KR0122308Y1 - Lead frame loading apparatus of solder plating equipment - Google Patents
Lead frame loading apparatus of solder plating equipmentInfo
- Publication number
- KR0122308Y1 KR0122308Y1 KR2019950002660U KR19950002660U KR0122308Y1 KR 0122308 Y1 KR0122308 Y1 KR 0122308Y1 KR 2019950002660 U KR2019950002660 U KR 2019950002660U KR 19950002660 U KR19950002660 U KR 19950002660U KR 0122308 Y1 KR0122308 Y1 KR 0122308Y1
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- storage guide
- lead
- guide
- plating equipment
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
본 고안은 납도금장비의 리드프레임 로딩장치에 관한 것으로, 매거진(1)으로부터 그리퍼(2)에 의해 공급되는 수개의 리드프레임을 수납가이드(3)에 수납하여 캐리어핑거(6)를 이용하여 도금조로 이동시키는 납도금장비의 리드프레임 로딩장치에 있어서, 리드프레임을 수납가이드(3)의 안쪽까지 수평이동시키기 위한 이동수단과, 리드프레임을 수납가이드(3)의 벽면에 수직으로 세워서 지지하기 위한 지지수단을 구비하여 이동수단으로 리드프레임을 수납가이드(3)의 안쪽까지 밀어 넣어 90°회전할대 떨어지지 않게 하고, 수납가이드(3)의 일측 벽면에 슬라이딩 되게 설치한 지지수단이 리드프레임을 수납가이드의 타측 벽면에 수직으로 세워서 지지하여 캐리어핑거(6)가 로딩할 때 미스로딩이 발생치 않도록 함으로서 생산성을 향상시킨 것이다.The present invention relates to a lead frame loading device of a lead plating equipment, the lead frame supplied by the gripper 2 from the magazine (1) is housed in the storage guide (3) and plated using the carrier finger (6) In the lead frame loading device of the lead plating equipment for moving the jaw, the moving means for horizontally moving the lead frame to the inside of the storage guide (3), and for supporting the lead frame to stand vertically on the wall surface of the storage guide (3) The support means includes a support means for pushing the lead frame to the inside of the storage guide 3 so as not to fall by 90 ° rotation, and the support means installed to slide on one side wall of the storage guide 3 accommodates the lead frame. The upright is supported on the other side wall of the guide to improve productivity by preventing misloading when the carrier finger 6 is loaded.
Description
제1도는 종래 납도금장비의 리드프레임 로딩장치의 구성을 보인 구성도.1 is a block diagram showing the configuration of a lead frame loading device of a conventional lead plating equipment.
제2도는 본 고안 납도금장비의 리드프레임 로딩장치의 구성을 보인 구성도2 is a block diagram showing the configuration of the lead frame loading device of the present invention lead plating equipment
* 도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
1 : 매거진 3 : 수납가이드1: Magazine 3: Storage Guide
6 : 캐리어핑거 10 : 모터6: carrier finger 10: motor
11 : 풀리 12 : 벨트11: pulley 12: belt
20 : 클램프가이드20: Clamp Guide
본 고안은 납도금장비의 리드프레임 로딩장치에 관한 것으로, 특히 납도금 하기 위하여 로딩(Loading)되는 리드프레임이 미스로딩(Miss Roading)으로 도금조에 떨어져서 생산성이 저하되는 것을 방지하고자 하는 것이다.The present invention relates to a lead frame loading device of a lead plating equipment, in particular, to prevent the productivity of the lead frame being loaded for lead plating (Miss Roading) to fall in the plating bath by the miss loading (fall).
제1도는 종래 납도금장비의 리드프레임 로딩장치의 구성을 보인 구성도로서, 이에 도시한 바와 같이, 로딩될 리드프레임을 담아 놓는 매거진(1)과, 상기 매거진(1)으로부터 리드프레임을 이송하기 위한 그리퍼(2)와, 상기 그리퍼(2)에서 이송한 리드프레임을 수납하여 납도금장비 입구까지 이송하기 위한 수납가이드(3)와, 상기 수납가이드(3)가 부착되어 회전하는 체인(4)과, 상기 체인(4)을 회전시키기 위한 회전축(5)으로 구성되어 있다.1 is a block diagram showing a configuration of a lead frame loading device of a conventional lead plating equipment, as shown in this, a magazine (1) containing a lead frame to be loaded, and to transport the lead frame from the magazine (1) A gripper 2, a storage guide 3 for accommodating the lead frame transferred from the gripper 2 to the entrance of the lead plating equipment, and a chain 4 attached and rotated to the storage guide 3. And a rotating shaft 5 for rotating the chain 4.
도면에서 미설명 부호 3a는 선단부, 6은 캐리어핑거이다.In the figure, reference numeral 3a denotes a distal end portion, and 6 denotes a carrier finger.
상기와 같은 구성을 갖는 종래 납도금장비의 리드프레임 로딩장치는 매거진(1)에 담겨 있는 리드프레임을 그리퍼(2)를 이용하여 수납가이드(3)의 선단부(3a)에 올려 놓으면 회전축(5)이 체인(4)을 회전 시키고 체인(4)에 부착되어 있는 수납가이드(3)가 90°회전하여 선단부(3a)의 리드프레임은 수납가이드(3)의 안족으로 슬라이딩되어 수납되는 동작을 6회 실시하여 1세트를 이룬다.In the lead frame loading apparatus of the conventional lead plating equipment having the above configuration, when the lead frame contained in the magazine 1 is placed on the tip portion 3a of the storage guide 3 using the gripper 2, the rotating shaft 5 The chain 4 is rotated and the storage guide 3 attached to the chain 4 is rotated 90 degrees so that the lead frame of the tip portion 3a is slid to the inner leg of the storage guide 3 for six times. By making one set.
상기와 같이 수납가이드(3)에 수납되어 있는 1세트의 리드프레임은 1세트의 캐리어핑거(6)에 의해 로딩되어 도금조를 이동하면서 도금이 이루어지는 것이다.One set of lead frames housed in the storage guide 3 as described above is loaded by one set of carrier fingers 6 to move the plating bath and plating is performed.
그런, 상기한 바와 같은 종래 납도금장비의 리드프레임 로딩장치에 있어서는, 리드프레임을 그리퍼(2)에 의해 수납가이드(3)의 선단부(3a)에 올려놓고 90°회전하는 과정에서 리드프레임이 수납가이드(3)의 밖으로 튀어나가고, 수납가이드(3)에 수납되는 리드프레임도 수납가이드(3)의 폭이 조정이 안되는 관계로 비스듬이 안착되어(제1도 A부 상세도) 캐리어핑거(6)로 로딩 할때에 미스로딩이 다량 발생하여 생산성이 저하되는 문제점이 있었다.In the lead frame loading apparatus of the conventional lead plating equipment as described above, the lead frame is accommodated in the process of rotating the lead frame by the gripper 2 on the tip portion 3a of the storage guide 3 and rotating by 90 °. The lead frame, which protrudes out of the guide 3 and is stored in the storage guide 3, is also obliquely seated because the width of the storage guide 3 is not adjusted (FIG. 1A detail). There is a problem in that the productivity is reduced due to a large amount of misloading occurs when loading.
이를 감안하여 안출한 본 고안의 목적은 리드프레임을 수납가이드의 안쪽에 안착하여 90°회전할 때에 수납가이드의 밖으로 튀어 나가지 않도록 하고, 수납가이드에 수납된 리드프레임도 수납가이드의 벽면에 수직으로 세워서 지지하여 캐리어핑거로 로딩할 때에 정확히 로딩하여 미스로딩이 발생하지 않도록 한 납도금장비의 리드프레임 로딩장치를 제공함에 있다.In view of this, the object of the present invention is to rest the lead frame on the inside of the storage guide so that it does not protrude out of the storage guide when rotated by 90 °, and the lead frame stored in the storage guide is also placed perpendicular to the wall of the storage guide. The present invention provides a lead frame loading device for lead plating equipment that is loaded correctly by a carrier finger so that miss loading does not occur.
이러한 본 고안의 목적을 달성하기 위하여, 매거진으로부터 공급되는 수개의 리드프레임을 수납가이드에 수납하여 캐리어핑거를 이용하여 도금조로 이동시키는 납도금장비의 리드프레임 로딩장치에 있어서, 리드프레임을 수납가이드의 안쪽까지 수평이동시키기 위한 이동수단과, 리드프레임을 수납가이드의 벽면에 수직으로 세워서 지지하기 위한 지지수단이 포함된 것을 특징으로 하는 납도금장비의 리드프레임 로딩장치가 제공된다.In order to achieve the object of the present invention, in the lead frame loading device of the lead plating equipment for storing several lead frames supplied from the magazine in the storage guide to move to the plating tank by using a carrier finger, the lead frame of the storage guide There is provided a lead frame loading device for lead plating equipment, comprising a moving means for horizontally moving to the inside, and a supporting means for supporting the lead frame to stand vertically on the wall surface of the storage guide.
상기와 같은 납도금장비의 리드프레임 로딩장치는 매거진으로부터 그리퍼에 의해 이동수단에 리드프레임을 올려놓으면 이동수단이 회전하면서 리드프레임을 수납가이드의 안쪽까지 밀어넣어 수납가이드가 90°회전 할 때에도 리드프레임이 떨어지지 않게 되고, 수납가이드가 90°회전하면 수납가이드의 일측 벽면에 통상적인 슬라이딩이 가능하게 설치된 지지수단이 슬라이딩되어 리드프레임을 수직으로 수납가이드의 타측 벽면에 세워서 캐리어핑거가 리드프레임을 로딩할 때에 정확하게 로딩할 수 있는 것이다.The lead frame loading device of the lead plating equipment as described above, when the lead frame is placed on the moving means by the gripper from the magazine, the moving means rotates and pushes the lead frame to the inside of the storing guide, even when the storing guide rotates 90 °. When the storage guide is rotated by 90 °, the support means installed on the wall of one side of the storage guide is slidably movable, and the lead frame is vertically mounted on the other wall of the storage guide so that the carrier finger can load the lead frame. Can be loaded correctly.
이하, 본 고안에 의한 납도금장비의 리드프레임 로딩장치를 첨부도면에 도시한 실시례에 따라서 상세히 서명한다.Hereinafter, the lead frame loading device of the lead plating equipment according to the present invention is signed in detail according to the embodiment shown in the accompanying drawings.
제2도는 본 고안 납도금장비의 리드프레임 로딩장치의 구성을 보인구성도로서, 이에 도시한 바와 같이, 리드프레임을 담아 놓기 위한 매거진(1)과, 그 매거진(1)으로부터 리드프레임을 이동하기 위한 그리퍼(2)와, 리드프레임을 수납하여 도금조의 전면으로 이동시키기 위한 수납가이드(3)와, 상기 수납가이드(3)가 부착되어 수납가이드(3)를 회전 이동시키는 체인(4)과, 상기 체인(4)을 회전시키기 위한 회전축(5)으로 구성되어 있는 납도금장비의 리드프레임 로딩장치에 있어서, 상기 그리퍼(2)에 의해 이동된 리드프레임을 수납가이드(3)의 안쪽까지 밀어 넣기 위한 이동수단을 설치하고, 수납가이드(3)의 일측 벽면에 통상적인 방법으로 슬라이딩되어 수납가이드(3)에 수납되는 리드프레임을 수납가이드(3)의 타측 벽면에 수직으로 세우기 위한 지지수단으로 구성되어 있다.2 is a block diagram showing the configuration of the lead frame loading device of the present invention lead plating equipment, as shown in this, to move the lead frame from the magazine (1), and the magazine (1) for holding the lead frame A gripper (2) for receiving, a storage guide (3) for storing the lead frame and moving it to the front side of the plating bath, a chain (4) attached to the storing guide (3) to rotate and move the storage guide (3), In the lead frame loading device of the lead plating equipment composed of a rotating shaft (5) for rotating the chain (4), the lead frame moved by the gripper (2) to the inside of the storage guide (3) As a supporting means for installing a moving means for the vertical, the lead frame which is slid in one of the wall surface of the storage guide (3) in the usual way and placed in the storage guide (3) perpendicular to the other wall surface of the storage guide (3) Consists of.
상기 이동수단은 모터(10)와, 상기 모터(10)에 의해 회전하는 풀리(11)와, 그 풀리(11)에 감겨져 리드프레임을 수납가이드(3)의 안쪽까지 이동시키는 벨트(12)로 구성되어 있다.The moving means includes a motor 10, a pulley 11 that is rotated by the motor 10, and a belt 12 wound around the pulley 11 to move the lead frame to the inside of the storage guide 3. Consists of.
상기 지지수단은 수납가이드(3)의 일측 벽면에 설치되고 자중에 의하여 통상적인 방법으로 슬라이딩되어 리드프레임을 수납가이드(3)의 타측 벽면에 수직으로 세우기 위한 클램프가이드(20)로 구성되어 있다.The support means is installed on one side wall of the storage guide (3) and is composed of a clamp guide 20 for sliding the lead frame perpendicular to the other side wall of the storage guide (3) by sliding in a conventional manner by its own weight.
미설명 부호 6은 수납가이드(3)로 부터 리드프레임을 로딩하여 도금조로 이동시키기 위한 캐리어핑거이다.Reference numeral 6 is a carrier finger for loading the lead frame from the storage guide (3) to move to the plating bath.
이와 같이 구성된 본 고안 납도금장비의 리드프레임 로딩장치는 매거진(1)에 담겨 있는 리드프레임을 그리퍼(2)을 이용하여 벨트(12)에 올려 놓으면 모터(10)에 의해 풀리(11)가 회전 하면서 벨트(12)에 올려놓은 리드프레임을 이동하여 수납가이드(3)의 안쪽까지 밀어 넣게 된다.In the lead frame loading device of the present invention lead plating equipment configured as described above, when the lead frame contained in the magazine 1 is placed on the belt 12 using the gripper 2, the pulley 11 is rotated by the motor 10. While moving the lead frame placed on the belt 12 is pushed to the inside of the storage guide (3).
이때 수납가이드(3)는 90°회전하여 체인(4) 상부의 일측에 올라가고, 수납가이드(3)의 일측에 설치된 클램프가이드(20)가 자중에 의해 슬라이딩되면서 내려와 리드프레임을 수납가이드(3)의 타측 벽면에 수직으로 세워서 지지하게 되는데, 회전축(5)이 회전하면서 이와같은 동작을 수회 반복하면서 1세트를 이루면 1조의 캐리어핑거(6)가 리드프레임을 로딩하여 도금조를 이동하면서 도금이 되는 것이다.At this time, the storage guide (3) is rotated 90 ° to rise to one side of the upper chain (4), the clamp guide 20 installed on one side of the storage guide (3) slides down by its own weight to lead the lead frame storage guide (3) It is supported vertically on the other side of the wall, the rotating shaft (5) rotates and repeats this operation several times to form a set of one set of carrier finger (6) is loaded while moving the plating bath to the lead frame to be plated will be.
이상에서 상세히 설명한 바와 같이 본 고안에 의한 납도금장비의 리드프레임 로딩장치는 매거진에서 그리퍼에 의해 이동수단에 올려진 리드프레임을 수납가이드의 안쪽까지 이동시켜 리드프레임이 수납된 수납가이드 90°회전할 때 수납가이드의 밖으로 튀어나가지 않도록 하였으며, 리드프레임이 수납된 수납가이드 90°회전하여 상부로 올라가면 수납가이드의 일측에 슬라이딩이 되도록 설치되어 있는 클램프가이드가 자중에 의해 아래로 슬라이딩되어 리드프레임이 수납가이드의 타측 벽면에 수직으로 세워서 지지되므로 종래와 같이 리드프레임이 수납가이드에 비스듬히 누워있지 않게 되어 캐리어핑거로 로딩을 할 때 미스로딩이 발생하는 것이 방지되고 생산성이 향상되는 효과가 있는 것이다.As described in detail above, the lead frame loading apparatus of the lead plating equipment according to the present invention moves the lead frame mounted on the moving means by the gripper in the magazine to the inside of the storage guide to rotate the storage guide housed 90 °. When the lead guide is rotated upward by 90 °, the clamp guide, which is installed to slide on one side of the storage guide, slides down by its own weight. Since it is vertically supported on the other side of the wall, the lead frame does not lie at an angle to the storage guide as in the prior art, thereby preventing misloading when loading with a carrier finger and improving productivity.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950002660U KR0122308Y1 (en) | 1995-02-18 | 1995-02-18 | Lead frame loading apparatus of solder plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950002660U KR0122308Y1 (en) | 1995-02-18 | 1995-02-18 | Lead frame loading apparatus of solder plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960029744U KR960029744U (en) | 1996-09-17 |
| KR0122308Y1 true KR0122308Y1 (en) | 1998-07-15 |
Family
ID=19408078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950002660U KR0122308Y1 (en) | 1995-02-18 | 1995-02-18 | Lead frame loading apparatus of solder plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0122308Y1 (en) |
-
1995
- 1995-02-18 KR KR2019950002660U patent/KR0122308Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960029744U (en) | 1996-09-17 |
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