JPS6032352B2 - Transfer device for plate-shaped objects - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for transferring plate-shaped objects, and particularly a device for transferring plate-like objects, and in particular, a device for transferring objects in an orderly manner.
The present invention relates to a device for transferring articles between two storage jigs for storing and picking up odors when the relationship between the pitches of the storage grooves is an integral multiple.

Generally, multiple objects (articles) of similar shape and size
When processing or manufacturing objects, it is necessary to transfer and align the objects from one jig to another.

For example, when manufacturing semiconductor devices, when performing emitter diffusion treatment on a wafer that has undergone base diffusion treatment, etc., the wafer must be etched to make emitter electrode holes in the wafer, and then cleaned. It is necessary to transfer from jig T to quartz jig Q for emitter diffusion. Conventionally,
Various types of cleaning jigs are used, but
After the cleaning is completed using the cleaning bath, the wafers are individually transferred to the quartz pick-up using tweezers or the like.

However, in this method using tweezers, the work is troublesome because a large number of wafers are transferred individually, and the wafers may be damaged by the tweezers during the work, and each wafer is evenly transferred on the quartz jig. They had drawbacks such as difficulty in arranging them.

As another method, as shown in Fig. 1, as the cleaning waste, a jig in which approximately 20 to 3 pieces of Ichiji odor are placed in parallel with each other is used. A method is also known in which the wafer is placed on the quartz jig, the wafer is inverted, and then the wafer is transferred to the quartz jig.

However, this method also has the disadvantage that it is difficult to align each wafer on the quartz jig, and as a result, the conditions for the emitter diffusion treatment vary from wafer to wafer.

Therefore, the present applicant has already proposed an article transfer device shown in FIGS. 2a to 2h' as a mechanism for solving these drawbacks.

Figures a to h show the wafers from the cleaning tool T to the quartz jig Q.
The longitudinal side views of each state when transferring and arranging them are shown. To explain the mechanism, 1 is a table movable in the
and 3 are bored in parallel in the X direction.
Reference numeral 4 designates a cleaning waste, and 5 designates a quartz jig. These lining tools 4 and 5 are installed in parallel to each other in the x direction at respective positions of the through holes 2 and 3 of the tape loop.

Reference numeral 6 denotes a wafer, and an orientation flat 6a is formed in a part of its circular periphery, and approximately 29 wafers 6 are aligned at the same time in one alignment operation.

Reference numeral 7 denotes a wafer receiver which moves vertically through the through holes 2 and 3 in a direction perpendicular to the surface of the upper taffle to move the wafer 6 up and down.

Grooves (not shown) are formed at a predetermined pitch on the surface of the wafer holder 7 that supports the wafers 6 in order to hold each wafer 6 vertically and to define the spacing between the wafers. Reference numeral 8 denotes a buffer case which sandwiches the wafers 6 transferred above the table by the wafer receiver 7 from both sides and aligns the wafers 6.

This buffer case 8 has its drive source separate from the x-direction movement mechanism of the table 1, and rotates the buffer case 8 while holding the wafer 6 between them to adjust the orientation of the wafer 6 to a flat position. The direction of 6a can be freely selected and positioned. Reference numeral 9 denotes a wafer guide plate, which is normally installed above the table 1, and is used when transferring the wafer 6 held by the buffer case 8 from the buffer case 8 to the quartz jig 5. It is located at the upper end of the tool 5 to prevent the wafer 6 from falling down and to maintain the alignment of the buffer case 8.

Next, the operation of transferring and aligning the wafers 6 from the cleaning jig 4 to the quartz lining tool 5 using the apparatus having the above configuration will be described.

First, as shown in FIG. 2a, in the initial set state, the wafer 6 is supported by the cleaning tool 4, and the buffer
Case 8 is open. Next, as shown in FIG. 2b, the wafer 6 in the cleaning rack 4 is raised to the level of the buffer case 8 by the raising of the wafer receiver 7, and stopped at that position. In this state, as shown in FIG. 2c, the buffer case 8 is closed and holds the wafer 6, while the wafer receiver 7 is lowered and moved to the initial position on the underside of the table 1. By this action of closing the buffer case 8, each wafer 6 is evenly aligned. Next, as shown in FIG. 2d, the tape loop moves in the direction of the arrow in the figure, and the buffer case 8 (and wafer 6)
is located above Quartz Osamu 5.

When the table 1 is moved, the buffer case 8 is rotated approximately 1800 times so that the orientation flat 6a of the wafer 6 is positioned above the wafer 6. Also, as a result of this movement of the table 1, the wafer receiver 7 is positioned below the through hole 2 below the quartz jig 5. After this, as shown in FIG. 2e, the wafer receiver 7 moves up through the through hole 2 and stops at a position where its upper end touches the lower end of the wafer 6. At this time, the wafer guide plate 9, which was above the tape loop, is lowered and positioned at the upper end of the quartz lever 5. Thereafter, as shown in FIG. 2, the buffer case 8 is opened and the wafers 6 are held on the wafer receiver 7 in an aligned state.

Subsequently, the wafer receiver 7 is gradually lowered, and the wafers 6 are placed in the quartz shell 5 in the aligned state as shown in FIG.
moved above. The wafer guide plate 9 prevents the wafer 6 from falling down when the wafer receiver 7 is lowered, but returns to its original position above the table 1 when this is finished. After the wafer 6 is transferred to the quartz jig 5, the table 1 moves to the left in the figure, as shown in FIG. The following processing is performed.

On the other hand, when considering cleaning work and diffusion work (heat treatment), it is not necessary that the cleaning waste tool and the diffusion waste tool (heat treatment waste tool) have the same accommodation groove pitch. That is, during the cleaning operation, the wafer is brought into contact with a liquid (cleaning liquid), and during the diffusion operation, the wafer is brought into contact with a gas.
Gases have much better fluidity than liquids, so even if the pitch of the housing grooves is narrower than the pitch of the housing grooves that accommodate the wafers in the cleaning tool, the diffusion efficiency will not decrease. do not have. If the number of wafers accommodated in the accommodating jig increases, processing capacity can be improved and processing costs reduced. Therefore, recently, the accommodating groove pitch of the diffusion jig is made half of the accommodating groove pitch of the cleaning jig to increase the wafer accommodating capacity. However, if such a housing groove pitch is 1:
The above-mentioned article transfer device cannot be used between two different storage jigs, and the actual work of transferring wafers between the two must be done manually, which is inefficient as in the past. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an apparatus for automatically transferring stored objects between storage pick-up tools having different pitches of storage grooves.

In order to achieve this purpose, one embodiment of the present invention is as follows:
A device for transferring articles between a first accommodation jig and a second accommodation jig having a relatively integral multiple of accommodation groove pitch relationship, wherein the first accommodation jig and the second accommodation jig There is a senpu table which moves horizontally by sending tools in parallel and has a sekiguchi part in the part corresponding to each hagi reki part, and a senpu table which is disposed below this sendo table and rises to the first or second part. a vertical transfer mechanism that supports the items to be arranged and stored in the storage jig No. 2 with a group of parallel grooves provided on the upper end branch; and a group of articles that are disposed above the previous Gonjikyo calendar table and are transferred upward by the vertical transfer mechanism. a holding mechanism that holds the articles from both sides in the holding grooves of a pair of holding plates, and at least one of the storage jigs on the calendar table is arranged in the arrangement direction of the group of articles relative to the holding mechanism. The gripping mechanism is configured to maintain the pitch interval between the stored articles in the first and second storage pick-up tools.The present invention will be described in detail below with reference to Examples.

An embodiment of the article transfer apparatus of the present invention is shown in FIGS. 3 to 12 a to 12 p.

As shown in Fig. 3, this article transfer device has a cleaning waste odor (T) 10 made of Teflon and a heat treatment waste odor (Q) made of quartz, which is shorter by a than the cleaning waste odor (Q). )
a machine base 13 having a plate-shaped Atsunao table 12 on which a wafer is placed on top of the machine base 11; Column 15 supports the. Further, as shown in FIG. 5, the table 12 is attached to a pair of guide rails 16 via wheels 17 so as to be freely movable in the horizontal direction. As shown in FIG. 11, the robot communicates back and forth between three positions A, B, and C. Also, positions A, B, C
The stopping operation of the table 12 is performed by the optoelectronic switches 22, 23, and 24 arranged at one end of the table.
When the light from the motor 1 is received through the mirror 26,
8 is to be stopped. In addition, the table 1
2 has two elongated through holes 2 as shown in FIG.
7 and 28 are provided. One of the through holes 27 is provided for cleaning and picking up odors, and the other through hole 28 is designed to fit a rectangular auxiliary plate 29 for holding the heat treatment jig. Furthermore, a pair of light emitters 30, 101 and light receivers 31, 102 are provided on the machine base 13 with the table 12 in between. It is designed to detect whether Next, each mechanical section will be explained separately. a vertical transfer mechanism 33 that moves up and down across the horizontal movement area of the table 12;
As shown in FIG.
and is arranged as a king between two parallel plates of the support plate 35. That is, the support plate 35 of the board 34 has an elongated support plate. A hook 36 is fixed in a penetrating state. This support block 36 extends along the longitudinal direction of the jigs mounted on the table 12, and is positioned directly below each of the jigs in sequence. Six sliding shafts 37 are respectively fitted along the longitudinal direction of this support block 36 so as to be able to move vertically. In addition, blocks 38 made of small pieces are fixed to the lower ends of these sliding shafts 37, respectively. The sliding shafts 37 at both ends are connected by a first connecting piece 39 formed of an angle between the respective blocks 38, forming a jig projecting shaft system 40 that moves up and down together. Further, the two adjacent sliding shafts 37 of the odor control protrusion shaft system 40 are connected by a second connecting piece 41 formed of an angle that rests on the first connecting piece 39 between the respective blocks 38. It forms a lifting shaft system 42 for aligning wafers that moves up and down. In addition, the adjacent 2
The book sliding shaft 37 also connects the block 38 portion with a third connecting piece 43 to form an elevating shaft system 44 for elevating and lowering the wafer. The third connecting piece 43 is configured to rest on the second connecting piece 41 mountain. Further, an inverted L-shaped guide piece 45 is fixed to the upper surface at the approximate center of the third connecting piece 43, and a contact piece 46 protruding in the horizontal direction of this guide piece 45 is fixed to the lower surface of the contact piece 46 at the tip of the lever bar 47. A rotatable roller 48 is brought into contact via its circumferential surface. The lever 47
is supported at its other end by a pin 49 so as to be vertically rotatable, and both ends of the pin 49 are fixed and supported by support pieces 501 fixed to the substrate 34, respectively. Also, the lever 47
A cam follower 51 is attached to an intermediate portion of the support plate 35, and the cam follower 51 comes into contact with a rotating end cam 52 disposed on the lower surface of the support plate 35. In addition, the cam follower 51 is always in contact with the end cam 52, and the lever 47
A tension coil spring 5 is provided between the lever 47 and the support plate 35 so that the lever 47 accurately follows the cam diagram of the end cam 52.
3 is installed. Therefore, when the tip of the lever 47 rises, the contact piece 46 fixed to the third connecting piece 43 via the roller 48 is pushed upward and rises.

Furthermore, when the lever 47 is lowered, the elevating shaft system 4 for elevating the wafer
4 is designed to descend under its own weight. Also, the third
Tension coil springs 54 and 5 are provided between the second and first connection pieces 41 and 39 and the support block 36 so that the second and first connection pieces 41 and 39 always follow the rise of the connection piece 43.
5 is attached. Further, the jig projection ball system 40
Block-shaped stoppers 56 and 57 are fixed in the middle of the wafer alignment elevator shaft system 42, respectively, and when these stoppers 56 and 57 abut against the lower surface of the support block 36, it will no longer rise. Further, the jig elevating shaft system 40 and the wafer alignment elevating shaft system 42 are moved downwardly by the lowering of the wafer elevating shaft system 44.
They are forcibly lowered via connecting pieces 39, respectively. On the other hand, a wafer receiver 58 made of a rectangular plate is fixed to the upper end of the sliding shaft 37 of the wafer elevating shaft system 44 that projects upward from the support block 36. The upper surface of this wafer receiver 58 is recessed in an arc shape.
This arc is approximately the same as the curvature of the outer circumference of the wafer. Further, on the upper surface of this wafer receiver 58, a heat treatment waste tool 1 is provided.
Receiving groove 5 consisting of 50 V-shaped grooves corresponding to storage book 1
9 (parallel groove group) are provided, and each receiving groove 59 supports the wafer 32.
It is designed to support the trees in a forested state. Further, above both sides of the wafer receiver 58, wafer alignment blocks 60 are provided.
The wafer alignment block 60 is fixed to the upper end of each sliding shaft 37 of the wafer alignment elevator shaft system 42. The upper surface of this wafer alignment block 60 also has a curved surface that has substantially the same curvature as the outer periphery of the wafer 32, and a plurality of alignment grooves 61 made of V-shaped grooves that support the wafer 32 are provided on this curved surface. The groove bottom width of the alignment groove is slightly narrower than the groove width of the opening □ at the tip of the receiving groove 59. In addition, these alignment grooves 61 are parallel to each other and have the same pitch as the housing grooves of the cleaning waste odor 10, in other words, the pitch is twice the pitch of the receiving grooves 59 of the wafer receiver 58,
There are 25 of them. The alignment groove 61 is the receiving groove 5.
It coincides with every other receiving groove 59 of 9. Furthermore, if each wafer 32 housed in the cleaning jig 10 is directly received by the receiving groove 59 with a narrow insertion opening and a small pitch, each wafer 32 is not accurately received in every other receiving groove 59, and sometimes Since wafers may enter adjacent receiving grooves 59, the alignment grooves 61 correct the alignment of the wafers, so that every other receiving groove 59 can reliably accommodate the wafers 32. . Therefore, the groove bottom l width of the alignment groove 61 is slightly narrower than the groove width of the upper insertion opening of the receiving groove 59. Further, a frame-shaped tool receiver 62 is provided so as to surround the outside of the wafer alignment block 60, and this jig receiver 62 is fixed to the upper end of the horizontal shaft 37 of the jig projection shaft system 40. . Further, a positioning protrusion 63 is attached to the upper surface of the jig receiver 62, and the positioning protrusion 63 is adapted to be inserted into and removed from a positioning hole (not shown) provided on the lower surface of the auxiliary plate 9. . Next, referring to FIG. 4, the waiting side that temporarily holds the wafer transferred upward by the vertical transfer mechanism 33 will be described.

A buffer receiver 14 of a holding mechanism 64 is arranged directly above the wafer receiver 58. As shown in FIG. 10, this buffer receiver 14 consists of two parallel receiving plates 65 and 66 along the vertical plane, and these receiving plates 65 and 66 are connected to the support plate 35.
It is provided at the upper part of the column 15 extending from the column 15. As shown in FIGS. 7a and 7b, the wafer 3 is placed on the corresponding surfaces of the receiving plates 65 and 66 in the state where the receiving plates 65 and 66 are closest to each other.
A guide groove 69 consisting of an arc-shaped holding groove (pinching groove) 68 with a support protrusion 67 at the bottom that can hold the wafer 32 and the center part of which is the most concave, and a straight long groove that is deeper than the holding groove 68 that cannot hold the wafer 32. are provided alternately and at equal intervals (pitch) as shown in FIG. 7c. This pitch is the same as the pitch of the housing grooves of the heat treatment sleeves 11, and 50 grooves are provided. Further, the opening/closing operation of the pair of receiving plates 65, 66 is performed by moving in and out a bar 70 inserted between the receiving plates 65, 66, as shown in FIG. The opening/closing cams 72 are moved by respective levers 73 that are driven in contact with the opening/closing cams 72.

This opening and closing is synchronized with the movement of the wafer receiver 58. Further, as shown in FIG. 10, the buffer receiver 14 has an inversion structure that allows the entire wafer to be inverted by 90 degrees. That is, the receiving plates 65 and 66 have guide pieces 74 fixed to their respective ends so as to be perpendicular to each other. The corresponding guide pieces 74 are freely engaged with two guide rods 76 that are linearly and parallel to each other at both ends of the support pieces 75 located between them. therefore,
As the birch 70 moves, the receiving plate 6 comes into contact with the rollers 77 mounted on the guide pieces 74 of one pair and two pairs.
5 and 66 are designed to open and close. Further, each of the support pieces 75 has a support shaft 78 attached to its outer surface. The rotation of the motor 80 is transmitted to one of the support shafts 78 via a group of gears 79 such as bevel gears and spur gears. Note that a half-rotation stopper 81 and a half-rotation detection switch 82 are attached to the support shaft 78. As a result, if it is desired to invert the wafer 32 in the entire buffer receiver, it is sufficient to operate the motor 80 to invert the entire buffer receiver. Further, as shown in FIG. 4, a wafer guide 83 is disposed between the buffer receiver 14 and the table 12.

This wafer guide 83 is made of a rectangular frame, and is fixed to the tip of a shaft 84 extending from the column 15.
When the shaft 84 moves forward, it stops directly below the buffer receiver 14, and when the shaft 84 retreats, it comes out from directly below the buffer receiver 14. Further, guide grooves 85 made of V-shaped grooves are provided in a pair of inner walls of the frame of the wafer guide 83, facing each other in parallel in the vertical direction and spaced at regular intervals. These guide grooves 85 correspond to the pitch of the housing grooves of the cleaning waste odor 10, and 25 guide grooves are provided each. These guide grooves 85
When located directly below the buffer receiver 14, as shown in FIG. It is positioned at the top. In addition, the cleaning jig 10
Guide grooves 69 are provided between the holding grooves 68 located directly above the holding grooves 86 , so that the width of the holding grooves 68 as a whole is equal to the groove width of the holding grooves 86 of the cleaning pick 10 . narrower than Therefore, if the wafer 32 is directly inserted from the cleaning waste odor 10 into the buffer receiver 14 via the wafer receiver 58, the wafer 32 will be trapped in the accommodation groove 86 of the cleaning waste odor 10, The upper end of the wafer 32 may not enter the holding groove 68 where it should be originally accommodated, but may enter the adjacent guide groove 69, and the wafer 32 may break as the wafer receiver 58 rises. Therefore, in order to ensure that the wafer 32 is transferred from the cleaning waste tool 10 to the buffer receiver 14,
As shown in FIG. 8, the groove width of the guide groove 85 of the wafer guide 83 gradually narrows from the bottom to the top.
The lower end is slightly wider than the groove width of the storage groove 86 of the washing upholstery 10, and the upper end is slightly narrower than the groove width of the holding groove 68. Next, referring to FIG. 9, the horizontal inching machine 88 for inching the heat treatment tool 11 by one pitch of the housing groove 87 will be explained.

That is, a mover 89 made of a rectangular frame is disposed at one end edge of the stepped through hole 28 that serves as a guide for the auxiliary plate 29 in the table 12. The mover 89 is guided by guides 90 on both sides and is movable in a direction perpendicular to the wafer 32 housed in the heat treatment pick-up tool 11. Further, an inching disk 91 is attached within the rectangular frame of the mover 89 so that its circumferential surface is brought into contact with the inching disk 91. A shaft 92 is fixed at a position eccentric from the center of this inching disk 91, and this shaft 92 extends downward through the table 12. A connecting shaft 94 having a slit 93 is fixed to the lower end surface of the shaft 92. There is. This slit 93 extends horizontally through the center of the shaft 92. Also,
The table 12 is mounted on wheels 17 along guide rails 16.
from position A shown in FIG. 3 to position B shown in FIG. 12a and position C shown in FIG. 12d.
Move horizontally like this. In the state of position C, a flat dowel 97 attached to the tip of a rotating shaft 96 of an inching motor 95 that protrudes through the support plate 35 from below competes with the slit 93 from the side. It is supposed to be done. When the inching motor 95 fixed to the lower surface of the support plate 35 rotates once, the mover 89
is designed to make one round trip. Therefore, when the inching motor 95 is rotated half a rotation, the mover 89 moves the heat treatment shell 11 mounted on the positioning layer on the auxiliary plate 29 (for example, a positioning pin or the like is provided as a shield on the auxiliary slope). It is designed to push out one pitch. Further, when the sizing motor 95 rotates once and returns to its original position, the mover 89 is removed from the auxiliary plate 29. Next, the wafer transfer operation will be explained based on FIGS. 12a to 12p.

First, as shown in FIG. 12a, the cleaning jig (T) 10 containing the wafer 32 on the table 12 and the empty heat treatment jig (T) which does not accommodate wafers are shorter than the cleaning jig (T) 10 by a distance a. After placing the tool (Q) 11 on the localization layer (in the case of a waste tool for heat treatment, a position close to the mover 89 before inching),
Press the start button (not shown). Then, an optical detection mechanism consisting of a light emitter 30 and a light receiver 31 is activated to detect whether or not a wafer 32 is accommodated in the cleaning pick-up tool 10. If a wafer 32 is accommodated, Start operation. Note that the position of the table in this state is position A. Further, the pitch between the cleaning odor control grooves and the accommodating grooves is, for example, 4.76 yanagi (25 lines). On the other hand, the pitch of the heat treatment bath equipment 11 is exactly half of 2.38 sails, and 50 accommodating grooves are provided. Further, the orientation flats (0.F.) 98 of the wafers 32 accommodated in the cleaning jig 10 are all placed at the bottom. Next, as shown in Figure 12a,
The table 12 is advanced to position B, and the cleaning odor 10 is positioned directly above the wafer receiver 58.

Further, in synchronization with this, the wafer guide 83 is made to protrude between the cleaning waste tool 10 and the buffer receiver 14. Further, in this state, both receiving plates 65 and 66 of the buffer receiving 14 are separated from each other. Therefore, as shown in Figure b, lever 4
7 to raise the wafer receiver 58. The wafer receiver 58 passes through the through hole 27, receives the wafer 32 in the cleaning tool 10 in the receiving groove 59, and rises, and the wafer 32 is accurately and securely held in the buffer receiver 14 through the guide groove 85 of the wafer guide 83. into the groove 68. At this time, although not shown in the same figure, as shown in FIG. 6, the wafer alignment block 601 passes upward through the through hole 27 together with the wafer receiver 58 and rises, and the wafer 32 in the cleaning waste odor chamber 10 is moved up. The bottom part is corrected to stand upright by the alignment groove 61 consisting of a wide V-shaped groove of the wafer alignment block 60, and both the wafer alignment block 60 and the wafer receiver 58 rise in the corrected state. In this state, the bottom (lower end) of the wafer 32 is not in the receiving groove 59 of the wafer receiver 58, but when the stopper 57 of the wafer alignment elevating shaft system 42 comes into contact with the lower surface of the support block 36 and stops rising. The wafer receiver 58 is raised relative to the wafer alignment block 601, and the wafer 32 supported at the bottom of the alignment groove 61 is supported by the receiving groove 59 of the receiver 58. At this time, since the groove width at the upper end of the V-shaped receiving groove 59 is narrower than the groove width at the bottom of the alignment groove 61, the wafer 3 is transferred from the alignment groove 61 to the receiving groove 59.
2 is reliably transferred, and furthermore, because of the narrow groove bottom width of the receiving groove 59, the degree of inclination of the wafer 32 with respect to the vertical line becomes small. Therefore, the green portions on both sides of the wafer 32 are securely inserted into the guide grooves 85 of the wafer guide 83. Further, since the groove width of the guide groove 85 becomes narrower as it goes upward, the wafer 32 is further corrected along the vertical line by the receiving groove 59 and the pair of guide grooves 85. (Hereinafter, the wafer 32 is transferred to the buffer receiver 14 at position B in a similar manner.) On the other hand, as the wafer receiver 58 rises, the jig receiver 62 also rises, but since the picker receiver 62 is larger than the through hole 27, it does not pass through, but comes into contact with the lower surface of the table 12 and stops.

Next, as shown in FIG. 12c, the buffer receiver 14 is closed to hold the wafer 32 between the holding grooves 68, and the wafer receiver 58 is lowered below the table 12.

Further, the wafer guide 83 also moves back and comes off from directly below the buffer receiver 14. Next, as shown in FIG.
and the wafer receiver 58, which is the position C.

Also, during this time, the buffer receiver is reversed 180 degrees, and the wafer 32 is placed at 0. F. position above. In the case of heat treatment waste odor 11, OF. This is done because there is not enough support at the bottom. Next, as shown in Figures e and f, the wafer receiver 58 is raised again. The wafer receiver 58, the wafer alignment block 60, and the odor receiver 62 all rise. At this time, the jig receiver 58 is larger than the space of the auxiliary plate 29 and is 4 mm wider than the auxiliary plate 29, so it supports the auxiliary plate 29 on its upper surface and rises through the through hole 28 of the table 12, and is picked up. At the time when the stopper 56 of the tool thrusting upper shaft system 40 comes into contact with the lower surface of the support block 36, that is, the auxiliary plate 29 has risen by approximately the difference a in the height of the cleaning waste tool 10 and the heat treatment waste tool 11. Stop at the point. This is done in order to more stably transfer the wafer 32 between the buffer receiver and the wafer receiver by bringing the wafer receiver 58 and the buffer receiver 14 closer together. Therefore, when the jig receiver 62 stops, the wafer receiver 58 further rises and prepares to support each wafer 32 between the pair of receiving plates 65 and 66 of the buffer receiver 14. After that, buffer receiver 1
4 is opened, so that the wafer 32 held in the buffer receiver 44 enters the heat treatment tool 11. At this time, every other wafer 32 is inserted into the accommodation groove 87 of the seven heat treatment tools 11. Next, as shown in g in the figure, the wafer receiver 58 etc. descends below the table 12 again, and
As shown, the table 12 is in position B.

Next, in this state or with the table 12 temporarily in position A, the empty cleaning fixture is removed and a new cleaning jig 10 containing the cleaned wafer 32 is placed in a predetermined position on the table 12. (See i in the same figure).

This work may be performed manually or by a loader or unloader (not shown). Next, as shown in the same figure i,
The wafer guide 83 is advanced and positioned directly below the buffer receiver 14, and the wafer receiver 58 is moved forward as shown by i and k in the same figure.
etc., and transfer the wafer 32 in the cleaning waste tool 10 to the buffer receiver 14. Further, the wafer guide 83 is moved backward, the wafer receiver 58 is lowered, and further the wafer guide 83 is moved back.
As shown in , the table 12 is set at position C, the buffer receiver 14 is turned over 180 degrees, and the wafer 32 is placed at 0. F
．． position above. Next, the adjusting machine 88 shown in FIG. 9 is operated, and the mover 89 is moved back and forth once to accurately push out the heat treatment tool 11 by one pitch of the housing groove 87.

As a result, an empty accommodation groove 87 in which no wafer 32 is yet accommodated is located directly below each wafer 32 accommodated in the holding groove 68 of the buffer receiver 14 . Therefore, as a natural result of this, FIG.
As shown in FIG.
The four guide oaks 69 are positioned respectively. Therefore, in this state, as shown in FIG.
8 and the like, and place the wafer 32 in the heat treatment waste tool 11 placed on the wafer receiver 58 into the guide groove 69 of the buffer receiver 14 from below. Even when the buffer receiver 14 is in the closed state, the guide groove 69 is formed deeper than the holding groove 68 and is a long groove that is straight in the vertical (up and down) direction, so the wafer 32 can be smoothly inserted into the guide groove 69. enter. At this time, each wafer 32 in the buffer receiver 14 comes to relatively fit between each wafer 32 in the heat treatment waste tool 11. Next, as shown by m in the same figure, the pair of receiving plates 65 and 66 of the buffer receiver 14 are separated to be in an open state.

Then, the wafers 32 that have been held between the holding grooves 68 of the buffer receiver 14 bite into the receiving grooves 59 every other heat treatment waste 11 and are supported. Therefore, the same figure o
As shown in , the wafer receiver 58 descends below the table 12 and stops, preparing for the next wafer transfer operation, and
The auxiliary plate 29 descends onto the table 12 and is placed on the table 12.
The heat treatment jig 12 containing the 5th female wafer 32 loaded via the table 12 is placed in the position B as shown in FIG. With wafer 12 located at position A, it is removed manually or by an unloader (not shown), and one wafer transfer operation is completed.

Therefore, when integrating wafers continuously, place a new empty heat treatment waste and cleaning jig containing wafers on the table, and then automatically integrate the wafers according to the above-mentioned procedure. Carry out moving work. In the examples, two types of heat treatment waste tools are used for convenience, but there is no particular meaning. Further, regarding the transfer operation, the explanation has been given regarding the transfer from a cleaning jig that accommodates a small number of wafers to a heat treatment waste tool that accommodates a large number of wafers, but the reverse is also possible.

According to this embodiment, the wafers can be automatically transferred between the cleaning fixture and the heat treatment pick-up fixture, which have different wafer accommodation pitches, resulting in extremely improved workability.

Further, according to this embodiment, since a wafer alignment block, a wafer guide, etc. are used when transferring the wafers, the wafers are transferred accurately and reliably from one groove etc. to the other groove etc., so there is no possibility of work errors. There is almost no damage to the wafer.

Therefore, the yield of wafer transfer is improved. Note that the present invention is not limited to the above embodiments.

In other words, the pitch difference between two different storage jigs only needs to be an integral multiple of the pitch of one of them.In this case, if one of the storage jigs can be moved several pitches at a time, It becomes possible to mutually transfer several wafers stored in one storage pick-up tool to the other. in this case,
It is also necessary to change the arrangement of the guide grooves and holding grooves of the buffer receiver. Further, in the embodiment, a structure is adopted in which the auxiliary plate supporting the heat treatment jig is moved in order to move the heat treatment jig in increments, but a structure in which the entire table is moved in increments may be adopted.

Furthermore, the two types of accommodation jigs may not be moved in increments, but instead the buffer receivers may be moved in increments. Furthermore, the article transfer apparatus of the present invention can be applied to transfer of plates similar to wafers, and has excellent versatility.

As described above, according to the article transfer device of the present invention, it is possible to automatically transfer stored items between storage pick-ups with different pitches of storage grooves, thereby improving the efficiency of the transfer operation and ensuring accurate Since reliable transfer is possible, there is no damage to the objects to be stored, etc., and there are many effects such as improving the operating rate of the device.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a conventional cleaning deodorizer, Figure 2a
- h are explanatory diagrams of the operation of the article transfer device proposed by the present applicant, and FIGS. 3 to 11 are drawings showing an embodiment of the article transfer device of the present invention, and FIG. 3 is an external view. , Fig. 4 is a mechanism diagram, Fig. 5 is a diagram of the table drive mechanism, Fig. 6 is a perspective view showing the vertical transfer mechanism, and Figs. 7 a to c are two sectional views showing the wafer ball holding state of the holding mechanism. FIG. 8 is a partial perspective view showing the relationship between the cleaning waste odor storage groove, guide groove, and shark holder side of the clamping mechanism. FIG. 10 is a perspective view showing the side, FIG. 10 is a perspective view of the holding mechanism, and FIG. 11 is an explanatory view showing the position detection mechanism of the table. Further, FIGS. 12a to 12p are explanatory diagrams of the operation of the embodiment. 1...Taffle, 2,3...Through hole, 4...Washing odor, 5...Quartz jig, 6...・Wafer, 6a...Orientation flat, 7...Wafer receiver, 8...Buffer gauge, 9...Wafer guide plate, 10...Cleaning pick-up, 11...For heat treatment Disposal tool, 12... layering table (table), 13... machine stand, 14...
Buffer receiver, 15... Column, 16... Guide rail, 17... Wheel, 18... Motor, 19, 20...
Pulley, 21…. ...Belt, 22, 23, 24...Optoelectronic switch, 25...Light source, 26...
・Mihu, 27, 28... Through hole, 29... Auxiliary plate, 30... Light emitter, 31... Light receiver, 32... Wafer, 33... ... Vertical transfer mechanism, 35 ... Support plate, 36 ... Support block, 37 ... 0 sliding shaft, 38 ... Block, 39 ......First connecting piece, 40...
Sleeve tool projection shaft system, 41...Second connecting piece, 42...
...Elevating shaft system for wafer alignment, 43...Third connecting piece,
44... Lifting shaft system for lifting and lowering wafer, 45...
Guide piece, 46... Contact piece, 47... Lever, 48... Roller, 49... Pin, 50... Support piece, 51... Cam follower, 52... ...End cam, 53-55...Tension coil spring, 56, 57...
...stopper, 58...wafer receiver, 59...receiving groove, 6
0...Wafer alignment block, 61...Alignment groove, 62...Longer support, 63...Positioning protrusion, 64...Nipper standby side, 65, 66...
...Support plate, 67... Support protrusion, 68...
Holding groove, 69... Guide groove, 70... Fusuma, 71
... Guide rod, 72 ... Opening/closing cam, 73 ... Lever, 74 ... Guide piece, 75 ... Branch piece, 76 ... Guide bar, 77 ...Roller, 78...Spindle, 79...Gear head, 80
...Motor, 81 ... Half rotation stopper, 8
2...Half rotation detection switch, 83...
Wafer guide, 84... Shaft, 85... Guide groove, 86, 87... Housing groove, 88... Dimension machine side, 89... Mover, 90... ·guide,
91... Inching disk, 92... Shaft, 93... Slit, 94... Connection track,
95... Inching motor, 96... Rotating shaft,
97... Sameko, 98... Orientation flat (0.F.). Figure 1 Figure 2 Figure 2 Figure 3 Figure 5 Figure 4 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 Figure 12

Claims (1)

[Scope of Claims] 1. First and second storage jigs installed substantially in parallel and having a plurality of storage grooves for storing a plurality of plate-like objects;
and a plate-like object holding mechanism located on a second storage jig for transferring the plurality of plate-like objects housed in the first storage jig to the second storage jig in one go. and the above first and second
A plate-like object transfer device having a horizontal position adjustment mechanism for adjusting the horizontal positional relationship between the first storage jig and the plate-like object holding mechanism, The accommodation groove pitch is configured to be an integral multiple of the accommodation groove pitch of the second accommodation jig, and the plate-shaped object holding mechanism and the second accommodation jig are configured to have a plurality of accommodation groove pitches accommodated in the second accommodation jig. 1. A transfer device for plate-like objects, characterized in that the device is capable of relatively moving in the direction in which the plate-like objects are arranged. 2. The device for transferring plate-like objects according to claim 1, wherein the clamping mechanism is capable of holding a plurality of plate-like objects of different pitches. 3. The plate-shaped object transfer device according to claim 2, wherein the clamping mechanism has a housing groove corresponding to the smallest pitch.