JPWO2025028301A1 - - Google Patents
Info
- Publication number
- JPWO2025028301A1 JPWO2025028301A1 JP2025537843A JP2025537843A JPWO2025028301A1 JP WO2025028301 A1 JPWO2025028301 A1 JP WO2025028301A1 JP 2025537843 A JP2025537843 A JP 2025537843A JP 2025537843 A JP2025537843 A JP 2025537843A JP WO2025028301 A1 JPWO2025028301 A1 JP WO2025028301A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023126146 | 2023-08-02 | ||
| PCT/JP2024/025935 WO2025028301A1 (ja) | 2023-08-02 | 2024-07-19 | エッチング方法及びプラズマ処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025028301A1 true JPWO2025028301A1 (https=) | 2025-02-06 |
Family
ID=94395213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025537843A Pending JPWO2025028301A1 (https=) | 2023-08-02 | 2024-07-19 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025028301A1 (https=) |
| KR (1) | KR20260045816A (https=) |
| CN (1) | CN121549087A (https=) |
| TW (1) | TW202520375A (https=) |
| WO (1) | WO2025028301A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2950785B2 (ja) * | 1996-12-09 | 1999-09-20 | セントラル硝子株式会社 | 酸化膜のドライエッチング方法 |
| JPWO2021117534A1 (https=) * | 2019-12-12 | 2021-06-17 | ||
| US20220165578A1 (en) * | 2020-11-25 | 2022-05-26 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
| JP2022170130A (ja) * | 2021-04-28 | 2022-11-10 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置及びエッチング方法 |
| JP7767024B2 (ja) * | 2021-05-07 | 2025-11-11 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
-
2024
- 2024-07-19 JP JP2025537843A patent/JPWO2025028301A1/ja active Pending
- 2024-07-19 KR KR1020267005049A patent/KR20260045816A/ko active Pending
- 2024-07-19 WO PCT/JP2024/025935 patent/WO2025028301A1/ja active Pending
- 2024-07-19 CN CN202480047888.6A patent/CN121549087A/zh active Pending
- 2024-07-22 TW TW113127299A patent/TW202520375A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202520375A (zh) | 2025-05-16 |
| WO2025028301A1 (ja) | 2025-02-06 |
| KR20260045816A (ko) | 2026-04-03 |
| CN121549087A (zh) | 2026-02-17 |