KR0130830B1 - 후막 NTC 써미스터 조성물(Thick Film NTC Thermistor Compositions) - Google Patents

후막 NTC 써미스터 조성물(Thick Film NTC Thermistor Compositions)

Info

Publication number
KR0130830B1
KR0130830B1 KR1019940701000A KR19940071000A KR0130830B1 KR 0130830 B1 KR0130830 B1 KR 0130830B1 KR 1019940701000 A KR1019940701000 A KR 1019940701000A KR 19940071000 A KR19940071000 A KR 19940071000A KR 0130830 B1 KR0130830 B1 KR 0130830B1
Authority
KR
South Korea
Prior art keywords
composition
ruo
resistance
metal oxide
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940701000A
Other languages
English (en)
Korean (ko)
Inventor
제이콥 호르매들리
Original Assignee
미리암 디. 메코너헤이
이.아이.듀폰 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미리암 디. 메코너헤이, 이.아이.듀폰 디 네모아 앤드 캄파니 filed Critical 미리암 디. 메코너헤이
Application granted granted Critical
Publication of KR0130830B1 publication Critical patent/KR0130830B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
    • H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Glass Compositions (AREA)
  • Non-Adjustable Resistors (AREA)
KR1019940701000A 1991-09-30 1992-09-30 후막 NTC 써미스터 조성물(Thick Film NTC Thermistor Compositions) Expired - Fee Related KR0130830B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/767,845 US5122302A (en) 1991-09-30 1991-09-30 Thick film NTC thermistor compositions
US7/767,845 1991-09-30

Publications (1)

Publication Number Publication Date
KR0130830B1 true KR0130830B1 (ko) 1998-05-15

Family

ID=25080756

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019940701000A Expired - Fee Related KR0130830B1 (ko) 1991-09-30 1992-09-30 후막 NTC 써미스터 조성물(Thick Film NTC Thermistor Compositions)
KR1019940701000A Granted KR940702640A (ko) 1991-09-30 1992-09-30 후막 ntc 써미스터 조성물

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019940701000A Granted KR940702640A (ko) 1991-09-30 1992-09-30 후막 ntc 써미스터 조성물

Country Status (8)

Country Link
US (1) US5122302A (enExample)
EP (1) EP0606364B1 (enExample)
JP (1) JP3273610B2 (enExample)
KR (2) KR0130830B1 (enExample)
CN (1) CN1029497C (enExample)
DE (1) DE69204074T2 (enExample)
TW (1) TW234193B (enExample)
WO (1) WO1993007631A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242623A (en) * 1991-08-13 1993-09-07 E. I. Du Pont De Nemours And Company Screen-printable thick film paste composition
US5122302A (en) * 1991-09-30 1992-06-16 E. I. Du Pont De Nemours And Company Thick film NTC thermistor compositions
US5352194A (en) * 1992-06-29 1994-10-04 University Of Pittsburgh Automated device for liposuction
US5491118A (en) * 1994-12-20 1996-02-13 E. I. Du Pont De Nemours And Company Cadmium-free and lead-free thick film paste composition
US6146743A (en) * 1997-02-21 2000-11-14 Medtronic, Inc. Barrier metallization in ceramic substrate for implantable medical devices
US5855995A (en) * 1997-02-21 1999-01-05 Medtronic, Inc. Ceramic substrate for implantable medical devices
US6066271A (en) * 1997-09-05 2000-05-23 Ben Gurion University Of The Negev Cobalt ruthenate thermistors
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
US6269695B1 (en) * 1998-03-05 2001-08-07 Nartron Corporation Analog liquid level sensor
JP2005259823A (ja) * 2004-03-09 2005-09-22 Tdk Corp 有機ｐｔｃサーミスタ及びその製造方法
CN101061752B (zh) * 2004-09-30 2011-03-16 沃特洛电气制造公司 模块化的层状加热系统
JP4791872B2 (ja) * 2006-03-30 2011-10-12 株式会社ノリタケカンパニーリミテド 導電性ペースト
CN105304242B (zh) * 2014-07-31 2018-08-14 中国振华集团云科电子有限公司 一种低b值高阻值厚膜ntc浆料的制备方法
CN104193305B (zh) * 2014-08-18 2016-01-06 广东风华高新科技股份有限公司 Ntc热敏电阻材料及其制备方法与ntc热敏电阻器及其制备方法
CN108597706B (zh) * 2018-02-07 2020-05-12 北京大学深圳研究生院 一种电阻tcr调零方法
WO2020251746A1 (en) * 2019-06-10 2020-12-17 Ferro Corporation High adhesion resistive composition
KR102623406B1 (ko) 2021-12-15 2024-01-11 주식회사와이테크 저저항 ntc 서미스터 후막 제조용 조성물 및 그 제조방법
TWI858856B (zh) 2023-08-09 2024-10-11 國巨股份有限公司 熱敏電阻膏體及其製作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4302362A (en) * 1979-01-23 1981-11-24 E. I. Du Pont De Nemours And Company Stable pyrochlore resistor compositions
US4539223A (en) * 1984-12-19 1985-09-03 E. I. Du Pont De Nemours And Company Thick film resistor compositions
US4651126A (en) * 1985-05-02 1987-03-17 Shailendra Kumar Electrical resistor material, resistor made therefrom and method of making the same
US4906406A (en) * 1988-07-21 1990-03-06 E. I. Du Pont De Nemours And Company Thermistor composition
JPH0736361B2 (ja) * 1989-03-22 1995-04-19 株式会社村田製作所 抵抗材料、その製造方法およびそれを用いた抵抗ペースト
US5122302A (en) * 1991-09-30 1992-06-16 E. I. Du Pont De Nemours And Company Thick film NTC thermistor compositions

Also Published As

Publication number Publication date
US5122302A (en) 1992-06-16
CN1073033A (zh) 1993-06-09
DE69204074T2 (de) 1996-02-15
EP0606364A1 (en) 1994-07-20
KR940702640A (ko) 1994-08-20
JPH06511112A (ja) 1994-12-08
EP0606364B1 (en) 1995-08-09
TW234193B (enExample) 1994-11-11
DE69204074D1 (de) 1995-09-14
WO1993007631A1 (en) 1993-04-15
JP3273610B2 (ja) 2002-04-08
CN1029497C (zh) 1995-08-09

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