KR0156644B1 - Heating apparatus of semiconductor process machine - Google Patents
Heating apparatus of semiconductor process machine Download PDFInfo
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- KR0156644B1 KR0156644B1 KR1019950043118A KR19950043118A KR0156644B1 KR 0156644 B1 KR0156644 B1 KR 0156644B1 KR 1019950043118 A KR1019950043118 A KR 1019950043118A KR 19950043118 A KR19950043118 A KR 19950043118A KR 0156644 B1 KR0156644 B1 KR 0156644B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Abstract
본 발명은 가열부에 부착되어 가열부를 일정온도로 가열 및 우지시키기 위한 가열기와, 가열부에 부착되어 가열부의 온도를 측정하는 온도측정부와, 가열기에 인가되는 전압공급을 제어하는 전압공급제어부와, 온도측정부에서 측정된 측정값과 설정되어 입력된 설정값을 비교하는 비교부와, 비교부와 전압공급제어부를 동작시키는 구동교류전압을 인가하되, 출력단에 퓨즈가 형성된 구동교류전압인가부를 구비하는 반도체 제조장비의 가열장치에 있어서, 구동교류전압인가부의 출력단에 형성된 퓨즈의 출력을 입력으로 하는 동작감지부와, 퓨즈의 출력을 입력으로 하는 동작감지부와 장비에라신호와 동작감지부의 출력신호를 입력신호로 하는 논리합게이트(OR gate)와, 논리합게이트의 출력신호가 입력되어, 인터록신호를 출력하는 시스템인터록제어부를 포함하여 이루어진다.The present invention includes a heater attached to the heating unit for heating and maintaining the heating unit at a constant temperature, a temperature measuring unit attached to the heating unit for measuring the temperature of the heating unit, a voltage supply control unit for controlling a voltage supply applied to the heater; A comparator for comparing the measured value measured by the temperature measuring part and the set value inputted therein, and applying a drive AC voltage for operating the comparator and the voltage supply controller, are provided with a drive AC voltage applying part having a fuse formed at the output terminal. In the heating apparatus of the semiconductor manufacturing equipment, the motion detection unit for inputting the output of the fuse formed at the output terminal of the drive alternating current applying unit, the motion detection unit for inputting the output of the fuse, the equipment error signal and the output signal of the motion detection unit A system interlock for inputting an OR gate having an input signal as an input signal and an output signal of the OR gate and outputting an interlock signal It comprises parts.
Description
제1도는 종래의 반도체 제조장비의 가열장치의 일실시예를 도시한 계통도.1 is a system diagram showing an embodiment of a heating apparatus of a conventional semiconductor manufacturing equipment.
제2도는 본 발명에 의한 반도체 제조장비의 가열장치의 일실시예를 도시한 계통도.2 is a schematic diagram showing an embodiment of a heating apparatus for semiconductor manufacturing equipment according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
20 : 동작감지부 Fs1.Fs'1 : 제 1퓨즈20: motion detection unit Fs1.Fs'1: first fuse
Fs2.Fs'2: 제 2퓨즈 L.L' : 램프Fs 2 .Fs ' 2 : Fuse 2 LL': Lamp
OR : 논리합게이트 I : 반전소자OR: Logic sum gate I: Inverting element
본 발명은 반도체 제조자비의 가열(heating)장치에 관한 것으로, 특히 반도체 제조공정 진행중에 대상물, 즉 반응실 자체 또는 웨이퍼(wafer)를 일정온도로 유지시켜 주는 가열장치의 온(ON)/오프(OFF) 상태 감지에 적당하도록 한 반도체 제조장비의 가열장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating apparatus at a semiconductor manufacturer's cost. Particularly, a heating apparatus for maintaining an object, that is, a reaction chamber itself or a wafer at a constant temperature during a semiconductor manufacturing process, is provided. OFF) relates to a heating device for semiconductor manufacturing equipment suitable for state sensing.
반도체 제조에 있어서, 대상물 즉, 반응실 자체 또는 웨이퍼 등을 일정온도로 유지시키면서 진행시키는 공정이 많은데, 이때 가열장치에서는 가열기(heater)를 구비하는 가열부(heater block)를 이용하여 대상물을 가열하고 있다.In semiconductor manufacturing, there are many processes in which an object, that is, a reaction chamber itself or a wafer, is maintained at a constant temperature. In this case, a heating device heats an object using a heater block provided with a heater. have.
제1도는 종래의 반도체 제조장비의 가열장치의 일실시예를 도시한 계통도로서, 이하 첨부된 도면을 참고로 종래의 반도체 제조장비의 가열장치의 구성 및 동작을 설명하면 다음과 같다.FIG. 1 is a system diagram showing an embodiment of a heating apparatus of a conventional semiconductor manufacturing equipment. Hereinafter, the configuration and operation of the heating apparatus of the conventional semiconductor manufacturing equipment will be described with reference to the accompanying drawings.
종래의 반도체 제조장비의 가열장치는 제1도에 도시된 바와 같이, 가열부에 부착되어 가열부를 일정온도로 가열 및 유지시키기 위한 가열기와, 가열부에 부착되어 가열부의 온도를 측정하는 온도측정부와, 가열기에 인가되는 전압공급을 제어하되, 자체에 과전류가 흐르는 것을 방지하기 위한 제 1퓨즈(Fs1)와, 제 2퓨즈가 과전류에 의해 끊어지면 커지는 램브(lamp)(L)가 설치되어 있는 전압공급제어부와, 온도측정부에서 측정된 측정값과 작업자에 의해 설정되어 입력된 설정값을 비교하는 비교부와, 비교부와 전압공급제어부를 동작시크는 구동교류전압을 인가하되, 과도한 구동교류전압이 비교부와 전압공급제어부로 인가되는 것을 방지하기 위한 제 2퓨즈(fuse)(Fs2)가 출력단에 연결되는 구동교류전압인가부로 이루어진다.The heating apparatus of the conventional semiconductor manufacturing equipment is a heater attached to the heating unit to heat and maintain the heating unit at a constant temperature, as shown in Figure 1, and a temperature measuring unit attached to the heating unit to measure the temperature of the heating unit And a first fuse Fs 1 for controlling a voltage supply applied to the heater and preventing overcurrent from flowing into the heater, and a lamp L that is enlarged when the second fuse is cut off by the overcurrent. The voltage supply control unit and the comparison unit comparing the measured value measured by the temperature measuring unit with the set value set and input by the operator, and applying the driving alternating voltage to operate the comparison unit and the voltage supply control unit. A second fuse (Fs 2 ) for preventing the AC voltage from being applied to the comparator and the voltage supply control unit is composed of a drive AC voltage applying unit connected to the output terminal.
그리고 종래의 반도체 제조장비에서 온도측정부는 써머커플(thermo couples)로 이루어지고, 전압공급제어부는 에스씨알(SCR : Silicon controlled rectifier)파워 랙(powe rrack)로 이루어진다.In the semiconductor manufacturing apparatus of the related art, the temperature measuring part is formed of thermo couples, and the voltage supply control part is made of a silicon controlled rectifier (SCR) power rack.
이하 종래의 반도체 제조장비의 가열장치의 동작을 설명하면 다음과 같다.Hereinafter, the operation of the heating apparatus of the conventional semiconductor manufacturing equipment will be described.
종래의 반도체 제조장비의 가열장치에서 우선 전압공급제어부에서 가열기에 구동전압을 공급하여 가열기를 동작시켜서 가열부를 가열시키는데, 가열기가 가열되어 설정값만큼만 가열되면, 비교기에서 전압공급제어부에 신호를 보내어 가열기로의 전압공급을 차단한다.In the heating apparatus of the conventional semiconductor manufacturing equipment, the voltage supply controller first supplies a driving voltage to the heater to operate the heater to heat the heater. When the heater is heated and heated only by a set value, the comparator sends a signal to the voltage supply controller to heat the heater. Shut off the supply of voltage to the
이어서 공정진행 중에 온도측정부에서 가열부의 온도를 측정하여 비교부로 측정값을 출력하면, 비교부에서는 측정값과 설정값을 비교하여 측정값이 설정값보다 작으면, 전압공급제어부에서 가열기로 구동전압을 공급하도록 하고, 측정값이 설정값보다 크면, 전압공급제어부에서 가열기로 구동되는 구동전압을 차단하여 가열기가 동장되지 않도록 한다.Subsequently, during the process, the temperature measuring unit measures the temperature of the heating unit and outputs the measured value to the comparing unit. The comparing unit compares the measured value and the set value, and if the measured value is smaller than the set value, the voltage supply controller controls the driving voltage. If the measured value is larger than the set value, the voltage supply controller cuts the driving voltage driven by the heater so that the heater is not inserted.
그러나 종래의 반도체 제조장비의 가열장치에서 과전압 또는 과전류의 발생시에는 제 1퓨즈, 제 2퓨즈 등에 의해 자체동작이 차단되는 동작에라가 발생되어도 공정을 진행하는 공정 장비자체는 인터록(inter-lock)되지 않고 계속적으로 동작하게 되어, 작업자는 공정불량 발생 이후에 가열장치의 동작에라를 인식할수 있었다.However, when an overvoltage or overcurrent is generated in a heating apparatus of a conventional semiconductor manufacturing equipment, even if an operation error is generated in which the self operation is blocked by the first fuse or the second fuse, the process equipment itself is not inter-locked. It was operated continuously without a worker, the operator was able to recognize the operation error of the heating apparatus after the process defect occurred.
즉, 종래의 반도체 제조장비의 가열장치에서 반도체 제조장비가 금속박막 증착장비인 경우에 있어서는, 가열장치의 퓨즈가 끊어져서 자체동작이 차단되어 가열부(heater block)가 더 이상 온도를 유지하지 못하게 되어 온도가 하강하게 되어도 계속적으로 금속박만 증착공정을 진행시키므로, 온도가 하강된 상태에서 공정이 완료된 웨이퍼는 후 공정불량의 원인이 되어 타장비의 동장이상을 유발시키고 자체 손상을 입게 되었으며, 이로 인하여 반도체 제조장비의 전반적인 장비 가동율 저하 및 생성수율 저하 등의 문제가 발생되었다.That is, in the case where the semiconductor manufacturing equipment is a metal thin film deposition equipment in the heating apparatus of the conventional semiconductor manufacturing equipment, the fuse of the heating apparatus is blown so that its operation is blocked so that the heater block no longer maintains the temperature. Since only the metal foil is continuously deposited even when the temperature is lowered, the wafer that has been processed in the state where the temperature is lowered may cause a later process defect and cause malfunction of other equipment and damage itself. Problems such as lowering the overall equipment utilization rate and production yield of manufacturing equipment have occurred.
본 발명은 이러한 문제를 해결하기 위해여 안출된 것으로, 반도체 제조장비의 가열장치에 있어서, 가열장치의 동작에라에 의해 장비자체에 인터록신호에 의해 장비의 작동이 멈추도록 하면서 작업자가 용이하게 가열장치의 동작이상을 감지할 수 있도록 하는 것이 그 목적이다.The present invention has been made to solve such a problem, in the heating device of the semiconductor manufacturing equipment, the operator easily stops the heating device while the operation of the equipment is stopped by the interlock signal to the equipment itself by the operation of the heating device. The purpose is to be able to detect the abnormal behavior of.
본 발명은 가열부에 부착되어 가열부를 일정온도로 가열 및 유지시키기 위한 가열기와, 가열부에 부착되어 가열부의 온도를 측정하는 온도측정부와, 가열기에 인가되는 전압공급을 제어하는 전압공급제어부와, 온도측정부에서 측정된 측정값과 설정되어 입력도니 설정값을 비교하는 비교부와, 비교부와 전압공급제어부를 동작시키는 구동교류전압을 인가하되, 출력단에 퓨즈가 형성된 구동교류전압인가부를 구비하는 반도체 제조장비의 가열장치에 있어서, 구동교류전압인가부의 출력단에 형성된 퓨즈의 출력을 입력으로 하는 동작감지부와, 퓨즈의 출력을 입력으로 하는 동작감지부와, 장비에라신호와 동작감지부의 출력신호를 입력신호로 하는 논리합게이트(OR gate)와, 논리합게이트의 출력신호가 입력되어, 인터록시호를 출력하는 시스템인터록제어(system inter-lock control)부를 포함하여 이루어진다.The present invention includes a heater attached to the heating unit for heating and maintaining the heating unit at a constant temperature, a temperature measuring unit attached to the heating unit for measuring the temperature of the heating unit, a voltage supply control unit for controlling a voltage supply applied to the heater; In addition, the comparator which compares the measured value measured by the temperature measuring part and the input value is set, and applies the drive AC voltage which operates the comparator and the voltage supply control part, but has a drive AC voltage application part in which the fuse is formed in the output terminal. A heating apparatus of a semiconductor manufacturing equipment comprising: an operation detecting unit for inputting an output of a fuse formed at an output end of a driving alternating voltage applying unit, an operation detecting unit for inputting an output of a fuse, an output of an equipment error signal, and an operation detecting unit; A system interlock for inputting an OR gate having a signal as an input signal and an output signal of the OR gate, and outputting an interrogation signal. Air comprises portions (inter-lock system control).
제2도는 본 발명에 의한 반도체 제조장비의 가열장치의 일실시예를 도시한 계통도로서, 이하 첨부된 도면을 참고로 본 발명에 의한 반도체 제조장비의 가열 장치의 구성 및 동작을 설명하면 다음과 같다.2 is a system diagram showing an embodiment of a heating apparatus of a semiconductor manufacturing apparatus according to the present invention. Hereinafter, the configuration and operation of the heating apparatus of the semiconductor manufacturing apparatus according to the present invention will be described with reference to the accompanying drawings. .
본 발명에 의한 반도체 제조장비의 가열장치는 제2도에 도시된 바와 같이, 가열부에 부착되어 가열부를 일정온도로 가열 빛 유지시키기 위한 가열기와, 가열부에 부착되어 가열부의 온도를 측정하는 온도측정부와, 가열기에 인가되는 전압공급을 제어하되, 자체에 과전류가 흐르는 것을 방지하기 위한 제1퓨즈(Fs'1)와, 제2퓨즈가 과전류에 의해 끊어지면 켜지는 램프(L')가 설치되어 있는 전압 공급제어부와, 온도측정부에서 측정된 측정값과 작업자에 의해 설정되어 입력된 설정값을 비교하는 비교부와, 비교부와 전압공급제어부를 동작시키는 구동교류전압을 인가하되, 과도한 구동교류전압이 비교부와 전압공급제어부로 인가되는 것을 방지하기 위한 제2퓨즈(Fs2)가 출력단에 연결되는 구동교류전압인가부와, 구동굘전압인가부에서 출력되는 교류전압이 입력되어 직류전압을 출력하는 직류전아인가부와, 직류전압인가부의 출력단에 연결된 반전소자(I : inverter)와, 반전소자의 출력신호를 입력신호로 하면서, 출력은 논리합게이트로 입력되는 디스플레이(display)장치로 이루어지는 동작감지부와, 장비에라신호와동작감지부에서 반전소자의 출력신호를 입력신호로 하는 논리합게이트(OR)와, 논리합게이트의 출력신호가 입력되어, 인터록신호를 출력하면서 스피커(speaker) 및 모니터(monitor)를 동작시키는 시스템인터록제어부를 포함하여 이루어진다.As shown in FIG. 2, the heating apparatus of the semiconductor manufacturing equipment according to the present invention is a heater attached to the heating unit to maintain the heating light at a constant temperature, and a temperature attached to the heating unit to measure the temperature of the heating unit. The first fuse (Fs ' 1 ) for controlling the measurement unit, the voltage supply applied to the heater, and to prevent the overcurrent flows, and the lamp (L') which is turned on when the second fuse is cut off by the overcurrent Apply the installed voltage supply control unit, the comparison unit for comparing the measured value measured by the temperature measuring unit with the set value set and input by the operator, and the driving alternating voltage for operating the comparison unit and the voltage supply control unit. driving AC is AC voltage is output from the comparator and the voltage supply control unit is a second fuse driving AC voltage (Fs 2) is connected to the output terminal for preventing the portion applied with the driving voltage applying unit gyol A display in which a voltage is input to output a DC voltage, an inverter connected to the output terminal of the DC voltage applying unit, an inverter (I: inverter) connected to an output terminal of the DC voltage applying unit, and an output signal of the inverter as an input signal, and the output is inputted to a logic sum gate. (display) the motion detection unit consisting of a display device, the logic error gate (OR) which uses the output signal of the inverting element as an input signal from the equipment error signal and the motion detection unit, and the output signal of the logic sum gate are input to output an interlock signal. It includes a system interlock control unit for operating a speaker and a monitor.
이하 본 발명에 의한 반도체 제조장비의 가열장치의 동작을 설명하겠다.Hereinafter, the operation of the heating apparatus of the semiconductor manufacturing equipment according to the present invention.
본 발명에 의한 반도체 제조장비의 가열장치에서는 비교부에서 가열부의 온도를 측정한 온도측정보의 측정값과 설정값을 비교하여 전압공급제어부로 출력시키면, 전압공급제어부에서는 비교기에서 입력된 신호에 따라 가열기를 동작시키거나 동작을 멈추도록 하여 가열부가 일정온도로 유지되도록 동작되고 있으며, 이대 구동 교류전압인가부에서 과전압이 출력되어 제2퓨즈가 끊어 지게 되면, 직류전압공급부로의 인가전압이 차단되어 직류전압공급부의 출력신호는 논리적으로 0(zero)이 되고, 이 출력신호는 반전소자(I)를 통과하면서 논리적으로 1의 신호로 되어 디스플레이장치를 동작시키면서 논리합게이트(OR)로 입력되며, 논리합게이트의 출력신호는 시스템인터록제어부에 입력된다.In the heating apparatus of the semiconductor manufacturing equipment according to the present invention, when the comparison unit compares the measured value of the temperature side information measured by the heating unit with the set value and outputs it to the voltage supply controller, the voltage supply controller according to the signal input from the comparator. The heating unit is operated to stop the operation or to stop the operation, and the heating unit is maintained at a constant temperature. When the overvoltage is output from the second driving AC voltage applying unit and the second fuse is cut off, the applied voltage to the DC voltage supply unit is cut off. The output signal of the DC voltage supply unit is logically 0 (zero), and this output signal is logically made of 1 while passing through the inverting element I, and is input to the logic sum gate OR while operating the display device. The output signal of the gate is input to the system interlock controller.
그리고 시스템인터록제어부가 논리합게이트의 출력신호에 의해 동작되면, 장비 자체를 인터록시키는 인터록신호를 출력하면서 스피커 또는 모니터를 동작시켜서 작업자가 장비의 에라를 인식하도록 한다.When the system interlock controller is operated by the output signal of the logic sum gate, the speaker or monitor is operated while outputting an interlock signal for interlocking the equipment itself so that the operator can recognize the error of the equipment.
또한 본 발명에 의한 반도체 제조장비의 가열장치에서 논리합게이트의 다른 입력단으로 입력되는 장비에라신호는 장비 자체의 에라신호를 말하며, 장비자체의 에라신호에 의해서도 스시템인터락신호가 동작되어 인터록신호를 출력하면서 스피커 및 모니터를 동작시켜서 작업자가 장비의 에라를 인식하되, 가열장치의 동작에라의 유무를 확인하기가 용이하지 않으므로, 상술한 동작감지부에서의 반전소자와, 논리합게이트 사이에 부가하여 형성시킨 디스플레이장치에 의해서 작업자가 가열장치의 동작에리임을 용이하게 인식할 수 있도록 한다.In addition, the equipment error signal input to the other input terminal of the logic sum gate in the heating apparatus of the semiconductor manufacturing equipment according to the present invention refers to the error signal of the equipment itself, the system interlock signal is also operated by the error signal of the equipment itself to generate an interlock signal. By operating the speaker and the monitor while outputting, the operator recognizes the error of the equipment, but it is not easy to confirm the presence or absence of the operation error of the heating device. By the display device, the operator can easily recognize that the operation of the heating device.
본 발명에 의한 반도체 제조장비의 가열장치에서는 동작에라가 발새되었을 경우에 작업자가 용이하게 인식할 수 있으므로 신속한 조치를 취할 수 있으며, 또한 종래의 기술과같이, 가열장치의 동자에라에 의해서도 장비자체가 인터록되므로 공정장비의 무리한 공정진행으로 인한 장비의 손상이 방지되고, 반도체 제조장비의 전반적인 장비 가동율 및 생상수율 등이 향상된다.In the heating apparatus of the semiconductor manufacturing equipment according to the present invention, since the operator can easily recognize when an operation error occurs, the user can take quick measures. Also, as in the related art, the equipment itself can be replaced by the heating device of the heating apparatus. The interlock prevents equipment damage due to excessive process progress of the process equipment and improves the overall equipment operation rate and production yield of the semiconductor manufacturing equipment.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950043118A KR0156644B1 (en) | 1995-11-23 | 1995-11-23 | Heating apparatus of semiconductor process machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950043118A KR0156644B1 (en) | 1995-11-23 | 1995-11-23 | Heating apparatus of semiconductor process machine |
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| Publication Number | Publication Date |
|---|---|
| KR970030428A KR970030428A (en) | 1997-06-26 |
| KR0156644B1 true KR0156644B1 (en) | 1998-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950043118A KR0156644B1 (en) | 1995-11-23 | 1995-11-23 | Heating apparatus of semiconductor process machine |
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| Country | Link |
|---|---|
| KR (1) | KR0156644B1 (en) |
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1995
- 1995-11-23 KR KR1019950043118A patent/KR0156644B1/en not_active IP Right Cessation
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| KR970030428A (en) | 1997-06-26 |
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