JPWO2025220065A1 - - Google Patents
Info
- Publication number
- JPWO2025220065A1 JPWO2025220065A1 JP2026505665A JP2026505665A JPWO2025220065A1 JP WO2025220065 A1 JPWO2025220065 A1 JP WO2025220065A1 JP 2026505665 A JP2026505665 A JP 2026505665A JP 2026505665 A JP2026505665 A JP 2026505665A JP WO2025220065 A1 JPWO2025220065 A1 JP WO2025220065A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2024/014961 WO2025220065A1 (ja) | 2024-04-15 | 2024-04-15 | ウエハ載置台 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025220065A1 true JPWO2025220065A1 (https=) | 2025-10-23 |
| JPWO2025220065A5 JPWO2025220065A5 (https=) | 2026-04-14 |
Family
ID=97403192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026505665A Pending JPWO2025220065A1 (https=) | 2024-04-15 | 2024-04-15 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025220065A1 (https=) |
| WO (1) | WO2025220065A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023044634A (ja) * | 2021-09-17 | 2023-03-30 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| WO2023074475A1 (ja) * | 2021-10-28 | 2023-05-04 | 東京エレクトロン株式会社 | プラズマ処理装置及び静電チャック |
| WO2023095707A1 (ja) * | 2021-11-26 | 2023-06-01 | 東京エレクトロン株式会社 | 静電チャック及びプラズマ処理装置 |
| JP7300069B2 (ja) * | 2020-08-21 | 2023-06-28 | 日本特殊陶業株式会社 | 接合体、保持装置、および、静電チャック |
| JP2023101194A (ja) * | 2022-01-07 | 2023-07-20 | 日本碍子株式会社 | 半導体製造装置用部材 |
| WO2023153021A1 (ja) * | 2022-02-09 | 2023-08-17 | 日本碍子株式会社 | 半導体製造装置用部材 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7130359B2 (ja) * | 2016-12-05 | 2022-09-05 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7002357B2 (ja) * | 2018-02-06 | 2022-01-20 | 株式会社日立ハイテク | プラズマ処理装置 |
-
2024
- 2024-04-15 WO PCT/JP2024/014961 patent/WO2025220065A1/ja active Pending
- 2024-04-15 JP JP2026505665A patent/JPWO2025220065A1/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7300069B2 (ja) * | 2020-08-21 | 2023-06-28 | 日本特殊陶業株式会社 | 接合体、保持装置、および、静電チャック |
| JP2023044634A (ja) * | 2021-09-17 | 2023-03-30 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| WO2023074475A1 (ja) * | 2021-10-28 | 2023-05-04 | 東京エレクトロン株式会社 | プラズマ処理装置及び静電チャック |
| WO2023095707A1 (ja) * | 2021-11-26 | 2023-06-01 | 東京エレクトロン株式会社 | 静電チャック及びプラズマ処理装置 |
| JP2023101194A (ja) * | 2022-01-07 | 2023-07-20 | 日本碍子株式会社 | 半導体製造装置用部材 |
| WO2023153021A1 (ja) * | 2022-02-09 | 2023-08-17 | 日本碍子株式会社 | 半導体製造装置用部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025220065A1 (ja) | 2025-10-23 |
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