JPWO2025100182A5 - - Google Patents

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Publication number
JPWO2025100182A5
JPWO2025100182A5 JP2025519052A JP2025519052A JPWO2025100182A5 JP WO2025100182 A5 JPWO2025100182 A5 JP WO2025100182A5 JP 2025519052 A JP2025519052 A JP 2025519052A JP 2025519052 A JP2025519052 A JP 2025519052A JP WO2025100182 A5 JPWO2025100182 A5 JP WO2025100182A5
Authority
JP
Japan
Prior art keywords
measuring device
manufacturing
resin
plating layer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025519052A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025100182A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/036903 external-priority patent/WO2025100182A1/ja
Publication of JPWO2025100182A1 publication Critical patent/JPWO2025100182A1/ja
Publication of JPWO2025100182A5 publication Critical patent/JPWO2025100182A5/ja
Pending legal-status Critical Current

Links

JP2025519052A 2023-11-06 2024-10-16 Pending JPWO2025100182A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023189468 2023-11-06
PCT/JP2024/036903 WO2025100182A1 (ja) 2023-11-06 2024-10-16 測定装置の製造方法及びロボットアーム

Publications (2)

Publication Number Publication Date
JPWO2025100182A1 JPWO2025100182A1 (https=) 2025-05-15
JPWO2025100182A5 true JPWO2025100182A5 (https=) 2026-02-03

Family

ID=95695829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025519052A Pending JPWO2025100182A1 (https=) 2023-11-06 2024-10-16

Country Status (3)

Country Link
JP (1) JPWO2025100182A1 (https=)
CN (1) CN121752879A (https=)
WO (1) WO2025100182A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0736444B2 (ja) * 1986-12-19 1995-04-19 工業技術院長 触覚センサ
JP2004117172A (ja) * 2002-09-26 2004-04-15 Kyocera Corp 圧力検出装置用パッケージ
JP4364146B2 (ja) * 2005-03-10 2009-11-11 株式会社東芝 触覚センサー
JP5470533B2 (ja) * 2010-02-18 2014-04-16 株式会社国際電気通信基礎技術研究所 触覚センサおよびそれを備えたロボット
JP2014024947A (ja) * 2012-07-26 2014-02-06 Dic Corp ポリアリーレンスルフィド樹脂組成物および成形体
US9149933B2 (en) * 2013-02-07 2015-10-06 GM Global Technology Operations LLC Grasp assist device with shared tendon actuator assembly
JP2019111590A (ja) * 2017-12-21 2019-07-11 日本精工株式会社 把持装置
JP7099908B2 (ja) * 2018-08-30 2022-07-12 トヨタ自動車株式会社 センサシステム、ロボットハンド、センサシステムの較正方法、およびプログラム
JP2021113308A (ja) * 2020-01-20 2021-08-05 ユニチカ株式会社 熱伝導性樹脂組成物およびそれからなる成形体

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