JPWO2024225411A1 - - Google Patents
Info
- Publication number
- JPWO2024225411A1 JPWO2024225411A1 JP2025516906A JP2025516906A JPWO2024225411A1 JP WO2024225411 A1 JPWO2024225411 A1 JP WO2024225411A1 JP 2025516906 A JP2025516906 A JP 2025516906A JP 2025516906 A JP2025516906 A JP 2025516906A JP WO2024225411 A1 JPWO2024225411 A1 JP WO2024225411A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023073223 | 2023-04-27 | ||
| PCT/JP2024/016368 WO2024225411A1 (ja) | 2023-04-27 | 2024-04-26 | 湿式除去可能なシリコン含有レジスト下層膜形成組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024225411A1 true JPWO2024225411A1 (https=) | 2024-10-31 |
Family
ID=93256558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025516906A Pending JPWO2024225411A1 (https=) | 2023-04-27 | 2024-04-26 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024225411A1 (https=) |
| KR (1) | KR20260002600A (https=) |
| CN (1) | CN120513432A (https=) |
| TW (1) | TW202507419A (https=) |
| WO (1) | WO2024225411A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5862894B2 (ja) * | 2010-09-21 | 2016-02-16 | 日産化学工業株式会社 | 保護された脂肪族アルコールを含有する有機基を有するシリコン含有レジスト下層膜形成組成物 |
| JP6250514B2 (ja) | 2014-10-03 | 2017-12-20 | 信越化学工業株式会社 | 塗布型ｂｐｓｇ膜形成用組成物、基板、及びパターン形成方法 |
| CN110494807A (zh) | 2017-03-31 | 2019-11-22 | 日产化学株式会社 | 具有羰基结构的含有硅的抗蚀剂下层膜形成用组合物 |
| CN111226175A (zh) * | 2017-10-25 | 2020-06-02 | 日产化学株式会社 | 使用包含具有铵基的有机基的含硅抗蚀剂下层膜形成用组合物的半导体装置的制造方法 |
| US12585188B2 (en) * | 2020-04-30 | 2026-03-24 | Nissan Chemical Corporation | Composition for forming resist underlying film |
| CN118159910A (zh) * | 2021-10-28 | 2024-06-07 | 日产化学株式会社 | 含添加剂含硅抗蚀剂下层膜形成组合物 |
-
2024
- 2024-04-26 CN CN202480008548.2A patent/CN120513432A/zh active Pending
- 2024-04-26 JP JP2025516906A patent/JPWO2024225411A1/ja active Pending
- 2024-04-26 WO PCT/JP2024/016368 patent/WO2024225411A1/ja not_active Ceased
- 2024-04-26 KR KR1020257026951A patent/KR20260002600A/ko active Pending
- 2024-04-26 TW TW113115738A patent/TW202507419A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202507419A (zh) | 2025-02-16 |
| WO2024225411A1 (ja) | 2024-10-31 |
| KR20260002600A (ko) | 2026-01-06 |
| CN120513432A (zh) | 2025-08-19 |