KR0125335Y1 - Wafer measurement apparatus - Google Patents

Wafer measurement apparatus Download PDF

Info

Publication number
KR0125335Y1
KR0125335Y1 KR2019950013444U KR19950013444U KR0125335Y1 KR 0125335 Y1 KR0125335 Y1 KR 0125335Y1 KR 2019950013444 U KR2019950013444 U KR 2019950013444U KR 19950013444 U KR19950013444 U KR 19950013444U KR 0125335 Y1 KR0125335 Y1 KR 0125335Y1
Authority
KR
South Korea
Prior art keywords
wafer
stage
sheet resistance
cassette
measuring apparatus
Prior art date
Application number
KR2019950013444U
Other languages
Korean (ko)
Other versions
KR970003255U (en
Inventor
류종암
Original Assignee
문정환
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 엘지반도체주식회사 filed Critical 문정환
Priority to KR2019950013444U priority Critical patent/KR0125335Y1/en
Publication of KR970003255U publication Critical patent/KR970003255U/en
Application granted granted Critical
Publication of KR0125335Y1 publication Critical patent/KR0125335Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

본 고안에 의한 웨이퍼 면저항 측정장치는 다수의 웨이퍼가 적재되어 있는 웨이퍼카세트가 안착되는 카세트스테이지와, 웨이퍼가 안착되는 웨이퍼스테이지와, 웨이퍼스테이지의 일측에 설치되어 수직선상으로 상하 구동하게 되어 웨이퍼스테이지에 안착되는 웨이퍼의 표면과 접촉하는 탐침이 부착되어 있는 탐침구동축과, 카세트스테이지와 웨이퍼스테이지의 사이에 형성되어 웨이퍼카세트의 웨이퍼를 웨이퍼스테이지 상면에 로딩 또는 언로딩시키는 웨이퍼이동자를 포함하여 이루어진다.The wafer sheet resistance measuring apparatus according to the present invention has a cassette stage on which a wafer cassette on which a plurality of wafers are loaded is mounted, a wafer stage on which a wafer is seated, and is installed on one side of the wafer stage to be driven vertically up and down on the wafer stage. And a probe drive shaft attached with a probe contacting the surface of the wafer to be seated, and a wafer mover formed between the cassette stage and the wafer stage to load or unload the wafer of the wafer cassette onto the wafer stage upper surface.

Description

웨이퍼 면저항 측정장치Wafer Sheet Resistance Measuring Equipment

제1도는 종래의 웨이퍼 면저항 측정장치를 설명하기 위한 도면.1 is a view for explaining a conventional wafer sheet resistance measuring apparatus.

제2도는 본 고안에 의한 웨이퍼 면저항 측정장치를 설명하기 위한 도면.2 is a view for explaining a wafer sheet resistance measuring apparatus according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

10.20 : 웨이퍼스테이지 10-1. 20-1 : 흡입라인10.20: Wafer stage 10-1. 20-1: suction line

11.21 : 탐침 12. 22 : 탐침구동축11.21: probe 12. 22: probe driving shaft

20-2 : 홈 20-3 : 웨이퍼고정자20-2: Groove 20-3: Wafer Stator

200 : 웨이퍼카세트 210 : 카세트스테이지200: wafer cassette 210: cassette stage

220 : 웨이퍼이동자 221 : 흡입구220: wafer mover 221: suction port

222 : 흡착회전축 223 : 구동축222: suction shaft 223: drive shaft

본 고안은 웨이퍼(wafer) 면저항 측정장치에 관한 것으로, 특히 웨이퍼 뒷면의 저항을 측정하기에 적당하도록 한 웨이퍼 면저항 측정장치에 관한 것이다.The present invention relates to a wafer sheet resistance measuring apparatus, and more particularly to a wafer sheet resistance measuring apparatus that is suitable for measuring the resistance of the back surface of the wafer.

반도체 제조공정에서 제작하고자 하는 제품의 패턴(pattern)이 형성된 웨이퍼는 웨이퍼 면저항 측정장치를 이용하여 그 면저항을 측정한다.A wafer on which a pattern of a product to be manufactured is formed in a semiconductor manufacturing process is measured using a wafer sheet resistance measuring apparatus.

제1도는 종래의 웨이퍼 면저항 측정장치를 설명하기 위한 도면으로, 종래의 웨이퍼 면저항 측정장치의 개략적인 구성을 도시한 사시도이다.1 is a view for explaining a conventional wafer sheet resistance measuring apparatus, and is a perspective view showing a schematic configuration of a conventional wafer sheet resistance measuring apparatus.

종래의 웨이퍼 면저항 측정장치는 제1도에 도시된 바와 같이, 웨이퍼가 안착되고 전후 좌우 및 회전 구동하는 웨이퍼스테이지(wafter stage)(10)와, 웨이퍼스테이지의 일측에 설치되어 수직선상으로 상하 구동하게 되어 웨이퍼의 표면과 접촉하는 탐침(11)과, 탐침을 상하 구동시키는 탐침구동축(12)로 이루어지며, 웨이퍼스테이지의 상면에는 흡입라인(line)(10-1)이 형성되어, 상면에 안착된 웨이퍼를 흡착한다.In the conventional wafer sheet resistance measuring apparatus, as shown in FIG. 1, a wafer stage (wafter stage) 10 in which a wafer is seated, and is driven in front, rear, left, and rotation, and installed on one side of the wafer stage to be driven vertically up and down in a vertical line. And a probe 11 contacting the surface of the wafer, and a probe driving shaft 12 for driving the probe up and down. A suction line 10-1 is formed on the upper surface of the wafer stage, and is mounted on the upper surface. Adsorb the wafer.

종래의 웨이퍼 면저항 측정장치에서는 웨이퍼스테이지의 상면에 웨이퍼를 작업자가 튀져(tweezer)를 이용하여 올려 놓으면, 웨이퍼 뒷면 전체가 흡입라인에 의해 흡착되어 고정되고, 웨이퍼스테이지가 전후 좌우 및 회전 구동되어 웨이퍼 면저항을 측정하고자 하는 부위가 탐침의 하단으로 위치하게 되면 탐침구동축이 하강하여 웨이퍼의 면저항을 측정하였다.In a conventional wafer sheet resistance measuring apparatus, when an operator puts a wafer on a top surface of a wafer stage by using a tweezer, the entire back surface of the wafer is sucked and fixed by a suction line, and the wafer stage is driven back and forth, left and right, and rotated so that the wafer sheet resistance When the area to be measured is located at the bottom of the probe, the probe drive shaft was lowered to measure the sheet resistance of the wafer.

즉, 종래의 웨이퍼 면저항 측정장치는 웨이퍼의 앞면만 면저항이 측정가능하도록 되어 있고, 웨이퍼의 뒷면은 그 전면(全面)이 웨이퍼스테이지의 상면과 접촉하게 된다.That is, in the conventional wafer sheet resistance measuring apparatus, the sheet resistance can be measured only on the front surface of the wafer, and the front surface of the wafer comes into contact with the upper surface of the wafer stage.

그러나 종래의 웨이퍼 면저항 측정장치에서는 웨이퍼 뒷면의 면저항을 측정하고자 할 때에 웨이퍼스테이지의 상면에 패턴을 형성시킨 웨이퍼의 앞면 전체가 접촉하게 되므로 웨이퍼의 오염 및 제품 페턴의 손상으로 면저항 측정이 완료된 웨이퍼는 폐기시킬 수 밖에 없는 문제가 발생하였으므로, 웨이퍼 뒷면의 면저항 측정에는 적합하지 못했다.However, in the conventional wafer sheet resistance measuring apparatus, when the sheet resistance on the back side of the wafer is to be measured, the entire front surface of the wafer having a pattern formed on the upper surface of the wafer stage comes into contact with the wafer. Since a problem that can only be made, it was not suitable for measuring the sheet resistance on the back of the wafer.

본 고안은 이러한 문제를 해결하기 위하여 안출된 것으로, 웨이퍼 면저항 측정장치의 구성을 개량하여 웨이퍼 앞면 또는 뒷면의 면저항 측정에 적합하도록 하는 것이 그 목적이다.The present invention has been made to solve such a problem, and its object is to improve the configuration of the wafer sheet resistance measuring apparatus so as to be suitable for measuring the sheet resistance of the front or rear surface of the wafer.

본 고안에 의한 웨이퍼 면저항 측정장치는 다수의 웨이퍼가 적재되어 있는 웨이퍼카세트가 안착되는 카세트스테이지와, 웨이퍼가 안착되는 웨이퍼스테이지와, 웨이퍼스테이지의 일측에 설치되어 수직선상으로 상하 구동하게 되어 웨이퍼스테이지에 안착되는 웨이퍼의 표면과 접촉하는 탐침이 부착되어 있는 탐침구동축와, 카세트스테이지와 웨이퍼스테이지의 사이에 형성되어 웨이퍼카세트의 웨이퍼를 웨이퍼스테이지 상면에 로딩 또는 언로딩시키는 웨이퍼이동자를 포함하여 이루어진다.The wafer sheet resistance measuring apparatus according to the present invention has a cassette stage on which a wafer cassette on which a plurality of wafers are loaded is mounted, a wafer stage on which a wafer is seated, and is installed on one side of the wafer stage to be driven vertically up and down on the wafer stage. And a probe drive shaft having a probe attached to the surface of the wafer to be seated thereon, and a wafer mover formed between the cassette stage and the wafer stage to load or unload the wafer of the wafer cassette onto the wafer stage upper surface.

제2도는 본 고안에 의한 웨이퍼 면저항 측정장치를 설명하기 위한 도면으로, 제2도의 (a)는 본 고안에 의한 웨이퍼 면저항 측정장치의 구성을 도시한 도면이고, 제2도의 (b)는 본 고안에 의한 웨이퍼 면저항 측정장치에서 웨이퍼스테이지의 단면을 도시한 도면이다. 이하 첨부된 도면을 참고로 본 고안에 의한 웨이퍼 면저항 측정장치의 구성 및 동작을 설명하겠다.2 is a view for explaining the wafer sheet resistance measuring apparatus according to the present invention, Figure 2 (a) is a view showing the configuration of the wafer sheet resistance measuring apparatus according to the present invention, Figure 2 (b) is the present invention Is a cross-sectional view of the wafer stage in the wafer sheet resistance measuring apparatus. Hereinafter, the configuration and operation of the wafer sheet resistance measuring apparatus according to the present invention will be described with reference to the accompanying drawings.

본 고안에 의한 웨이퍼 면저항 측정장치는 제2도의 (a)와(b)에 도시된 바와 같이, 다수의 웨이퍼가 적재되어 있는 웨이퍼카세트(200)가 안착되는 카세트스테이지(210)와, 웨이퍼가 안착되는 웨이퍼스테이지(20)와, 웨이퍼스테이지의 일측에 설치되어 수직선상으로 상하 구동하게 되어 웨이퍼스테이지에 안착되는 웨이퍼의 표면과 접촉하는 탐침(21)이 부착되어 있는 탐침구동축(22)와, 카세트스테이지(210)와 웨이퍼스테이지(20)의 사이에 형성되어 웨이퍼카세트의 웨이퍼를 웨이퍼스테이지 상면에 로딩(loading) 또는 언로딩(unloading)시키는 웨이퍼이동자(220)를 포함하여 이루어지며, 웨이퍼이동자는 일측에 다 수의 흡입력이 부여되는 흡입구(221)가 형성되어, 웨이퍼카세트에 적재되어 있는 웨이퍼를 흡착하여 잡으면서 웨이퍼를 회전시켜서 뒤집는 흡착회전축(222)과, 흡착회전축의 또 다른 측에 연결되어 형성되고, 흡착회전축이 웨이퍼스테이지에 적재되어 있는 각각의 웨이퍼에 대응되도록 상하구동하면서, 흡착회전축에 의해 흡착된 웨이퍼를 웨이퍼스테이지 상면에 로딩 또는 언로딩시키기 위하여 웨이퍼카세트와 웨이퍼스테이지 사이를 흡착회전축이 회전 왕복하게 되도록 하는 구동축(223)으로 이루어진다.As shown in (a) and (b) of FIG. 2, the wafer sheet resistance measuring apparatus according to the present invention includes a cassette stage 210 on which a wafer cassette 200 on which a plurality of wafers are loaded is mounted, and a wafer is seated. A probe driving shaft 22 and a cassette stage provided with a wafer stage 20, a probe 21 mounted on one side of the wafer stage, and driven up and down in a vertical line to contact the surface of the wafer seated on the wafer stage. And a wafer mover 220 formed between the 210 and the wafer stage 20 to load or unload the wafer of the wafer cassette onto the top of the wafer stage. A suction inlet 221 is provided to which a plurality of suction forces are applied, and the suction rotating shaft 22 which rotates and flips the wafer while absorbing and catching the wafer loaded on the wafer cassette. 2) and the wafer adsorbed by the adsorption rotating shaft is loaded or frozen on the upper surface of the wafer stage while being connected to another side of the adsorption rotating shaft and driven up and down so that the adsorption rotating shaft corresponds to each wafer loaded on the wafer stage. It consists of a drive shaft 223 for rotating the suction and rotation axis between the wafer cassette and the wafer stage for loading.

그리고 웨이퍼가 안착되는 웨이퍼스테이지(20)는 웨이퍼이동자에 의해 상면에 안착된 웨이퍼의 가장자리에서 웨이퍼의 컷팅(cutting) 길이 만큼만 접촉부(@부위)에 접촉되도록 상면 중앙부위에 홈(20-2)을 형성시키고, 접촉부의 상단에는 왕복구동하면서 접촉부에만 접촉되어 안착되는 웨이퍼의 가장자리를 고정시키는 웨이퍼고정자(20-3)를 포함하여 이루어지며, 접촉부의 면상에는 흡입력이 부여되는 흡입라인(20-1)을 추가로 형성시켜서, 웨이퍼의 가장자리가 접촉부에 안착되면서 흡착되도록 한다. 이 때, 웨이퍼의 컷팅길이는 웨이퍼 상면의 패턴이 형성되지 않는 부분이며, 반도체 제조가 돤료된 후에 웨이퍼에서 컷팅되어 제거되는 길이를 뜻한다.The wafer stage 20 on which the wafer is seated has a groove 20-2 in the center surface of the upper surface such that the contact portion (@ region) is contacted only by the cutting length of the wafer from the edge of the wafer seated on the upper surface by the wafer mover. And a wafer stator 20-3 for forming a reciprocating drive at the upper end of the contact portion and fixing the edge of the wafer to be seated in contact with the contact portion, and a suction line 20-1 provided with suction force on the surface of the contact portion. Is further formed so that the edges of the wafer are adsorbed while seated at the contacts. In this case, the cutting length of the wafer is a portion where the pattern on the upper surface of the wafer is not formed, and means a length that is cut and removed from the wafer after semiconductor manufacturing is completed.

즉, 본 고안에 의한 웨이퍼 면저항 측정장치에서는 웨이퍼카세트(200)에 적재된 웨이퍼가 웨이퍼이동자(220)의 흡착회전축(222)에 형성된 다 수의 흡입구 (221)에 의해 흡착되어 뒤집어지면서 웨이퍼스테이지(20) 상단으로 회전하게 되면, 흡착회전축(222)의 흡입구(221)의 흡입력을 차단하여 웨이퍼스테이지의 상면에 안착되도록 하고, 웨이퍼가 안착된 웨이퍼스테이지는 전후 좌우 및 회전 구동되어, 웨이퍼 뒷면에서 면저항을 측정하고자 하는 부위가 탐침(21)의 하단으로 위치하도록 하고, 탐침구동축(22)이 하강하여 탐침이 접촉하는 부위 -면저항을 측정하고자 하는 부위- 의 면저항을 측정하고, 측정이 완료된 웨이퍼는 다시 웨이퍼이동자에 의해 웨이퍼카세트에 적재된다.That is, in the wafer sheet resistance measuring apparatus according to the present invention, the wafer loaded on the wafer cassette 200 is absorbed and flipped over by the suction holes 221 formed on the suction rotating shaft 222 of the wafer mover 220, and the wafer stage ( 20) When rotated to the upper end, the suction force of the suction port 221 of the suction rotating shaft 222 is blocked to be seated on the upper surface of the wafer stage, and the wafer stage on which the wafer is seated is driven back and forth and left and right, and the sheet resistance at the back of the wafer. The area to be measured is positioned at the lower end of the probe 21, the probe drive shaft 22 descends to measure the sheet resistance of the site where the probe contacts-the surface resistance to be measured-and the measured wafer is again It is loaded on the wafer cassette by the wafer mover.

그리고 본 고안에 의한 웨이퍼 면저항 검사장치에서 웨이퍼스테이지는 테프론(tefron)으로 형성시키고, 상면 중앙부위에 홈을 형성시켜서 웨이퍼 앞면에 형성된 패턴이 보호되도록 하였으며, 웨이퍼스테이지에 웨이퍼가 정확히 안착되며, 웨이퍼 가장자리가 접촉하게 되는 좁촉부 상단에 웨이퍼 표면상에서 일정간격으로 3부분을 고정시키도록 형성시킨 웨이퍼고정자가 웨이퍼 중심쪽으로 이동하여 웨이퍼 가장자리를 고정시키면, 접촉부의 접촉면상에는 다 수의 흡입력이 부여되는 흡입구를 형성시켜서 웨이퍼가 안착되면서, 그 가장자리가 흡착되도록 한다.In the wafer sheet resistance inspection apparatus according to the present invention, the wafer stage is formed of tefron and the groove is formed at the center of the upper surface so that the pattern formed on the front surface of the wafer is protected, and the wafer is correctly seated on the wafer stage, and the wafer edge When the wafer holder, which is formed to fix three portions on the wafer surface at regular intervals on the top of the narrow contact portion, moves toward the wafer center to fix the wafer edge, a suction port is provided on the contact surface of the contact portion, where a plurality of suction forces are applied. As the wafer is seated, the edge is adsorbed.

본 고안에 의한 웨이퍼 면저항 측정장치에서는 웨이퍼의 면저항을 측정하기 위하여 종래 기술에서처럼 작업자가 직접 웨이퍼를 튀져로 잡아서 웨이퍼스테이지에 안착시키지 않고, 웨이퍼이동자에 의해 자동으로 로딩 또는 언로딩되게 하여 웨이퍼 면저항의 작업시간이 단축되며, 또한 웨이퍼 뒷면의 면저항 측정시에도 앞면에 형성시킨 패턴이 보호되면서 웨이퍼스테이지에 안착되므로 패턴의 손상이 방지될 뿐 아니라 오염격자에 의한 웨이퍼 표면(앞면 또는 뒷면)의 오염을 방지할 수 있다.In the wafer sheet resistance measuring apparatus according to the present invention, in order to measure the sheet resistance of the wafer, the operator does not directly hold the wafer with the wafer, so that the wafer is loaded and unloaded by the wafer mover automatically, instead of holding it on the wafer stage. The time is shortened and the pattern formed on the front side is protected and seated on the wafer stage even when measuring the sheet resistance on the back side of the wafer to prevent damage to the pattern as well as to prevent contamination of the wafer surface (front or back side) by contamination grids. Can be.

Claims (6)

반도체 장치의 웨이퍼 면저항 측정장치에 있어서, 다수의 웨이퍼가 적재되어 있는 웨이퍼카세트가 안착되는 카세트스테이지와, 웨이퍼가 가장자리만 접촉되면서 안착되고, 전후 좌우 및 호지너 구동되는 웨이퍼스테이지와, 상기 웨이퍼스테이지의 일측에 설치되어 수직선상으로 상하 구동하게 되어 웨이퍼스테이지에 안착되는 웨이퍼의 표면과 접촉하는 탐침이 부착되어 있는 탐침구동축와, 상기 카세트스테이지와 상기 웨이퍼스테이지의 사이에 형성되어 상기 웨이퍼카세트의 웨이퍼를 상기 웨이퍼스테이지 상면에 로딩 또는 언로딩시키는 웨이퍼이동자를 포함하여 이루어진 웨이퍼 면저항 측정장치.A wafer sheet resistance measuring apparatus of a semiconductor device, comprising: a cassette stage on which a wafer cassette on which a plurality of wafers are loaded is mounted, a wafer stage on which wafers are seated while contacting only edges, and driven forward, backward, left, and right, and wafer stages; A probe drive shaft installed at one side and driven up and down in a vertical line, and having a probe contacting the surface of the wafer seated on the wafer stage, and formed between the cassette stage and the wafer stage to transfer the wafer of the wafer cassette to the wafer. Wafer sheet resistance measuring apparatus comprising a wafer mover for loading or unloading on the upper surface of the stage. 제1항에 있어서, 상기 웨이퍼스테이지는 상기 웨이퍼이동자에 의해 상면에 안착된 웨이퍼의 가장자리가 접촉부에만 접촉되도록 상면 중앙부위에 홈을 형성시키고, 상기 접촉부의 상단에는 왕복구동하면서 상기 접촉부에만 접촉되어 안착되는 웨이퍼의 가장자리를 고정시키는 웨이퍼고정자를 포함하여 이루어진 것을 특징으로 하는 웨이퍼 면저항 측정장치.The wafer stage of claim 1, wherein the wafer stage has a groove formed in the center of the upper surface such that the edge of the wafer seated on the upper surface by the wafer mover contacts only the contact portion, and the upper end of the contact portion is reciprocated to contact only the contact portion and is seated. Wafer sheet resistance measuring apparatus comprising a wafer stator for fixing the edge of the wafer to be. 제2항에 있어서, 상기 접촉부에 흡입력이 부여되는 흡입라인을 추가로 형성시켜서, 상기 웨이퍼의 가장자리가 상기 접촉부에 안착되면서 흡착되도록 하는 것을 특징으로 하는 웨이퍼 면저항 측정장치.The wafer sheet resistance measuring apparatus of claim 2, further comprising a suction line to which suction force is applied to the contact portion, so that the edge of the wafer is sucked while seated on the contact portion. 제2항에 있어서, 상기 웨이퍼스테이지는 테프론 재질로 형성시키고, 상기 웨이퍼고정자는 웨이퍼 표면상에서 일정간격으로 3부분을 고정시키도록 상기 접촉부의 상단에 형성시키는 것을 특징으로 하는 웨이퍼 면저항 측정장치.The wafer sheet resistance measuring apparatus of claim 2, wherein the wafer stage is formed of a Teflon material, and the wafer stator is formed at an upper end of the contact portion to fix three portions at predetermined intervals on a wafer surface. 제2항에 있어서, 상기 접촉부에 접촉되는 상기 웨이퍼의 가장자리의 길이는 상기 웨이퍼의 컷팅길이인 것을 특징으로 하는 웨이퍼 면저항 측정장치.The wafer sheet resistance measuring apparatus of claim 2, wherein a length of an edge of the wafer contacting the contact portion is a cutting length of the wafer. 제1항 또는 제2항에 있어서, 상기 웨이퍼이동자는 일측에 다 수의 흡입력이 부여되는 흡입구가 형성되어, 상기 웨이퍼카세트에 적재되어 있는 상기 웨이퍼를 흡착하여 잡으면서 상기 웨이퍼를 회전시켜서 뒤집는 흡착회전축과, 상기 흡착회전축의 또 다른 측에 연결되어 형성되고, 상기 흡착회전축이 상기 웨이퍼스테이지에 적재되어 있는 각각의 웨이퍼에 대응되도록 상하구동하면서, 상기 흡착회전축에 의해 흡착된 웨이퍼를 웨이퍼스테이지 상면에 로딩 또는 언로딩시키기 위하여 상기 웨이퍼카세트와 상기 웨이퍼스테이지 사이를 상기 흡착회전축이 회전 왕복하게 되도록 하는 구동축을 포함하여 이루어진 웨이퍼 면저항 측정장치.The suction shaft of claim 1 or 2, wherein the wafer mover is provided with a suction port provided with a plurality of suction forces on one side thereof, and rotates the wafer by flipping the wafer while absorbing and holding the wafer loaded on the wafer cassette. And a wafer adsorbed by the adsorption rotation shaft on the upper surface of the wafer stage while being driven up and down so as to be connected to another side of the adsorption rotation shaft, and the adsorption rotation shaft corresponding to each wafer loaded on the wafer stage. Or a driving shaft for rotating the suction rotation shaft between the wafer cassette and the wafer stage so as to unload the wafer.
KR2019950013444U 1995-06-14 1995-06-14 Wafer measurement apparatus KR0125335Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950013444U KR0125335Y1 (en) 1995-06-14 1995-06-14 Wafer measurement apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950013444U KR0125335Y1 (en) 1995-06-14 1995-06-14 Wafer measurement apparatus

Publications (2)

Publication Number Publication Date
KR970003255U KR970003255U (en) 1997-01-24
KR0125335Y1 true KR0125335Y1 (en) 1999-04-15

Family

ID=19415545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950013444U KR0125335Y1 (en) 1995-06-14 1995-06-14 Wafer measurement apparatus

Country Status (1)

Country Link
KR (1) KR0125335Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100900830B1 (en) * 2007-08-22 2009-06-04 한국표준과학연구원 Four Point Probe Fixing Apparatus for Sheet Resistance Measurement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100900830B1 (en) * 2007-08-22 2009-06-04 한국표준과학연구원 Four Point Probe Fixing Apparatus for Sheet Resistance Measurement

Also Published As

Publication number Publication date
KR970003255U (en) 1997-01-24

Similar Documents

Publication Publication Date Title
KR920004063B1 (en) Method and apparatus for grinding the surface of a semiconductor
US9805980B2 (en) Method of manufacturing a semiconductor device
US6249342B1 (en) Method and apparatus for handling and testing wafers
JP2003211354A (en) Cutting device
KR100874856B1 (en) Cutting and handling equipment for semiconductor package manufacturing
KR20020049954A (en) Handler System For Cutting The Semiconductor Device
JP2000100757A (en) Method of cutting tapeless board, and cutter, and board supporter for dicing processing used for the method
JP3343503B2 (en) Cleaning equipment
KR0125335Y1 (en) Wafer measurement apparatus
JPS61252642A (en) Chip supporting table for testing semiconductor ic chip
JPH07130637A (en) Semiconductor manufacturing equipment
JP2001157959A (en) Surface grinding apparatus
CN110919881A (en) Cutting device
TW202132046A (en) Processing apparatus
KR101896269B1 (en) Semiconductor strip grinder
KR100491928B1 (en) Apparatus with the tables for reversing
JP3050910B2 (en) Device for holding thin plate members
KR200177337Y1 (en) Semiconductor dummy wafer inspection apparatus
JP2840858B2 (en) Wafer inspection method and inspection device
JP2607923B2 (en) Wafer handling chuck structure
JP3609230B2 (en) Semiconductor device manufacturing equipment
KR20240027548A (en) Processing apparatus
JPH05232423A (en) Liquid crystal plate cutting device
TW202412990A (en) Processing equipment
JPH01129436A (en) Treater for semiconductor substrate

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040331

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee