JP7809252B1 - ウエハ載置台 - Google Patents

ウエハ載置台

Info

Publication number
JP7809252B1
JP7809252B1 JP2025552164A JP2025552164A JP7809252B1 JP 7809252 B1 JP7809252 B1 JP 7809252B1 JP 2025552164 A JP2025552164 A JP 2025552164A JP 2025552164 A JP2025552164 A JP 2025552164A JP 7809252 B1 JP7809252 B1 JP 7809252B1
Authority
JP
Japan
Prior art keywords
gas passage
ceramic plate
gas
wafer mounting
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025552164A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025220060A5 (https=
JPWO2025220060A1 (https=
Inventor
達也 久野
靖也 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2025220060A1 publication Critical patent/JPWO2025220060A1/ja
Application granted granted Critical
Publication of JP7809252B1 publication Critical patent/JP7809252B1/ja
Publication of JPWO2025220060A5 publication Critical patent/JPWO2025220060A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2025552164A 2024-04-15 2024-04-15 ウエハ載置台 Active JP7809252B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2024/014923 WO2025220060A1 (ja) 2024-04-15 2024-04-15 ウエハ載置台

Publications (3)

Publication Number Publication Date
JPWO2025220060A1 JPWO2025220060A1 (https=) 2025-10-23
JP7809252B1 true JP7809252B1 (ja) 2026-01-30
JPWO2025220060A5 JPWO2025220060A5 (https=) 2026-03-25

Family

ID=97403145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025552164A Active JP7809252B1 (ja) 2024-04-15 2024-04-15 ウエハ載置台

Country Status (3)

Country Link
JP (1) JP7809252B1 (https=)
KR (1) KR20260027328A (https=)
WO (1) WO2025220060A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140155A (ja) * 2018-02-06 2019-08-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP2023044634A (ja) * 2021-09-17 2023-03-30 東京エレクトロン株式会社 プラズマ処理装置
WO2023095707A1 (ja) * 2021-11-26 2023-06-01 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP2023106928A (ja) * 2022-01-21 2023-08-02 日本碍子株式会社 半導体製造装置用部材
JP2023131599A (ja) * 2022-03-09 2023-09-22 東京エレクトロン株式会社 基板載置台、基板処理装置、及び基板載置台の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140155A (ja) * 2018-02-06 2019-08-22 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP2023044634A (ja) * 2021-09-17 2023-03-30 東京エレクトロン株式会社 プラズマ処理装置
WO2023095707A1 (ja) * 2021-11-26 2023-06-01 東京エレクトロン株式会社 静電チャック及びプラズマ処理装置
JP2023106928A (ja) * 2022-01-21 2023-08-02 日本碍子株式会社 半導体製造装置用部材
JP2023131599A (ja) * 2022-03-09 2023-09-22 東京エレクトロン株式会社 基板載置台、基板処理装置、及び基板載置台の製造方法

Also Published As

Publication number Publication date
WO2025220060A1 (ja) 2025-10-23
JPWO2025220060A1 (https=) 2025-10-23
KR20260027328A (ko) 2026-02-27

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