JPS59112942U

JPS59112942U - IC device inspection equipment

Info

Publication number: JPS59112942U
Application number: JP715083U
Authority: JP
Inventors: 丸内　彌生
Original assignee: 丸豊精工株式会社
Priority date: 1983-01-20
Filing date: 1983-01-20
Publication date: 1984-07-30

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図はＩＣ素子の一例を示す斜面図、第２図はＩＣ素
子を収容するトレーの一部を示す斜面図、第３図は一実
施例の概略斜面図、第４図は把持式トレー間欠送り手段
の断面図、第５図はトレーマガジン載置部の断面図、第
６図は把持式トレー間欠送り手段の正面図、第７図はＩ
Ｃ素子取出し手段およびＩＣ素子給送手段の側面図、第
８図はＩＣ素子吸着ノーズの断面図、第９図はＩＣ素子
取出し手段の側面図、第１０図は第９図一部の横断面図
、第１１図はＩＣ素子給送手段終端部の平面図、第１−
２図、第１３図は第１１図の吸着ヘッドを含むそれぞれ
異なった角度での断面図である。１・・・ＩＣ素子、２・・・トレー、（３・・・テスタ
ー、５・・・ターンテーブル、７・・・ＩＣ素子ホルダ
ー、８・・・ＩＣ素子吸着ヘッド、１２・・・ＩＣ素子
自動供給部）４・・・検査作業手段、（２６・・・トレ
ー引き入れ部材、２８・・・上置ローラ゛対）１３・・
・把持式トレー間欠送り手段、（１４・・・ＩＣ素子吸
着ノーズ、３５・・・上下動基台、３８・・・保持枠、
４０・・・ホルダー、４１・・・リンク、４３・・・流
体圧シリンダー、４５・・・ラック、４６・・・ピニオ
ン）１５・・・ＩＣ素子取出し手段、（１６・・・コン
ベヤ、１７・・・仕切部、１６ａ・・・受載部、１８・
・・位置決め部、５０・・・上下スライダ、５１・・・
クランク機構、５２・・・溝型本体、５４・・・位置決
めピン、５８・・・吸気小孔、５９・・・噴気小孔）１
９・・・ＩＣ素子給送手段、８・・・ＩＣ素子吸着ヘッ
ド、５５・・・凹状マウス、５７・・・位置決めピン。第１２図第１３図FIG. 1 is a perspective view showing an example of an IC element, FIG. 2 is a perspective view showing a part of a tray that accommodates an IC device, FIG. 3 is a schematic perspective view of one embodiment, and FIG. 4 is a gripping type tray. 5 is a sectional view of the tray magazine mounting section, FIG. 6 is a front view of the grip type tray intermittent feeding means, and FIG. 7 is a sectional view of the intermittent feeding means.
A side view of the C element extraction means and IC element feeding means, FIG. 8 is a sectional view of the IC element suction nose, FIG. 9 is a side view of the IC element extraction means, and FIG. 10 is a cross section of a part of FIG. 9. Figure 11 is a plan view of the terminal end of the IC element feeding means, and Figure 1-
2 and 13 are cross-sectional views of the suction head shown in FIG. 11 taken at different angles. DESCRIPTION OF SYMBOLS 1...IC element, 2...Tray, (3...Tester, 5...Turntable, 7...IC element holder, 8...IC element suction head, 12...IC element automatic supply unit) 4... inspection work means, (26... tray pull-in member, 28... upper roller pair) 13...
・Gripping type tray intermittent feeding means, (14... IC element adsorption nose, 35... vertically movable base, 38... holding frame,
40... Holder, 41... Link, 43... Fluid pressure cylinder, 45... Rack, 46... Pinion) 15... IC element extraction means, (16... Conveyor, 17... ... Partition section, 16a... Receiving section, 18.
...Positioning section, 50...Vertical slider, 51...
Crank mechanism, 52... Groove body, 54... Positioning pin, 58... Intake small hole, 59... Fumarole small hole) 1
9... IC element feeding means, 8... IC element suction head, 55... concave mouse, 57... positioning pin. Figure 12 Figure 13

Claims

[Scope of utility model registration request]

(1) Introducing and grasping a tray containing a large number of IC devices arranged in an array so that they can be freely taken out and taken out one by one, and intermittently feeding the tray so that the stored IC devices are sequentially sent out unit row by unit to the take-out position and positioned. and an IC element suction nose member whose pitch can be set so as to correspond to each IC element in a unit row that reaches the ejection position, and the IC element suction nose member that adsorbs the IC elements at the ejection position in the tray. IC element extraction means that takes out the IC elements and carries them to a desired position in the same arrangement as they are and releases them; and IC elements that are released from the IC element extraction means are received in each receiving part, and the IC elements are picked up and received by the inspection work means. The present invention includes an IC element feeding means for sequentially and intermittently feeding the IC elements to the positioning part, and an IC element suction head provided on the inspection work means for carrying the IC elements fed to the positioning part for IC element suction to the tester. An IC device inspection device characterized by:

(2) The positioning part for suctioning and receiving IC elements has a small intake hole and a small blowhole at the bottom of the positioning part, and the IC element being fed to the positioning part is lightly vibrated, and the IC element is The IC device testing device according to claim 1, which is a comb that is easily suction-fitted into a concave mouth of a device suction/receiving head.

(3) The IC element suction head is installed in an IC element holder in which struts are vertically movably fitted at equidistant positions on the circumference of the outer periphery of the turntable, which is intermittently driven;
The IC element suction head is moved up and down by the operation of a fluid pressure cylinder applied between it and the turntable, and retaining holes are formed on both sides of the concave mouth for IC element suction of the IC element suction head.
By inserting positioning pins erected on both sides of the positioning part for attracting the IC element into this engagement hole, the concave mouse can correctly face the IC element positioned at that position. An IC device testing device according to claim 1 or 2 of the utility model registration claim.