성을 도시하는 제3도의 도면(a)에 비해 본 발명에 의한 제품의 손실특성을 도시하는 도면(b)의 손실특성이 더욱 안정되게 나타낸 것을 알 수 있으며 또한 탄탈콘덴서의 접촉저항을 줄임으로서 고신뢰성의 탄탈콘덴서를 제조할 수 있다.The carbon and silver coating method of the tantalum capacitor of the present invention as described above is a method for reducing the increase in contact resistance caused by the epoxy adhesive of the silver layer 20, which is a conventional problem. Compared with a), it can be seen that the loss characteristic of the drawing (b) showing the loss characteristics of the product according to the present invention is more stably represented, and also a high reliability tantalum capacitor can be manufactured by reducing the contact resistance of the tantalum capacitor. .
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940037104A KR0163860B1 (en) | 1994-12-27 | 1994-12-27 | Carbon and argentum pasting method in tantalum electrolytic condenser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940037104A KR0163860B1 (en) | 1994-12-27 | 1994-12-27 | Carbon and argentum pasting method in tantalum electrolytic condenser |
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| Publication Number | Publication Date |
|---|---|
| KR960025870A KR960025870A (en) | 1996-07-20 |
| KR0163860B1 true KR0163860B1 (en) | 1998-12-15 |
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| KR1019940037104A KR0163860B1 (en) | 1994-12-27 | 1994-12-27 | Carbon and argentum pasting method in tantalum electrolytic condenser |
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| KR960025870A (en) | 1996-07-20 |
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