JPWO2025229727A5 - - Google Patents

Info

Publication number
JPWO2025229727A5
JPWO2025229727A5 JP2025518582A JP2025518582A JPWO2025229727A5 JP WO2025229727 A5 JPWO2025229727 A5 JP WO2025229727A5 JP 2025518582 A JP2025518582 A JP 2025518582A JP 2025518582 A JP2025518582 A JP 2025518582A JP WO2025229727 A5 JPWO2025229727 A5 JP WO2025229727A5
Authority
JP
Japan
Prior art keywords
workpiece
laser
laser beam
irradiation
irradiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025518582A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025229727A1 (enExample
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/016717 external-priority patent/WO2025229727A1/ja
Publication of JPWO2025229727A1 publication Critical patent/JPWO2025229727A1/ja
Publication of JPWO2025229727A5 publication Critical patent/JPWO2025229727A5/ja
Pending legal-status Critical Current

Links

JP2025518582A 2024-04-30 2024-04-30 Pending JPWO2025229727A1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2024/016717 WO2025229727A1 (ja) 2024-04-30 2024-04-30 レーザ加工装置およびレーザ加工方法

Publications (2)

Publication Number Publication Date
JPWO2025229727A1 JPWO2025229727A1 (enExample) 2025-11-06
JPWO2025229727A5 true JPWO2025229727A5 (enExample) 2026-04-07

Family

ID=97561492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025518582A Pending JPWO2025229727A1 (enExample) 2024-04-30 2024-04-30

Country Status (3)

Country Link
JP (1) JPWO2025229727A1 (enExample)
TW (1) TW202543772A (enExample)
WO (1) WO2025229727A1 (enExample)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5639191A (en) * 1979-09-10 1981-04-14 Hitachi Ltd Laser processing method
WO2005032757A1 (en) * 2003-09-30 2005-04-14 Matsushita Electric Industrial Co. Ltd. Mold for optical components
JP4976576B2 (ja) * 2010-11-01 2012-07-18 住友電気工業株式会社 切削工具とその製造方法および製造装置
JP5861494B2 (ja) * 2012-02-23 2016-02-16 三菱マテリアル株式会社 レーザ加工装置およびレーザ加工方法
JP5983364B2 (ja) * 2012-12-04 2016-08-31 三菱マテリアル株式会社 エンドミル
JP2014113606A (ja) * 2012-12-07 2014-06-26 Sharp Corp レーザ加工装置およびレーザ加工方法
WO2022070402A1 (ja) * 2020-10-02 2022-04-07 住友電工ハードメタル株式会社 立方晶窒化硼素焼結体工具

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