JPWO2025220060A1 - - Google Patents
Info
- Publication number
- JPWO2025220060A1 JPWO2025220060A1 JP2025552164A JP2025552164A JPWO2025220060A1 JP WO2025220060 A1 JPWO2025220060 A1 JP WO2025220060A1 JP 2025552164 A JP2025552164 A JP 2025552164A JP 2025552164 A JP2025552164 A JP 2025552164A JP WO2025220060 A1 JPWO2025220060 A1 JP WO2025220060A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2024/014923 WO2025220060A1 (ja) | 2024-04-15 | 2024-04-15 | ウエハ載置台 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025220060A1 true JPWO2025220060A1 (https=) | 2025-10-23 |
| JP7809252B1 JP7809252B1 (ja) | 2026-01-30 |
| JPWO2025220060A5 JPWO2025220060A5 (https=) | 2026-03-25 |
Family
ID=97403145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025552164A Active JP7809252B1 (ja) | 2024-04-15 | 2024-04-15 | ウエハ載置台 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7809252B1 (https=) |
| KR (1) | KR20260027328A (https=) |
| WO (1) | WO2025220060A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7002357B2 (ja) * | 2018-02-06 | 2022-01-20 | 株式会社日立ハイテク | プラズマ処理装置 |
| JP2023044634A (ja) * | 2021-09-17 | 2023-03-30 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| TW202326801A (zh) * | 2021-11-26 | 2023-07-01 | 日商東京威力科創股份有限公司 | 靜電吸盤及電漿處理裝置 |
| JP7569342B2 (ja) * | 2022-01-21 | 2024-10-17 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP2023131599A (ja) * | 2022-03-09 | 2023-09-22 | 東京エレクトロン株式会社 | 基板載置台、基板処理装置、及び基板載置台の製造方法 |
-
2024
- 2024-04-15 JP JP2025552164A patent/JP7809252B1/ja active Active
- 2024-04-15 WO PCT/JP2024/014923 patent/WO2025220060A1/ja active Pending
- 2024-04-15 KR KR1020267002627A patent/KR20260027328A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7809252B1 (ja) | 2026-01-30 |
| WO2025220060A1 (ja) | 2025-10-23 |
| KR20260027328A (ko) | 2026-02-27 |
Similar Documents
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