JPWO2025094349A1 - - Google Patents
Info
- Publication number
- JPWO2025094349A1 JPWO2025094349A1 JP2025554447A JP2025554447A JPWO2025094349A1 JP WO2025094349 A1 JPWO2025094349 A1 JP WO2025094349A1 JP 2025554447 A JP2025554447 A JP 2025554447A JP 2025554447 A JP2025554447 A JP 2025554447A JP WO2025094349 A1 JPWO2025094349 A1 JP WO2025094349A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07232—Compression bonding, e.g. thermocompression bonding
- H10W72/07233—Ultrasonic bonding, e.g. thermosonic bonding
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/039583 WO2025094349A1 (ja) | 2023-11-02 | 2023-11-02 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025094349A1 true JPWO2025094349A1 (https=) | 2025-05-08 |
| JPWO2025094349A5 JPWO2025094349A5 (https=) | 2026-03-06 |
Family
ID=95582573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025554447A Pending JPWO2025094349A1 (https=) | 2023-11-02 | 2023-11-02 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025094349A1 (https=) |
| WO (1) | WO2025094349A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4004715B2 (ja) * | 2000-05-31 | 2007-11-07 | 三菱電機株式会社 | パワーモジュール |
| JP2002359334A (ja) * | 2001-05-31 | 2002-12-13 | Toyota Industries Corp | 半導体装置の端子構造 |
| DE102005031836B4 (de) * | 2005-07-06 | 2007-11-22 | Infineon Technologies Ag | Halbleiterleistungsmodul mit SiC-Leistungsdioden und Verfahren zur Herstellung desselben |
| JP4570092B2 (ja) * | 2005-07-19 | 2010-10-27 | ニチコン株式会社 | 半導体モジュール |
| CN102859671A (zh) * | 2010-12-03 | 2013-01-02 | 富士电机株式会社 | 半导体器件以及半导体器件的制造方法 |
| JP6381489B2 (ja) * | 2015-07-02 | 2018-08-29 | 三菱電機株式会社 | 半導体装置の製造方法 |
| JP6621714B2 (ja) * | 2016-07-01 | 2019-12-18 | 三菱電機株式会社 | 半導体装置 |
| DE112016007133B4 (de) * | 2016-08-10 | 2021-08-12 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
| JP6952503B2 (ja) * | 2017-06-07 | 2021-10-20 | 三菱電機株式会社 | 半導体装置の製造方法 |
| JP7209615B2 (ja) * | 2019-11-13 | 2023-01-20 | 三菱電機株式会社 | 半導体装置 |
-
2023
- 2023-11-02 WO PCT/JP2023/039583 patent/WO2025094349A1/ja active Pending
- 2023-11-02 JP JP2025554447A patent/JPWO2025094349A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025094349A1 (ja) | 2025-05-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251203 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251203 |