KR0125965B1 - Solder ball auto-supply apparatus - Google Patents

Solder ball auto-supply apparatus

Info

Publication number
KR0125965B1
KR0125965B1 KR1019940015304A KR19940015304A KR0125965B1 KR 0125965 B1 KR0125965 B1 KR 0125965B1 KR 1019940015304 A KR1019940015304 A KR 1019940015304A KR 19940015304 A KR19940015304 A KR 19940015304A KR 0125965 B1 KR0125965 B1 KR 0125965B1
Authority
KR
South Korea
Prior art keywords
solder ball
ball
housing
hole
pitch
Prior art date
Application number
KR1019940015304A
Other languages
Korean (ko)
Other versions
KR960002768A (en
Inventor
김강산
Original Assignee
김주용
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김주용, 현대전자산업주식회사 filed Critical 김주용
Priority to KR1019940015304A priority Critical patent/KR0125965B1/en
Publication of KR960002768A publication Critical patent/KR960002768A/en
Application granted granted Critical
Publication of KR0125965B1 publication Critical patent/KR0125965B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pinball Game Machines (AREA)

Abstract

An apparatus is described that can automatically supply a sold ball to a pocket formed by a certain interval. The apparatus includes a ball housing 12 which has a hole 11' formed by pitch P1 to load a solder ball 11 in the hole 11', a solder ball loading part 10 which comprises a base plate 15 where a push pin 14 is protruded and a cylinder 16 is equipped, a screw housing 22 for binding the solder ball loading part 10 with the solder ball 11 using a fixing volt 24, a solder ball transmitting part 20 for coupling a lead screw 21 to the screw housing 22 and having a step motor 23 which elevates the solder ball loading part 10 when the lead screw 21 is turned around, and a laser sensor 32 for measuring the location of a hole 31' and thus determining a moving distance which corresponds to the moving interval of a pith. Thereby, it is possible to improve the productivity of a semiconductor device.

Description

솔더볼 자동 공급장치Solder Ball Auto Feeder

제1도는 일반적인 볼 그리드 어레이 패키지를 뒤집은 상태의 사시도,1 is a perspective view of a typical ball grid array package upside down,

제2도는 본 발명의 종단면도,2 is a longitudinal cross-sectional view of the present invention,

제3도는 제2도의 G-G선 좌측면도,3 is a left side view of the G-G line of FIG.

제4도는 본 발명의 우측면도,4 is a right side view of the present invention,

제5도는 제4도의 H부분인 감지부를 좌측단면 상태로 나타낸 확대도이다.FIG. 5 is an enlarged view showing a sensing unit, which is a portion H of FIG. 4, in a left sectional state.

*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

10 : 솔더볼 적재부11 : 솔더볼10: solder ball loading portion 11: solder ball

12 : 볼 하우징13 : 가이드 레일12: ball housing 13: guide rail

14 : 푸쉬핀15 : 베이스 플레이트14 push pin 15 base plate

16 : 실린더20 : 솔더볼 이송부16: cylinder 20: solder ball transfer unit

21 : 리드 스크류22 : 스크류 하우징21: lead screw 22: screw housing

23 : 스테핑 모터24 : 고정볼트23 stepping motor 24: fixing bolt

30 : 감지부31 : 센서 플레이트30 sensing unit 31 sensor plate

31' : 홀32 : 레이저 센서31 ': hole 32: laser sensor

33 : 고정 브라켓33: fixing bracket

본 발명는 반도체 패키지 형태중 볼 그리드 어레이 패키지에 솔더볼 부착시 솔더볼을 자동공급함을 특징으로 하는 솔더볼 자동공급장치에 관한 것이다.The present invention relates to an automatic solder ball supply device characterized in that the solder ball is automatically supplied when the solder ball is attached to the ball grid array package in the semiconductor package form.

일반적으로 볼 그리드 어레이 패키지(ball grid array package)는 제1도에 도시한 바와 같이, 수평수직방향에 일정피치(P1) 간격으로 볼 그리드 어레이 패키지용 포켓을 n개 형성하여 볼 그리드 어레이 패키지의 포켓에 솔더볼을 일일이 장착하여 볼 그리드 어레이 패키지를 제작하는 방식을 사용해 왔다.In general, as shown in FIG. 1, a ball grid array package includes n pockets for a ball grid array package at a constant pitch (P1) interval in a horizontal and vertical direction. We have used solder balls to fabricate ball grid array packages.

따라서, 비능률적이며, 생산성이 저하되는 문제점이 있었다.Therefore, there is a problem that it is inefficient and productivity is lowered.

본 발명은 종래의 이러한 문제를 해결코자 하는 것으로,일정피치 간격으로 형성된 포켓에 솔더볼을 자동공급하는 것을 특징으로 한다.The present invention is to solve this problem of the prior art, it characterized in that the automatic supply of solder balls to the pocket formed at a constant pitch interval.

즉, 볼 그리드 어레이 보텀부의 포켓과 동일 피치로 일정하게 형성된 볼 하우징에 솔더볼을 적재하여 푸쉬핀으로 솔더볼을 피치이동 시키는 솔더볼 적재부와, 상기 솔더볼 적재부를 고정 및 상하이송하여 푸쉬핀을 이동시키는 솔더볼 이송부와, 센서홀을 측정하여 피치이동 상태를 측정하는 감지부로 구성하여 일정간격으로 형성된 볼 하우징으로부터 솔더볼을 동시에 공급토록 한 것이다That is, a solder ball loading part for pitch shifting the solder ball with a push pin by placing solder balls in a ball housing uniformly formed at the same pitch as the pocket of the ball grid array bottom part, and solder balls for fixing and shangong the solder ball loading part to move the push pins. Consists of a feeder and a sensor to measure the pitch shift by measuring the sensor hole to simultaneously supply solder balls from the ball housing formed at regular intervals.

이하 도면을 참조로 상세히 설명하면 다음과 같다.Hereinafter, described in detail with reference to the drawings.

제2-5도는 본 발명의 구성도로써, 볼 그리드 어레이 보텀부의 포켓과 동일한 피치(P1)로 솔더볼(11)을 내부홀(11')에 적재하며 양측하단에 가이드 레일(13)이 형성된 볼 하우징(12)과, 내부홀(11')과 동일피치로 푸쉬핀(14)이 돌출되며 양단에는 가이드 레일(13)에 끼워져 안내하는 실린더(16)가 장착된 베이스 플레이트(15)로 구성되는 솔더볼 적재부(10)와; 볼 하우징(12)에 솔더볼(11) 적재후 고정볼트(24)를 이용하여 솔더볼 적재부(10)를 체결하는 스크류 하우징(22)과, 스크류 하우징(22)에 리드 스크류(21)를 나사결합시키며 리드 스크류(21) 회전시 솔더볼 적재부(10)를 상승시켜 피치이동 시키는 스테핑 모터(23)로 구성되는 솔더볼 이송부(20)와; 고정브라켓(33)에 체결되며 홀(31')형성된 센서 플레이트(31)의 홀(31')위치를 측정하여 피치이동구간에 상응하는 이동거리를 결정케하는 레이저 센서(32)로 구성되는 감지부(30)로 이루어진다.2-5 is a configuration diagram of the present invention, in which the solder ball 11 is loaded into the inner hole 11 'at the same pitch P1 as the pocket of the ball grid array bottom portion, and the guide rails 13 are formed at both lower ends thereof. The push pin 14 protrudes at the same pitch as the housing 12 and the inner hole 11 'and includes a base plate 15 having a cylinder 16 mounted on the guide rail 13 and guided at both ends thereof. A solder ball loading part 10; After mounting the solder ball 11 in the ball housing 12, the screw housing 22 for fastening the solder ball loading part 10 using the fixing bolt 24 and the lead screw 21 are screwed to the screw housing 22. And solder ball transfer unit 20 consisting of a stepping motor 23 for raising the pitch of the solder ball loading portion 10 during the lead screw 21 rotation; Detection consisting of a laser sensor 32 is fastened to the fixing bracket 33 and determines the movement distance corresponding to the pitch movement section by measuring the position of the hole 31 'of the sensor plate 31 formed with the hole 31'. It consists of a portion (30).

상기 볼 하우징(12)은 리드 스크류(21)및 스테핑 모터(23)가 고정되는 브라켓에 분리가능토록 결합시킴이 바랍직하다.The ball housing 12 is preferably detachably coupled to the bracket to which the lead screw 21 and the stepping motor 23 are fixed.

상기와 같이 구성된 본 발명은 솔더볼(11)을 볼 하우징(12)에 일정길이(L1)만큼 채운 후 푸쉬핀(14)이 리드 스크류(21)에 의하여 일정길이(P2)만큼 이송하여 픽업 포인트(b)에 지속적으로 공급하며 공급된 n개의 솔더볼(11)은 패키지로 이송전까지 볼 하우징(12) 내부홀(11')의 포인트(b)에 항상 대기한다.According to the present invention configured as described above, after filling the solder ball 11 in the ball housing 12 by a predetermined length (L1), the push pin 14 is transported by a predetermined length (P2) by the lead screw 21 to the pickup point ( The n solder balls 11 continuously supplied to b) are always waiting at the point (b) of the inner hole 11 'of the ball housing 12 until transfer to the package.

또한 솔더볼 적재부(10)는 솔더볼 이송부(20)에서 고정볼트(24)를 풀어 분리할 수 있으므로 솔더볼 적재부(10)를 분리한 상태에서 볼 하우징(12)에 일정길이(L1)만큼 볼을 채우고, 이때 가이드 레일(13)은 실린더(16)에 의하여 안내 가능토록 결합되어 있어 푸쉬핀(14)이 초기 포인트(a)에 일정하게 고정되며, 솔더볼(11)을 포인트(b)가지 채운후 솔더볼 이송부(20)의 고정볼트(24)를 이용하여 스크류 하우징(22)에 체결한다.In addition, the solder ball loading part 10 may be separated by loosening the fixing bolt 24 from the solder ball transferring part 20, so that the ball is placed in the ball housing 12 by a predetermined length L1 in the state in which the solder ball loading part 10 is removed. In this case, the guide rail 13 is coupled to guide by the cylinder 16 so that the push pin 14 is fixed to the initial point (a) and the solder ball 11 is filled with points (b) Fastening to the screw housing 22 using the fixing bolt 24 of the solder ball transfer unit 20.

상기와 같이 체결이 완료되면 흡착부가 있는 픽업장치(도시하지 않음)에 의해서 솔더볼(11)을 볼 그리드 어레이 패키지 포켓부로 이송하게 되는데, 픽업장치가 픽업포인트(b)에 있는 솔더볼(11)을 패키지로 이송하면 솔더볼 이송부(20)의 스테핑 모터(23) 구동으로 리드 스크류(21)가 회전하여 스크류 하우징(22)을 일정피치(P2)만큼 상승이송하며 이에 상응하여 푸쉬핀(14)이 일정피치(P2)만큼 상승되어 두번째 위치(c)에 있는 솔더볼(11)이 픽업 포인트(b)위치로 n개(P1×n)가 동시에 이동하며, 이동되는 구간에서는 가이드 레일(13)을 잡고 있는 실린더(16)에 에어 공급되어 실린더 로드가 복귀되어 가이드 레일(13) 및 볼 하우징(12)은 일정피치(13)만큼 하강하는 역할을 한다.When the fastening is completed as described above, the solder ball 11 is transferred to the ball grid array package pocket by a pickup device (not shown) having an adsorption part, and the pickup device packages the solder ball 11 at the pickup point b. In this case, the lead screw 21 is rotated by driving the stepping motor 23 of the solder ball transfer unit 20 so that the screw housing 22 is moved upward by a certain pitch P2. Accordingly, the push pin 14 has a constant pitch. The number of solder balls 11 in the second position (c) is increased by (P2) and n pieces (P1 × n) are simultaneously moved to the pickup point (b) position, and the cylinder holding the guide rails 13 is moved in the moving section. The air is supplied to the cylinder 16 to return the cylinder rod, and the guide rail 13 and the ball housing 12 serve to descend by a predetermined pitch 13.

또한, 가이드 레일(13)은 사각으로 구성되어 있어 회전을 최대한 방지하고, 일정길이(L1) 하한 포인트(a)의 솔더볼(11)이 픽업 포인트(b)에 이르기까지 스크류 하우징(22)에 의하여 이송된다.In addition, the guide rail 13 is formed in a rectangular shape to prevent rotation as much as possible, and by the screw housing 22 until the solder ball 11 of the predetermined length L1 lower limit point a reaches the pickup point b. Transferred.

이때 이송량(P2)은 센서 플레이트(31)와 고정 브라켓(33)에 결착된 레이저 센서(32)에 의하여 결정된다.In this case, the feed amount P2 is determined by the laser sensor 32 bound to the sensor plate 31 and the fixing bracket 33.

상기 스크류 하우징(22)은 리드 스크류(21)와 나사결합 상태를 이루며 안내봉(도시하지 않음)에 의해 상하 이동되어 정위치에서 상승하강 되도록함이 요구된다.The screw housing 22 is screwed with the lead screw 21, it is required to be moved up and down by a guide rod (not shown) to move up and down in position.

상기에서 상세히 설명한 바와 같이 본 발명은 볼 그리드 어레이 패키지에 솔더볼 공급시 자동이송에 의한 작업을 실시할 수 있으므로 생산성 향상에 크게 기여한다.As described in detail above, the present invention can perform work by automatic transfer when supplying solder balls to a ball grid array package, thereby greatly improving productivity.

Claims (1)

솔더볼 공급장치에 있어서, 볼 그리드 어레이 보텀부의 포켓과 동일한 피치(P1)로 일정하게 홀(11')이 형성되어 솔더볼(11)을 내부홀(11')에 적재하는 볼 하우징(12)과, 내부홀(11')과 동일피치로 푸쉬핀(14)이 돌출되며 양단에는 가이드 레일(13)에 끼워져 안내하는 실린더(16)가 장착된 베이스 플레이트(15)로 구성되는 솔더볼 적재부(10)와; 볼 하우징(12)에 솔더볼(11) 적재후 고정볼트(24)를 이용하여 솔더볼 적재부(10)를 체결하는 스크류 하우징(22)과, 스크류 하우징(22)에 리드 스크류(21)를 나사결합 시키며 리드 스크류(21) 회전시 솔더볼 적재부(10)를 상승시켜 피치이동 시키는 스테핑 모터(23)로 구성되는 솔더볼 이송부(20)와; 고정브라켓(33)에 체결되며 홀(31')이 형성된 센서 플레이트(31)의 홀(31')위치를 측정하여 피치이동구간에 상응하는 이동거리를 결정케하는 레이저 센서(32)로 구성되는 감지부(30)로 이루어짐을 특징으로 하는 솔더볼 자동공급장치.In the solder ball supply device, a hole 11 'is formed at a constant pitch P1 at the same pitch as the pocket of the ball grid array bottom portion, and the ball housing 12 for loading the solder ball 11 into the inner hole 11', The push pin 14 protrudes at the same pitch as the inner hole 11 ′, and a solder ball loading part 10 including a base plate 15 having a cylinder 16 mounted on a guide rail 13 and guided at both ends thereof. Wow; After mounting the solder ball 11 in the ball housing 12, the screw housing 22 for fastening the solder ball loading part 10 using the fixing bolt 24 and the lead screw 21 are screwed to the screw housing 22. And solder ball transfer unit 20 consisting of a stepping motor 23 for raising the pitch of the solder ball loading portion 10 during the lead screw 21 rotation; It is composed of a laser sensor 32 is fastened to the fixing bracket 33 and determines the moving distance corresponding to the pitch moving section by measuring the position of the hole 31 'of the sensor plate 31 in which the hole 31' is formed. Solder ball automatic supply device characterized in that consisting of a sensing unit (30).
KR1019940015304A 1994-06-29 1994-06-29 Solder ball auto-supply apparatus KR0125965B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940015304A KR0125965B1 (en) 1994-06-29 1994-06-29 Solder ball auto-supply apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940015304A KR0125965B1 (en) 1994-06-29 1994-06-29 Solder ball auto-supply apparatus

Publications (2)

Publication Number Publication Date
KR960002768A KR960002768A (en) 1996-01-26
KR0125965B1 true KR0125965B1 (en) 1997-12-18

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