KR0140030B1 - 퓨징 시스템 - Google Patents
퓨징 시스템Info
- Publication number
- KR0140030B1 KR0140030B1 KR1019940039687A KR19940039687A KR0140030B1 KR 0140030 B1 KR0140030 B1 KR 0140030B1 KR 1019940039687 A KR1019940039687 A KR 1019940039687A KR 19940039687 A KR19940039687 A KR 19940039687A KR 0140030 B1 KR0140030 B1 KR 0140030B1
- Authority
- KR
- South Korea
- Prior art keywords
- fusing
- data
- unit
- serial data
- output
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/18—Auxiliary circuits, e.g. for writing into memory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N17/00—Diagnosis, testing or measuring for television systems or their details
- H04N17/06—Diagnosis, testing or measuring for television systems or their details for recorders
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940039687A KR0140030B1 (ko) | 1994-12-30 | 1994-12-30 | 퓨징 시스템 |
JP7269832A JPH0917957A (ja) | 1994-12-30 | 1995-10-18 | ヒュージングシステム |
DE19548984A DE19548984A1 (de) | 1994-12-30 | 1995-12-28 | Schmelz- bzw. Sicherungssystem |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940039687A KR0140030B1 (ko) | 1994-12-30 | 1994-12-30 | 퓨징 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960026651A KR960026651A (ko) | 1996-07-22 |
KR0140030B1 true KR0140030B1 (ko) | 1998-07-15 |
Family
ID=19405738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940039687A KR0140030B1 (ko) | 1994-12-30 | 1994-12-30 | 퓨징 시스템 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH0917957A (de) |
KR (1) | KR0140030B1 (de) |
DE (1) | DE19548984A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100636753B1 (ko) * | 1998-04-30 | 2006-10-20 | 마이크로나스 게엠베하 | 집적 회로의 파라미터화 방법 및 그 집적 회로 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0154667B1 (ko) * | 1995-10-13 | 1998-12-01 | 김광호 | 퓨징회로 |
DE19743271C1 (de) | 1997-09-30 | 1998-10-29 | Siemens Ag | Lineare Anordnung metallischer Sicherungsstrecken auf Wafern, wobei durch "Schießen" der Sicherungsstrecken Schaltungskenngrößen einstellbar sind |
DE19912446C1 (de) * | 1999-03-19 | 2000-11-09 | Micronas Intermetall Gmbh | Einrichtung zum Einstellen von Betriebsgrößen in mehreren programmierbaren integrierten Schaltungen, insbesondere enthaltend jeweils einen Hallgenerator |
DE10052484B4 (de) * | 2000-10-23 | 2006-04-13 | Stmicroelectronics Gmbh | Zappingschaltung und Zappingverfahren |
JP2009016657A (ja) * | 2007-07-06 | 2009-01-22 | Tokyo Electron Ltd | レジストパターンの再形成方法 |
-
1994
- 1994-12-30 KR KR1019940039687A patent/KR0140030B1/ko not_active IP Right Cessation
-
1995
- 1995-10-18 JP JP7269832A patent/JPH0917957A/ja active Pending
- 1995-12-28 DE DE19548984A patent/DE19548984A1/de not_active Ceased
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100636753B1 (ko) * | 1998-04-30 | 2006-10-20 | 마이크로나스 게엠베하 | 집적 회로의 파라미터화 방법 및 그 집적 회로 |
Also Published As
Publication number | Publication date |
---|---|
KR960026651A (ko) | 1996-07-22 |
DE19548984A1 (de) | 1996-07-04 |
JPH0917957A (ja) | 1997-01-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120229 Year of fee payment: 15 |
|
LAPS | Lapse due to unpaid annual fee |