KR0150670B1 - Recovering and filtering method of microparticle by using electrodialysis - Google Patents
Recovering and filtering method of microparticle by using electrodialysis Download PDFInfo
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- KR0150670B1 KR0150670B1 KR1019940022381A KR19940022381A KR0150670B1 KR 0150670 B1 KR0150670 B1 KR 0150670B1 KR 1019940022381 A KR1019940022381 A KR 1019940022381A KR 19940022381 A KR19940022381 A KR 19940022381A KR 0150670 B1 KR0150670 B1 KR 0150670B1
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/469—Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis
- C02F1/4696—Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis electrophoresis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C5/00—Separating dispersed particles from liquids by electrostatic effect
- B03C5/02—Separators
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
Abstract
본 발명은 미세입자를 회수·여과하는 방법에 관한 것으로서, 연삭·연마가공액중에(+),(-)전극을 설치하고, 양 전극간에 공급전원으로 전압을 부가하여 상기 가공액중에 대전된 상태로 존재하는 미세한 입자를 전기영동현상을 이용하여 한 방향으로 이동·응집시켜 회수·여과함으로써, 가공액의 청정도 유지와 균일한 가공환경의 지속이 가능하여 보다 고품위(high integrity or damage free)의 가공면을 안정되게 얻는 것이 가능하며, 기존의 여과방식 혹은 여과공정의 소형화, 간이화가 가능한 전기영동현상을 이용한 연삭·연막가공액중에 존재하는 미세입자 회수·여과방법이다.The present invention relates to a method for recovering and filtration of fine particles, wherein the positive and negative electrodes are provided in a grinding and polishing solution, and a voltage is applied to both electrodes to supply a voltage to the processing liquid. The fine particles present in the process can be recovered and filtered by electrophoresis, recovered and filtered to maintain cleanliness of the processing liquid and to maintain a uniform processing environment. It is possible to obtain a processed surface stably, and is a method for recovering and filtering fine particles existing in grinding and smoke processing solutions using electrophoretic phenomena, which can be miniaturized and simplified.
Description
본 발명은 경취성 재료의 연삭가공과 연마가공시 가공액 중에 존재하는 미세입자를 회수하여 여과하는 방법에 관한 것으로서, 특히 전기영동현상을 이용하여 가공액중에 존재하는 미세입자를 회수함으로써 여과효과를 극대화하는 전기영동현상을 이용한 초정밀 연삭·연마가공액 중에 존재하는 미세입자 회수·여과 방법에 관한 것이다.The present invention relates to a method for recovering and filtering fine particles present in a processing liquid during grinding and polishing of a hard brittle material, and in particular, by using electrophoresis to recover the fine particles present in the processing liquid. The present invention relates to a method for recovering and filtering fine particles present in ultra-precise grinding and polishing solutions using maximizing electrophoresis.
일반적으로 세라믹재료와 반도체 결정재료 및 광학유리 등으로 대표되는 경취성재료(Hard and Brittle Material)의 초정밀가공[(경면가공, 미세형상가공, 무결함가공(damage free가공)]에는 연삭가공과 연마가공이 적용되고 있으며, 가공된 재료가 초정밀 부품이나 소자로서 정상적인 기능을 효과적으로 수행하기 위해서는 최종 가공면의 표면거칠기(maximum surface roughness; Rmax)가 수∼수십 나노미터(nanometer : 10-9-m)의 극히 높은 정도의 평활면이 요구되며, 이러한 초정밀 가공은 가공방법, 가공기계 및 측정기술의 조합에 의해서 실현되게 된다.In general, the ultra-precision processing of hard and brittle materials such as ceramic materials, semiconductor crystal materials, and optical glass (mirror processing, fine shape processing, and defect free processing) is used for grinding and polishing. Machining is applied, and the maximum surface roughness (Rmax) of the final processing surface is several to several tens of nanometers (nanometer: 10 -9 -m) in order for the processed material to perform its normal function effectively as an ultra-precision part or element. Extremely high level of smooth surface is required, and this ultra precision machining is realized by the combination of processing method, processing machine and measuring technology.
한편, 최종 가공면의 표면거칠기가 수∼수십나노미터의 극 히높은 정도의 표면을 얻기 위해서는 상기한 연삭 및 연마가공에 있어서 가공단위를 극소화하여야 하며, 따라서 이와 같은 가공공정에서 생성되는 가공칩의 단위는 나노미터 혹은 그 이하의 옹스트롬(angstrom:10-10m)정도의 크기로 추정된다.On the other hand, in order to obtain a surface having an extremely high surface roughness of several to tens of nanometers, the processing unit should be minimized in the above-described grinding and polishing process. Units are estimated to be on the order of nanometers or less in angstroms (10 -10 m).
종래에는 통상적으로 연삭 혹은 연마과정에서 생성되는 수미크론(micron:10-6)이상의 칩을 페이퍼필터, 원심분리 및 침전 등의 몇단계를 거쳐서 회수·여과하고 있으나, 초정밀 필터 제작상의 문제와 더불어 가공액 중에서 극히 작은 질량단위를 갖는 각각의 칩에 방향성을 부여하는 것이 곤란하기 때문에 나노미터 혹은 그 이하의 미세한 칩에 관해서는 현재까지 효과적인 여과방법이 제시되어 있지 않은 실정이다.Conventionally, chips of more than several microns (micron: 10 -6 ) produced during grinding or polishing are recovered and filtered through several steps such as paper filter, centrifugation, and sedimentation. Since it is difficult to impart orientation to each chip having an extremely small mass unit in the liquid, no effective filtration method has been proposed to date for fine chips of nanometer or less.
이와 같은 종래의 일반적인 연삭 혹은 연마공정에 있어서 연삭·연마가공액 중에 존재하는 미세입자 회수·여과는 연산액을 순환시켜 사용하고 있으나, 초정밀 가공을 위한 연삭·연마공정에 있어서는 연산액을 재사용 하고 있지 않으며, 이는 초정밀 가공의 정의가 표면거칠기의 정도가 0.1㎛ 이하인 가공면을 얻는 것어어서 가공시 발생되는 입자가 함유된 연삭액 또는 연마액을 재사용 하는 경우 1㎛ 이하의 입자가 함유되어 있기 때문에 가공면의 표면을 손상시키는 주요 원인이 되게 된다.In the conventional general grinding or polishing process, the recovery and filtration of fine particles present in the grinding and polishing processing liquid are used to circulate the calculation liquid, but the grinding fluid is reused in the grinding and polishing process for ultra-precision processing. This is because the definition of ultra-precision machining is to obtain a processing surface with a degree of surface roughness of 0.1 μm or less, and therefore, when the grinding liquid or abrasive liquid containing particles generated during processing is reused, it contains particles of 1 μm or less. It is a major cause of damage to the surface of the cotton.
따라서 반도체공정에 활용중인 초정밀 가공공정에서는 연산액을 순환시키지 않고 새로운 연삭·연마액을 공급하고 있으며, 사용된 연산액은 가공공정과 별도로 여과장치를 통하여 정제하여 재사용 하거나 폐기함으로써 가공비가 증가한다는 문제점 뿐만 아니라 환경오염을 일으키는 문제점도 있었다.Therefore, in the ultra-precision processing process used in the semiconductor process, new grinding and polishing liquids are supplied without circulating the processing liquid, and the processing liquid increases by reusing or discarding it through a filtration device separately from the processing process. In addition, there was a problem that causes environmental pollution.
또한 초정밀 가공에 있어서 만일 회수되지 않은 미세한 칩이 순환계를 통하여 가공부위에 재공급될 경우에는 가공면에 미세한 긁힘(scratch)이 유발되어 가공면의 손상 및 가공액 성분의 변질·열과의 요인으로 되는 문제점도 있었다. 일반적으로 입자는 크기에 따라서 10-6∼10-7m 정도에 상당하는 입자를 미립자, 10-7∼10-9m의 입자를 초미립자로 분류하며, 그 이하는 분자 및 원자의 크기에 해당된다. 이때 초미립자 혹은 그에 상당하는 미립자는 전체원자수 중에서 표면원자수가 차지하는 비율이 극히 높으며, 따라서 큰 표면자유에너지를 갖게 된다. 즉, 물질은 초미립자 상태에서 높은 표면활성 상태를 유지하여 높은 흡착성·화학반응성 및 높은 촉매활성의 성질을 띠게 된다.In the case of ultra-precision processing, if unrecovered fine chips are resupplied to the processing site through the circulation system, fine scratches are caused on the processing surface, which causes damage to the processing surface and deterioration and heat of the processing liquid components. There was a problem. In general, the particles are classified into particles of 10 -6 to 10 -7 m depending on the size of the fine particles, particles of 10 -7 to 10 -9 m into ultra-fine particles, the size of the particles and atoms below . At this time, the ultrafine particles or the corresponding fine particles have a very high proportion of surface atoms in the total number of atoms, and thus have a large surface free energy. That is, the material maintains a high surface active state in the ultrafine state, and thus has high adsorption, chemical reaction, and high catalytic activity.
따라서 본 발명은 초정밀 연삭 혹은 연마가공중에 생성되는 미세한 칩이 여과조에서 회수되지 않은 채 순환계를 통하여 가공점에 재공급됨으로서 가공면에 손상을 야기시키는 악영향을 방지하기 위하여 현재까지의 여과방법으로는 회수불가능한 초미립자 혹은 그에 상당하는 크기의 미립자 칩을 전기영동현상을 이용하여 회수·요과하는 방법을 제공함에 그 목적이 있다.Therefore, the present invention is a filtration method up to now in order to prevent the adverse effect of causing damage to the processing surface by re-feeding the fine chips generated during the ultra-precision grinding or polishing process through the circulation system without being recovered from the filtration tank. It is an object of the present invention to provide a method for recovering and collecting ultrafine non-recoverable fine particles or particles of equivalent size using electrophoresis.
제1도는 전기영동현상에 의한 물질의 이송상태를 나타낸 도면,1 is a view showing the transport state of the material by the electrophoresis phenomenon,
제2도는 본 발명 미세입자 회수, 여과 방법을 설명하기 위한 도면이다.2 is a view for explaining the present invention fine particle recovery, filtration method.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 미세한 입자 2 : 분산매질1: fine particles 2: dispersion medium
3 : 양극 4 : 음극3: anode 4: cathode
B+: 공급전원B + : power supply
상기한 목적을 달성하기 위한 본 발명 미세입자 회수여과방법은 연삭·연마 가공액중에 (+), (-)전극을 설치하고, 양 전극간에 공급전원으로 전압을 부가하여 상기 가공액중에 대전된 상태로 존재하는 미세한 입자를 전기영동현상을 이용하여 한방향으로 이동, 응집시켜 회수·여과함을 특징으로 한다.In the present invention, the fine particle recovery filtration method for achieving the above object is a state in which the positive and negative electrodes are installed in the grinding and polishing processing liquid, and the voltage is charged in the processing liquid by adding a voltage to both electrodes. The fine particles present in the present invention are characterized in that they are recovered and filtered by moving and coagulating in one direction using electrophoresis.
이하 첨부도면을 참조하여 본 발명 미세입자 회수·여과방법을 상세하게 설명한다.Hereinafter, the fine particle recovery and filtration method of the present invention will be described in detail with reference to the accompanying drawings.
제1도는 전기영동현상에 의한 물질의 이송상태를 나타낸 도면으로서, 전기영동(electrophoresis)현상은 미세한 입자(1)가 분산매질(2) 중에서 갖게 되는 계면동전(界面動電;surface or interface dynamic electricity)현상의 한형태로서, 미립자를 포함한 분산매질 중에 전기장을 부가할 경우, 미세입자가 양극(3) 혹은 음극(4)의 방향으로 이동하는 현상을 전기영동현상이라 하며, 전기영동현상은 생명과학 분야에서는 단백질의 분석에 응용·적용되고 있으며, 공학분야에서는 전기영동도장법 및 연마법 등이 개발되어 있다.1 is a diagram showing a state of transport of a substance by electrophoresis, and electrophoresis is a surface or interface dynamic electricity in which fine particles 1 are present in a dispersion medium 2. As a phenomenon, when an electric field is added to a dispersion medium containing fine particles, a phenomenon in which microparticles move in the direction of the positive electrode 3 or the negative electrode 4 is called electrophoresis. Is applied and applied to the analysis of proteins, and electrophoretic coating and polishing methods have been developed in the engineering field.
본 발명의 발명자들은 상기한 전기영동현상을 이용하여 미세한 입자에 일정한 방향성의 부여와 동시에 수집된 입자를 고정시키는 것이 가능하게 되며, 입자크기에 구속받지 않고 서브미크론(sub-micron)이하의 미세한 입자, 즉, 칩의 회수·여과가 가능할 것이라는데 착안하여 본 발명을 완성한 것이다.The inventors of the present invention make it possible to fix the collected particles simultaneously with the provision of a certain direction to the fine particles by using the electrophoretic phenomenon, fine particles of sub-micron or less without being constrained by the particle size In other words, the present invention has been completed in view of the possibility of recovering and filtering chips.
한편, 서브미크론(sub-micron)이하의 미세입자 표면은 높은 활성상태를 유지하며, 이와 같은 표면활성 상태는 입자의 크기와 미세화 할수록 높은 표면활성의 성질을 갖게 되고, 높은 표면활성 상태에서의 입자는 이온등을 흡착하기 쉬우며, 높은 화학적 친화력을 갖고 있다. 이와 같이 미세한 입자는 수용액 중에서 수중의 수산기와 수소이온을 표면에 흡착하여 전기 이중층(electric double layer)현상에 의해 대전되어 전하를 띠며, 대전된 입자가 매질에 인가된 전압에 의해서 방향성을 갖고 이동하는 현상을 전기영동현상이라고 한다.On the other hand, the surface of the microparticles below the sub-micron maintains a high active state, and such surface active state has a property of high surface activity as the size and size of the particles become finer, and the particles in the high surface active state Is easy to adsorb ions and has a high chemical affinity. As such, the fine particles are charged and charged by an electric double layer phenomenon by adsorbing hydroxyl groups and hydrogen ions in water in an aqueous solution, and the charged particles move in a direction by the voltage applied to the medium. The phenomenon is called electrophoresis.
제2도는 전기영동현상을 이용하여 미세입자를 회수·여과하는 본 발명 미세입자 회수·여과방법을 설명하기 위한 도면으로서, 공급전원(B+)을 사용하여 (+)극(3)과 (-)극(4)의 전극간에 전압을 인가하면, 분산매질(2)중의 미세한 입자(1)의 운동방향제어와 더불어 입자의 응집이 가능하며 기존의 방법으로는 불가능한 극히 미세한 입자의 회수·여과가 가능하게 된다.2 is a view for explaining a method for recovering and filtration of microparticles according to the present invention, which recovers and filters microparticles by using electrophoresis, using the positive electrode 3 and (-) using a power supply B + . When voltage is applied between the electrodes of the electrode 4, the fine particles 1 in the dispersion medium 2 can be controlled together with the movement direction of the particles, and the fine particles can be collected and filtered. It becomes possible.
이와 같이 전기영동현상을 이용한 미세입자의 회수·여과방법을 효과적으로 적용할 경우, 초정밀 가공분야에 있어서 가공액의 청정도 유지와 균일한 가공환경의 지속이 가능하여 보다 고품위(high integrity or damage free)의 가공면을 안정되게 얻는 것이 가능하며, 기존의 여과방식 혹은 여과공정의 소형화, 간이화가 가능한 이점을 갖게 된다.In this way, when the particle recovery and filtration method using electrophoresis is effectively applied, it is possible to maintain the cleanliness of the processing liquid and to maintain a uniform processing environment in the ultra-precision processing field. It is possible to obtain a processing surface of the stably, and has the advantage that the existing filtration method or filtration process can be miniaturized and simplified.
또한 본 발명 전기영동현상을 이용한 연삭·연마가공액 중에 존재하는 미세입자 회수·여과방법을 이용하는 경우 기존의 여과장치로 정제할 수 없는 연삭액내 부유중인 1㎛이하의 미세입자들의 정제가 가능하기 때문에 초정밀 가공공정에서 연삭·연마가공액을 순환적으로 사용할 수 있게 되고, 전자통신분야의 발전을 고려할 때 초정밀 가공공정에서 나오는 연삭·연마액의 재활용이 가능하게 되므로 가공비의 절감효과와 환경오염을 줄일 수 있는 장점을 갖게 된다.In addition, when using the microparticle recovery and filtration method present in the grinding and polishing process using the electrophoresis of the present invention it is possible to purify the fine particles of less than 1㎛ suspended in the grinding fluid that can not be purified by the existing filtration device In the ultra-precision process, the grinding and polishing solution can be used cyclically, and considering the development of the electronic communication field, the grinding and polishing solution from the ultra-precision process can be recycled, thereby reducing the processing cost and reducing the environmental pollution. You will have the advantage.
또 본 발명의 방법을 역으로 활용한다면, 현재 1㎛ 이하인 미세세라믹입자의 수입이 100%인 점을 감안할 때 연삭가공공정을 이용한 미세입자 제조가 가능하여 가공액에 부유된 입자를 회수함으로써 미세입자를 제조하는 방법도 가능하게 된다.In addition, if the method of the present invention is used in reverse, considering that the import of the microceramic particles having a diameter of 1 μm or less is 100%, it is possible to manufacture the fine particles using the grinding process, thereby recovering the particles suspended in the processing liquid. It is also possible to prepare a method.
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
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| KR1019940022381A KR0150670B1 (en) | 1994-09-06 | 1994-09-06 | Recovering and filtering method of microparticle by using electrodialysis |
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| KR1019940022381A KR0150670B1 (en) | 1994-09-06 | 1994-09-06 | Recovering and filtering method of microparticle by using electrodialysis |
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| Publication Number | Publication Date |
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| KR0150670B1 true KR0150670B1 (en) | 1998-10-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100366717B1 (en) * | 2000-03-04 | 2003-01-09 | 주식회사 엔엠씨텍 | The method and apparatus of separting very minute particles by using quantum and electric field |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100366717B1 (en) * | 2000-03-04 | 2003-01-09 | 주식회사 엔엠씨텍 | The method and apparatus of separting very minute particles by using quantum and electric field |
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| KR960010089A (en) | 1996-04-20 |
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