JP2516309Y2 - IC supply and storage head adjustment mechanism - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention relates to an adjusting mechanism for an IC supply head and a storage head used particularly in an IC test handler.

[Prior Art] Mass-produced ICs in a factory are subjected to data measurement under a heat load in order to maintain constant quality, and sorted into good products and defective products. The supply, heating, data measurement, selection and storage of each IC are automatically performed by using an IC test handler as shown in FIG.

The IC test handler includes a tray 2 for storing a large number of ICs 1, a vacuum type supply head 3, a walking beam 4 for carrying ICs, a preheating heater 5, a hand 6, a pusher 7,
A hand 8, a walking beam 9, and a vacuum type storage head 10 are provided, and a socket assembly 12 is arranged below a pusher 7 and on a base 11. The socket assembly 12 is equipped with a number of connector pins (not shown) that are in electrical communication with the legs of the IC1, and each pin is a base.
11 Connected to the lower test board 13.

Therefore, the ICs 1 on the tray 2 on the left side in FIG. 2 are first placed on the walking beam 4 in rows by the supply head 3, that is, five in number, are fed one pitch in the direction of the arrow, and the preheating heater 5 in the middle. Is preheated at. Subsequently, the ICs 1 reaching the end of the walking beam 4 are sent to the socket assembly 12 one by one by the hand 6.

Then, the pusher 7 with a built-in heater descends, the legs of the IC1 come into contact with the pins on the socket assembly 12, and the data of the IC1 is measured by the test board 13. Since the IC1 has already been preheated during the transportation, when it hits the high temperature pusher 7, it rises to a predetermined temperature in a short time.

IC1 judged to be good by test board 13 is hand 8
Is placed on the walking beam 9 and is conveyed by the beam 9 by one pitch in the direction of the arrow. Further, the IC judged to be defective is discharged in the direction of the dotted arrow by a sorting mechanism (not shown).

On the other hand, the empty trays 2 ′ are once moved to an intermediate position by a lower carrier (not shown) and stacked.
In addition, another carrier sends each one to the right. Therefore, the ICs 1 on the walking beam 9 are stored in the empty tray 2 ″ by the vacuum type storage head 10 in groups of 5 in each row.

[Problems to be solved by the invention] However, in the above-mentioned IC test handler, when the type of IC to be measured changes, the supply head 3 and the storage head 10
However, there is a drawback that cannot be dealt with. For this reason, the distance between the IC suction chucks provided in the supply head 3 has been conventionally adjusted so that the number of replacement parts can be reduced by adjusting to different IC pitches.

However, even if the distance between each chuck is adjusted to the IC pitch,
Since the length of the walking beam 4, which is the transport path, is constant, when one set of ICs moves on the beam and reaches the end, its position is not parallel to the IC measurement position, and it is a multiple of the pitch change. Misalignment occurs.

The present invention has been made in view of such circumstances,
An object of the invention is to provide an adjusting mechanism for an IC supply / accommodation head that can easily correspond to the type of IC with almost no replacement of parts.

[Means for Solving the Problems] In order to achieve the above object, an adjusting mechanism for an IC supply / accommodation head according to the present invention has a head arm extending along the IC transfer direction and a set of ICs for pitch transfer to the end of the transfer path. A drive unit that moves the head arm before the IC is mounted by a total deviation when the operation is performed, a stopper that restricts the moving distance of the head arm, and a plurality of blocks slidably attached to the head arm. It is composed of a fine adjustment member for making the block correspond to the IC pitch on the tray, and a chuck attached to each block to suck the IC on the tray.

[Operation] With these configurations, the stopper is fixed by adjusting the stop position of the head arm tip to the IC transport start position of the walking beam, and then each block is slid and adjusted according to the IC pitch on the tray, and then the fine adjustment is performed. By fixing the block with a member, it can be used for all ICs.

[Embodiment] FIG. 1 shows an IC supply head 3 to which the present invention is applied. The head 3 includes a head arm 14, a drive unit 15, a stopper 16 (FIG. 3), a block 17, It is composed of a fixing screw 18, a spring pin 19, and a chuck 20.

A guide groove 21 of a block 17 is formed in the head arm 14 in the lateral direction, and the base end side is connected to a drive unit 15 via a rod 22. The drive unit 15 drives the head arm 14 up and down and front and back and left and right along the rod 22 and rails 23 and 24 (Fig. 3). Although details are omitted, a pulse motor or an air cylinder is used. There is.

The stopper 16 regulates the front-back direction of the head arm 14, and is composed of a bolt 25, a nut 26, a bush 27, an angle 28 and a set screw 29 as shown in FIGS. 3 and 4. The bolt 25 is screwed into the bush 27 and fixed by the nut 26 at a predetermined position, and the bolt 25 is angled as shown in FIG.
It is inserted into the hole 30 of 28 and is fixed by the set screw 29 at the position where the flange portion 27a hits. Therefore, if the nut 26 is loosened, the bolt 25 can be expanded and contracted by rotation, and the drive unit 15
Also, the head arm 14 stops at the position of the bolt head 25a. Further, when it is troublesome to adjust the protruding distance of the bolt 25 for each IC type, the bolts 25 having a length corresponding to the type may be prepared, and the set screw 29 may be loosened and replaced.

As shown in FIG. 5, the block 17 is formed by connecting the trapezoidal plate 31 and the guide plate 32 at a right angle, and the portion of the guide plate 32 can slide in the guide groove 21 of the head arm 14. The guide plate 32 is formed with holes 33 and 34 through which the fixing screw 18 and the spring pin 19 pass, and the trapezoidal plate 31 is provided with a hole 36 into which the air tube 35 is inserted. The tip of the spring pin 19 is biased in the protruding direction by an internal spring (not shown), and a plurality of recesses 37 for receiving the spring pin 19 are formed on the head arm 14 side.

The chuck 20 adsorbs the IC1 on the tray 2,
In this embodiment, a vacuum type Bernoulli chuck is used. The air tube 35 penetrates the hole 36 of the block 17 and is supported by a pressing member 38 on the block.

Although the walking beam 4 is publicly known, in brief description, when the outer movable beam 4a rises, the IC on the fixed beam 4b is lifted, and when the movable beam 4a advances by one pitch, it returns to its original position. Therefore, all ICs on fixed beam 4b
Moves upward by one pitch in FIG. 3, and the drive pitch is set to be the same as the pitch p of the IC1 on the tray 2. In addition, the IC storage head 10 (Fig. 2) is also the supply head 3.
It has exactly the same configuration as.

On the other hand, even if the IC pitch p on the tray 2 and the driving pitch of the walking beam 4 are the same, if the IC type changes, the first IC transport start position on the beam 4 will not be parallel to the IC on the tray, As shown in FIG. 3, a constant deviation s occurs. Second
As can be seen from the figure, since the end of the beam 4 is parallel to the IC inspection position of the socket assembly 12, it is not possible to easily change the transfer start position of the IC on the beam 4 by performing back calculation at a pitch interval.

Therefore, it is necessary to place IC1 on the walking beam 4 after the supply head 3 has moved five distances s to the front (downward in FIG. 3) after adsorbing five ICs on the tray 2. Since the movement distance of the supply head 3 is regulated by the stopper 16, the protrusion distance of the bolt head 25a of the stopper 16 may be adjusted first. To adjust the distance between the chucks 20 to the pitch p, the fixing screw 18 and the spring pin 19 are loosened and the block 17 is slid.

When the supply head 3 is operated, the head 3 first moves to the left in FIG. 3 and descends, the chuck 20 adsorbs five ICs 1, then rises and moves to the right, and moves forward on the walking beam 4. Only s, go down, place IC1 on the walking beam 4, and then return to the original position. Next, the movable beam 4a of the walking beam 4 conveys the IC1 one pitch at a time, and when it advances five pitches, the supply head 3 repeats the above-mentioned operation again.

The steps of preheating, heating, inspecting, and returning the IC1 are almost the same as those in the case of FIG. 2, and the storage head 10 performs the operation opposite to that of the supply head 3.

[Advantages of the Invention] As described in detail above, according to the adjustment mechanism of the IC supply / accommodation head in the present invention, the IC can be mounted at the walking beam transfer start position even if the IC type changes.
This has the effect that the end position of is always kept parallel to the measurement position.

[Brief description of drawings]

FIG. 1 is a perspective view of an IC supply head according to the present invention, and FIG.
FIG. 3 is a plan view of the IC supply head, FIG. 4 is a side view of the stopper, and FIG. 5 is a perspective view of the block. 1 ... IC, 2,2 ', 2 "... Tray, 3 ... Supply head, 1
0 …… Storing head, 14 …… Head arm, 15 …… Drive unit, 16 …… Stopper, 17 …… Block, 18 …… Fixing screw, 19 …… Spring pin, 20 …… Chuck, 21 …… Guide groove , 25 …… bolt, 25a …… bolt head

Claims (1)

(57) [Scope of utility model registration request] 1. A head arm extending along the IC carrying direction, and a drive unit for moving the head arm before mounting the IC by a total deviation S when one set of ICs is pitch carried to the end of the carrying path. , The moving distance S of the head arm
Stopper that regulates, a plurality of blocks slidably attached to the head arm, a fine adjustment member that makes each block correspond to the IC pitch on the tray, and a chuck that is attached to each block to adsorb the IC on the tray And an IC supply and storage head adjustment mechanism consisting of.