JPWO2024247461A1 - - Google Patents

Info

Publication number
JPWO2024247461A1
JPWO2024247461A1 JP2025523297A JP2025523297A JPWO2024247461A1 JP WO2024247461 A1 JPWO2024247461 A1 JP WO2024247461A1 JP 2025523297 A JP2025523297 A JP 2025523297A JP 2025523297 A JP2025523297 A JP 2025523297A JP WO2024247461 A1 JPWO2024247461 A1 JP WO2024247461A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025523297A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024247461A1 publication Critical patent/JPWO2024247461A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Surface Treatment Of Glass (AREA)
  • Catalysts (AREA)
JP2025523297A 2023-05-31 2024-03-26 Pending JPWO2024247461A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023089319 2023-05-31
PCT/JP2024/012084 WO2024247461A1 (ja) 2023-05-31 2024-03-26 凹部構造を有する部材を製造する方法および凹部構造を有する部材

Publications (1)

Publication Number Publication Date
JPWO2024247461A1 true JPWO2024247461A1 (https=) 2024-12-05

Family

ID=93657139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025523297A Pending JPWO2024247461A1 (https=) 2023-05-31 2024-03-26

Country Status (5)

Country Link
US (1) US20260063997A1 (https=)
JP (1) JPWO2024247461A1 (https=)
CN (1) CN121219816A (https=)
TW (1) TW202514768A (https=)
WO (1) WO2024247461A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1539700A (en) * 1976-05-14 1979-01-31 Int Plasma Corp Process for etching sio2
JPS5587436A (en) * 1978-12-25 1980-07-02 Fujitsu Ltd Method of producing semiconductor device
JP3704965B2 (ja) * 1998-08-12 2005-10-12 セイコーエプソン株式会社 ドライエッチング方法及び装置
TW200620451A (en) * 2004-11-09 2006-06-16 Univ Osaka Method for forming hole in crystal substrate, and crystal substrate having hole formed by the method
JP6028969B2 (ja) * 2012-08-24 2016-11-24 国立大学法人大阪大学 結晶基板に孔を形成する方法、並びに結晶基板内に配線や配管を有する機能性デバイス
JP7567547B2 (ja) * 2021-02-19 2024-10-16 Agc株式会社 凹部を有するケイ素含有部材の製造方法

Also Published As

Publication number Publication date
US20260063997A1 (en) 2026-03-05
WO2024247461A1 (ja) 2024-12-05
CN121219816A (zh) 2025-12-26
TW202514768A (zh) 2025-04-01

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