KR970030428A - Heating device of semiconductor manufacturing equipment - Google Patents

Heating device of semiconductor manufacturing equipment Download PDF

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Publication number
KR970030428A
KR970030428A KR1019950043118A KR19950043118A KR970030428A KR 970030428 A KR970030428 A KR 970030428A KR 1019950043118 A KR1019950043118 A KR 1019950043118A KR 19950043118 A KR19950043118 A KR 19950043118A KR 970030428 A KR970030428 A KR 970030428A
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KR
South Korea
Prior art keywords
unit
output
heating
voltage
signal
Prior art date
Application number
KR1019950043118A
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Korean (ko)
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KR0156644B1 (en
Inventor
이덕희
Original Assignee
문정환
엘지반도체 주식회사
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Application filed by 문정환, 엘지반도체 주식회사 filed Critical 문정환
Priority to KR1019950043118A priority Critical patent/KR0156644B1/en
Publication of KR970030428A publication Critical patent/KR970030428A/en
Application granted granted Critical
Publication of KR0156644B1 publication Critical patent/KR0156644B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Abstract

본 발명은 가열부에 부착되어 가열부를 일정온도로 가열 및 유지시키기 위한 가열기와, 가열부에 부착되어 가열부의 온도를 측정하는 온도측정부와, 가열기에 인가되는 전압공급을 제어하는 전압공급제어부와, 상기 온도 측정부에서 측정된 측정값과 설정되어 입력된 설정값을 비교하는 비교부와, 비교부와 전압공급제어부를 동작시키는 구동교류전압을 인가하되, 출력단에 퓨즈가 형성된 구동교류전압인가부를 구비하는 반도체 제조장비의 가열장치에 있어서, 구동교류전압인가부의 출력단에 형성된 퓨즈의 출력을 입력으로 하는 동작감지부와, 퓨즈의 출력을 입력으로 하는 동작감지부와, 장비에라신호와 동작감지부의 출력신호를 입력신호로 하는 논리합게이트(OR gate)와, 논리합게이트의 출력신호가 입력되어, 인터록신호를 출력하는 시스템인터록제어부를 포함하여 이루어진다.The present invention includes a heater attached to the heating unit for heating and maintaining the heating unit at a constant temperature, a temperature measuring unit attached to the heating unit for measuring the temperature of the heating unit, a voltage supply control unit for controlling a voltage supply applied to the heater; A comparison unit for comparing the measured value measured by the temperature measuring unit with the set value inputted therein, and applying a driving alternating voltage for operating the comparing unit and the voltage supply control unit, wherein In the heating apparatus of the semiconductor manufacturing equipment comprising: an operation detecting unit for inputting the output of the fuse formed at the output terminal of the drive AC voltage applying unit, an operation detecting unit for inputting the output of the fuse, an equipment error signal and the operation detecting unit OR gate which uses the output signal as an input signal and an output signal of the logic sum gate are input to output an interlock signal. It comprises a locking control unit.

Description

반도체 제조장비의 가열장치Heating device of semiconductor manufacturing equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의한 반도체 제조장비의 가열장치의 일실시예를 도시한 계통도.2 is a schematic diagram showing an embodiment of a heating apparatus for semiconductor manufacturing equipment according to the present invention.

Claims (3)

가열부에 부착되어 가열부를 일정온도로 가열 및 유지시키기 위한 가열기와, 상기 가열부에 부착되어 가열부의 온도를 측정하는 온도측정부와, 상기 가열기에 인가되는 전압공급을 제어하는 전압공급제어부와, 상기 온도측정부에서 측정된 측정값과 설정되어 입력된 설정값을 비교하는 비교부와, 상기 비교부와 상기 전압공급 제어부를 동작시키는 구동교류전압을 인가하되, 출력단에 퓨즈가 형성된 구동교류전압인가부를 구비하는 반도체 제조장비의 가열장치에 있어서, 상기 구동교류전압인가부의 출력단에 형성된 퓨즈의 출력을 입력으로 하는 동작감지부와, 장비에라신호와 상기 동작감지부의 출력신호를 입력신호로 하는 논리합게이트와, 상기 논리합게이트의 출력신호가 입력되어, 인터록신호를 출력하는 시스템인터록제어부를 포함하여 이루어지는 반도체 제조장비의 가열장치.A heater attached to the heating unit for heating and maintaining the heating unit at a predetermined temperature, a temperature measuring unit attached to the heating unit for measuring the temperature of the heating unit, a voltage supply control unit controlling a voltage supply applied to the heater; A comparison unit for comparing the measured value measured by the temperature measuring unit and the set value inputted and a driving AC voltage for operating the comparing unit and the voltage supply control unit are applied, and a driving AC voltage having a fuse formed at an output terminal is applied. A heating apparatus of a semiconductor manufacturing equipment having a portion, comprising: an operation sensing unit for inputting an output of a fuse formed at an output end of the driving alternating voltage applying unit; and a logic sum gate configured to use an equipment error signal and an output signal of the operation sensing unit as input signals. And a system interlock controller for inputting an output signal of the logic sum gate to output an interlock signal. Eojineun heating device of a semiconductor manufacturing equipment. 제1항에 있어서, 상기 동작감지부는 상기 구동교류전압인가부에서 출력되는 교류전압이 입력되어 직류전압을 출력하는 직류전압인가부와, 상기 직류전압인가부의 출력단에 연결되어 상기 직류전압인가부의 출력신호가 입력되고, 출력신호는 상기 논리합게이트로 입력되는 반전소자릍 포함하여 이루어지는 것을 특징으로 하는 반도체 제조장비의 가열장치.The DC voltage applying unit of claim 1, wherein the motion detection unit is connected to an output voltage of the DC voltage applying unit and a DC voltage applying unit configured to input an AC voltage output from the driving AC voltage applying unit to output a DC voltage. A signal is input, the output signal is a heating device of the semiconductor manufacturing equipment, characterized in that it comprises an inverting element which is input to the logic sum gate. 제2항에 있어서, 상기 반전소자와 상기 논리합게이트 소자 사이에 디스플레이장치를 부가하여 형성시키는 것을 특징으로 하는 반도체 제조장비의 가열장치.The heating apparatus of claim 2, wherein a display device is added between the inverting element and the logic sum gate element.
KR1019950043118A 1995-11-23 1995-11-23 Heating apparatus of semiconductor process machine KR0156644B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950043118A KR0156644B1 (en) 1995-11-23 1995-11-23 Heating apparatus of semiconductor process machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950043118A KR0156644B1 (en) 1995-11-23 1995-11-23 Heating apparatus of semiconductor process machine

Publications (2)

Publication Number Publication Date
KR970030428A true KR970030428A (en) 1997-06-26
KR0156644B1 KR0156644B1 (en) 1998-12-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950043118A KR0156644B1 (en) 1995-11-23 1995-11-23 Heating apparatus of semiconductor process machine

Country Status (1)

Country Link
KR (1) KR0156644B1 (en)

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Publication number Publication date
KR0156644B1 (en) 1998-12-01

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