JPWO2024241721A5 - - Google Patents

Info

Publication number
JPWO2024241721A5
JPWO2024241721A5 JP2025521844A JP2025521844A JPWO2024241721A5 JP WO2024241721 A5 JPWO2024241721 A5 JP WO2024241721A5 JP 2025521844 A JP2025521844 A JP 2025521844A JP 2025521844 A JP2025521844 A JP 2025521844A JP WO2024241721 A5 JPWO2024241721 A5 JP WO2024241721A5
Authority
JP
Japan
Prior art keywords
conductor
dielectric layer
capacitor
substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025521844A
Other languages
English (en)
Japanese (ja)
Other versions
JP7713636B2 (ja
JPWO2024241721A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/013887 external-priority patent/WO2024241721A1/ja
Publication of JPWO2024241721A1 publication Critical patent/JPWO2024241721A1/ja
Publication of JPWO2024241721A5 publication Critical patent/JPWO2024241721A5/ja
Application granted granted Critical
Publication of JP7713636B2 publication Critical patent/JP7713636B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2025521844A 2023-05-19 2024-04-04 キャパシタ、電気回路、回路基板、機器、及びキャパシタの製造方法 Active JP7713636B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023083366 2023-05-19
JP2023083366 2023-05-19
PCT/JP2024/013887 WO2024241721A1 (ja) 2023-05-19 2024-04-04 キャパシタ、電気回路、回路基板、機器、及びキャパシタの製造方法

Publications (3)

Publication Number Publication Date
JPWO2024241721A1 JPWO2024241721A1 (https=) 2024-11-28
JPWO2024241721A5 true JPWO2024241721A5 (https=) 2025-07-18
JP7713636B2 JP7713636B2 (ja) 2025-07-28

Family

ID=93590033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025521844A Active JP7713636B2 (ja) 2023-05-19 2024-04-04 キャパシタ、電気回路、回路基板、機器、及びキャパシタの製造方法

Country Status (5)

Country Link
US (1) US20260066191A1 (https=)
EP (1) EP4715850A1 (https=)
JP (1) JP7713636B2 (https=)
CN (1) CN121127937A (https=)
WO (1) WO2024241721A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4916715B2 (ja) * 2005-12-21 2012-04-18 富士通株式会社 電子部品
CN101484976B (zh) 2006-05-02 2011-02-23 Nxp股份有限公司 包括改进的电极的电器件及其制造方法
JP5051166B2 (ja) * 2009-03-27 2012-10-17 Ｔｄｋ株式会社 薄膜デバイス
CN115943470B (zh) * 2020-06-29 2025-11-14 Tdk株式会社 薄膜电容器及具备其的电子电路基板

Similar Documents

Publication Publication Date Title
CN100382209C (zh) 一种金属-绝缘层-金属电容结构及其制作方法
CN100369167C (zh) 固体电解电容器
CN101983409B (zh) 具有牺牲导线构造的电容器及制造该电容器的改进方法
JP3350846B2 (ja) 導電性高分子を用いた固体電解コンデンサ及びその製造方法
TWI279888B (en) A capacitor for a semiconductor device and method for fabrication therefor
WO1996010845A3 (en) Semiconductor device comprising a ferroelectric memory element with a lower electrode provided with an oxygen barrier
JP2005260227A5 (https=)
JP2009010114A (ja) 誘電体薄膜キャパシタ
CN100550348C (zh) 制造集成电路器件的方法及由此形成的器件
CN107204331B (zh) 多层电容器的制造方法
JPWO2024241721A5 (https=)
US6914770B1 (en) Surface mount flipchip capacitor
TW200401463A (en) Metal-insulator-metal (MIM) capacitor and method for fabricating the same
JP2005268494A5 (https=)
JP2005311299A5 (https=)
US20050229388A1 (en) Multi-layer ceramic chip varistor device surface insulation method
CN109791840A (zh) 电子部件
JP3478041B2 (ja) チップ状固体電解コンデンサの製造方法
CN209015904U (zh) 薄膜器件
JP2728099B2 (ja) 固体電解コンデンサ及びその製造方法
JP7713636B2 (ja) キャパシタ、電気回路、回路基板、機器、及びキャパシタの製造方法
JP2950586B2 (ja) 固体電解コンデンサの製造方法
JP2002202734A5 (https=)
JPH07106205A (ja) 固体電解コンデンサ及びその製造方法
TWI419328B (zh) 主動層堆疊結構及其製造方法及其應用