TW202543772A - 雷射加工裝置及雷射加工方法 - Google Patents

雷射加工裝置及雷射加工方法

Info

Publication number
TW202543772A
TW202543772A TW114105170A TW114105170A TW202543772A TW 202543772 A TW202543772 A TW 202543772A TW 114105170 A TW114105170 A TW 114105170A TW 114105170 A TW114105170 A TW 114105170A TW 202543772 A TW202543772 A TW 202543772A
Authority
TW
Taiwan
Prior art keywords
aforementioned
laser
laser light
workpiece
processing object
Prior art date
Application number
TW114105170A
Other languages
English (en)
Chinese (zh)
Inventor
友田裕士
原田岳
Original Assignee
日商住友電工硬質合金股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電工硬質合金股份有限公司 filed Critical 日商住友電工硬質合金股份有限公司
Publication of TW202543772A publication Critical patent/TW202543772A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW114105170A 2024-04-30 2025-02-12 雷射加工裝置及雷射加工方法 TW202543772A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2024/016717 WO2025229727A1 (ja) 2024-04-30 2024-04-30 レーザ加工装置およびレーザ加工方法
WOPCT/JP2024/016717 2024-04-30

Publications (1)

Publication Number Publication Date
TW202543772A true TW202543772A (zh) 2025-11-16

Family

ID=97561492

Family Applications (1)

Application Number Title Priority Date Filing Date
TW114105170A TW202543772A (zh) 2024-04-30 2025-02-12 雷射加工裝置及雷射加工方法

Country Status (3)

Country Link
JP (1) JPWO2025229727A1 (enExample)
TW (1) TW202543772A (enExample)
WO (1) WO2025229727A1 (enExample)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5639191A (en) * 1979-09-10 1981-04-14 Hitachi Ltd Laser processing method
WO2005032757A1 (en) * 2003-09-30 2005-04-14 Matsushita Electric Industrial Co. Ltd. Mold for optical components
JP4976576B2 (ja) * 2010-11-01 2012-07-18 住友電気工業株式会社 切削工具とその製造方法および製造装置
JP5861494B2 (ja) * 2012-02-23 2016-02-16 三菱マテリアル株式会社 レーザ加工装置およびレーザ加工方法
JP5983364B2 (ja) * 2012-12-04 2016-08-31 三菱マテリアル株式会社 エンドミル
JP2014113606A (ja) * 2012-12-07 2014-06-26 Sharp Corp レーザ加工装置およびレーザ加工方法
WO2022070402A1 (ja) * 2020-10-02 2022-04-07 住友電工ハードメタル株式会社 立方晶窒化硼素焼結体工具

Also Published As

Publication number Publication date
JPWO2025229727A1 (enExample) 2025-11-06
WO2025229727A1 (ja) 2025-11-06

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