JPWO2025220065A1 - - Google Patents

Info

Publication number
JPWO2025220065A1
JPWO2025220065A1 JP2026505665A JP2026505665A JPWO2025220065A1 JP WO2025220065 A1 JPWO2025220065 A1 JP WO2025220065A1 JP 2026505665 A JP2026505665 A JP 2026505665A JP 2026505665 A JP2026505665 A JP 2026505665A JP WO2025220065 A1 JPWO2025220065 A1 JP WO2025220065A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2026505665A
Other languages
Japanese (ja)
Other versions
JPWO2025220065A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025220065A1 publication Critical patent/JPWO2025220065A1/ja
Publication of JPWO2025220065A5 publication Critical patent/JPWO2025220065A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
JP2026505665A 2024-04-15 2024-04-15 Pending JPWO2025220065A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2024/014961 WO2025220065A1 (ja) 2024-04-15 2024-04-15 ウエハ載置台

Publications (2)

Publication Number Publication Date
JPWO2025220065A1 true JPWO2025220065A1 (https=) 2025-10-23
JPWO2025220065A5 JPWO2025220065A5 (https=) 2026-04-14

Family

ID=97403192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2026505665A Pending JPWO2025220065A1 (https=) 2024-04-15 2024-04-15

Country Status (2)

Country Link
JP (1) JPWO2025220065A1 (https=)
WO (1) WO2025220065A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023044634A (ja) * 2021-09-17 2023-03-30 東京エレクトロン株式会社 プラズマ処理装置
WO2023074475A1 (ja) * 2021-10-28 2023-05-04 東京エレクトロン株式会社 プラズマ処理装置及び静電チャック
WO2023095707A1 (ja) * 2021-11-26 2023-06-01 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP7300069B2 (ja) * 2020-08-21 2023-06-28 日本特殊陶業株式会社 接合体、保持装置、および、静電チャック
JP2023101194A (ja) * 2022-01-07 2023-07-20 日本碍子株式会社 半導体製造装置用部材
WO2023153021A1 (ja) * 2022-02-09 2023-08-17 日本碍子株式会社 半導体製造装置用部材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7130359B2 (ja) * 2016-12-05 2022-09-05 東京エレクトロン株式会社 プラズマ処理装置
JP7002357B2 (ja) * 2018-02-06 2022-01-20 株式会社日立ハイテク プラズマ処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7300069B2 (ja) * 2020-08-21 2023-06-28 日本特殊陶業株式会社 接合体、保持装置、および、静電チャック
JP2023044634A (ja) * 2021-09-17 2023-03-30 東京エレクトロン株式会社 プラズマ処理装置
WO2023074475A1 (ja) * 2021-10-28 2023-05-04 東京エレクトロン株式会社 プラズマ処理装置及び静電チャック
WO2023095707A1 (ja) * 2021-11-26 2023-06-01 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP2023101194A (ja) * 2022-01-07 2023-07-20 日本碍子株式会社 半導体製造装置用部材
WO2023153021A1 (ja) * 2022-02-09 2023-08-17 日本碍子株式会社 半導体製造装置用部材

Also Published As

Publication number Publication date
WO2025220065A1 (ja) 2025-10-23

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