JPWO2025120767A1 - - Google Patents
Info
- Publication number
- JPWO2025120767A1 JPWO2025120767A1 JP2024556215A JP2024556215A JPWO2025120767A1 JP WO2025120767 A1 JPWO2025120767 A1 JP WO2025120767A1 JP 2024556215 A JP2024556215 A JP 2024556215A JP 2024556215 A JP2024556215 A JP 2024556215A JP WO2025120767 A1 JPWO2025120767 A1 JP WO2025120767A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/043646 WO2025120767A1 (ja) | 2023-12-06 | 2023-12-06 | セラミックサセプタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025120767A1 true JPWO2025120767A1 (https=) | 2025-06-12 |
| JPWO2025120767A5 JPWO2025120767A5 (https=) | 2025-11-05 |
| JP7812936B2 JP7812936B2 (ja) | 2026-02-10 |
Family
ID=95939819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024556215A Active JP7812936B2 (ja) | 2023-12-06 | 2023-12-06 | セラミックサセプタ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250193971A1 (https=) |
| JP (1) | JP7812936B2 (https=) |
| TW (1) | TW202538958A (https=) |
| WO (1) | WO2025120767A1 (https=) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008028354A (ja) * | 2006-07-20 | 2008-02-07 | Applied Materials Inc | 急速温度勾配コントロールによる基板処理 |
| JP2009009795A (ja) * | 2007-06-27 | 2009-01-15 | Taiheiyo Cement Corp | セラミックスヒーター |
| JP2010109346A (ja) * | 2008-03-11 | 2010-05-13 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
| JP2014511572A (ja) * | 2011-02-23 | 2014-05-15 | アプライド マテリアルズ インコーポレイテッド | マルチゾーンペデスタルヒータ用の方法および装置 |
| JP2016189425A (ja) * | 2015-03-30 | 2016-11-04 | 日本特殊陶業株式会社 | セラミックヒータ及びその制御方法、並びに、静電チャック及びその制御方法 |
| JP2018536287A (ja) * | 2015-11-17 | 2018-12-06 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 堆積された表面フィーチャを有する基板支持アセンブリ |
| JP2022014775A (ja) * | 2020-07-07 | 2022-01-20 | 新光電気工業株式会社 | セラミックス構造体、静電チャック、基板固定装置 |
| JP2022023629A (ja) * | 2020-07-27 | 2022-02-08 | 日本特殊陶業株式会社 | 保持装置 |
| JP2023149343A (ja) * | 2022-03-31 | 2023-10-13 | 日本特殊陶業株式会社 | 電極埋設部材、および基板保持部材 |
-
2023
- 2023-12-06 WO PCT/JP2023/043646 patent/WO2025120767A1/ja active Pending
- 2023-12-06 JP JP2024556215A patent/JP7812936B2/ja active Active
-
2024
- 2024-09-13 TW TW113134798A patent/TW202538958A/zh unknown
- 2024-10-03 US US18/905,235 patent/US20250193971A1/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008028354A (ja) * | 2006-07-20 | 2008-02-07 | Applied Materials Inc | 急速温度勾配コントロールによる基板処理 |
| JP2009009795A (ja) * | 2007-06-27 | 2009-01-15 | Taiheiyo Cement Corp | セラミックスヒーター |
| JP2010109346A (ja) * | 2008-03-11 | 2010-05-13 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
| JP2014511572A (ja) * | 2011-02-23 | 2014-05-15 | アプライド マテリアルズ インコーポレイテッド | マルチゾーンペデスタルヒータ用の方法および装置 |
| JP2016189425A (ja) * | 2015-03-30 | 2016-11-04 | 日本特殊陶業株式会社 | セラミックヒータ及びその制御方法、並びに、静電チャック及びその制御方法 |
| JP2018536287A (ja) * | 2015-11-17 | 2018-12-06 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 堆積された表面フィーチャを有する基板支持アセンブリ |
| JP2022014775A (ja) * | 2020-07-07 | 2022-01-20 | 新光電気工業株式会社 | セラミックス構造体、静電チャック、基板固定装置 |
| JP2022023629A (ja) * | 2020-07-27 | 2022-02-08 | 日本特殊陶業株式会社 | 保持装置 |
| JP2023149343A (ja) * | 2022-03-31 | 2023-10-13 | 日本特殊陶業株式会社 | 電極埋設部材、および基板保持部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202538958A (zh) | 2025-10-01 |
| WO2025120767A1 (ja) | 2025-06-12 |
| US20250193971A1 (en) | 2025-06-12 |
| JP7812936B2 (ja) | 2026-02-10 |
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